Copper electroplating device for circuit board

Abstract

The utility model discloses a circuit board electroplating copper plating device which comprises an electroplating box, a portal frame is installed on the upper portion of the electroplating box, a first electric telescopic rod penetrates through the upper portion of the portal frame, an installation frame is installed at one end of the first electric telescopic rod, and three sets of shaft pipes penetrate through the inner bottom face of the installation frame through bearings. A lifting frame plate is arranged in the electroplating box, connecting shafts are slidably mounted in the three sets of shaft pipes, two sets of clamping plates are mounted on the side walls of the three sets of connecting shafts, two sets of clamping grooves are formed in the inner walls of the three sets of shaft pipes, and the six sets of clamping plates slidably penetrate through the six sets of clamping grooves correspondingly. And mounting plates are mounted at the lower ends of the three groups of connecting shafts. The copper plating device for circuit board electroplating has the beneficial effects that the shaft tube is adopted, so that the number of electroplated circuit boards can be increased and the working efficiency of the copper plating device for circuit board electroplating is improved on the premise that the electroplating work is not influenced through the arranged shaft tube.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board electroplating, in particular to a circuit board electroplating copper plating device. Background Art

[0002] Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Circuit board electroplating is the electroplating of through holes or blind holes in circuit boards so that the copper thickness in these through holes or blind holes can reach the required range. It is an indispensable part of the printed circuit board manufacturing process. Circuit board electroplating now mostly uses electroplating copper plating equipment, which has the advantages of simple operation, stable structure and good copper plating effect in actual use.

[0003] The prior art discloses a plating device capable of uniform copper plating, the publication number of which is CN220183412U, comprising a plating pool, a circuit board, a mounting frame, a guide groove, a guide block, a fixing seat, a cylinder, a connecting frame, an automatic telescopic rod, a fixing plate, a slide rail, a bidirectional threaded rod, a motor, a slider, a moving groove, a moving block and a clamping plate. When the electroplating device capable of uniform copper plating is used, firstly, the bidirectional threaded rod can be driven to work by the motor, and the bidirectional threaded rod can be threadedly matched with the moving block, and then the moving block can pass through the moving groove to pull the slider to move, and when the slider slides along the slide rail, the clamping plate can be driven to move closer, and when the clamping plate moves closer to the side of the circuit board, it can be squeezed and fixed, and then the circuit board can be firmly clamped to prevent the circuit board from falling during the copper plating process, and then, the circuit board can be started. The moving cylinder can push the fixed plate to move downward, which will drive the clamped circuit board downward to embed into the electroplating tank. Since the through holes of the circuit board cannot evenly pass through each group of through holes in the static battery fluid, the fixing seat can be pulled to move through the automatic telescopic rod. When the front automatic telescopic rod extends to push the fixing seat, the rear automatic telescopic rod will automatically shrink. When the fixing seat moves, it will pull the guide block to move in the guide groove, and then drive the cylinder through the fixed seat, so that the fixed plate and the clamping mechanism make forward and backward movements on the same horizontal line. At this time, the circuit board will shake in the electroplating tank, and the shaking process will cause the battery liquid to flow, so that the battery liquid can pass through the through holes of the circuit board, thereby evenly copper-plating the circuit board. This is the working principle of the electroplating device that can evenly copper-plate.

[0004] In the above utility model, when the motor is powered on, its conveying end drives the bidirectional threaded rod to rotate, and the bidirectional threaded rod makes the two groups of clamping plates approach or move away from each other through two groups of moving blocks, and the two clamping plates are used to complete the clamping work of the circuit board. However, this clamping method can only clamp one group of circuit boards, and only one group of circuit boards can be electroplated at a time, and its working efficiency is limited, which reduces the practicality of the use of this utility model.

[0005] Currently, no effective solution has been proposed for the problems in the related technologies. Utility Model Content

[0006] 1. Technical issues to be solved

[0007] In view of the deficiencies in the prior art, the utility model provides a circuit board copper plating device, which has the advantage of being able to increase the number of circuit boards to be electroplated without affecting the electroplating work, thereby solving the problems in the above-mentioned background technology.

[0008] (II) Technical solution

[0009] In order to achieve the above advantages of increasing the number of circuit boards electroplated without affecting the electroplating work, the specific technical solutions adopted by the utility model are as follows:

[0010] A circuit board electroplating copper plating device comprises an electroplating box, a gantry is installed on the upper part of the electroplating box, and a first electric telescopic rod is passed through the upper part of the gantry, and a mounting frame is installed at one end of the first electric telescopic rod, and three groups of shaft tubes are passed through the inner bottom surface of the mounting frame through bearings, and a lifting frame plate is arranged inside the electroplating box, and connecting shafts are slidably installed inside the three groups of shaft tubes, and two groups of clamping plates are installed on the side walls of the three groups of connecting shafts, and two groups of clamping grooves are arranged on the inner walls of the three groups of shaft tubes, and six groups of clamping plates slide through the six groups of clamping grooves respectively, and mounting plates are installed at the lower ends of the three groups of connecting shafts, and the mounting Three groups of second electric telescopic rods penetrate the upper part of the frame, and one end of the three groups of second electric telescopic rods is installed with a connecting block, the upper ends of the three groups of shaft tubes are connected to the three groups of connecting blocks through bearings, the lower end side wall of the middle group of shaft tubes is fixedly sleeved with a main gear, and the lower end side walls of the two groups of shaft tubes on both sides are fixedly sleeved with driven gears, a right angle plate is installed on the inner bottom surface of the mounting frame, and a driving motor is installed on the upper part of the right angle plate, and the output end of the driving motor is sleeved with a mounting gear, the upper end side wall of the middle group of shaft tubes is fixedly sleeved with a sleeve gear, and the lower end side walls of the three groups of shaft tubes are fixedly sleeved with sleeve orifice plates.

[0011] Furthermore, the main gear is meshed with the two sets of driven gears.

[0012] Furthermore, the mounting gear and the sleeve gear are meshed with each other.

[0013] Furthermore, positioning hole plates are installed on both sides of the interior of the electroplating box, and adjusting screws are installed on the upper part of the lifting frame plate. One end of the two groups of adjusting screws respectively penetrate the two groups of positioning hole plates, and the side walls of the two groups of adjusting screws are sleeved with two groups of adjusting nuts.

[0014] Furthermore, the two groups of adjusting screws and the four groups of adjusting nut threads cooperate with each other.

[0015] Furthermore, the inner length and width of the lifting frame plate are smaller than the length and width of the mounting frame.

[0016] Furthermore, a control panel is installed on one side of the gantry, and the control panel is electrically connected to the first electric telescopic rod, the three groups of the second electric telescopic rods and the driving motor through electric wires.

[0017] Furthermore, a support seat is installed at the lower part of the electroplating box.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the utility model provides a circuit board electroplating copper plating device, which has the following beneficial effects:

[0020] (1) The utility model adopts an axis tube. When the circuit board copper plating device is actually used, the operator first moves the three circuit boards to between a group of socket hole plates and a group of mounting plates on the same side, and then uses the control panel to shorten the three groups of second electric telescopic rods. Finally, the three groups of socket hole plates and the three groups of mounting plates will clamp the three circuit boards. At this time, the control panel is used to operate the first electric telescopic rod and the drive motor. The first electric telescopic rod extends. When the three circuit boards contact the plating liquid inside the electroplating box, the output end of the drive motor drives the installation gear to rotate. Since the installation gear and the socket gear are meshed with each other The rotating mounting gear will push the socket gear to rotate, the rotating socket gear will drive the middle set of shaft tubes to rotate, the middle set of shaft tubes will drive the main gear to rotate, and since the main gear and the two sets of driven gears are meshed with each other, the rotating main gear can push the two sets of driven gears. At this time, the three sets of shaft tubes can drive the three circuit boards to rotate and stir the electroplating liquid inside the electroplating box. Due to the existence of the three sets of connecting blocks, the three sets of second electric telescopic rods will not rotate with the three sets of connecting shafts. By setting the shaft tubes, the number of circuit boards to be electroplated can be increased without affecting the electroplating work, thereby improving the working efficiency of the circuit board copper plating device.

[0021] (2) The utility model adopts a lifting frame. According to the above operation, when the electroplating of the three circuit boards is completed, the first electric telescopic rod is shortened by using the control panel, and the three circuit boards will move up and reset. The operator then manually moves up the two sets of adjusting screws to drive the lifting frame to move up. When the lifting frame moves up to a suitable position, the two sets of adjusting screws and the four sets of adjusting nut threads cooperate with each other. The operator manually rotates the four sets of adjusting nuts clockwise and counterclockwise. When the four sets of adjusting nuts are respectively fixed in position with the two sets of positioning hole plates, the first electric telescopic rod is extended again. When the mounting frame contacts the lifting frame, the drive motor is operated again. At this time, the three circuit boards are not in contact with the plating liquid. When the three circuit boards rotate, the plating liquid on the surface of the three circuit boards will be detached due to the centrifugal force. The lifting frame can quickly remove the residual plating liquid on the surface of the circuit board, which brings convenience to the cleaning work of the circuit board of the circuit board copper plating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a structural schematic diagram of a circuit board electroplating copper plating device proposed by the utility model;

[0024] Figure 2 It is a three-dimensional diagram of the shaft tube proposed by the utility model;

[0025] Figure 3 The utility model proposes Figure 1 A magnified view of middle;

[0026] Figure 4 The utility model proposes Figure 1 Enlarged view of B.

[0027] In the figure:

[0028] 1. Electroplating box; 2. Gantry; 3. First electric telescopic rod; 4. Mounting frame; 5. Axle tube; 6. Lifting frame plate; 7. Connecting shaft; 8. Card plate; 9. Card slot; 10. Main gear; 11. Driven gear; 12. Socket plate; 13. Mounting plate; 14. Second electric telescopic rod; 15. Connecting block; 16. Right-angle plate; 17. Driving motor; 18. Mounting gear; 19. Socket gear; 20. Positioning hole plate; 21. Adjusting screw; 22. Adjusting nut. DETAILED DESCRIPTION

[0029] To further illustrate each embodiment, the present invention provides drawings, which are part of the disclosure of the present invention and are mainly used to illustrate the embodiments. They can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, ordinary technicians in the field should be able to understand other possible implementation methods and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0030] According to an embodiment of the utility model, a circuit board copper electroplating device is provided.

[0031] The present invention is now further described in conjunction with the accompanying drawings and specific implementation methods. Figure 1-4 As shown, a circuit board electroplating copper plating device according to an embodiment of the utility model comprises an electroplating box 1, a gantry 2 is installed on the upper part of the electroplating box 1, and a first electric telescopic rod 3 is penetrated on the upper part of the gantry 2, and a mounting frame 4 is installed on one end of the first electric telescopic rod 3, and three groups of shaft tubes 5 are penetrated through the inner bottom surface of the mounting frame 4 through bearings, a lifting frame plate 6 is arranged inside the electroplating box 1, connecting shafts 7 are slidably installed inside the three groups of shaft tubes 5, and two groups of clamping plates 8 are installed on the side walls of the three groups of connecting shafts 7, two groups of clamping grooves 9 are arranged on the inner walls of the three groups of shaft tubes 5, six groups of clamping plates 8 slide through the six groups of clamping grooves 9 respectively, and mounting plates 13 are installed on the lower ends of the three groups of connecting shafts 7, three groups of second electric telescopic rods 14 are penetrated on the upper part of the mounting frame 4, and the three groups of second electric A connecting block 15 is installed at one end of the movable telescopic rod 14, and the upper ends of the three groups of shaft tubes 5 are connected to the three groups of connecting blocks 15 through bearings. The lower end side wall of the middle group of shaft tubes 5 is fixedly sleeved with a main gear 10, and the lower end side walls of the two groups of shaft tubes 5 on both sides are fixedly sleeved with a driven gear 11. A right-angle plate 16 is installed on the inner bottom surface of the mounting frame 4, and a driving motor 17 is installed on the upper part of the right-angle plate 16, and the output end of the driving motor 17 is sleeved with a mounting gear 18, the upper end side wall of the middle group of shaft tubes 5 is fixedly sleeved with a sleeve gear 19, and the lower end side walls of the three groups of shaft tubes 5 are fixedly sleeved with a sleeve hole plate 12. By setting the shaft tube 5, the number of circuit board electroplating can be increased without affecting the electroplating work, thereby improving the working efficiency of the circuit board electroplating copper plating device.

[0032] In one embodiment, the main gear 10 and the two sets of driven gears 11 are meshed with each other, so that the main gear 10 drives the two sets of driven gears 11 to rotate.

[0033] In one embodiment, the mounting gear 18 and the sleeve gear 19 mesh with each other, so that the mounting gear 18 pushes the sleeve gear 19 to rotate.

[0034] In one embodiment, positioning hole plates 20 are installed on both sides of the interior of the electroplating box 1, and adjusting screws 21 are installed on the upper part of the lifting frame plate 6. One end of the two groups of adjusting screws 21 respectively penetrate the two groups of positioning hole plates 20, and the side walls of the two groups of adjusting screws 21 are sleeved with two groups of adjusting nuts 22. Through the setting of the lifting frame plate 6, the electroplating liquid residual on the surface of the circuit board can be quickly removed, which brings convenience to the cleaning work of the circuit board of the circuit board copper plating device.

[0035] In one embodiment, the threads of the two sets of adjusting screws 21 and the four sets of adjusting nuts 22 cooperate with each other, so as to facilitate the adjustment of the use positions of the four sets of adjusting nuts 22 .

[0036] In one embodiment, the inner length and width of the lifting frame plate 6 are smaller than the length and width of the mounting frame 4 , thereby ensuring that the mounting frame 4 can cover the inner part of the lifting frame plate 6 .

[0037] In one embodiment, a control panel is installed on one side of the gantry 2, and the control panel is electrically connected to the first electric telescopic rod 3, the three sets of second electric telescopic rods 14 and the drive motor 17 through electric wires. The control panel can be implemented by simple programming by technicians in this field, which is common knowledge in this field. It is only used without modification, so the control method and circuit connection will not be described in detail.

[0038] In one embodiment, a support base is installed at the lower part of the electroplating box 1.

[0039] Working principle:

[0040] When the circuit board copper plating device is actually used, the operator first moves the three circuit boards to between a set of socket hole plates 12 and a set of mounting plates 13 on the same side, and then uses the control panel to shorten the three sets of second electric telescopic rods 14. Finally, the three sets of socket hole plates 12 and the three sets of mounting plates 13 will clamp the three circuit boards. At this time, the control panel is used to operate the first electric telescopic rod 3 and the drive motor 17, and the first electric telescopic rod 3 is extended. When the three circuit boards contact the electroplating liquid inside the electroplating box 1, the output end of the drive motor 17 drives the mounting gear 18 to rotate. Since the installation gear 18 and the sleeve gear 19 are meshed with each other, the rotating installation gear 18 will push the sleeve gear 19 to rotate, and the rotating sleeve gear 19 will drive the middle set of shaft tubes 5 to rotate, and the middle set of shaft tubes 5 will drive the main gear 10 to rotate. Since the main gear 10 and the two sets of driven gears 11 are meshed with each other, the rotating main gear 10 can push the two sets of driven gears 11. At this time, the three sets of shaft tubes 5 can drive the three circuit boards to rotate and stir the electroplating liquid inside the electroplating box 1. Due to the existence of the three sets of connecting blocks 15, the three sets of second electric telescopic rods 14 will not follow the three sets of connecting blocks. The connecting shaft 7 rotates, and the shaft tube 5 is set, under the premise of not affecting the electroplating work, the number of circuit boards to be electroplated can be increased, thereby improving the working efficiency of the circuit board electroplating copper plating device. At the same time, according to the above operation, when the electroplating of three circuit boards is completed, the first electric telescopic rod 3 is shortened by using the control panel, and the three circuit boards will be moved up and reset. The operator then moves up the two sets of adjusting screws 21 by hand, which can drive the lifting frame plate 6 to move up. When the lifting frame plate 6 moves up to a suitable position, the two sets of adjusting screws 21 and the four sets of adjusting nuts 22 are used to cooperate with each other, and the operation The worker rotates the four sets of adjusting nuts 22 clockwise and counterclockwise by hand. When the four sets of adjusting nuts 22 are respectively fixed in position with the two sets of positioning hole plates 20, the first electric telescopic rod 3 is extended again. When the mounting frame 4 contacts the lifting frame plate 6, the driving motor 17 is operated again. At this time, the three circuit boards are not in contact with the electroplating liquid. When the three circuit boards rotate, the electroplating liquid on the surfaces of the three circuit boards will be separated due to the centrifugal force. The electroplating liquid remaining on the surface of the circuit board can be quickly removed through the provided lifting frame plate 6, which brings convenience to the cleaning work of the circuit board of the circuit board copper plating device.

[0041] In the present utility model, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the utility model according to the specific circumstances.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board copper plating device, characterized in that: The invention comprises an electroplating box (1), wherein a gantry (2) is installed on the upper part of the electroplating box (1), and a first electric telescopic rod (3) is passed through the upper part of the gantry (2), and a mounting frame (4) is installed at one end of the first electric telescopic rod (3), and three groups of shaft tubes (5) are passed through the inner bottom surface of the mounting frame (4) through bearings, and a lifting frame plate (6) is arranged inside the electroplating box (1), and connecting shafts (7) are slidably installed inside the three groups of shaft tubes (5), and two groups of clamping plates (8) are installed on the side walls of the three groups of connecting shafts (7), and two groups of clamping grooves (9) are arranged on the inner walls of the three groups of shaft tubes (5), and six groups of clamping plates (8) are respectively slidably passed through the six groups of clamping grooves (9), and the lower ends of the three groups of connecting shafts (7) are installed with mounting plates (13), and the upper part of the mounting frame (4) is passed through There are three groups of second electric telescopic rods (14), and one end of each of the three groups of second electric telescopic rods (14) is installed with a connecting block (15). The upper ends of the three groups of shaft tubes (5) are connected to the three groups of connecting blocks (15) through bearings. The lower end side wall of the middle group of shaft tubes (5) is fixedly sleeved with a main gear (10), and the lower end side walls of the two groups of shaft tubes (5) on both sides are fixedly sleeved with a driven gear (11). A right angle plate (16) is installed on the inner bottom surface of the installation frame (4), and a driving motor (17) is installed on the upper part of the right angle plate (16), and the output end of the driving motor (17) is sleeved with a mounting gear (18). The upper end side wall of the middle group of shaft tubes (5) is fixedly sleeved with a sleeve gear (19), and the lower end side walls of the three groups of shaft tubes (5) are fixedly sleeved with a sleeve hole plate (12).

2. A circuit board copper electroplating device according to claim 1, characterized in that: The main gear (10) and the two sets of driven gears (11) are meshed with each other.

3. A circuit board copper electroplating device according to claim 1, characterized in that: The mounting gear (18) and the sleeve gear (19) are meshed with each other.

4. A circuit board copper electroplating device according to claim 1, characterized in that: Positioning hole plates (20) are installed on both sides of the interior of the electroplating box (1), and adjusting screws (21) are installed on the upper part of the lifting frame plate (6). One end of the two groups of adjusting screws (21) respectively penetrate the two groups of positioning hole plates (20), and the side walls of the two groups of adjusting screws (21) are sleeved with two groups of adjusting nuts (22).

5. A circuit board copper electroplating device according to claim 4, characterized in that: The threads of the two groups of adjusting screws (21) and the four groups of adjusting nuts (22) cooperate with each other.

6. A circuit board copper electroplating device according to claim 1, characterized in that: The inner length and width of the lifting frame plate (6) are smaller than the length and width of the installation frame (4).

7. A circuit board copper electroplating device according to claim 1, characterized in that: A control panel is installed on one side of the gantry (2), and the control panel is electrically connected to the first electric telescopic rod (3), three groups of the second electric telescopic rods (14) and the driving motor (17) through electric wires.

8. The circuit board copper electroplating device according to claim 1, characterized in that: A support seat is installed at the lower part of the electroplating box (1).

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