Signal conditioning circuit board structure for pressure sensor

Abstract

The utility model relates to the technical field of pressure sensors, in particular to a signal conditioning circuit board structure for a pressure sensor, which comprises a signal conditioning circuit board body provided with an upper electric connecting part, a lower electric connecting part, a signal conditioning circuit board clamping groove and a signal conditioning circuit board pin. A lead wire circuit board clamping groove is arranged between the two conditioning signal circuit board pins and the bottom side of the conditioning signal circuit board body and is used for limiting and clamping a lead wire circuit board which is vertical to the conditioning signal circuit board body. The signal conditioning circuit board structure for the pressure sensor is simple in structure and convenient to assemble or disassemble, the internal layout of the sensor can be more concise, and the assembling efficiency of the sensor can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of pressure sensors, in particular to a signal conditioning circuit board structure for pressure sensors. Background Art

[0002] Brake pressure sensors are used in ESC systems (electronic stability control systems) and are mainly installed on hydraulic control modules to monitor brake fluid pressure. Traditional pressure sensors involve several circuit boards with functional modules, and as the core signal conditioning circuit board, it is mainly used to collect, process and output pressure signals. Therefore, not only are multiple functional components connected to its body, but it also needs to be fixed in a specific housing in the sensor.

[0003] Conventionally, the signal conditioning circuit board and the conductive parts are electrically connected by spot welding. For fixation, a specific slot is usually set in the sensor housing to connect the signal conditioning circuit board. This method is not only troublesome to assemble, but also causes a mess in the sensor housing, which is not conducive to heat dissipation, assembly, and later disassembly and maintenance.

[0004] Therefore, a technology is urgently needed to solve the above technical problems. Utility Model Content

[0005] The purpose of the utility model is to overcome the above-mentioned problems of the prior art and provide a signal conditioning circuit board structure for a pressure sensor, which is used to solve the technical problems in the prior art of using cable spot welding to electrically connect the signal conditioning circuit board, such as high reliance on manual labor and low assembly efficiency, and using a specific slot to socket the signal conditioning circuit board, which causes spatial clutter in the sensor housing and is not conducive to heat dissipation, assembly, and subsequent disassembly and maintenance.

[0006] The above objectives are achieved through the following technical solutions:

[0007] A signal conditioning circuit board structure for a pressure sensor includes a signal conditioning circuit board body, on which the following components are provided:

[0008] An upper electrical connection portion, the upper electrical connection portion being used for connecting an upper conductive member;

[0009] A lower electrical connection portion, the lower electrical connection portion being used for connecting a lower conductive member;

[0010] A conditioning signal circuit board card slot, wherein there are two conditioning signal circuit board card slots, which are symmetrically arranged on both sides of the conditioning signal circuit board body and are used for the upper support member buckle;

[0011] The conditioning signal circuit board pins include two conditioning signal circuit board pins, which are symmetrically arranged on the bottom side of the conditioning signal circuit board body and are used for plugging with the lower support member;

[0012] A lead circuit board clamping groove is also provided between the two conditioning signal circuit board pins and the bottom side of the conditioning signal circuit board body, for limiting and clamping the lead circuit board perpendicular to the conditioning signal circuit board body.

[0013] Furthermore, the signal conditioning circuit board slot is adjacent to the upper electrical connection portion and is located below the upper electrical connection portion.

[0014] Furthermore, the lower electrical connection portion is adjacent to the lead circuit board clamping groove.

[0015] Furthermore, right-angled limiting grooves are respectively provided on the outer sides of the two conditioning signal circuit board pins, and the right-angled limiting grooves are used for limiting the insertion with the lower support member.

[0016] Furthermore, the upper electrical connection portion includes a plurality of vertical upper conductive member slots opened on the signal conditioning circuit board body, and an upper conductive member pad is provided at each of the upper conductive member slots.

[0017] Furthermore, the notches of the upper conductive member slots are provided with mutually symmetrical inclined slopes.

[0018] Furthermore, the upper conductive member includes an upper conductive member right-angle pin, and the upper conductive member right-angle pin can be plugged into the upper conductive member slot.

[0019] Furthermore, the width of the upper electrical connection portion is not greater than the length between two of the signal conditioning circuit board slots.

[0020] Furthermore, the lower electrical connection portion includes a plurality of lower conductive pads arranged on two side surfaces of the conditioning signal circuit board body, and correspondingly, the lower conductive member is a conductive spring, one end of the conductive spring is plugged into the lead circuit board, and the other end is crimped with the lower conductive pad.

[0021] Furthermore, each of the lower conductive member pads is located on the same horizontal plane.

[0022] Beneficial Effects

[0023] The signal conditioning circuit board structure for the pressure sensor provided by the utility model realizes quick electrical connection with the conductive member by arranging the upper electrical connection part and the lower electrical connection part at the upper and lower ends of the signal conditioning circuit board body; realizes the upper buckle support by arranging the signal conditioning circuit board slot and the upper support member, and realizes the lower buckle support by arranging the signal conditioning circuit board pin and the lower support member. The signal conditioning circuit board structure for the pressure sensor provided by the scheme is not only simple in structure and convenient to assemble or disassemble, but also can make the internal layout of the sensor more concise, and can effectively improve the assembly efficiency of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of a signal conditioning circuit board structure for a pressure sensor according to the utility model from a first perspective;

[0025] Figure 2 This is a schematic diagram from a second perspective of the structure of the signal conditioning circuit board for the pressure sensor according to the utility model;

[0026] Figure 3 It is a schematic diagram of the connection between the conditioning signal circuit board body and the upper conductive member in the conditioning signal circuit board structure for the pressure sensor of the utility model;

[0027] Figure 4 This is a schematic diagram of the connection between the signal conditioning circuit board body and the upper support member in the signal conditioning circuit board structure for the pressure sensor of the utility model;

[0028] Figure 5 The present invention is a schematic diagram of the connection between the signal conditioning circuit board body and the lower support member in the signal conditioning circuit board structure for the pressure sensor described in the present invention.

[0029] Graphic marking:

[0030] 1- conditioning signal circuit board body, 2- upper electrical connection part, 3- lower electrical connection part, 4- conditioning signal circuit board slot, 5- conditioning signal circuit board pin, 6- lead circuit board clamping groove, 7- upper conductive part slot, 8- upper conductive part pad, 9- lower conductive part pad, 10- upper conductive part right angle pin, 11- upper conductive part, 12- lower conductive part, 13- upper support part, 14- lower support part, 15- lead circuit board, 16- pin right angle limit groove. DETAILED DESCRIPTION

[0031] The utility model is further described in detail below based on the accompanying drawings and embodiments. The described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] like Figures 1 to 5 As shown, the present solution provides a signal conditioning circuit board structure for a pressure sensor, including a signal conditioning circuit board body 1, on which the signal conditioning circuit board body 1 is provided:

[0033] An upper electrical connection portion 2, the upper electrical connection portion 2 is used for connecting an upper conductive member 11;

[0034] A lower electrical connection portion 3, the lower electrical connection portion 3 is used for connecting a lower conductive member 12;

[0035] The signal conditioning circuit board card slot 4 has two signal conditioning circuit board card slots 4, which are symmetrically arranged on both sides of the signal conditioning circuit board body 1 and are used for buckling the upper support member 13;

[0036] The conditioning signal circuit board pins 5 include two conditioning signal circuit board pins 5 which are symmetrically arranged on the bottom side of the conditioning signal circuit board body 1 and are used for plugging with the lower support member 14;

[0037] A lead circuit board clamping groove 6 is also provided between the two conditioning signal circuit board pins 5 and the bottom side of the conditioning signal circuit board body 1 for limiting and clamping the lead circuit board 15 perpendicular to the conditioning signal circuit board body 1 .

[0038] As an optimization of this solution:

[0039] The signal conditioning circuit board slot 4 is adjacent to the upper electrical connection portion 2 and is located below the upper electrical connection portion 2 .

[0040] The lower electrical connection portion 3 is adjacent to the lead circuit board clamping groove 6 .

[0041] The outer sides of the two conditioning signal circuit board pins 5 are respectively provided with right-angle pin limiting grooves 16 , and the right-angle pin limiting grooves 16 are used for plugging and limiting with the lower support member 14 .

[0042] like Figures 1 to 3 As shown, the upper electrical connection portion 2 in this embodiment includes a plurality of vertical upper conductive member slots 7 opened on the conditioning signal circuit board body 1, and each of the upper conductive member slots 7 is provided with an upper conductive member pad 8;

[0043] Specifically, when the upper conductive member 11 is inserted into the upper conductive member slot 7, it can contact the upper conductive member pad 8 to achieve electrical connection; in addition, in order to increase the firmness between the upper conductive member 11 and the upper conductive member pad 8, spot welding can also be performed to achieve welding of the upper conductive member 11 to the upper conductive member pad 8.

[0044] It should be noted that, in this embodiment, the notches of the upper conductive member slots 7 are provided with mutually symmetrical inclined slopes to form a wide-mouth shape, which is used to guide the upper conductive member 11 to be smoothly and quickly inserted into the upper conductive member slots 7 .

[0045] The upper conductive member 11 includes an upper conductive member right-angle pin 10 , and the upper conductive member right-angle pin 10 can be plugged into the upper conductive member slot 7 .

[0046] In addition, if Figure 1 As shown, in this embodiment, the width of the upper electrical connection part 2 is not greater than the length between the bottom walls of the two conditioning signal circuit board slots 4. This structure facilitates the buckling of the conditioning signal circuit board body 1 and the upper support member 13 without the upper electrical connection part 2 interfering therewith, that is, it will not interfere with or hinder the plug-in buckling of the conditioning signal circuit board body 1 and the upper support member 13.

[0047] In this embodiment, the lower electrical connection part 3 includes a plurality of lower conductive pads 9 arranged on the two side surfaces of the conditioning signal circuit board body 1. Correspondingly, the lower conductive member 12 is a conductive spring, one end of which is plugged into the lead circuit board 15, and the other end is crimped with the lower conductive pad 9. This structure is used to electrically connect the mutually perpendicular conditioning signal circuit board body 1 and the lead circuit board 15.

[0048] This embodiment does not introduce the circuits and power supply principles on the lead circuit board 15 and the signal conditioning circuit board body 1 in detail, but only focuses on the protection structure and appearance.

[0049] The lower conductive pads 9 are located on the same horizontal plane, so that the lower conductive members 12 of the same specification can be used to electrically connect the lead circuit board 15 and the conditioning signal circuit board body 1 .

[0050] The above description is only for illustrating the implementation mode of the present invention and is not intended to limit the present invention. For those skilled in the art, any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A signal conditioning circuit board structure for a pressure sensor, comprising a signal conditioning circuit board body (1), characterized in that: The signal conditioning circuit board body (1) is provided with: An upper electrical connection portion (2), the upper electrical connection portion (2) being used for connecting an upper conductive member (11); A lower electrical connection portion (3), the lower electrical connection portion (3) being used for connecting a lower conductive member (12); A conditioning signal circuit board slot (4), wherein the conditioning signal circuit board slots (4) are two in number and are symmetrically arranged on both sides of the conditioning signal circuit board body (1) and are used for snapping the upper support member (13); Conditioning signal circuit board pins (5), the conditioning signal circuit board pins (5) having two, symmetrically arranged on the bottom side of the conditioning signal circuit board body (1), and used for plugging with the lower support member (14); A lead circuit board clamping groove (6) is also provided between the two conditioning signal circuit board pins (5) and the bottom side of the conditioning signal circuit board body (1) for limiting and clamping the lead circuit board (15) perpendicular to the conditioning signal circuit board body (1).

2. The signal conditioning circuit board structure for a pressure sensor according to claim 1, characterized in that: The signal conditioning circuit board slot (4) is adjacent to the upper electrical connection portion (2) and is located below the upper electrical connection portion (2).

3. The signal conditioning circuit board structure for a pressure sensor according to claim 1, characterized in that: The lower electrical connection portion (3) is adjacent to the lead circuit board clamping groove (6).

4. The signal conditioning circuit board structure for a pressure sensor according to claim 1, characterized in that: The outer sides of the two conditioning signal circuit board pins (5) are respectively provided with right-angle pin limit grooves (16), and the right-angle pin limit grooves (16) are used for plugging and limiting with the lower support member (14).

5. The signal conditioning circuit board structure for a pressure sensor according to claim 1 or 2, characterized in that: The upper electrical connection portion (2) comprises a plurality of vertical upper conductive member slots (7) opened on the signal conditioning circuit board body (1), and each of the upper conductive member slots (7) is provided with an upper conductive member pad (8).

6. The signal conditioning circuit board structure for a pressure sensor according to claim 5, characterized in that: The notches of the upper conductive member slots (7) are provided with mutually symmetrical inclined slopes.

7. The signal conditioning circuit board structure for a pressure sensor according to claim 5, characterized in that: The upper conductive member (11) comprises an upper conductive member right-angle plug pin (10), and the upper conductive member right-angle plug pin (10) can be plugged into the upper conductive member slot (7).

8. The signal conditioning circuit board structure for a pressure sensor according to claim 5, characterized in that: The width of the upper electrical connection portion (2) is not greater than the length between the two signal conditioning circuit board slots (4).

9. The signal conditioning circuit board structure for a pressure sensor according to claim 1 or 3, characterized in that: The lower electrical connection portion (3) includes a plurality of lower conductive pads (9) arranged on two side surfaces of the conditioning signal circuit board body (1); correspondingly, the lower conductive member (12) is a conductive spring sheet, one end of which is plugged into the lead circuit board (15) and the other end is crimped into the lower conductive pad (9).

10. The signal conditioning circuit board structure for a pressure sensor according to claim 9, characterized in that: Each of the lower conductive member pads (9) is located on the same horizontal plane.

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