LED lamp bead

Abstract

The utility model belongs to the technical field of display, and relates to an LED lamp bead. The LED lamp bead comprises a substrate, a light-emitting chip and a driving chip, the substrate is provided with a coarsening bonding pad and a connecting bonding pad, the coarsening bonding pad is provided with an etching area, the etching area comprises a plurality of convex parts and concave parts which are alternately arranged, the surface of each convex part is provided with a heat conduction layer, and the surface of each concave part is provided with a heat conduction layer. The driving chip is arranged on the etching area and makes contact with the heat conduction layer, the light-emitting chip is arranged on the connecting bonding pad, and the driving chip is electrically connected with the light-emitting chip. According to the LED lamp bead, the heat conduction layer on the surface of the convex part absorbs heat generated by the driving chip, and the concave part forms a heat circulation channel, so that the heat of the driving chip can be quickly dissipated, the service life of the LED lamp bead is prolonged, the luminous efficiency is high, the display effect is good, the stability is high, and the product yield of the LED lamp bead is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to an LED lamp bead. Background Art

[0002] Most existing LED lamp beads use driver chips to regulate the light-emitting chips. However, the driver chips generate a lot of heat when working, which leads to a shortened life of the LED lamp beads, low luminous efficiency, poor display effect and poor stability. Utility Model Content

[0003] The embodiment of the present application is to provide an LED lamp bead, which is used to solve the problems in the prior art that the LED lamp bead driver chip heats up, resulting in a shortened LED lamp bead life, low luminous efficiency, poor display effect and poor stability.

[0004] In order to solve the above technical problems, the present application provides an LED lamp bead, which adopts the following technical solution:

[0005] An LED lamp bead comprises a substrate, a light-emitting chip and a driving chip, wherein a roughened pad and a connecting pad are provided on the substrate, the roughened pad has an etched area, the etched area comprises a plurality of alternately arranged raised portions and recessed portions, a heat-conducting layer is provided on the surface of the raised portion, the driving chip is arranged on the etched area and contacts the heat-conducting layer, the light-emitting chip is arranged on the connecting pad, and the driving chip is electrically connected to the light-emitting chip.

[0006] Furthermore, the connecting pads include a first pad, a second pad and several third pads, the light-emitting chip is flip-chip mounted on the first pad, at least one resistor is connected between the first pad and the second pad, and the driving chip is respectively connected to the first pad, the second pad and the third pad through gold wires.

[0007] Furthermore, the first pad includes a first sub-pad and a second sub-pad, the two poles of the light-emitting chip are respectively connected to the first sub-pad and the second sub-pad, the driving chip is connected to the first sub-pad through the gold wire, and the resistor is connected between the first sub-pad and the second pad.

[0008] Furthermore, the surface of the recessed portion is also provided with the heat conducting layer.

[0009] Further, the ratio of the depth of the recessed portion to the thickness of the roughened pad is 1:5; and / or

[0010] The width of the recessed portion is 5 to 10 um.

[0011] Furthermore, the ratio of the thickness of the heat conducting layer to the depth of the recessed portion is 1:4.

[0012] Furthermore, the ratio of the length of the etching area to the length of the driving chip is (0.8-1):1.

[0013] Furthermore, the width of the etched area is greater than the width of the driver chip.

[0014] Furthermore, the heat conducting layer on the protruding portion and the roughened pad are located on the same horizontal plane.

[0015] Furthermore, the driving chip has a mounting surface connected to the etching area, and the ratio of the contact area between the mounting surface and the heat conductive layer to the surface area of ​​the mounting surface is (0.7-1):1.

[0016] Compared with the prior art, the embodiments of the present application mainly have the following beneficial effects: when the driver chip is working, the heat-conducting layer on the surface of the raised portion absorbs the heat generated by the driver chip, and the recessed portion forms a heat flow channel, so that the heat of the driver chip can be quickly dissipated, thereby extending the life of the LED lamp beads, increasing the luminous efficiency, improving the display effect and the stability, and improving the product yield of the LED lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the scheme of the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a schematic diagram of the structure of an LED lamp bead provided in an embodiment of the present application;

[0019] Figure 2 yes Figure 1 Schematic diagram of the structure after hiding the driver chip and light-emitting chip;

[0020] Figure 3 It is a structural schematic diagram of a roughened solder pad in an LED lamp bead provided in an embodiment of the present application;

[0021] Figure 4 yes Figure 3 Side view of.

[0022] Figure numerals: 1. substrate; 2. light-emitting chip; 21. red light chip; 22. green light chip; 23. blue light chip; 3. driving chip; 4. roughened pad; 41. etching area; 42. raised portion; 43. recessed portion; 44. thermal conductive layer; 5. connecting pad; 51. first pad; 511. first sub-pad; 512. second sub-pad; 52. second pad; 53. third pad. DETAILED DESCRIPTION

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0024] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0025] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0026] The present application embodiment provides an LED lamp bead, such as Figures 1 to 4 As shown, the LED lamp bead includes a substrate 1, a light-emitting chip 2 and a driving chip 3. The substrate 1 is provided with a roughened pad 4 and a connecting pad 5. The roughened pad 4 has an etched area 41. The etched area 41 includes a plurality of alternately arranged protrusions 42 and recessed portions 43. The surface of the protrusion 42 is provided with a thermal conductive layer 44. The driving chip 3 is arranged on the etched area 41 and in contact with the thermal conductive layer 44. The light-emitting chip 2 is arranged on the connecting pad 5. The driving chip 3 is electrically connected to the light-emitting chip 2.

[0027] The beneficial effect of an LED lamp bead provided in an embodiment of the present application is that when the driving chip 3 is working, the heat-conducting layer 44 on the surface of the protrusion 42 absorbs the heat generated by the driving chip 3, and the recessed portion 43 forms a heat flow channel, so that the heat of the driving chip 3 can be quickly dissipated, thereby extending the life of the LED lamp bead, increasing the luminous efficiency, improving the display effect and high stability, and improving the product yield of the LED lamp bead.

[0028] like Figure 3 As shown, in order to facilitate the distinction between the protrusions 42 and the depressions 43 in the etched region 41 , the depressions 43 are filled with oblique lines.

[0029] In this embodiment, the driver chip 3 is connected to the etched area 41 through a bonding adhesive. Since the etched area 41 has a protrusion 42 and a depression 43, the surface of the etched area 41 is roughened, so that the driver chip 3 can be connected to the roughened pad 4 with high stability.

[0030] In this embodiment, the etched region 41 of the roughened pad 4 is obtained by an etching process.

[0031] In this embodiment, the heat conducting layer 44 is disposed on the roughened pad 4 by a laser sputtering process.

[0032] Furthermore, the connecting pad 5 includes a first pad 51, a second pad 52 and a plurality of third pads 53, the light-emitting chip 2 is flip-chip mounted on the first pad 51, at least one resistor is connected between the first pad 51 and the second pad 52, and the driving chip 3 is respectively connected to the first pad 51, the second pad 52 and the third pad 53 through gold wires.

[0033] In the present embodiment, the light-emitting chip 2 is flip-chip mounted on the first pad 51, and the connection point between the driving chip 3 and the light-emitting chip 2 is on the first pad 51, thereby avoiding the phenomenon that the gold wire does not stick to the electrode when welding from the driving chip 3 to the light-emitting chip 2. In addition, compared with the solution of mounting the light-emitting chip 2 upright on the first pad 51, the present application reduces the number of welding wires, thereby improving production efficiency.

[0034] In this embodiment, the resistor plays a role in protecting the circuit, thereby protecting the use of the light emitting chip 2.

[0035] In this embodiment, the resistance value of the resistor is 1-3.9Ω.

[0036] In this embodiment, the number of the resistors is two.

[0037] like Figure 1As shown, further, the light-emitting chip 2 includes a red light chip 21, a green light chip 22 and a blue light chip 23, and the red light chip 21, the green light chip 22 and the blue light chip 23 are respectively connected to the current output ends corresponding to the driving chip 3, and the number of the third pad 53 and the first sub-pad 511 is three, and the third pad 53 is used for grounding.

[0038] It should be noted that Figure 1 The installation positions of the red light chip 21 , the green light chip 22 and the blue light chip 23 are only examples and can be adjusted according to actual use, and this application does not limit them here.

[0039] Furthermore, the first pad 51 includes a first sub-pad 511 and a second sub-pad 512, the two poles of the light-emitting chip 2 are respectively connected to the first sub-pad 511 and the second sub-pad 512, the driving chip 3 is connected to the first sub-pad 511 through the gold wire, and the resistor is connected between the first sub-pad 511 and the second pad 52.

[0040] In this embodiment, the electrical connection between the two electrodes of the light emitting chip 2 is achieved through the first sub-pad 511 and the second sub-pad 512 .

[0041] Furthermore, the surface of the recessed portion 43 is also provided with the heat conducting layer 44 .

[0042] In this embodiment, a heat conducting layer 44 is disposed on the surface of the recessed portion 43 to further improve the heat dissipation speed of the driving chip 3 .

[0043] Furthermore, the material of the heat-conducting layer 44 is selected from one of high-thermal-conductivity nanogel and graphene three-dimensional heat-conducting material.

[0044] In this embodiment, the high thermal conductivity nanogel not only has excellent thermal conductivity and flame retardant properties, but also has good mechanical properties and is stable in durability; the graphene three-dimensional thermal conductive material has high thermal conductivity and can reduce the impact on the bonding performance of the solid crystal glue.

[0045] Preferably, the material of the heat-conducting layer 44 is selected from graphene three-dimensional heat-conducting materials; graphene three-dimensional heat-conducting materials are low in price and have good stability.

[0046] Furthermore, the ratio of the depth of the recessed portion 43 to the thickness of the roughened pad 4 is 1:5.

[0047] In this embodiment, the ratio of the depth of the recessed portion 43 to the thickness of the roughened pad 4 is 1:5, so as to prevent the recessed portion 43 of the etched area 41 from penetrating the roughened pad 4, thereby improving the stability of the LED lamp bead.

[0048] Furthermore, the width of the recessed portion 43 is 5-10 um.

[0049] In some optional implementations of this embodiment, the width of the recessed portion 43 is any one of 5um, 6um, 7um, 8um, 9um, 10um, etc., or a range between any two of them.

[0050] Furthermore, the ratio of the thickness of the heat conducting layer 44 to the depth of the recessed portion 43 is 1:4.

[0051] In this embodiment, the ratio of the thickness of the heat conductive layer 44 to the depth of the recess 43 is 1:4 to prevent the heat conductive layer 44 from filling the recess 43 and to maintain the heat flow channel formed by the recess 43 so that the heat of the driving chip 3 can be quickly dissipated.

[0052] like Figure 3 As shown, the X direction in the figure is the length direction, and the Y direction in the figure is the width direction.

[0053] Furthermore, the ratio of the length of the etched region 41 to the length of the driver chip 3 is (0.8-1):1.

[0054] In this embodiment, the ratio of the length of the etched region 41 to the length of the driver chip 3 is (0.8-1):1, so as to ensure that the driver chip 3 can be disposed in the etched region 41 , thereby ensuring the heat dissipation effect of the driver chip 3 .

[0055] In some optional implementations of this embodiment, the ratio of the length of the etched region 41 to the length of the driving chip 3 is any one of 0.8:1, 0.85:1, 0.9:1, 0.95:1, 1:1, etc., or a range between any two of them.

[0056] Furthermore, the width of the etched region 41 is greater than the width of the driving chip 3 .

[0057] In this embodiment, the width of the etched region 41 is greater than the width of the driver chip 3 , so as to ensure that the driver chip 3 can be disposed in the etched region 41 , thereby ensuring the heat dissipation effect of the driver chip 3 .

[0058] Furthermore, the heat conducting layer 44 on the protruding portion 42 and the roughened pad 4 are located on the same horizontal plane.

[0059] In this embodiment, when the heat conductive layer 44 on the raised portion 42 is located on the same horizontal plane as the roughened pad 4, when the driver chip 3 is set, the driver chip 3 will not tilt even if it contacts the roughened pad 4, so as to facilitate the installation of the driver chip 3, thereby improving production efficiency.

[0060] Furthermore, the driving chip 3 has a mounting surface (not shown) connected to the etching area 41 , and the ratio of the contact area between the mounting surface and the heat conducting layer 44 to the surface area of ​​the mounting surface is (0.7-1):1.

[0061] In this embodiment, the ratio of the contact area between the mounting surface and the heat-conducting layer 44 to the surface area of ​​the mounting surface is (0.7-1):1, so as to ensure the heat dissipation effect of the driving chip 3 .

[0062] In some optional implementations of this embodiment, the ratio of the contact area between the mounting surface and the heat conductive layer 44 to the surface area of ​​the mounting surface is any one of 0.7:1, 0.8:1, 0.9:1, 1:1, etc., or a range between any two of them.

[0063] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. An LED lamp bead, characterized in that: The invention comprises a substrate, a light-emitting chip and a driving chip. The substrate is provided with a roughened pad and a connecting pad. The roughened pad has an etched area. The etched area comprises a plurality of alternately arranged raised portions and recessed portions. A heat-conducting layer is provided on the surface of the raised portion. The driving chip is arranged on the etched area and in contact with the heat-conducting layer. The light-emitting chip is arranged on the connecting pad. The driving chip is electrically connected to the light-emitting chip.

2. The LED lamp bead according to claim 1, characterized in that: The connecting pads include a first pad, a second pad and a plurality of third pads, the light-emitting chip is flip-chip mounted on the first pad, at least one resistor is connected between the first pad and the second pad, and the driving chip is respectively connected to the first pad, the second pad and the third pad through gold wires.

3. The LED lamp bead according to claim 2, characterized in that: The first pad includes a first sub-pad and a second sub-pad, the two poles of the light-emitting chip are respectively connected to the first sub-pad and the second sub-pad, the driving chip is connected to the first sub-pad through the gold wire, and the resistor is connected between the first sub-pad and the second pad.

4. The LED lamp bead according to any one of claims 1 to 3, characterized in that: The surface of the recessed portion is also provided with the heat conducting layer.

5. The LED lamp bead according to any one of claims 1 to 3, characterized in that: The ratio of the depth of the recessed portion to the thickness of the roughened pad is 1:5; and / or The width of the recessed portion is 5 to 10 um.

6. The LED lamp bead according to any one of claims 1 to 3, characterized in that: The ratio of the thickness of the heat conducting layer to the depth of the recessed portion is 1:

4.

7. The LED lamp bead according to any one of claims 1 to 3, characterized in that: The ratio of the length of the etching area to the length of the driving chip is (0.8-1):

1.

8. The LED lamp bead according to any one of claims 1 to 3, characterized in that: The width of the etched area is greater than the width of the driving chip.

9. The LED lamp bead according to any one of claims 1 to 3, characterized in that: The heat conducting layer on the protruding portion and the roughened pad are located on the same horizontal plane.

10. The LED lamp bead according to any one of claims 1 to 3, characterized in that: The driving chip has a mounting surface connected to the etching area, and the ratio of the contact area between the mounting surface and the heat conductive layer to the surface area of ​​the mounting surface is (0.7-1):1.

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