Air cooling assembly of heating lamp set and semiconductor process equipment

Abstract

The utility model provides an air cooling assembly of a heating lamp set, which comprises a bottom plate and an annular air inlet plate, the bottom plate is arranged at the bottom of the heating lamp set, the air inlet plate is connected to the bottom plate, an air inlet area is arranged on the air inlet plate, and the air inlet area is distributed around the bottom plate. According to the air cooling assembly of the heating lamp set and the semiconductor process equipment, the annular air inlet plate is arranged around the bottom plate at the bottom of the heating lamp set, and the air inlet area is formed in the circumferential direction of the air inlet plate, so that cooling air can uniformly flow to the heating lamp set at all positions in the circumferential direction of the air inlet plate, uniform cooling of the heating lamp set is achieved, and the service life of the heating lamp set is prolonged. And the cooling uniformity of each heating lamp is improved.

Description

Technical Field

[0001] The utility model relates to an air cooling component of a heating lamp group and semiconductor process equipment. Background Art

[0002] In the semiconductor processing process, such as the epitaxial growth process, it is necessary to use a heating lamp to heat the internal wafer through the dome of the reaction chamber to ensure that the wafer can quickly heat up to the optimal process temperature and improve the reaction efficiency of the process gas and the wafer. During the operation of the heating lamp, the temperature of the heating lamp itself continues to rise, and it is necessary to introduce external cooling air to cool the heating lamp to ensure that the heating lamp does not overheat. In order to improve the heating efficiency of the heating lamp and the uniformity of the temperature field inside the reaction chamber, multiple heating lamps are arranged along the circumference of the reaction chamber. The existing process equipment uses an air inlet on one side wall of the equipment shell to introduce cooling air to the heating lamp, and the cooling air is led out from the other side along the cooling path. In this way, the cooling air blown between the multiple heating lamps arranged in a ring outside the reaction chamber is different, so that the cooling amount of each heating lamp is different, and the cooling air volume of the heating lamp far away from the air inlet is always lower than the cooling air volume of the heating lamp facing the air inlet, resulting in the problem of overheating of the heating lamp far away from the air inlet. Utility Model Content

[0003] The utility model aims to provide an air cooling component of a heating lamp group and semiconductor process equipment, which has the advantage of uniform air intake.

[0004] To achieve the above object, the utility model provides an air cooling component of a heating lamp group, which comprises:

[0005] A bottom plate, the bottom plate is arranged at the bottom of the heating lamp group;

[0006] An annular air inlet plate is connected to the bottom plate, and an air inlet area is provided on the air inlet plate, and the air inlet area is distributed around the bottom plate.

[0007] Preferably, the air cooling component also includes an annular air guide plate, which surrounds the heating lamp group and is arranged between the heating lamp group and the air inlet plate. A gap is provided between the air guide plate and the bottom plate so that the cooling air entering the air inlet area flows through the bottom of the air guide plate.

[0008] Preferably, the air cooling component further comprises a protective ring, wherein the protective ring is connected to the base plate or the air inlet plate, and the protective ring is arranged between the inner ring of the air inlet plate and the air guide plate.

[0009] Preferably, the upper edge of the protective ring is not lower than the lower edge of the air guide plate.

[0010] Preferably, the protective ring is arranged perpendicular to the bottom plate.

[0011] Preferably, the air guide plate is arranged perpendicular to the bottom plate.

[0012] Preferably, the gap between the air guide plate and the bottom plate is 5-30 mm.

[0013] Preferably, the air inlet area includes a plurality of air inlets, and the plurality of air inlets are evenly distributed along the circumference of the air inlet plate.

[0014] Preferably, the air inlet is circular, and the diameter of the air inlet is greater than 30 mm; or,

[0015] The air inlet is a waist-shaped hole, and the distance between the two ends of the waist-shaped hole is greater than 30 mm; or,

[0016] The air inlet is elliptical, and the major diameter of the air inlet is greater than 30 mm.

[0017] Preferably, the number of the air inlets is greater than five.

[0018] Preferably, the air inlet area is an annular air inlet belt arranged along the circumference of the air inlet plate.

[0019] Preferably, the air inlet or the annular air inlet belt is provided with a protective mesh of matching shape, and the opening rate of the protective mesh is greater than 70%.

[0020] Preferably, the air inlet plate is lower than the bottom plate or is arranged in the same plane as the bottom plate.

[0021] Preferably, the air inlet plate is arranged perpendicular to the bottom plate.

[0022] Preferably, the heating lamp group includes a plurality of heating lamps, each of which includes a lamp head and a lamp socket portion connected to each other, wherein the lamp head and the lamp socket portion are respectively located on both sides of the air guide plate, and the cooling air entering from the air inlet area is separated by the air guide plate into a first cooling airflow and a second cooling airflow, wherein the first cooling airflow flows along the inner side of the air guide plate to cool the lamp head, and the second cooling airflow flows along the outer side of the air guide plate to cool the lamp socket portion.

[0023] The utility model also provides a semiconductor process equipment, the semiconductor process equipment comprising:

[0024] Reaction chamber;

[0025] A heating lamp group, wherein the heating lamp group is arranged outside the reaction chamber and is used to heat the reaction chamber;

[0026] The air cooling component is arranged on a side of the heating lamp group away from the reaction chamber and is used to transport cooling air to the heating lamp group. The air cooling component is the above-mentioned air cooling component.

[0027] Preferably, the gas flow channel of the air cooling component passes through the heating lamp group and the outer cavity wall of the reaction chamber in sequence from the air inlet plate, so that the cooling air can cool the outer cavity wall of the reaction chamber.

[0028] In summary, compared with the prior art, the air cooling assembly of the heating lamp group and the semiconductor process equipment provided by the utility model have the following beneficial effects:

[0029] The air cooling component of the heating lamp group and the semiconductor process equipment of the utility model are provided with an annular air inlet plate around the bottom plate at the bottom of the heating lamp group, and an air inlet area is opened along the circumference of the air inlet plate, so that cooling air can flow to the heating lamp group uniformly at all circumferential locations of the air inlet plate, thereby achieving uniform cooling of the heating lamp group and improving the uniformity of cooling of each heating lamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a schematic diagram of the air cooling component surrounding the heating lamp group in Example 1.

[0031] Figure 2 This is a schematic diagram of the structure of the air cooling component of Example 1.

[0032] Figure 3 This is a top view of the air cooling component of Example 1.

[0033] Figure 4 This is a schematic diagram of the semiconductor process equipment of Example 1.

[0034] Figure 5 This is a schematic diagram of the structure of the air cooling component of Example 2.

[0035] Figure 6 This is a top view of the air-cooling assembly of Example 2.

[0036] Figure 7 This is a schematic diagram of the semiconductor process equipment of Example 3.

[0037] Description of reference numerals:

[0038] Air cooling component 10

[0039] Base plate 100

[0040] Air inlet plate 200

[0041] Air intake area 210

[0042] Air Inlet 211

[0043] Air deflector 300

[0044] Protective ring 400

[0045] Heating lamp set 20

[0046] Heating lamp 201

[0047] Semiconductor process equipment 50

[0048] outer cavity wall 510

[0049] Reaction chamber 520 DETAILED DESCRIPTION

[0050] The following will be combined with the appended examples in the present utility model Figure 1 ~Attached Figure 7 , the technical scheme, structural features, objectives achieved and effects in the embodiments of the utility model are described in detail.

[0051] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the implementation methods of the utility model, and are not used to limit the conditions for the implementation of the utility model. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed by the utility model without affecting the efficacy and purpose that can be achieved by the utility model.

[0052] It should be noted that, in the present invention, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0053] like Figure 1As shown, the utility model provides an air cooling component 10 of a heating lamp group, and the air cooling component 10 is used to introduce external cooling air to cool a plurality of heating lamps 201 included in the heating lamp group 20. The air cooling component 10 includes a bottom plate 100 and an annular air inlet plate 200. The bottom plate 100 is arranged at the bottom of the heating lamp group 20. The bottom plate 100 is a plate arranged at the bottom of the heating lamp group 20, and the bottom plate 100 is used to connect the annular air inlet plate 200 located outside thereof. An air inlet area 210 is provided on the air inlet plate 200, and the air inlet area 210 is distributed around the bottom plate 100. The cooling air flows through the air inlet area 210 distributed around the bottom plate 100 to cool the heating lamps 201 at different positions. After the cooling air flows in from the air inlet areas 210 at different positions of the bottom, the heating lamps 201 at different positions are cooled respectively, so as to avoid the situation that the same cooling air cools different heating lamps 201 successively, resulting in different cooling effects on each heating lamp 201. The air cooling assembly 10 of the utility model can improve the uniformity of the cooling effect of each heating lamp 201. The difference between the air inlet plate 200 and the bottom plate 100 is that the air inlet plate 200 is provided with an air inlet area 210 for cooling air to flow through, while the bottom plate 100 is not provided with an air inlet area 210.

[0054] like Figure 2 and Figure 3 As shown, the air inlet area 210 includes a plurality of air inlets 211, and the plurality of air inlets 211 are evenly distributed along the circumference of the air inlet plate 200. In this embodiment, the air inlet 211 is circular, and the diameter of the air inlet 211 is greater than 30 mm. In other embodiments, the air inlet 211 may also be elliptical or other shapes.

[0055] To ensure that adjacent heating lamps 201 can be cooled by cooling air entering from different air inlets 211, the number of air inlets 211 is greater than or equal to 5. In this embodiment, 12 circular air inlets 211 are evenly distributed along the circumference of the air inlet plate 200.

[0056] In other embodiments, the air inlet area 210 may also be an annular air inlet belt arranged along the circumference of the air inlet plate 200. The annular air inlet belt allows cooling air to enter along the circumference of the bottom plate 100, further improving the uniformity of cooling of each heating lamp 201.

[0057] A protective screen of matching shape is provided on the air inlet 211 or the annular air inlet belt. To prevent dust or other objects from entering the air inlet plate 200 from the air inlet 211, a protective screen is provided at the air inlet 211 to play a blocking role. At the same time, in order to prevent the protective screen from having too much fluid resistance to the cooling air, resulting in a reduction in the amount of cooling air entering, the opening rate of the protective screen is greater than 70%, to ensure that the cooling air is not blocked by the protective screen and affects the cooling effect on the heating lamp 201.

[0058] The air cooling assembly 10 also includes an annular air guide plate 300. The air guide plate 300 is circumferentially arranged above the bottom plate 100 along the outer edge of the bottom plate 100. Each heating lamp 201 includes a lamp head and a lamp socket portion that are connected to each other, wherein the lamp head is used to emit heat radiation outward to heat an object, and the lamp socket portion is used to connect a power source to supply power to the lamp head. The lamp head and the lamp socket portion of the heating lamp 201 are respectively located on both sides of the air guide plate 300. And the multiple heating lamps 201 included in the heating lamp group 20 are arranged at intervals along the circumference of the air guide plate 300. Therefore, the air guide plate 300 is arranged between the heating lamp group 20 and the air inlet plate 200, and a gap is provided between the air guide plate 300 and the bottom plate 100 so that the cooling air entering the air inlet area 210 flows through the gap between the air guide plate 300 and the bottom plate 100. The cooling air entering from the air inlet area 210 is divided into two cooling airflows, namely a first cooling airflow and a second cooling airflow, when flowing through the air guide plate 300. The two cooling airflows flow through the two sides of the air guide plate 300 respectively, wherein the first cooling airflow flows along the inner side of the air guide plate 300 to cool the lamp head, and the second cooling airflow flows along the outer side of the air guide plate 300 to cool the lamp socket.

[0059] To ensure that the air guide plate 300 can divert the cooling air entering from the air inlet area 210, the gap between the air guide plate 300 and the bottom plate 100 is 5-30 mm. If the gap between the air guide plate 300 and the bottom plate 100 is too small or too large, the cooling air will flow completely through one side of the air guide plate 300, and the air guide plate 300 will not be able to divert the cooling air into two cooling air flows. The specific value of the gap between the air guide plate 300 and the bottom plate 100 can be selected as needed according to the size of the air inlet area 210 and the wind pressure of the cooling air to ensure that the air guide plate 300 can divert the cooling air well.

[0060] In this embodiment, the air guide plate 300 is disposed perpendicular to the bottom plate 100. In other embodiments, the air guide plate 300 may also be disposed obliquely, so as to divert the cooling air entering from the air inlet area 210 to cool the lamp head and the lamp socket respectively.

[0061] The present invention provides an air-cooling component 10 for a heating lamp group, wherein a plurality of air inlets 211 are arranged at the bottom of the air-cooling component 10 or at the side wall near the bottom. The air inlets 211 may be arranged uniformly along the circumference of the bottom or the side wall. In another embodiment, the air inlets 211 may be arranged to be non-uniform in the circumference according to the specific situation of the air-cooling component 10. Due to the arrangement of the air inlets 211, the cooling gas can enter the circumference of the bottom of the semiconductor process equipment 50 uniformly, thereby achieving uniform cooling of the heating lamp group 20. In order to prevent the heating light of the heating lamp group 20 from leaking from the air inlet to the outside of the semiconductor process equipment 50 and causing safety hazards, the present invention arranges a protective ring 400 between the air inlet 211 and the heating lamp group 20, and the protective ring 400 can be connected to the bottom plate 100 or the air inlet plate 200. In this embodiment, if Figure 1 As shown, the protective ring 400 is connected to the inner ring of the air inlet plate 200. In other embodiments, the protective ring 400 can also be connected to the outer ring of the bottom plate 100. The protective ring 400 extends from the air inlet plate 200 in the vertical direction toward the direction of the heating lamp 201. The protective ring 400 is arranged between the inner ring of the air inlet area 210 and the air guide plate 300, and the lamp head of the heating lamp 201 is arranged on the inner side of the air guide plate 300, that is, the protective ring 400 is arranged between the air inlet area 210 and the lamp head of the heating lamp 201. Since the heat radiation outward from the heating lamp 201 has no clear directionality, the heating lamp 201 will also emit heat radiation in the direction of the air inlet area 210. In particular, since the air inlet 211 is provided with a protective mesh with an opening rate greater than 70%, the heat radiation emitted by the heating lamp 201 can easily pass through the air inlet 211 to radiate to the outside of the equipment. The utility model provides a protective ring 400 between the lamp head of the heating lamp 201 and the air inlet area 210 to prevent the heat radiation from the heating lamp 201 from leaking to the outside of the air inlet plate 200 through the air inlet area 210, thereby causing heat radiation to other equipment located outside the air inlet plate 200. The protective ring 400 is provided to ensure that the heat radiation energy of the heating lamp 201 is completely confined to the inside of the air inlet plate 200. It should be noted that the inside of the air inlet plate 200 refers to the side of the air inlet plate 200 where the heating lamp 201 is provided, that is, Figure 1 The outer side of the air inlet plate 200 refers to the side of the air inlet plate 200 where the heating lamp 201 is not provided, that is, Figure 1 The lower side of the air inlet plate 200 is shown in FIG.

[0062] In this embodiment, the protective ring 400 is arranged perpendicular to the bottom plate 100. In other embodiments, the protective ring 400 may also be arranged obliquely to the bottom plate 100, as long as the protective ring 400 can block the heat radiation emitted by the heating lamp 201 toward the air inlet area 210, so as to prevent the heat radiation of the heating lamp 201 from heating the equipment outside the air inlet plate 200 through the air inlet area 210.

[0063] In order to ensure the protective effect of the protective ring 400 on the heat radiation of the heating lamp 201, the upper edge of the protective ring 400 is not lower than the lower edge of the air guide plate 300. The lamp head of the heating lamp 201 is located on the inner side of the air guide plate 300, and the heat radiation emitted by the heating lamp 201 will leak from the lower part of the air guide plate 300 through the air inlet area 210 to the outside of the air inlet plate 200. The upper edge of the protective ring 400 is set to be not lower than the height of the lower edge of the air guide plate 300 to ensure that the protective ring 400 can play a protective effect on the heat radiation of the heating lamp 201 leaking out of the air inlet area 210, and prevent the heating lamp 201 from heating the equipment outside the air inlet plate 200.

[0064] In this embodiment, if Figure 1 As shown, the air inlet plate 200 is arranged below the bottom plate 100. The air inlet plate 200 is arranged below the bottom plate 100, and a protective ring 400 is arranged on the inner circle side of the air inlet plate 200 close to the bottom plate 100. A gap is arranged between the bottom plate 100 and the air guide plate 300, and the upper edge of the protective ring 400 is higher than the lower edge of the air guide plate 300. After the cooling air enters from the air inlet 211, it bypasses the upper edge of the protective ring 400 and is then diverted by the air guide plate 300 into two cooling air flows to cool the lamp head and the lamp holder of the heating lamp 201 respectively. In the process of bypassing the upper edge of the protective ring 400, the cooling air is further mixed during the bypassing process to improve the uniformity of the cooling air flow and improve the uniformity of the cooling effect on each heating lamp 201. In other embodiments, the air inlet plate 200 can also be arranged in the same plane as the bottom plate 100.

[0065] like Figure 4 As shown, the present embodiment further provides a semiconductor process equipment 50, which includes a reaction chamber 520, a heating lamp group 20, and an air cooling assembly 10 of the present embodiment. The heating lamp group 20 is arranged outside the reaction chamber 520 for radiant heating inside the reaction chamber 520. The air cooling assembly 10 is arranged on a side of the heating lamp group 20 away from the reaction chamber 520, and is used to deliver cooling air to the heating lamp group 20.

[0066] Figure 4 The arrows in the figure show the flow direction of cooling air in the semiconductor process equipment 50. The gas flow channel of the air cooling component 10 passes through the heating lamp group 20 and the outer cavity wall 510 of the reaction chamber 520 from the air inlet plate 200 in turn, so that the cooling air can cool the outer cavity wall 510 of the reaction chamber 520. In this embodiment, the cooling air input by the air cooling component 10 can not only cool the heating lamp 201, but also further cool the outer cavity wall 510 of the semiconductor process equipment 50 to prevent the temperature of the outer cavity wall 510 from being too high. The air cooling component 10 is arranged as a whole at the bottom of the semiconductor process equipment 50, and the cooling air is input from the bottom of the semiconductor process equipment 50 to cool the heating lamp 201 and the outer cavity wall 510 respectively. An exhaust component is provided above the semiconductor process equipment 50. Figure 4The upper left corner of the semiconductor process equipment 50 is marked with three parallel arrows, indicating that the exhaust assembly is located here to exhaust the cooling air from the semiconductor process equipment 50. The exhaust assembly is used to extract the cooling air in the semiconductor process equipment 50, filter and cool it, and then re-input it into the semiconductor process equipment 50 through the air inlet 211 to achieve the recycling of the cooling air and improve the utilization rate.

[0067] Example 2

[0068] The same parts of this embodiment 2 as those of embodiment 1 will not be repeated, and only the different parts will be described. In embodiment 1, the air inlet 211 is circular, and in embodiment 2, the air inlet 211 is a waist-shaped hole.

[0069] like Figure 5 and Figure 6 As shown, the air inlet 211 is a waist-shaped hole. In this embodiment, eight air inlets 211 are evenly distributed along the circumference of the air inlet plate 200 to ensure that cooling air can flow into each air inlet 211 along the circumference of the air inlet plate 200 to cool the heating lamp group 20. The distance between the two ends of each waist-shaped hole is greater than 30 mm, ensuring that each air inlet 211 can have enough cooling air to enter, thereby ensuring the cooling effect on the heating lamp group 20.

[0070] Similarly, the present embodiment further provides a semiconductor process equipment 50, which includes a reaction chamber 520, a heating lamp group 20, and an air cooling assembly 10 of the present embodiment. The heating lamp group 20 is arranged outside the reaction chamber 520 for heating the reaction chamber 520. The air cooling assembly 10 is arranged on a side of the heating lamp group 20 away from the reaction chamber 520, and is used to deliver cooling air to the heating lamp group 20.

[0071] Example 3

[0072] The same parts of this embodiment 3 as those of embodiment 1 will not be repeated, and only the different parts will be described. In embodiment 1, the air inlet plate 200 is arranged parallel to the bottom plate 100, while in embodiment 3, the air inlet plate 200 is arranged perpendicular to the bottom plate 100.

[0073] like Figure 7 As shown, in the present embodiment, the air inlet plate 200 is arranged perpendicular to the base plate 100, that is, the air inlet plate 200 is arranged at the bottom of the outer cavity wall 510 of the semiconductor process equipment 50, and a plurality of evenly distributed air inlets 211 or annular air inlet belts are opened on the air inlet plate 200. The cooling air enters the interior of the semiconductor process equipment 50 from the air inlet 211 or the annular air inlet belt opened at the bottom of the outer cavity wall 510 to cool the heating lamp 201 and the outer cavity wall 510, and then is extracted by the exhaust assembly above the semiconductor process equipment 50, filtered and cooled, and then re-input into the semiconductor process equipment 50 through the air inlet 211 to continue cooling the heating lamp 201 and the outer cavity wall 510.

[0074] The present embodiment further provides a semiconductor process equipment 50, which includes a reaction chamber 520, a heating lamp group 20, and an air cooling assembly 10 of the present embodiment. The heating lamp group 20 is arranged outside the reaction chamber 520 for heating the reaction chamber 520. The air cooling assembly 10 is arranged on a side of the heating lamp group 20 away from the reaction chamber 520, and is used to deliver cooling air to the heating lamp group 20.

[0075] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. An air cooling component of a heating lamp group, characterized in that: The air cooling component comprises: A bottom plate, the bottom plate is arranged at the bottom of the heating lamp group; An annular air inlet plate is connected to the bottom plate, and an air inlet area is provided on the air inlet plate, and the air inlet area is distributed around the bottom plate.

2. The air cooling assembly of the heating lamp assembly according to claim 1, characterized in that: The air cooling component also includes an annular air guide plate, which surrounds the heating lamp group and is arranged between the heating lamp group and the air inlet plate. A gap is provided between the air guide plate and the bottom plate so that the cooling air entering the air inlet area flows through the bottom of the air guide plate.

3. The air cooling assembly of the heating lamp assembly according to claim 2, characterized in that: The air cooling component also includes a protective ring, which is connected to the bottom plate or the air inlet plate, and is arranged between the inner ring of the air inlet plate and the air guide plate.

4. The air cooling assembly of the heating lamp assembly according to claim 3, characterized in that: The upper edge of the protective ring is not lower than the lower edge of the air guide plate.

5. The air cooling assembly of the heating lamp assembly according to claim 3, characterized in that: The protective ring is arranged perpendicular to the bottom plate.

6. The air cooling assembly of the heating lamp assembly according to claim 2, characterized in that: The air guide plate is arranged perpendicular to the bottom plate.

7. The air cooling assembly of the heating lamp assembly according to claim 6, characterized in that: The gap between the air guide plate and the bottom plate is 5-30 mm.

8. The air cooling assembly of the heating lamp assembly according to claim 1, characterized in that: The air inlet area includes a plurality of air inlets, and the plurality of air inlets are evenly distributed along the circumference of the air inlet plate.

9. The air cooling assembly of the heating lamp assembly according to claim 8, characterized in that: The air inlet is circular, and the diameter of the air inlet is greater than 30 mm; or, The air inlet is a waist-shaped hole, and the distance between the two ends of the waist-shaped hole is greater than 30 mm; or, the air inlet is an ellipse, and the long diameter of the air inlet is greater than 30 mm.

10. The air cooling assembly of the heating lamp assembly according to claim 8, characterized in that: The number of the air inlets is greater than five.

11. The air cooling assembly of the heating lamp assembly according to claim 1, characterized in that: The air inlet area is an annular air inlet belt arranged along the circumference of the air inlet plate.

12. The air cooling assembly of the heating lamp assembly according to claim 8, characterized in that: The air inlet is provided with a protective screen with a matching shape, and the opening rate of the protective screen is greater than 70%.

13. The air cooling assembly of the heating lamp assembly according to claim 11, characterized in that: The annular air inlet belt is provided with a protective wire mesh with a matching shape, and the opening rate of the protective wire mesh is greater than 70%.

14. The air cooling assembly of the heating lamp assembly according to claim 1, characterized in that: The air inlet plate is lower than the bottom plate or is arranged in the same plane as the bottom plate.

15. The air cooling assembly of the heating lamp assembly according to claim 1, characterized in that: The air inlet plate is arranged perpendicular to the bottom plate.

16. The air cooling assembly of the heating lamp assembly according to claim 2, characterized in that: The heating lamp group includes multiple heating lamps, and the heating lamp includes a lamp head and a lamp socket part which are connected to each other. The lamp head and the lamp socket part are respectively located on both sides of the air guide plate. The cooling air entering from the air inlet area is separated by the air guide plate into a first cooling airflow and a second cooling airflow. The first cooling airflow flows along the inner side of the air guide plate to cool the lamp head, and the second cooling airflow flows along the outer side of the air guide plate to cool the lamp socket part.

17. A semiconductor process equipment, characterized in that: The semiconductor process equipment comprises: Reaction chamber; A heating lamp group, wherein the heating lamp group is arranged outside the reaction chamber for heating the reaction chamber; an air cooling component, arranged on a side of the heating lamp group away from the reaction chamber, for conveying cooling air to the heating lamp group, wherein the air cooling component is the air cooling component according to any one of claims 1 to 16.

18. The semiconductor process equipment according to claim 17, wherein: The gas flow channel of the air cooling component passes through the heating lamp group and the outer cavity wall of the reaction chamber in sequence from the air inlet plate, so that the cooling air can cool the outer cavity wall of the reaction chamber.

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