3DS module test platform
By designing the 3DS module test platform, directly connecting and testing the 3DS modules, the problems of low efficiency, high cost and data deviation caused by disassembly and repackaging in traditional test solutions are solved, and efficient and accurate testing is achieved.
Patent Information
- Application Number
- CN202420653032.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-01
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-04-01
AI Technical Summary
Traditional 3DS module testing solutions require disassembly and repackaging, resulting in problems such as low testing efficiency, waste of costs, deviation of test data and material loss.
A 3DS module test platform is designed, including a base, detector, fixed seat, placement slot, drive board and power supply connection board. The power supply connection board is adapted to the electrodes of the 3DS module main body to realize direct connection and testing.
Improves testing efficiency and operational ease, reduces cost and ensures test accuracy and data accuracy.
Smart Images
Figure CN222482343U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical communication, in particular to a 3DS module testing platform. Background Art
[0002] 3DS module refers to 3D Sensing Module, that is, 3D sensing module, its main function is to emit light signals, and it is a product of miniaturized and modular chip packaging process.
[0003] Testing refers to testing the optoelectronic performance of 3DS module products, determining whether product performance indicators meet the requirements, and analyzing the test data.
[0004] Traditional test solution: Since there is no corresponding module test platform, the 3DS chip in the module is disassembled and then packaged into TO, that is, the chip is converted into TO package (such as Figure 7 As shown), the packaged samples are then placed into the TO test platform for testing. This solution has the following disadvantages:
[0005] 1. Compared with the test solution mentioned in the present invention, this solution has the redundant operation of chip disassembly and repackaging, which leads to low efficiency of the whole test. At the same time, the repackaging operation also causes certain cost waste;
[0006] 2. There are differences in the process between TO packaging and 3DS module packaging, which leads to a certain deviation between the test data and the actual value, which will affect the analysis and judgment of the test results;
[0007] 3. The chip disassembly operation is somewhat difficult, which will result in a certain proportion of material loss and indirectly increase the cost.
[0008] Therefore, a 3DS module testing platform is proposed. Summary of the invention
[0009] The purpose of the utility model is to provide a 3DS module testing platform to solve the problems raised in the above background technology.
[0010] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a 3DS module testing platform, comprising a base, a detector is installed on one side of the base through a bracket, a fixing seat is installed on the upper surface of the base, a placement groove is opened on the fixing seat, a driving board is arranged inside the placement groove, a power supply connection board is plugged into one side of the driving board, and a 3DS module body is placed on the power supply connection board.
[0011] Preferably, a stepped portion for supporting the driving plate is provided on the upper portion of the placement slot.
[0012] Preferably, an avoidance groove is provided on the outer side of the placement groove to facilitate the removal and installation of the drive plate.
[0013] Preferably, a screw hole is opened in the middle of the placement slot, a fixing screw is connected to the screw hole, and the fixing screw passes through the middle of the driving plate.
[0014] Preferably: one side of the driving board is provided with a connection socket for facilitating installation of the power supply connection board.
[0015] Preferably, a pin is installed below one side of the power supply connection plate, and the pin is plugged into the inside of the connection socket.
[0016] Preferably: a power supply electrode is installed on the upper surface of the power supply connection plate.
[0017] Preferably, a module electrode is installed on the lower surface of the 3DS module body, and the module electrode is matched with the power supply electrode.
[0018] Compared with the prior art, the beneficial effect of the utility model is that the fixing seat in the test platform is designed according to the outer dimensions of the driving plate, which effectively ensures the horizontal installation and fixation of the driving plate and ensures the test accuracy of the test platform.
[0019] The power connection board is designed with reference to the electrode characteristics and dimensions of the 3DS module. It can be connected to the module electrodes very quickly, greatly improving the test efficiency and operational convenience. At the same time, the power connection board can be reused many times, effectively controlling the cost.
[0020] The pin electrodes on the power connection board are designed with reference to the positive and negative characteristics of the driver board and the hole size, taking into account the convenience of installation and connection to the greatest extent. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a structural schematic diagram of the utility model;
[0022] Figure 2 It is a schematic diagram of the explosion of the structure of the utility model;
[0023] Figure 3 It is a structural schematic diagram of the fixing seat of the utility model;
[0024] Figure 4 This is a schematic diagram of the structure of the power supply connection board of the utility model;
[0025] Figure 5 This is a schematic diagram of the structure of the main body of the 3DS module of the utility model;
[0026] Figure 6 This is a schematic diagram of the bottom structure of the main body of the 3DS module of the utility model;
[0027] Figure 7 Schematic diagram of the TO packaging structure used in traditional testing solutions.
[0028] In the figure: 1. base; 2. detector; 3. fixing seat; 31. placement slot; 32. screw hole; 33. avoidance slot; 34. step portion; 4. drive board; 42. connection socket; 5. fixing screw; 6. power supply connection board; 61. pin; 62. power supply electrode; 7. 3DS module body; 71. module electrode. DETAILED DESCRIPTION
[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Example
[0030] See also Figure 1-6 The utility model provides a technical solution: a 3DS module testing platform, including a base 1, a detector 2 is installed on one side of the base 1 through a bracket, a fixing seat 3 is installed on the upper surface of the base 1, a placement groove 31 is opened on the fixing seat 3, a driving board 4 is arranged inside the placement groove 31, a power supply connection board 6 is plugged into one side of the driving board 4, and a 3DS module body 7 is placed on the power supply connection board 6.
[0031] like Figure 3 As shown: a stepped portion 34 for supporting the drive plate 4 is provided at the upper portion of the placement groove 31; through the above arrangement, when the drive plate 4 is placed inside the placement groove 31, the edge of the drive plate 4 can be supported by the stepped portion 34, thereby avoiding the situation where the components on the lower surface of the drive plate 4 are squeezed and damaged.
[0032] like Figure 3 As shown: an avoidance groove 33 is provided on the outer side of the placement groove 31 for facilitating the removal and installation of the drive plate 4; through the above arrangement, the staff can insert their fingers into the inside of the avoidance groove 33 to take out the drive plate 4 more conveniently and quickly.
[0033] like Figure 2 and Figure 3 As shown: a screw hole 32 is opened in the middle of the placement groove 31, and a fixing screw 5 is connected to the screw hole 32, and the fixing screw 5 passes through the middle of the driving plate 4; through the above arrangement, the fixing screw 5 passes through the driving plate 4 and is connected to the screw hole 32, so that the position of the driving plate 4 can be fixed, avoiding the situation of its random movement.
[0034] like Figure 2 and Figure 4As shown: a connection socket 42 is provided on one side of the driving board 4 for facilitating the installation of the power supply connecting board 6, and a pin 61 is installed at the lower side of the power supply connecting board 6, and the pin 61 is plugged into the inside of the connection socket 42; through the above arrangement, the pin 61 on the power supply connecting board 6 is inserted into the inside of the connection socket 42, so as to quickly complete the connection work between the power supply connecting board 6 and the driving board 4.
[0035] like Figure 2 , Figure 4 and Figure 6 As shown: a power supply electrode 62 is installed on the upper surface of the power supply connection plate 6, and a module electrode 71 is installed on the lower surface of the 3DS module body 7, and the module electrode 71 is adapted to the power supply electrode 62; through the above arrangement, the module electrode 71 and the power supply electrode 62 are attached to each other, and the 3DS module body 7 can be quickly powered, which is convenient for subsequent testing.
[0036] Working principle: first, place the driving board 4 into the placement groove 31, support the position of the driving board 4 by the step portion 34, and then limit and fix the position of the driving board 4 by the fixing screws 5, and then insert the two pins 61 of the power supply connection board 6 into the connection socket 42 to quickly connect the power supply connection board 6 and the driving board 4, and then place the 3DS module body 7 on the power supply connection board 6 so that the module electrode 71 corresponds to the power supply electrode 62 to complete the power supply work of the 3DS module body 7, and finally place the assembled fixing base 3 under the detector 2, start the test program operation, and complete the test operation of the product.
[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A 3DS module testing platform, comprising a base (1), characterized in that: A detector (2) is mounted on one side of the base (1) via a bracket, a fixing seat (3) is mounted on the upper surface of the base (1), a placement groove (31) is provided on the fixing seat (3), a driving board (4) is provided inside the placement groove (31), a power supply connection board (6) is plugged into one side of the driving board (4), and a 3DS module body (7) is placed on the power supply connection board (6).
2. A 3DS module testing platform according to claim 1, characterized in that: The upper portion of the placement groove (31) is provided with a stepped portion (34) for supporting the drive plate (4).
3. A 3DS module testing platform according to claim 1, characterized in that: An escape groove (33) is provided on the outer side of the placement groove (31) for facilitating the removal and installation of the drive plate (4).
4. A 3DS module testing platform according to claim 1, characterized in that: A screw hole (32) is provided in the middle of the placement slot (31), a fixing screw (5) is connected to the screw hole (32), and the fixing screw (5) passes through the middle of the drive plate (4).
5. The 3DS module testing platform according to claim 1, characterized in that: One side of the driving plate (4) is provided with a connection socket (42) for facilitating installation of the power supply connection plate (6).
6. A 3DS module testing platform according to claim 5, characterized in that: A pin (61) is installed below one side of the power supply connection plate (6), and the pin (61) is plugged into the interior of the connection socket (42).
7. A 3DS module testing platform according to claim 1, characterized in that: A power supply electrode (62) is mounted on the upper surface of the power supply connection plate (6).
8. A 3DS module testing platform according to claim 7, characterized in that: A module electrode (71) is mounted on the lower surface of the 3DS module body (7), and the module electrode (71) is compatible with the power supply electrode (62).