Substrate processing apparatus and heat treatment system

Abstract

The utility model provides substrate processing equipment and a heat treatment system. A base plate of the substrate holder transfer mechanism is provided with a damping member to assist an elastic member in damping and restricting movement of the substrate holder transfer mechanism when the substrate transfer mechanism is subjected to an unnecessary external force, such as an earthquake force. By damping and limiting the movement of the substrate holder transfer mechanism, undesired damage to a substrate housed in a substrate holder carried by the substrate holder transfer mechanism can be minimized.

Description

Technical Field

[0001] The utility model relates to substrate processing equipment and a heat treatment system. Background Art

[0002] High temperature heat treatment (annealing) of semiconductor wafers is often used to achieve certain desired properties. For example, such a process can be used to produce a defect-free silicon layer on a wafer or to form a silicon nitride film. Such high temperature processes are usually performed in a vertical furnace that subjects the wafer to elevated temperatures.

[0003] During such high temperature heat treatment, the wafers must be adequately supported to avoid slipping or deformation due to local gravity and thermal stress. In some processes, vertical wafer boats are used to adequately support semiconductor wafers. Utility Model Content

[0004] In one embodiment of the present disclosure, a method for processing a substrate includes: supporting a substrate in a substrate holder; activating a substrate holder transport mechanism and moving the substrate holder; and thermally treating the substrate in the substrate holder. The substrate holder transport mechanism includes a transport mechanism track, a substrate holder support base, a substrate holder support cover, a plurality of elastic components between the substrate holder support base and the substrate holder support cover, and a plurality of damping components between the substrate holder support base and the substrate holder support cover.

[0005] In another embodiment of the present disclosure, a substrate processing apparatus includes a substrate holder and a substrate holder transport mechanism. The substrate holder transport mechanism includes a transport mechanism track, a substrate holder support base, a substrate holder support cover, a plurality of elastic components between the substrate holder support base and the substrate holder support cover, and a plurality of damping components between the substrate holder support base and the substrate holder support cover.

[0006] In another embodiment of the present disclosure, a thermal treatment system includes a substrate boat, a substrate boat elevator, and a thermal treatment chamber. The substrate boat elevator includes a boat elevator track, a boat elevator arm base connected to the boat elevator track, a boat elevator arm cover, three springs between the upper surface of the boat elevator arm base and the lower surface of the boat elevator arm cover, and a plurality of adjustable damping components between the upper surface of the boat elevator arm base and the lower surface of the boat elevator arm cover. Each of the plurality of adjustable damping components includes an upper portion and a lower portion connected by a threaded component. Each of the upper portion and the lower portion includes a damping material section attached to a connector section. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] When read in conjunction with the accompanying drawings, various aspects of the present disclosure can be best understood from the following detailed description. It should be noted that, in accordance with industry standard practice, various features are not drawn to scale. In fact, for the sake of clarity of discussion, the size of various features can be increased or reduced at will.

[0008] Figure 1 is a diagram schematically showing a perspective view of a substrate processing apparatus according to one or more embodiments described herein;

[0009] Figure 2 is a diagram schematically showing a longitudinal section of a processing furnace of a substrate processing apparatus according to an embodiment described herein;

[0010] Figure 3 is a diagram schematically showing an enlarged view of a main configuration of a substrate holder and a substrate holder transport mechanism according to an embodiment described herein;

[0011] Figure 4 is a top view of a portion of a substrate holder transport mechanism according to an embodiment of the present disclosure;

[0012] Figure 5 is a top view of a portion of a substrate holder transport mechanism according to an embodiment of the present disclosure;

[0013] Fig. 6A and Figure 6B is a perspective view of a damping mechanism according to an embodiment of the present disclosure;

[0014] Figure 7 is a schematic side view of a portion of a substrate holder transport mechanism according to an embodiment of the present disclosure.

[0015] Figure 8 is a flow chart of a method according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0016] Many different embodiments or examples for implementing the different features of the provided subject matter are provided below. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first feature above or on a second feature may include an embodiment in which the first and second features are formed in direct contact, and may also include an embodiment in which an additional feature may be formed between the first and second features so that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and / or letters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself dictate the relationship between the various embodiments and / or configurations discussed.

[0017] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "above," etc. may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0018] One embodiment described herein is a method for processing a substrate in a substrate processing device, which includes a support member, such as a substrate boat, for supporting a substrate having a front side and a rear side. The substrate boat includes a top plate, a bottom plate, and a plurality of boat rods extending between the top plate and the bottom plate. Each of the plurality of boat rods includes a finger, the finger including a substrate contact surface for receiving and supporting the substrate. The substrate contact surface contacts the lower side of the substrate supported by the substrate boat. The substrate support or substrate holder moves within the substrate processing device through several different substrate support transmission mechanisms. For example, one example of a substrate transmission mechanism includes an elevator for moving the substrate support along a vertical direction. Another example of a substrate transmission mechanism is a robot for moving the substrate support in a horizontal direction. According to an embodiment of the present disclosure, the substrate transmission mechanism includes a combination of elastic components and damping components arranged purposefully to absorb forces acting on the substrate support, such as unexpected seismic forces. In embodiments described herein, the substrate processing device may be a furnace for heating / annealing a substrate. In some embodiments, a process for forming a thin film on a substrate is performed in the substrate processing device. An example of a process for forming thin films is atomic layer deposition.

[0019] refer to Figure 1 and Figure 2 The substrate processing apparatus 1 includes a housing 2. A front maintenance port 4 as a maintenance opening is provided at a lower portion of a front wall 3 of the housing 2. The front maintenance port 4 is opened or closed by a front maintenance door 5.

[0020] A box loading and unloading port 6 is provided at the front wall 3 of the housing 2 so as to communicate with the inside and outside of the housing 2. The box loading and unloading port 6 can be opened or closed by a front baffle (not shown). A loading port (loading port rack) 7 is provided at the box loading and unloading port 6. The loading port 7 is configured so that the box 8 is aligned when placed on the loading port 7.

[0021] The cassette 8 is a sealed substrate container. The cassette 8 may be transferred into the load port 7 by an in-process transfer device (not shown) and placed on the load port 7, and may be transferred from the load port 7 by the in-process transfer device.

[0022] The box rack 9 is arranged at the substantially central part of the front-back direction of the housing 2. The box rack 9 is configured to store a plurality of boxes including boxes 8 in multiple stages and rows. A transfer rack 12 is arranged at the box rack 9, and the transfer rack 12 is configured to accommodate the boxes 8 transferred by the wafer transfer structure (hereinafter also referred to as "transfer device") 11. A spare box rack 13 is arranged above the loading port 7, and the spare box rack 13 is configured to store spare boxes 8.

[0023] A box transport device 14 is provided between the loading port 7 and the box rack 9. The box transport device 14 may be composed of a box elevator 15 which is capable of holding (or supporting) the box 8 while moving along the Figure 1 The box 8 is lifted in the CZ axis direction as shown; and the box transport structure 16 can be moved along Figure 1 The CX-axis direction and the CS-axis direction shown carry out the forward, backward and rotational motion of the box 8. In cooperation with the box elevator 15 and the box transmission structure 16, the box transmission device 14 is configured so that the box 8 can be transmitted between the loading port 7, the box rack 9 and the spare box rack 13.

[0024] The conveying device 11 is provided at the rear of the cassette rack 9. For example, the conveying device 11 is composed of a wafer conveying device 18 capable of rotating or horizontally moving the wafer 17 and a wafer conveying device elevator 19 capable of lifting and lowering the wafer conveying device 18.

[0025] The wafer transfer device 18 may include a predetermined number of wafer mounting plates (which are substrate supports) 21, on which a predetermined number of wafers including the wafer 17 are mounted. Figure 1 As shown, three wafers can be mounted on three wafer mounting plates 21. In cooperation with the wafer transfer device 18 and the wafer transfer device elevator 19, the transfer device 11 is configured to load the wafer 17 into the boat (substrate holder) 22 and unload the wafer 17 from the boat 22. In addition, a notch alignment device (not shown) as a substrate alignment device for aligning the circumferential position of the wafer 17 may also be provided near the transfer device 11.

[0026] A standby space 23 is provided in the rear area of ​​the housing 2, and the boat 22 is accommodated and stands by in the standby space 23, and a vertical processing furnace 24 is provided above the standby space 23. The processing furnace 24 may be composed of: a reaction tube 25, in which the wafer 17 is processed; and an inlet flange 26, which is provided at the lower end of the reaction tube 25. For example, the inlet flange 26 is made of stainless steel. The reaction chamber 27 is defined inside the processing furnace 24. A heater 56 is provided around the reaction chamber 27. The inlet flange 26 is cylindrical. A supply port and an exhaust port are provided on the circumferential surface of the inlet flange 26, and various processing gases are supplied into the reaction chamber 27 through the supply port, and the internal atmosphere of the reaction chamber 27 is discharged through the exhaust port. In addition, an upper flange and a lower flange are provided at the upper end and the lower end of the inlet flange 26, respectively, and an opening (also referred to as a "furnace port") is provided at the lower end of the lower flange.

[0027] The furnace port is opened or closed by a furnace port baffle (cover opening and closing structure) 33. The furnace port baffle 33 includes a cover 34. The furnace port baffle 33 is configured to open or close the furnace port by moving the cover 34 between a standby position and a furnace port position. In the standby position, the cover 34 is retracted to a position where the cover 34 does not contact other components such as the boat 22, and in the furnace port position, the cover 34 is configured to close the furnace port airtightly.

[0028] A substrate holder transport mechanism 35 is provided in the standby space 23, and the substrate holder transport mechanism 35 is configured to lift the substrate holder 22 (e.g., substrate boat) into the reaction chamber 27 or to lower the substrate holder 22 from the reaction chamber 27. A moving structure configured to insert the substrate holder 22 into the reaction chamber 27 and to pull the substrate holder 22 out of the reaction chamber 27 is composed of the substrate holder transport mechanism 35, the furnace side arm 36, and the base 37. A sealing cover 38 serving as a cover is horizontally provided on the base 37. The furnace side arm 36, the base 37, and the sealing cover 38 are lowered or raised by the substrate holder transport mechanism 35, resulting in the substrate holder 22 being introduced into the reaction chamber 27 or being removed from the reaction chamber 27.

[0029] A clean air supply structure (which is a clean air supplier) 44 is arranged at a position facing the substrate holder transport mechanism 35. The clean air supply mechanism 44 is composed of a supply fan and a dust filter to supply clean air such as an inert gas and clean atmosphere.

[0030] The clean air ejected from the clean air supply structure 44 circulates in components such as the transfer device 11 and the substrate holder 22. Thereafter, the clean air is exhausted from the housing 2 through the duct 45 provided above the cassette rack 9, or ejected into the housing 2 again through the clean air supply structure 44.

[0031] Figure 3The embodiment according to the present disclosure is shown Figure 1 and Figure 2 4. The substrate holder 22 is a portion of a substrate holder 22. The substrate holder 22 includes spaced apart support rods 40c and support rods 40f (e.g., boat rods) that are fixed at their tops to a top plate 41 of the boat and at their bottoms to a bottom plate 42 of the boat. This fixation helps to maintain the position of the rods relative to each other. When the substrate holder 22 is placed in a vertical processing chamber such as a furnace, the support rods 40c and support rods 40f are typically vertical. In the illustrated embodiment, the substrate holder 22 has a central rod (e.g., support rod 40c) and two front rods (e.g., support rod 40f). Figure 3 In the embodiment shown, the underside of the base plate 42 includes a coupling 46 located in the center of the base plate. The coupling may be connected to a drive mechanism, such as a substrate holder rotator 47 described in more detail below.

[0032] The support rods 40c and 40f each support a plurality of laterally extending retainer fingers (not shown). The fingers may be integrally formed on the support rods. Alternatively, cutouts or slots may be made in the elongated one-piece structure of the support rods 40c and 40f to form slots for accommodating the fingers and securing them to the support rods 40c and 40f. Each finger includes a top side on which the underside of the substrate 17 rests when the substrate 17 is placed in the boat 22. The fingers of the substrate holder 22 are arranged in groups in different common substantially horizontal planes along the vertical length of the support rods 40c and 40f. The fingers located on the same substantially horizontal plane engage and support the same substrate 17. The fingers located on the same substantially horizontal plane contact the back side of the common substrate 17. The entire substrate holder 22 may be made of quartz, silicon carbide material, or other suitable materials that are mechanically stable and chemically inert relative to the processing conditions (including high temperatures) to which it will be exposed.

[0033] In use, the substrate holder 22 is prepared by placing a substrate (e.g., wafer 17) into the substrate holder 22 so that each wafer is placed on the top surface of three holder fingers located in the same horizontal plane. Wafers can be loaded into the substrate holder 22 boat by a robot. Once the substrate holder 22 is loaded with a predetermined number of wafers, the substrate holder is received into the processing chamber, where a high temperature heat treatment or other heat treatment is performed. After the heat treatment and other treatments, the wafer, the substrate holder 22 is removed from the processing chamber and the wafer is unloaded from the substrate holder 22, for example, using a robot.

[0034] Figure 3 Show Figure 1 and Figure 2 A schematic diagram of a portion of a substrate processing apparatus is shown. Figure 3 An embodiment of a substrate processing apparatus is shown that utilizes a substrate holder 22 in the form of a substrate boat; however, embodiments of the present disclosure are not limited to substrate processing apparatus utilizing a substrate boat. For example, the force absorption system described in more detail below can be implemented in a substrate processing apparatus utilizing a substrate holder 22 that is not a substrate boat. Figure 3 The portion of the substrate processing apparatus shown includes a substrate holder transport mechanism 35, such as a substrate holder elevator, which includes a substrate holder transport mechanism track 39, a substrate holder support, and the substrate holder support includes a substrate holder support base 102, a substrate holder support cover 104, a plurality of elastic components 106, and a plurality of damping components 108, wherein the plurality of elastic components 106 and the plurality of damping components 108 are between the substrate holder support base 102 and the substrate holder support cover 104.

[0035] refer to Figure 7 and Figure 3 In combination, embodiments according to the present disclosure are related to substrate processing equipment and systems including force absorbing subsystems or damping systems. The force absorbing subsystem or damping subsystem formed according to the present disclosure absorbs abnormal external forces applied to a substrate holder processed by the substrate processing equipment or system. During normal operation in the absence of abnormal external forces, the substrate holder 22 will be subjected to normal forces caused by the normal operation of the substrate holder transmission mechanism 35. Such normal forces include vibrations or oscillations originating from a drive mechanism that moves or rotates the substrate holder, such as a substrate holder elevator. An example of an abnormal external force includes a force caused by an unexpected seismic event (such as an earthquake). Figure 7 The figure above shows the state of the force absorbing subsystem during normal operation when there are no abnormal, undesirable external forces. Figure 7 In the above figure, the elastic components 106a, 106b and 106n support the substrate holder support cover 104 above the substrate holder support base 102 in a generally horizontal position relative to the vertical gravity vector. When no abnormal, undesirable external forces are applied to the substrate holder, the elastic components 106a, 106b and 106n provide effective stability to the substrate holder support cover 104, help to maintain the substrate holder support cover 104 in a desired position and minimize movement of the substrate holder, which may cause the substrate supported in the substrate holder to move and be damaged. Figure 7The following figure in illustrates an abnormal, undesirable external force acting on a substrate holder, such as a seismic event, and the impact of such abnormal force may cause the substrate holder support cover 104 to move, particularly the movement of the substrate holder support cover 104 relative to the substrate holder support base 102. For example, during a seismic event, the substrate holder support cover 104 may move from a horizontal position to an undesirable angular position shown in the following figure. Such movement may cause the substrate within the substrate holder to move and become damaged. Additionally, such movement may have a frequency that causes the substrate within the substrate holder to be jostled and moved in a manner that may cause damage to the substrate. In Figure 7 In the lower figure of FIG. 1 , at least the elastic member 106b is capable of compressing and absorbing some of the movement of the substrate holder support member out of the horizontal plane. According to an embodiment of the present disclosure, the damping member 108b is used to damp the movement of the substrate holder support cover 104 by contacting the lower side of the substrate holder support cover 104 and absorbing (e.g., by compressing) a portion of the force generated by the abnormal movement of the substrate holder support cover 104. Therefore, according to an embodiment of the present disclosure, the damping members 108a, 108b and 108n and the elastic members 106a, 106b and 106n are combined to limit the movement of the substrate holder support cover 104 and suppress the frequency of movement of the substrate holder support cover 104 when the substrate holder support member is subjected to abnormal, undesirable external forces.

[0036] refer to Figure 3 The substrate holder transport mechanism 35 includes a substrate holder transport mechanism track 39. Figure 3 In the embodiment of the present invention, the substrate holder transport mechanism rail 39 is oriented in a vertical direction. The substrate holder transport mechanism rail 39 includes a drive mechanism (not shown) designed to cooperate with the substrate holder arm 110 to move the substrate holder arm 110 up and down along the substrate holder transport mechanism rail 39. The substrate holder arm 110 includes a side attached to the substrate holder transport mechanism rail 39 and another side opposite to the side attached to the substrate holder transport mechanism rail 39 and connected to the substrate holder support base 102. In the embodiment shown, the substrate holder support base 102 is a rectangular plate extending along a horizontal plane. The substrate holder support base 102 includes a transport holder rotation mechanism 47 for coupling to a rotation coupling 46 of the substrate holder 22. The transport holder rotation mechanism 47 includes a drive mechanism that causes the substrate holder to rotate when activated. The substrate holder support base 102 includes an upper surface 102u. The upper surface 102u supports the lower ends of three damping components 108 and the lower ends of three elastic components 106. The following reference Figure 4 , Figure 5 , Fig. 6A and Figure 6BDetails of the structures and positions of the three damping members 108 and the three elastic members 106 are provided. The upper end of each of the three elastic members 106 contacts the lower surface 1041 of the substrate holder support cover 104. In some embodiments, the upper end of each of the three elastic members 106 is connected to the lower surface 1041 of the substrate holder support cover 104. In some embodiments, the three damping members 108 rest on the substrate holder support base 102 but are not attached to the substrate holder support base 102. In other embodiments, one or more of the three damping members 108 may be attached to the substrate holder support base 102. When the substrate holder transfer mechanism 35 operates under normal conditions without any abnormal, undesirable external forces, the upper end of each of the three damping members 108 is very close to but does not contact the lower surface 1041 of the substrate holder support 104. During normal operation, the distance between the upper surface of the damping member 108 and the lower surface 1041 of the substrate holder support cover 104 can vary, depending on the amount of movement of the substrate holder support cover 104 that can be tolerated during exposure of the substrate holder support cover 104 to abnormal, unwanted external forces. When abnormal, unwanted external forces act on the substrate holder support cover 104, as described above, the lower surface 1041 of the substrate holder support cover 104 may contact the upper surface of one or more damping members 108. In this way, the extent of movement and the intensity of oscillation of the substrate holder support cover 104 relative to the substrate holder support base 102 are attenuated and minimized. Figure 3 , the upper surface 102u of the substrate holder support base 102 and the lower surface 1041 of the substrate holder support cover 104 are separated by a distance indicated by a height H.

[0037] Figure 4 The above reference Figure 3 and Figure 7 A top view of the substrate holder transport mechanism 35 is depicted. Figure 4 In FIG. 1 , the position of the substrate holder support cover 104 is indicated by a dotted line so that the positions of the elastic member 106 and the damping member 108 below can be easily observed. Figure 3 and Figure 4 The embodiment of FIG. 1 shows a substrate holder transport mechanism 35 including three elastic components (106a, 106b, and 106n) and three damping components (108a, 108b, and 108n). According to other embodiments, the substrate holder transport mechanism may include more than three elastic components and more than three damping components. Figure 4In the embodiment of the present invention, the three elastic members (106a, 106b and 106n) are circular springs. Each circular spring includes a central axis D, which is located at a corresponding one of the three vertices of the isosceles triangle X. The centroid C of the isosceles triangle X is located at the center of the substrate holder support cover 104. Examples of suitable circular springs include circular springs for supporting the substrate holder support cover 104 of a furnace for processing semiconductor substrates, such as semiconductor wafers.

[0038] exist Figure 4 , a portion of the substrate holder support cover 104 that overlaps the substrate holder support base 102 and does not overlap the isosceles triangle X is shaded and corresponds to a damping region V in which one or more damping components 108 are positioned, according to an embodiment of the present disclosure. Figure 4 In the embodiment of FIG. 1 , three damping members ( 108 a , 108 b , and 108 n ) are located in the damping region V. When the damping members 108 a , 108 b , and 108 n are located in the damping region V, they can contact the substrate holder support cover 104 at positions where the elastic members 106 a , 106 b , and 106 n do not contact the substrate holder support cover 104 .

[0039] exist Figure 5 , further details of the positions of the resilient member 106 and the damping member 108 are shown. Figure 5 In the embodiment, the elastic member 106 and the damping member 108 are shown in the same manner as in the above reference Figure 4 Generally, the position of the damping member reflects the position of the elastic member located on the opposite side of the center of mass C. When arranged in these positions, the substrate holder support cover 104 is rotated about the rotation axis (e.g. Figure 5 The possibility of the rotating shaft 118) rotating is reduced. Figure 5 In the embodiment, there is a first angle α between the ray 114 and a line L extending through the central axis D of the elastic member 106n, the position of the center of mass C, and the central axis D of the damping member 108n. There is a second angle β between the ray 116 and the line L. In some embodiments, the angle α and the angle β are less than 30°. In some embodiments, the angle α and the angle β are equal. In other embodiments, the angle α and the angle β are not less than 30°. When the angle α and the angle β are not less than 30°, the possibility of rotation about a rotation axis similar to the rotation axis 118 increases compared to when the angle α and the angle β are greater than 30°. In some embodiments, the angle α and the angle β are not equal. Figure 5 In the embodiment of FIG. 1 , the damping member 108 n is located between the ray 114 and the ray 116 .

[0040] Fig. 6A and Figure 6BAn example of an adjustable damping component 108 formed in accordance with an embodiment of the present disclosure is shown. Fig. 6A and Figure 6B The damping member 108 in the embodiment includes an upper portion 120 and a lower portion 122. Since the upper portion 120 and the lower portion 122 are mirror images of each other, the following description of the upper portion 120 also applies to the lower portion 122. The upper portion 120 includes a damping material section 124 and a connector section 126. Fig. 6A and Figure 6B In some embodiments, the damping material section 124 and the connector section 126 are both cylindrical in shape with a circular cross section. In other embodiments, the damping material section 124 and the connector section 126 are cylindrical in shape but do not have a circular cross section. For example, the damping material section 124 and the connector section 126 have an oval, elliptical, or polygonal cross section. In some embodiments, the damping material section 124 has a cross section that is different from the cross-sectional shape of the connector section 126.

[0041] In one embodiment, the connector section 126 is formed of a heat-resistant and corrosion-resistant material, such as stainless steel or some other metal or composite material. The connector section 126 of the upper portion 120 of the damping member 108 includes a lower surface 127, which includes a central hole having threads to receive one end of a threaded member 128 (e.g., a threaded rod). In some embodiments, the central hole extends completely through the connector section 126, while in other embodiments, the central hole does not extend completely through the connector section 126. The other end of the threaded member 128 is received in the threaded hole of the connector section 126 of the lower portion 122 of the damping member 108. The length of the damping member 108 can be adjusted by tightening the upper portion 120 and / or the lower portion 122 along the length of the threaded member 128 to adjust the position of the upper portion 120 relative to the lower portion 122. Embodiments according to the present disclosure are not limited to adjusting the length of the damping member 108 using threaded holes and threaded members. For example, in other embodiments, other configurations for making the length of the damping member 108 adjustable can be used.

[0042] The connector section 126 includes an upper surface 130 at one end of the connector section 126, the upper surface 130 being opposite to the end of the connector section 126 including the lower surface 127. The upper surface 130 of the connector section 126 is connected to the damping material section 124. The upper surface 130 of the connector section 126 can be connected to the damping material section 124 in several different ways, such as by an adhesive, by a mechanical fastener, or by other means. As described above, the lower portion 122 is a mirror image of the upper portion 120. The damping material section 124 of the upper portion 120 includes an upper surface 132, which is opposite to the surface of the damping material section 124 adjacent to the upper surface 130 of the connector section 126. As described above, the above description of the upper portion 120 is equally applicable to the lower portion 122. The damping material section 124 is formed of a material having a spring constant that is less than the spring constant of the elastic member 106. Examples of materials forming the damping material section 124 include nitrile rubber (NBR) or Viton TM brand high performance fluoroelastomer. The material of the damping material section 124 exhibits a damping ratio greater than 0.1 or greater than 0.5. The damping ratio (ζ) is a dimensionless measure that describes how oscillations in a system decay after being disturbed. Many systems exhibit oscillatory behavior when disturbed in a static equilibrium position. For example, a mass suspended on a spring, if pulled and released, may bounce up and down. With each bounce, the system tends to return to the equilibrium position, but it will exceed the equilibrium position. Sometimes, losses (such as friction losses) inhibit the system and may cause the amplitude of the oscillation to gradually decay to zero or weaken. The damping ratio is a measure that describes how quickly the vibration decays from one bounce to the next. The material of the damping material section 124 should also resist damage or decay when exposed to temperatures above 30°C and above 100°C in other embodiments.

[0043] In some embodiments, the height of the damping member 108 is greater than 1 cm and less than the height H. In some embodiments, the height H may be 20 cm or less. In other embodiments, the height H may be greater than 20 cm.

[0044] According to some embodiments, during an abnormal, unexpected seismic event, the upper surface 132 of the damping material section 124 that may contact the lower surface 1041 of the substrate holder support cover 104 has a larger surface area than the contact area between the lower surface 1041 and the resilient member 106. Figure 3 , Figure 4 and Figure 5In the embodiment of the present invention, the combined surface area of ​​the upper surfaces 132 of the damping material sections 124 of the damping members 108a, 108b, and 108n is greater than the combined surface area of ​​the contact between the lower surface 1041 and the elastic members 106a, 106b, and 106n. When the combined surface area of ​​the upper surfaces 132 of the damping material sections 124 of the damping members 108a, 108b, and 108n is greater than the combined surface area of ​​the contact between the lower surface 1041 and the elastic members 106a, 106b, and 106n, favorable damping of movement of the substrate holder support cover 104 caused by abnormal external force can be achieved.

[0045] According to some embodiments of the present disclosure, the coefficient of static friction μ between the material of the damping material section 124 and the material of the substrate holder support base 102 is selected such that the risk of the damping member 108 sliding on the substrate holder support base 102 to a position where its ability to dampen movement of the substrate holder support cover 104 would be impaired is minimized. In some embodiments, the coefficient of static friction μ between the material of the damping material section 124 and the material of the substrate holder support base 102 is greater than about 0.14. For embodiments where the damping member 108 rests on the substrate holder support base 102 but is not secured to the substrate holder support base 102, this degree of static friction reduces the risk of the damping member 108 sliding on the substrate holder support base 102 to a position where its ability to dampen movement of the substrate holder support cover 104 would be impaired.

[0046] According to an embodiment of the present disclosure, the damping member 108 and the elastic member 106 may be positioned at different locations on the surface of the substrate holder support base 102. Figure 4 and Figure 5 In the illustrated embodiment, the distance between the damping member 108n and the elastic member 106n is greater than X1+X2, wherein the distance X1 is equal to the distance between the central axis D of the elastic member 106n and the centroid C of the isosceles triangle X, the centroid C of the isosceles triangle X coincides with the central axis of the substrate holder support cover 104, and the distance Wherein H is the distance between the lower surface 1041 of the substrate holder support cover 104 and the upper surface 102u of the substrate holder support base 102 .

[0047] Figure 8 800 is a flow chart of a method 800 for processing a substrate according to an embodiment of the present disclosure. The various steps of the method 800 can be performed using the above-mentioned substrate processing apparatus / system. The method 800 begins with operation 802, supporting a substrate in a substrate holder, such as the one described above with reference to Figure 3The method 800 continues to operation 804. Operation 804 includes activating the substrate holder transport mechanism and moving the substrate holder 22 from one position to a different position within the substrate processing system. Operation 804 can be performed by activating the substrate holder transport mechanism described above. Figure 3 The substrate holder transport mechanism 35 described above is carried out. Figure 8 In an embodiment, the substrate holder transport mechanism is subjected to an abnormal external force (e.g., a seismic force) (see operation 806). When the abnormal seismic force is large enough or has a sufficient frequency to cause a portion of the substrate holder transport mechanism (e.g., the substrate holder support base 102) to vibrate, oscillate, or move in some other undesirable manner outside of normal process tolerances, the method 800 proceeds to operation 808. At operation 808, as described above with reference to Figure 2 , Figure 4 and Figure 7 As described above, the unwanted abnormal movement of the substrate holder transport mechanism is damped by the action of the elastic member 106 and the damping member 108. Thereafter, the method 800 continues at operation 810 to heat-treat the substrate in the substrate holder.

[0048] Thermal treatment methods and systems have utility in atomic layer deposition processes. In atomic layer deposition processes, excited species of process gases may be generated to assist atomic layer deposition. These species may be excited by plasma assistance, UV assistance (light assistance), ion assistance (e.g., ions generated by an ion source), or a combination thereof. The species is excited in or near a processing region within a chamber housing to avoid relaxation of excited states before the ions reach a processing region of a batch processing chamber. The ALD process may be performed in a chamber that is also capable of thermally treating a substrate, such as the substrate processing apparatus or system described above. Embodiments of the present disclosure include other material deposition processes that may be performed in a chamber capable of thermally treating a substrate.

[0049] In one embodiment of the present disclosure, a method for processing a substrate includes the step of supporting a substrate in a substrate holder. According to the method, a substrate holder transport mechanism is activated, causing the substrate holder to move. The substrate holder transport mechanism includes a transport mechanism track, a substrate holder support base, a substrate holder support cover, a plurality of elastic components between the substrate holder support base and the substrate holder support cover, and a plurality of damping components between the substrate holder support base and the substrate holder support cover. The method also includes heat treating the substrate in the substrate holder. In some embodiments, supporting the substrate in the substrate holder includes supporting the substrate in a substrate boat. In some embodiments, heat treating the substrate in the substrate holder includes forming a thin film on the substrate. In some embodiments, the method also includes absorbing abnormal movement of the substrate holder support cover relative to the substrate holder support base by a plurality of elastic components and a plurality of damping components. In some embodiments, absorbing abnormal movement of the substrate holder support cover relative to the substrate holder support base also includes damping abnormal movement of the substrate holder support cover relative to the substrate holder support base. In some embodiments, damping abnormal movement of the substrate holder support cover relative to the substrate holder support base includes maintaining the position of the plurality of damping components relative to the substrate holder support base. In some embodiments, absorbing abnormal movement of the substrate holder support cover relative to the substrate holder support base further comprises compressing one or more of the plurality of elastic components and bringing one or more of the plurality of damping components into contact with the substrate holder support cover. In some embodiments, compressing one or more of the plurality of elastic components comprises compressing one or more of the plurality of springs between the substrate holder support base and the substrate holder support cover.

[0050] In another embodiment of the present disclosure, a substrate processing device includes a substrate holder and a substrate holder transmission mechanism. The substrate holder transmission mechanism includes a transmission mechanism track, a substrate holder support base, a substrate holder support cover, a plurality of elastic components between the substrate holder support base and the substrate holder support cover, and a plurality of damping components between the substrate holder support base and the substrate holder support cover. In some embodiments, the spring constant of each of the plurality of elastic components is greater than the spring constant of each of the plurality of damping components. In some embodiments, the plurality of elastic components are a plurality of springs. In some embodiments, the substrate holder is a substrate boat. In some embodiments, the substrate holder transmission mechanism is a boat elevator. In some embodiments, the substrate is a semiconductor wafer. In some embodiments, the plurality of damping components include at least one damping component, the at least one damping component including an upper component spaced a distance from a lower component, and the distance is adjustable. In some embodiments, a threaded component extends between the upper component and the lower component.

[0051] In another embodiment of the present disclosure, a heat treatment system is provided, which includes a substrate boat as described above. The system also includes a substrate boat elevator, which includes a boat elevator track, a boat elevator arm base connected to the boat elevator track, a boat elevator arm cover, three springs between the upper surface of the boat elevator arm base and the lower surface of the boat elevator arm cover, and a plurality of adjustable damping components between the upper surface of the boat elevator arm base and the lower surface of the boat elevator arm cover. In some embodiments, each of the plurality of adjustable damping components includes an upper portion and a lower portion connected by a threaded component, and each of the upper portion and the lower portion includes a damping material section attached to a connector section. The system also includes a heat treatment chamber. In some embodiments, the connector section includes a threaded hole. In some embodiments, the threaded component is a threaded rod. In some embodiments, there is a static friction coefficient greater than 0.14 between the damping material section and the upper surface of the boat elevator arm base.

[0052] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the various aspects of the present disclosure. Those skilled in the art will appreciate that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art will also appreciate that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions, and modifications without departing from the spirit and scope of the present disclosure.

Claims

1. A substrate processing device, characterized in that: include: substrate holder; as well as A substrate holder transport mechanism comprising: Transmission mechanism tracks; a substrate holder support base; a substrate holder support cover; a plurality of elastic members between the substrate holder support base and the substrate holder support cover; and A plurality of damping components are between the substrate holder support base and the substrate holder support cover.

2. The substrate processing equipment according to claim 1, characterized in that: A spring constant of each of the plurality of elastic members is greater than a spring constant of each of the plurality of damping members.

3. The substrate processing equipment according to claim 1, characterized in that: The plurality of elastic members are a plurality of springs.

4. The substrate processing equipment according to claim 1, characterized in that: The substrate holder is a substrate boat.

5. The substrate processing equipment according to claim 1, characterized in that: The plurality of damping members include at least one damping member including an upper member spaced apart from a lower member by a distance, the distance being adjustable.

6. The substrate processing equipment according to claim 5, characterized in that: A threaded member extends between the upper member and the lower member.

7. A heat treatment system, characterized in that: include: substrate boat; Substrate boat elevator, including: Boat lift tracks; A boat elevator arm base connected to the boat elevator track; Boat lift arm covers; three springs between an upper surface of the boat elevator arm base and a lower surface of the boat elevator arm cover; and a plurality of adjustable damping members between the upper surface of the boat elevator arm base and the lower surface of the boat elevator arm cover, each of the plurality of adjustable damping members comprising an upper portion and a lower portion connected by a threaded member, each of the upper portion and the lower portion comprising a damping material section attached to a connector section; and Heat treatment chamber.

8. The heat treatment system according to claim 7, characterized in that: The connector section includes a threaded hole.

9. The heat treatment system according to claim 7, characterized in that: The threaded component is a threaded rod.

10. The heat treatment system according to claim 7, characterized in that: There is a static coefficient of friction greater than 0.14 between the damping material section and the upper surface of the boat elevator arm base.

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