Inverter

Abstract

The utility model discloses an inverter, which is characterized by comprising a case, a fan and a main radiator, the fan is arranged in the case; an air outlet is formed in the first side of the fan; the main radiator is arranged in the case, the main radiator is located on the first side of the fan, the main radiator and the fan are arranged at intervals, the main radiator comprises a first part and a second part which are arranged side by side, each of the first part and the second part comprises a plurality of first fins which are arranged in sequence, and a first radiating air channel is formed between every two adjacent first fins; the air outlet faces the first part and the second part, airflow exhausted by the air outlet can flow along the first heat dissipation air channels in the first part and the second part, and the distance between the air outlet and the first part is smaller than that between the air outlet and the second part. The diffusion space for diffusing the air flow is arranged between the fan and the first part and between the fan and the second part, and the air flow blown out of the air outlet can be diffused in the diffusion space, so that the main radiator also has better radiating efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of current conversion equipment, and in particular to an inverter. Background Art

[0002] An inverter is a conversion device that converts the DC power generated by a power generation device into AC power that can be connected to the grid. Electronic components such as transistors and inductors in the inverter will generate a lot of heat during operation. Therefore, a heat sink and fan are usually installed in the inverter to ensure the heat dissipation of the electronic components. The heat sink is usually used to expand the heat dissipation area of ​​the electronic components, and the cold air blown by the fan takes away the heat from the heat sink, thereby accelerating the heat dissipation of the heat on the radiator.

[0003] However, in the related art, in order to compress the volume of the inverter, the fan is generally very close to the radiator, resulting in a high air flow velocity through the part of the radiator that is directly opposite the air outlet of the fan, while the air flow velocity through other parts of the radiator is low, and even heat reflux may be formed, resulting in poor overall heat dissipation efficiency of the radiator. Utility Model Content

[0004] The present application provides an inverter, so that there is a diffusion space between the fan and the main radiator for sufficient diffusion of airflow, so that the main radiator as a whole has better heat dissipation efficiency.

[0005] Specifically, an inverter comprises: a chassis; a fan, arranged in the chassis, and a first side of the fan has an air outlet; a main radiator, arranged in the chassis, the main radiator is located on the first side of the fan and is spaced apart from the fan, the main radiator comprises a first part and a second part arranged side by side, the first part and the second part each comprise a plurality of first fins arranged in sequence, and a first heat dissipation duct is formed between two adjacent first fins; wherein the air outlet faces the first part and the second part, the airflow discharged from the air outlet can flow along the first heat dissipation duct in the first part and the second part, and the distance between the air outlet and the first part is smaller than the distance between the air outlet and the second part.

[0006] In some embodiments of the present application, the distance between the air outlet and the first part along the arrangement direction of the fan and the main radiator is D1, the thickness of the fan along the arrangement direction of the fan and the main radiator is h, and 0.5h≤D1≤2h. On the basis of ensuring that there is a sufficient distance between the fan and the main radiator, the arrangement of the fan and the main radiator is prevented from causing the overall volume of the inverter to be too large.

[0007] In some embodiments of the present application, the orthographic projection of the air outlet on the first plane at least partially overlaps with the orthographic projection of the second part on the first plane, and the arrangement direction of the fan and the main radiator is perpendicular to the first plane, so that part of the airflow blown out of the air outlet can be directly blown to the second part, which can further improve the heat dissipation efficiency of the second part.

[0008] In some embodiments of the present application, the total heat dissipation area of ​​all the first fins of the main heat sink is S, the preset heat dissipation power of the main heat sink is Q, S=Q*n, 2000 square millimeters / watt≤n≤3000 square millimeters / watt. This prevents the cost of the main heat sink from being too high, and at the same time prevents the volume of each first fin from being too large, which makes it inconvenient to arrange the first fins.

[0009] In some embodiments of the present application, the second part and the first part form a storage space, and the inverter further includes: an inductor component located in the storage space, the inductor component includes an inductor and an inductor heat sink, and the inductor heat sink is used to dissipate heat for the inductor, so as to improve the heat dissipation efficiency of the inductor heat sink.

[0010] In some embodiments of the present application, the main heat sink includes two second parts, the two second parts are respectively located on opposite sides of the first part, and the two second parts and the first part form two accommodation spaces; wherein, the inductor components are provided in two groups, and the two groups of inductor components are respectively located in the two accommodation spaces. This can reduce the space occupied by the inductor heat sink and make the center of gravity of the inverter closer to the geometric center of the inverter, preventing the center of gravity of the inverter from shifting and causing the inverter to easily tip over when being carried and set up.

[0011] In some embodiments of the present application, the inductive heat sink includes a base and a plurality of second fins arranged at intervals, the plurality of second fins are located on a side of the base close to the first portion, and a second heat dissipation duct is formed between two adjacent second fins, so that more of the airflow blown out from the air outlet can flow to the second heat dissipation duct, thereby further improving the heat dissipation efficiency of the inductive heat sink.

[0012] In some embodiments of the present application, the orthographic projection of the side surface of the base body close to the first part on the first plane is tangent to the outer side of the contour of the orthographic projection of the air outlet on the first plane, and the arrangement direction of the fan and the main heat sink is perpendicular to the first plane, so that more airflow can be blown to the second fins to further improve the heat dissipation efficiency of the inductive heat sink.

[0013] In some embodiments of the present application, the inductive heat sink is spaced apart from the second portion, and the spacing between the inductive heat sink and the second portion along the arrangement direction of the fan and the main heat sink is D2, 15 mm ≤ D2. There is sufficient gap space between the inductive heat sink and the second portion, so that the airflow flowing to the accommodation space can diffuse to the second portion through the gap space between the inductive heat sink and the second portion to ensure heat dissipation of the second portion.

[0014] In some embodiments of the present application, the main heat sink and the fan are both located outside the chassis, and the inverter further includes: a fan cover, including a first baffle, the first baffle is located on a side of the fan away from the chassis, and the first baffle extends toward the first part to cover the gap between the fan and the first part. The first baffle can play a certain sealing and guiding role, so that the airflow is concentrated to flow toward the first part, thereby further improving the heat dissipation efficiency of the first part.

[0015] In some embodiments of the present application, the first baffle includes an overlapping portion overlapping the first portion, and the length of the overlapping portion along the arrangement direction of the fan and the main heat sink is D3, 5 mm≤D3. It is ensured that the first baffle can cover the gap between the fan and the first portion.

[0016] The beneficial effects of the present application are as follows: since the first part is opposite to the air outlet, the speed of the air flow passing through the first part is large, thereby ensuring the heat dissipation efficiency of the first part; and since the fan is evenly spaced from the first part and the second part, there is a diffusion space between the fan and the first part and the second part for the air flow to diffuse, and the air flow blown out from the air outlet can diffuse in the diffusion space, so that part of the air flow can smoothly enter the first heat dissipation duct on the second part, so that the second part has better heat dissipation efficiency, thereby improving the overall heat dissipation efficiency of the radiator; in addition, the distance between the second part and the air outlet is relatively large, so that there is sufficient diffusion space between the second part and the air outlet, so that the air flow can be fully diffused in the diffusion space between the second part and the air outlet, so as to further improve the heat dissipation efficiency of the second part. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1This is a schematic structural diagram of an inverter in an embodiment of the present application at a first viewing angle;

[0019] Figure 2 This is a schematic structural diagram of an inverter in an embodiment of the present application after removing a fan cover at a second viewing angle;

[0020] Figure 3 This is a schematic diagram of the exploded components of an inverter in one embodiment of the present application;

[0021] Figure 4 It is a schematic diagram of the orthographic projection of the main radiator and the fan on the first plane P in one embodiment of the present application;

[0022] Figure 5 It is a schematic diagram of an orthographic projection of an inductor component and a fan on a first plane P in an embodiment of the present application;

[0023] Figure 6 It is a schematic diagram of the structure of the fan cover, the fan and the main radiator in one embodiment of the present application.

[0024] Reference numerals:

[0025] 10. Chassis; 11. Shell; 111. Heat dissipation opening; 12. Cover; 13. Circuit board assembly; 20. Main radiator; 21. First part; 22. Second part; 23. First fin; 24. First heat dissipation duct; 25. Accommodation space; 26. Heat dissipation substrate; 30. Fan; 31. Air outlet; 40. Inductor assembly; 41. Inductor; 42. Inductor heat dissipation element; 421. Base; 422. Second fin; 423. Second heat dissipation duct; 50. Fan cover; 51. First baffle; 52. Second baffle; 521. Vent. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0027] In the related art, in order to compress the volume of the inverter, the fan is generally very close to the radiator, and there is not enough air flow diffusion space between the fan and the radiator, resulting in a high air flow velocity through the part of the radiator directly opposite the air outlet of the fan, while the air flow velocity through other parts of the radiator is low, and even heat reflux may be formed, resulting in poor heat dissipation efficiency of the radiator.

[0028] Based on the above problems, the present application provides an inverter to solve the problem that the heat dissipation efficiency of the radiator is poor because the fan is generally very close to the radiator.

[0029] Specifically, Figure 1 As shown, the inverter includes a chassis 10 , a main radiator 20 and a fan 30 .

[0030] The chassis 10 is used to provide space and support for the main heat sink 20 and fan 30 and other components in the inverter. The overall shape of the chassis 10 can be a cube, a rectangular parallelepiped, a cylinder or other shapes, which is not limited in this application.

[0031] The fan 30 is disposed on the chassis 10, and a first side of the fan 30 has an air outlet 31 (eg, Figure 3 ). It should be noted that the air outlet 31 of the fan 30 is used for discharging air.

[0032] The main radiator 20 is arranged on the chassis 10. The main radiator 20 is located on the first side of the fan 30 and is spaced apart from the fan 30. The main radiator 20 includes a first part 21 and a second part 22 arranged side by side. The first part 21 and the second part 22 both include a plurality of first fins 23 arranged in sequence, and a first heat dissipation duct 24 is formed between two adjacent first fins 23. The main radiator 20 is used to provide heat dissipation for electronic components on the chassis 10. The heat generated by the electronic components can be conducted to the first fins 23, and the first fins 23 can diffuse the heat to improve the heat dissipation efficiency. The preparation material of the main radiator 20 can be copper, aluminum, copper alloy, aluminum alloy or other materials with good heat dissipation efficiency.

[0033] More specifically, if Figure 2 As shown, the air outlet 31 faces the first part 21 and the second part 22, and the airflow discharged from the air outlet 31 can flow along the first heat dissipation duct 24 in the first part 21 and the second part 22. The distance between the air outlet 31 and the first part 21 is smaller than the distance between the air outlet 31 and the second part 22.

[0034] It can be understood that when the airflow blown out from the air outlet 31 blows toward the first heat dissipation duct 24, the airflow can quickly take away the heat in the first heat dissipation duct 24 when flowing through the first heat dissipation duct 24, so as to achieve the effect of rapid heat dissipation. Since the first part 21 is opposite to the air outlet 31, the speed of the airflow flowing through the first part 21 is large, which can ensure the heat dissipation efficiency of the first part 21. Moreover, since the fan 30 is spaced apart from the first part 21 and the second part 22, there is a diffusion space for airflow diffusion between the fan 30 and the first part 21 and the second part 22, so that The airflow blown out from the air outlet 31 can diffuse in the diffusion space, so that part of the airflow can smoothly enter the first heat dissipation duct 24 on the second part 22, so that the second part 22 also has good heat dissipation efficiency, thereby improving the overall heat dissipation efficiency of the radiator; in addition, the distance between the second part 22 and the air outlet 31 is relatively large, so that there is enough diffusion space between the second part 22 and the air outlet 31, so that the airflow can be fully diffused in the diffusion space between the second part 22 and the air outlet 31, so as to further improve the heat dissipation efficiency of the second part 22.

[0035] Continue to see Figure 2 As shown, in one embodiment of the present application, the distance between the air outlet 31 and the first part 21 along the arrangement direction of the fan 30 and the main radiator 20 is D1, and the thickness of the fan 30 along the arrangement direction of the fan 30 and the main radiator 20 is h, 0.5h≤D1≤2h. It should be noted that, taking the arrangement direction of the first part 21 and the second part 22 as the first preset direction XX, and the arrangement direction of the fan 30 and the main radiator 20 as the second preset direction YY as an example, the first preset direction XX and the second preset direction YY are different directions, and the first preset direction XX and the second preset direction YY can be perpendicular or form an angle of other angles. If D1 is too large, the distance between the fan 30 and the main radiator 20 will be too large, which will cause the overall volume of the inverter to increase; if D1 is too small, the distance between the outlet fan 30 and the first part 21 will be too small, so that there is no diffusion space between the fan 30 and the first part 21 for the airflow to fully diffuse. Among them, D1 can be 0.5h, 1h, 1.5h, 2h or other values. The specific value of h can be selected according to actual needs and is not limited in this application.

[0036] In an embodiment of the present application, the number of fans 30 may be 1, 2 or more. When there are multiple fans 30, the multiple fans 30 may be arranged at intervals along the second preset direction YY.

[0037] In one embodiment of the present application, the total heat dissipation area of ​​all the first fins 23 of the main radiator 20 is S, and the preset heat dissipation power of the main radiator 20 is Q, S=Q*n, 2000 square millimeters / watt ≤n≤3000 square millimeters / watt. It should be noted that the preset heat dissipation power is the heat dissipation power required by the main radiator 20 to ensure that the electronic components on the chassis 10 can dissipate heat in time. Taking the two side surfaces arranged along the first preset direction XX on the first fin 23 as the heat dissipation surface as an example, the first fin 23 is mainly cooled by two heat dissipation surfaces. Therefore, the heat dissipation area of ​​each first fin 23 can be approximately equal to the sum of the areas of the two heat dissipation surfaces. The area of ​​the heat dissipation surface is s, the number of first fins 23 is m, the spacing between two adjacent first fins 23 is a, and the length of the first fins 23 on the inverter is A, then a=A / m, from S=2*s*m, it can be obtained that a=(2sA) / S=(2sA) / (Qn). When s, A, and Q remain unchanged, the larger n is, the smaller a is, and the larger m is, that is, the smaller the spacing between two adjacent first fins 23 is, the more the number of first fins 23 is. When n is too large, the number of first fins 23 is too large, which will lead to too high a cost for the main heat sink 20; when n is too small, the number of first fins 23 is too small, which will lead to too large a heat dissipation area required for each first fin 23, thereby leading to too large a volume of each first fin 23, making it inconvenient to arrange the first fins 23. Among them, n can be 2000 square millimeters / watt, 2500 square millimeters / watt, 3000 square millimeters / watt or other values.

[0038] Specifically, Figure 2 and Figure 3 As shown, the second part 22 and the first part 21 form a receiving space 25, and the inverter further includes an inductor assembly 40, and the inductor assembly 40 includes an inductor 41 and an inductor heat sink 42, and the inductor heat sink 42 is used to dissipate heat for the inductor 41. It should be noted that the inductor 41 is a component used in the inverter to convert electrical energy into magnetic energy and store it. The specific working principle of the inductor 41 has been disclosed in the relevant technology, and this application will not repeat it; the inductor heat sink 42 is a device used to provide heat dissipation for the inductor 41, and the inductor heat sink 42 can be in contact with the inductor 41 or not, and this application does not make specific restrictions.

[0039] Among them, the inductor assembly 40 is located in the accommodating space 25. It can be understood that the accommodating space 25 is the diffusion space between the fan 30 and the second part 22. The airflow blown out from the air outlet 31 can be diffused in the accommodating space 25, and the airflow takes away the heat emitted by the second part 22, and at the same time, the heat emitted by the inductor heat sink 42 can be quickly taken away. The main heat sink and the inductor heat sink 42 can be cooled by one fan 30 at the same time, which can improve the heat dissipation efficiency of the inductor heat sink 42, and there is no need to provide a separate fan 30 for the inductor heat sink 42; in addition, accommodating the inductor assembly 40 in the accommodating space 25 can make the arrangement of the inductor assembly 40 and the main heat sink more compact, thereby reducing the volume of the inverter.

[0040] In an embodiment of the present application, the substrate 421 may be disposed on the outside of the inductor 41 , that is, the inductor 41 is accommodated in a cavity formed by the substrate 421 , so that the substrate 421 provides protection for the inductor 41 .

[0041] Continue to see Figure 2 and Figure 3 As shown, in one embodiment of the present application, the inductor heat sink 42 is spaced from the second portion 22, and the spacing between the inductor heat sink 42 and the second portion 22 along the second preset direction YY is D2, 15 mm ≤ D2, so that there is enough gap space between the inductor heat sink 42 and the second portion 22, so that the airflow flowing to the accommodating space 25 can diffuse to the second portion 22 through the gap space between the inductor heat sink 42 and the second portion 22, so as to ensure the heat dissipation of the second portion 22. Among them, D2 can be 15 mm, 20 mm, 25 mm or other values.

[0042] Continue to see Figure 2 and Figure 3 As shown, in one embodiment of the present application, the main heat sink 20 may include two second parts 22 , and the two second parts 22 are respectively located on opposite sides of the first part 21 , and the two second parts 22 and the first part 21 form two accommodating spaces 25 .

[0043] There are two groups of inductor components 40, and the two groups of inductor components 40 are respectively located in two accommodating spaces 25. It can be understood that the two second parts 22 are respectively located on both sides of the first part 21 along the first preset direction XX. Taking the total inductor power required by the inverter as K as an example, in this embodiment, there are two groups of inductor components 40, and the working power of the inductor 41 in each group of inductor components 40 is only K / 2. The heat generated by the inductor 41 when working is relatively small. Therefore, the heat dissipation efficiency required by the inductor heat sink 42 is relatively small, so that the inductor heat sink 42 can be set shorter, and the space occupied by the inductor heat sink 42 can be reduced; in addition, the inductor component 40 is generally heavier, and the two groups of inductor components 40 are respectively set on both sides of the first part 21, so that the center of gravity position of the inverter can be adjusted, so that the center of gravity of the inverter is closer to the geometric center of the inverter, and the center of gravity of the inverter is prevented from shifting, which causes the inverter to easily tip over when being carried and set.

[0044] like Figure 4 As shown, in one embodiment of the present application, the orthographic projection of the air outlet 31 on the first plane P at least partially overlaps with the orthographic projection of the second part 22 on the first plane P, and the first plane P is perpendicular to the second preset direction YY, so that part of the airflow blown out from the air outlet 31 can be directly blown toward the accommodating space 25, which can further improve the heat dissipation efficiency of the second part 22 and the inductor heat sink 42.

[0045] like Figure 2 and Figure 5 As shown, in some embodiments of the present application, the inductor heat sink 42 includes a base 421 and a plurality of second fins 422 arranged at intervals, the plurality of second fins 422 are located on a side of the base 421 close to the first part 21, and a second heat dissipation duct 423 extending along a second preset direction YY is formed between two adjacent second fins 422. It can be understood that when the airflow flows through the second heat dissipation duct 423, the heat in the second heat dissipation duct 423 can be quickly taken away, thereby achieving the purpose of heat dissipation. The airflow blown out of the air outlet 31 of the fan 30 is mainly concentrated in the area where the first part 21 is located. By setting the second fin 422 on a side close to the first part 21, more of the airflow blown out from the air outlet 31 can flow to the second heat dissipation duct 423, thereby further improving the heat dissipation efficiency of the inductor heat sink 42. It should also be noted that the second fin 422 and the base 421 can be integrally formed, and the second fin 422 and the base 421 can also be formed separately and then spliced ​​by welding, riveting, threaded connection or gluing.

[0046] Among them, multiple second fins 422 can be arranged at intervals along a third preset direction ZZ, and the third preset direction ZZ is perpendicular to the first preset direction XX and the second preset direction YY. On the basis of ensuring that the number of second fins 422 remains unchanged, the length of the inductor heat sink 42 along the first preset direction XX can be reduced, thereby reducing the space occupied by the inductor heat sink 42.

[0047] Continue to see Figure 5 As shown, in one embodiment of the present application, the orthographic projection of the side surface of the base 421 close to the first part 21 on the first plane P is tangent to the outer side of the contour of the orthographic projection of the air outlet 31 on the first plane P, so that the orthographic projection of the second fin 422 on the first plane P can overlap with the orthographic projection of the air outlet 31 on the first plane P as much as possible, so that more airflow can be blown to the second fin 422, so as to further improve the heat dissipation efficiency of the inductor heat sink 42.

[0048] like Figure 3 and Figure 6 As shown, in one embodiment of the present application, the main heat sink 20 and the fan 30 are both located outside the chassis 10, and the inverter further includes a fan cover 50, which includes a first baffle 51, which is located on the side of the fan 30 away from the chassis 10, and extends toward the first portion 21 to cover the gap between the fan 30 and the first portion 21. It can be understood that the first baffle 51 can play a certain sealing and guiding role. When the airflow blown out of the air outlet 31 blows to the gap between the fan 30 and the first portion 21, the first baffle 51 can prevent the airflow from diffusing outside the gap, so that the airflow is concentrated to flow toward the first portion 21, thereby further improving the heat dissipation efficiency of the first portion 21.

[0049] Further, the first baffle 51 includes an overlapping portion overlapping the first portion 21, and the length of the overlapping portion along the second preset direction (YY) is D3, 5 mm ≤ D3, so as to ensure that the first baffle 51 can cover the gap between the fan 30 and the first portion 21. Among them, D3 can be 5 mm, 7 mm, 10 mm or other values.

[0050] Further, the heat dissipation performance may also include a second baffle 52, the second baffle 52 is located on the side of the fan 30 away from the first part 21, the second baffle 52 is perpendicular to the first baffle 51 and connected to the first baffle 51, and the second baffle 52 is provided with a vent 521 (such as Figure 1), the airflow can enter the air inlet through the vent 521. It can be understood that the second baffle 52, the first baffle 51 and the chassis 10 can form a wind gathering cavity, so that the airflow blown out of the air outlet 31 can flow more concentratedly to the first part 21, thereby further improving the heat dissipation efficiency of the first part 21. Among them, the first baffle 51 can be integrally formed with the second baffle 52, and the first baffle 51 can also be separately formed with the second baffle 52 and spliced ​​by welding, bonding, riveting or threaded connection.

[0051] like Figure 3 As shown, in one embodiment of the present application, the chassis 10 may include a shell 11, a cover 12 and a circuit board assembly 13. The cover 12 is covered on the shell 11 and forms a protective cavity with the shell 11. The circuit board assembly 13 is located in the protective cavity. The circuit board assembly 13 can be electrically connected to electronic devices such as a fan 30 and an inductor 41 to control the operation of electronic devices such as the fan 30 and the inductor 41.

[0052] In one embodiment of the present application, the main radiator 20, the fan 30 and the inductor assembly 40 are all located on the side of the shell 11 away from the cover plate 12. A heat dissipation opening 111 is provided on the side of the shell 11 away from the cover plate 12. The main radiator 20 is located at the heat dissipation opening 111. The heat generated by the circuit board assembly 13 can be transmitted to the main radiator 20 through the heat dissipation opening 111.

[0053] It should be noted that, in one embodiment, the plurality of first fins 23 may be independent of each other and directly disposed on the shell 11; in another embodiment, the main radiator 20 may further include a heat dissipation substrate 26, the heat dissipation substrate 26 is disposed on the shell 11, and the plurality of first fins 23 are disposed on the heat dissipation substrate 26, the first fins 23 and the heat dissipation substrate 26 may be integrally formed, or the first fins 23 and the heat dissipation substrate 26 may be separately formed and then spliced ​​by welding, bonding, riveting or threaded connection.

[0054] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An inverter, characterized in that: include: Chassis; A fan is disposed on the chassis, and a first side of the fan has an air outlet; a main radiator, arranged in the chassis, the main radiator being located on a first side of the fan and spaced apart from the fan, the main radiator comprising a first part and a second part arranged side by side, the first part and the second part both comprising a plurality of first fins arranged in sequence, and a first heat dissipation duct being formed between two adjacent first fins; Among them, the air outlet faces the first part and the second part, the airflow discharged from the air outlet can flow along the first heat dissipation duct in the first part and the second part, and the distance between the air outlet and the first part is smaller than the distance between the air outlet and the second part.

2. The inverter according to claim 1, characterized in that: The distance between the air outlet and the first part along the arrangement direction of the fan and the main radiator is D1, the thickness of the fan along the arrangement direction of the fan and the main radiator is h, and 0.5h≤D1≤2h.

3. The inverter according to claim 1, characterized in that: The orthographic projection of the air outlet on the first plane at least partially overlaps with the orthographic projection of the second part on the first plane, and the arrangement direction of the fan and the main radiator is perpendicular to the first plane.

4. The inverter according to claim 1, characterized in that: The total heat dissipation area of ​​all the first fins of the main radiator is S, and the preset heat dissipation power of the main radiator is Q, S=Q*n, 2000 square millimeters / watt≤n≤3000 square millimeters / watt.

5. The inverter according to claim 1, characterized in that: The second part and the first part form a receiving space, and the inverter further includes: The inductor assembly is located in the accommodating space. The inductor assembly includes an inductor and an inductor heat sink. The inductor heat sink is used to dissipate heat for the inductor.

6. The inverter according to claim 5, characterized in that: The main radiator comprises two second parts, the two second parts are respectively located on two opposite sides of the first part, and the two second parts and the first part form two accommodating spaces; There are two groups of inductor components, and the two groups of inductor components are respectively located in the two accommodating spaces.

7. The inverter according to claim 5, characterized in that: The inductor heat sink includes a base and a plurality of second fins arranged at intervals. The plurality of second fins are located on a side of the base close to the first portion, and a second heat dissipation duct is formed between two adjacent second fins.

8. The inverter according to claim 7, characterized in that: The orthographic projection of the side surface of the base close to the first part on the first plane is tangent to the outer side of the contour of the orthographic projection of the air outlet on the first plane, and the arrangement direction of the fan and the main radiator is perpendicular to the first plane.

9. The inverter according to claim 5, characterized in that: The inductive heat sink is spaced apart from the second portion, and a distance between the inductive heat sink and the second portion along an arrangement direction of the fan and the main heat sink is D2, 15 mm≤D2.

10. The inverter according to claim 1, characterized in that: The main radiator and the fan are both located outside the chassis, and the inverter further includes: The fan cover comprises a first baffle, wherein the first baffle is located at a side of the fan away from the chassis, and the first baffle extends toward the first part to cover a gap between the fan and the first part.

11. The inverter according to claim 10, characterized in that: The first baffle includes an overlapping portion overlapping the first portion, and a length of the overlapping portion along an arrangement direction of the fan and the main radiator is D3, 5 mm≤D3.

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