Injection mold for producing lower cover assembly of mobile phone mainboard

Abstract

The utility model discloses an injection mold for producing a lower cover component of a mobile phone mainboard, which comprises a lower mold and an upper mold, a sprue is fixedly mounted in the middle of the outer surface of the upper end of the upper mold, a forming cavity is formed in the middle of the outer surface of the upper end of the lower mold, and a base is fixedly mounted on the outer surface of the lower end of the lower mold. A discharging structure is fixedly mounted in the middle of the outer surface of one side of the base, a mounting cavity is formed in the outer surface of the upper end of the base, an ejection discharging structure is mounted in the mounting cavity, and ejector pin holes are formed in the four corners of the bottom of the forming cavity. According to the injection mold for producing the lower cover assembly of the mobile phone mainboard, through the arrangement of the ejection discharging structure, discharging of low workpieces is facilitated, the situation that the workpieces are clamped in the forming cavity and are not ejected out is avoided, through the arrangement of the discharging structure, discharging of the workpieces is facilitated, and the discharging efficiency and safety are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of production of a lower cover of a mobile phone mainboard, in particular to an injection mold for producing a lower cover assembly of a mobile phone mainboard. Background Art

[0002] When producing the lower cover of the mobile phone motherboard, it is necessary to use a mold for injection molding. When unloading the workpiece inside the molding cavity, a spring-loaded ejector is generally used to eject the workpiece by utilizing the return effect of the spring.

[0003] In the prior art, a Chinese patent document with the authorization announcement number CN216992879U records an injection mold for producing a lower cover assembly of a mobile phone motherboard. The patent includes an upper mold and a lower mold. The upper mold and the lower mold are both provided with a mold cavity on the opposite side. The upper mold is provided with a liquid injection channel inside. The upper mold and the lower mold are both provided with a cooling channel inside. The injection mold for producing the lower cover assembly of the mobile phone motherboard is provided with a guide rod arranged on the bottom surface of the upper mold. When the upper mold and the lower mold are molded together, the guide rod will extend into the guide rod to position the upper mold to prevent the upper mold and the lower mold from deviating. After the guide rod is extended, it will press the push rod, and the slide plate will slide on the slide rod by driving the push rod to compress the spring. The slide plate drives the push plate to fit with the mold cavity by driving the connecting rod, and then the mold cavity is injected. After the injection is completed, the upper mold is opened, the guide rod moves upward, and the slide plate is affected by the elastic force of the spring to drive the push plate to move up by driving the connecting rod to eject the product.

[0004] It uses the return of the spring to eject the workpiece, but it has the following disadvantages when used:

[0005] 1. After injection molding, the workpiece tends to adhere to the inside of the molding cavity, and the spring's reset force is small, so the workpiece often gets stuck inside the molding cavity and is not ejected;

[0006] 2. After the spring has been used for a period of time, its free length will become shorter, and its strength and fatigue life will be reduced, thus affecting normal stamping and demolding.

[0007] 3. After the product is ejected, it is necessary to manually reach between the lower mold and the upper mold to remove the workpiece, which poses a safety hazard.

[0008] To this end, we propose an injection mold for producing a lower cover assembly of a mobile phone motherboard. Utility Model Content

[0009] 1. Technical issues to be resolved

[0010] In view of the deficiencies in the prior art, the utility model provides an injection mold for producing a lower cover assembly of a mobile phone mainboard, which is convenient for cutting workpieces and has the advantages of constant high safety, and can effectively solve the problems in the background technology.

[0011] (II) Technical solution

[0012] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an injection mold for producing a lower cover assembly of a mobile phone motherboard, comprising a lower mold and an upper mold, a nozzle is fixedly installed on the middle part of the upper outer surface of the upper mold, a molding cavity is opened in the middle part of the upper outer surface of the lower mold, a base is fixedly installed on the lower outer surface of the lower mold, a blanking structure is fixedly installed on the middle part of the outer surface of one side of the base, a mounting cavity is opened on the upper outer surface of the base, an ejection and blanking structure is installed inside the mounting cavity, and ejector holes are opened at the four corners of the bottom of the molding cavity, the ejector and blanking structure comprises an electric telescopic rod, a movable arm plate, a guide rod, a guide ring, a connecting arm rod and an ejector, the blanking structure comprises a rotary lifting cylinder, a connecting wall plate, a vacuum suction cup and a ring frame, and the upper part of the ejector extends into the ejector hole.

[0013] Preferably, the number of the guide rods, guide rings, and connecting arm rods are two groups, the number of the ejector pins is four groups, and the electric telescopic rod is fixedly installed in the middle of the lower end of the installation cavity, the middle of the outer surface of the lower end of the movable arm plate is fixedly connected to the outer surface of the upper end of the piston rod in the electric telescopic rod, and the number of the guide rods is two groups, and the two groups of guide rods are fixedly installed on the left and right sides of the installation cavity.

[0014] Preferably, the two groups of guide rings are fixedly installed on the left and right sides of the outer surface of the upper end of the movable arm plate, the guide rings are located on the outer wall of the guide rod, and the guide rings and the outer wall of the guide rod are slidably connected. The four groups of ejector pins are fixedly installed on the left and right ends of the outer surface of the upper end of the two groups of connecting arm rods, and the outer walls of the ejector pins are gap-matched with the ejector pin holes.

[0015] Preferably, the rotary lifting cylinder is fixedly installed at the middle of the outer surface of one side of the base, and one end of the lower outer surface of the connecting wall plate is fixedly connected to the upper outer surface of the piston rod in the rotary lifting cylinder.

[0016] Preferably, the outer surface of one end of the connecting wall plate away from the rotary lifting cylinder is fixedly connected to the middle of the outer surface of one side of the annular frame, and the number of the vacuum suction cups is four groups, which are fixedly installed on the left and right sides of the outer surfaces of both ends of the annular frame.

[0017] Preferably, the vacuum suction cup is externally connected to a vacuum air pump via a soft air tube.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the utility model provides an injection mold for producing a lower cover assembly of a mobile phone mainboard, which has the following beneficial effects:

[0020] 1. The injection mold for producing the lower cover assembly of the mobile phone mainboard is convenient for unloading the workpiece by setting the ejection and unloading structure, so as to avoid the situation that the workpiece is stuck in the molding cavity and is not ejected.

[0021] 2. The injection mold for producing the lower cover assembly of the mobile phone mainboard is convenient for unloading the workpiece by setting a unloading structure, thereby improving the efficiency and safety of unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The utility model is a schematic diagram of the overall structure of an injection mold for producing a lower cover assembly of a mobile phone mainboard.

[0023] Figure 2 The utility model is a structural schematic diagram of a blanking structure in an injection mold for producing a lower cover assembly of a mobile phone mainboard.

[0024] Figure 3 The utility model is a side cross-sectional view of a lower mold and a rotary lifting cylinder in an injection mold for producing a lower cover assembly of a mobile phone motherboard.

[0025] Figure 4 The utility model is a partial structural schematic diagram of an ejection and blanking structure in an injection mold for producing a lower cover assembly of a mobile phone mainboard.

[0026] In the figure: 1. lower mold; 2. upper mold; 3. nozzle; 4. molding cavity; 5. unloading structure; 6. base; 7. rotary lifting cylinder; 8. connecting wall panel; 9. vacuum suction cup; 10. installation cavity; 11. electric telescopic rod; 12. movable arm plate; 13. guide rod; 14. guide ring; 15. connecting arm rod; 16. ejector pin; 17. ejector pin hole; 18. ring frame. DETAILED DESCRIPTION

[0027] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0028] This embodiment is an injection mold for producing a lower cover assembly of a mobile phone mainboard.

[0029] like Figure 1-4As shown, it includes a lower mold 1 and an upper mold 2, a nozzle 3 is fixedly installed in the middle of the upper outer surface of the upper mold 2, a molding cavity 4 is opened in the middle of the upper outer surface of the lower mold 1, a base 6 is fixedly installed on the lower outer surface of the lower mold 1, a blanking structure 5 is fixedly installed in the middle of the outer surface of one side of the base 6, a mounting cavity 10 is opened on the upper outer surface of the base 6, an ejection and blanking structure is installed inside the mounting cavity 10, and ejector holes 17 are opened at the four corners of the bottom of the molding cavity 4. The ejector and blanking structure includes an electric telescopic rod 11, a movable arm plate 12, a guide rod 13, a guide ring 14, a connecting arm rod 15 and an ejector 16. The blanking structure 5 includes a rotary lifting cylinder 7, a connecting wall plate 8, a vacuum suction cup 9 and a ring frame 18, and the upper part of the ejector 16 extends into the ejector hole 17.

[0030] The number of guide rods 13, guide rings 14, and connecting arm rods 15 are all two groups, the number of ejector pins 16 is four groups, and the electric telescopic rod 11 is fixedly installed in the middle of the lower end of the installation cavity 10, the middle of the outer surface of the lower end of the movable arm plate 12 is fixedly connected to the outer surface of the upper end of the piston rod in the electric telescopic rod 11, the number of guide rods 13 is two groups, and the two groups of guide rods 13 are fixedly installed on the left and right sides of the installation cavity 10; two groups of guide rings 14 are fixedly installed on the left and right sides of the outer surface of the upper end of the movable arm plate 12, the guide rings 14 are located on the outer wall of the guide rods 13, and the guide rings 14 and the outer wall of the guide rods 13 are slidably connected, and the four groups of ejector pins 16 is fixedly installed on the left and right ends of the upper outer surfaces of the two groups of connecting arm rods 15, and the outer wall of the ejector pin 16 is clearance-matched with the ejector pin hole 17; the rotary lifting cylinder 7 is fixedly installed on the middle part of the outer surface of one side of the base 6, and one end of the outer surface of the lower end of the connecting wall plate 8 is fixedly connected to the upper outer surface of the piston rod in the rotary lifting cylinder 7; the outer surface of one end of the connecting wall plate 8 away from the rotary lifting cylinder 7 is fixedly connected to the middle part of the outer surface of one side of the annular frame 18, and the number of vacuum suction cups 9 is four groups, and the four groups of vacuum suction cups 9 are fixedly installed on the left and right sides of the outer surfaces of both ends of the annular frame 18; the vacuum suction cups 9 are externally connected to a vacuum air pump through a soft air pipe.

[0031] It should be noted that the utility model is an injection mold for producing a lower cover assembly of a mobile phone motherboard. The lower mold 1 and the upper mold 2 described in the text belong to the prior art, which can be effectively known to the technicians in the relevant technical field, and the specific details are not repeated here. When it is necessary to unload the product inside the molding cavity 4, the movable arm plate 12 is driven to rise by the operation of the electric telescopic rod 11, and the movable arm plate 12 slides along the outer wall of the guide rod 13 through the guide ring 14. The movable arm plate 12 drives the ejector pin 16 to rise through the connecting arm rod 15, and the ejector pin 16 moves along the ejector pin 16. The hole 17 is lifted up, and the ejector hole 17 squeezes the product inside the molding cavity 4, and the product inside the molding cavity 4 is ejected, and then the material is unloaded through the unloading structure 5, and the annular frame 18 is driven to move to the upper part of the molding cavity 4 by the rotating lifting cylinder 7, and the vacuum suction cup 9 is driven to descend by the rotating lifting cylinder 7. The vacuum suction cup 9 is externally connected to a vacuum air pump, and the workpiece can be adsorbed by the vacuum suction cup 9, and then the workpiece is driven to be unloaded by the operation of the rotating lifting cylinder 7, so as to avoid extending into the space between the lower mold 1 and the upper mold 2 during unloading, thereby improving the efficiency and safety of unloading.

[0032] It should be noted that, in this article, relational terms such as first and second (number one, number two), etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0033] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. The technicians in this industry should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. An injection mold for producing a lower cover assembly of a mobile phone motherboard, comprising a lower mold (1) and an upper mold (2), wherein a nozzle (3) is fixedly mounted in the middle of the upper outer surface of the upper mold (2), and a molding cavity (4) is provided in the middle of the upper outer surface of the lower mold (1), characterized in that: A base (6) is fixedly mounted on the outer surface of the lower end of the lower mold (1), a blanking structure (5) is fixedly mounted in the middle of the outer surface of one side of the base (6), a mounting cavity (10) is provided on the outer surface of the upper end of the base (6), an ejection blanking structure is installed inside the mounting cavity (10), four corners of the bottom of the molding cavity (4) are provided with ejector holes (17), the ejector blanking structure comprises an electric telescopic rod (11), a movable arm plate (12), a guide rod (13), a guide ring (14), a connecting arm rod (15) and an ejector pin (16), the blanking structure (5) comprises a rotary lifting cylinder (7), a connecting wall plate (8), a vacuum suction cup (9) and a ring frame (18), and the upper part of the ejector pin (16) extends into the ejector pin hole (17).

2. The injection mold for producing a lower cover assembly of a mobile phone mainboard according to claim 1, characterized in that: The number of the guide rods (13), the guide rings (14), and the connecting arm rods (15) are all two groups, the number of the ejector pins (16) is four groups, and the electric telescopic rod (11) is fixedly installed in the middle of the lower end of the installation cavity (10), the middle of the lower end outer surface of the movable arm plate (12) is fixedly connected to the upper end outer surface of the piston rod in the electric telescopic rod (11), the number of the guide rods (13) is two groups, and the two groups of guide rods (13) are fixedly installed on the left and right sides of the installation cavity (10).

3. The injection mold for producing a lower cover assembly of a mobile phone mainboard according to claim 2, characterized in that: The two groups of guide rings (14) are fixedly mounted on the left and right sides of the outer surface of the upper end of the movable arm plate (12); the guide rings (14) are located on the outer wall of the guide rod (13); the guide rings (14) and the outer wall of the guide rod (13) are slidably connected; the four groups of ejector pins (16) are fixedly mounted on the left and right ends of the outer surface of the upper end of the two groups of connecting arm rods (15); the outer wall of the ejector pin (16) is clearance-matched with the ejector pin hole (17).

4. The injection mold for producing a lower cover assembly of a mobile phone mainboard according to claim 3, characterized in that: The rotary lifting cylinder (7) is fixedly mounted on the middle of the outer surface of one side of the base (6), and one end of the lower outer surface of the connecting wall plate (8) is fixedly connected to the upper outer surface of the piston rod in the rotary lifting cylinder (7).

5. The injection mold for producing a lower cover assembly of a mobile phone mainboard according to claim 4, characterized in that: The outer surface of one end of the connecting wall plate (8) away from the rotary lifting cylinder (7) is fixedly connected to the middle of the outer surface of one side of the annular frame (18), and the number of the vacuum suction cups (9) is four groups, and the four groups of vacuum suction cups (9) are fixedly installed on the left and right sides of the outer surfaces of both ends of the annular frame (18).

6. The injection mold for producing a lower cover assembly of a mobile phone mainboard according to claim 5, characterized in that: The vacuum suction cup (9) is externally connected to a vacuum air pump via a soft air tube.

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