High-temperature dynamic pressure measuring device of semiconductor device sorting machine
By designing the misalignment guide, material stop mechanism, slip mechanism and chip pin protection mechanism on the chip sorting machine, the impact problem when the test probe is in contact with the chip pin is solved, and the chip temperature is maintained through the heating device, which can achieve the realization of the impact of the test probe when the chip pin is in contact with the chip pin. Accuracy and reliability of high temperature dynamic testing.
Patent Information
- Application Number
- CN202420223603.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-30
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-01-30
AI Technical Summary
During the dynamic testing of high-temperature chip sorting machines, the impact force of the test probe when it comes into contact with the chip pin is too large, resulting in excessive bending and damage to the chip pin; at the same time, the test track lacks thermal insulation function, resulting in a drop in the chip temperature. Impacts test accuracy.
A high-temperature dynamic pressure testing device of semiconductor device sorting machine is designed, using misalignment guide rails, material stop mechanisms, slip mechanisms and chip pin protection mechanisms. Through these mechanisms, the test probe and chip pins are achieved stable contact, and the test probe and chip pins are achieved. A heating device is provided on the track to keep the chip temperature stable.
It effectively avoids damage to the chip pins due to excessive impact force, and ensures the temperature stability of the chip during the test process, improving the accuracy and reliability of the test.
Smart Images
Figure CN222491094U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a high-temperature dynamic pressure measuring device for a semiconductor device sorting machine. Background Art
[0002] At present, when a chip sorter performs high-temperature dynamic testing on chips, a test probe driven by an electric cylinder or an air cylinder is generally arranged at the rear or front side of the track. The test probe is driven by the electric cylinder or the air cylinder to move to achieve contact between the test pin and the chip pin. However, in actual operation, there is a problem that when the test probe touches the chip pin, the impact force is too large, causing the chip pin to be excessively bent or damaged. At the same time, the test track of the existing sorter does not have a heat preservation function, which may easily lead to inaccurate performance testing due to temperature reduction. Summary of the invention
[0003] In view of this, the purpose of the utility model is to overcome the shortcomings of the above-mentioned prior art and provide a high-temperature dynamic pressure testing device for a semiconductor device sorting machine, so as to solve the problem that when the test pins in the existing chip sorting machine touch the chip pins, the chip pins are excessively bent and damaged due to excessive impact force. At the same time, the track has a heat preservation function, and there will be no problem of inaccurate performance testing due to the chip temperature dropping due to the chip track transportation.
[0004] The present invention is implemented by the following scheme: a high-temperature dynamic pressure testing device for a semiconductor device sorting machine: comprising at least one pressure testing mechanism, which is installed on the sorting machine, and the pressure testing mechanism comprises an offset guide rail, a material blocking mechanism is installed on the output end of the offset guide rail, a sliding mechanism for driving the offset guide rail to move forward and backward is installed on the side of the offset guide rail, and a chip pin protection mechanism is arranged on the offset guide rail.
[0005] Furthermore, the offset guide rail includes a track plate body, a chip guide groove is arranged on the track plate body along the length direction, a chip guide groove cover plate is provided on one side of the chip guide groove of the track plate body, one side of the chip guide groove cover plate is fixedly connected to the track plate body, and there is a gap between the other side and the track plate body for the chip pin to extend out.
[0006] Furthermore, the material blocking mechanism includes a mounting bracket, which is fixed on the lower part of the chip guide groove cover plate, and a horizontal material blocking plate is slidably connected to the mounting bracket. A socket is provided on the chip guide groove cover plate corresponding to the material blocking plate, and the socket passes through the chip guide groove cover plate.
[0007] Furthermore, a material stopping cylinder perpendicular to the offset guide rail is installed on the mounting bracket, and the movable end of the material stopping cylinder faces the chip guide groove cover plate, and an L-shaped sliding block is installed on the movable end of the material stopping block, and the vertical part of the L-shaped sliding block is on the top and the horizontal part is on the bottom, and the horizontal part of the L-shaped sliding block is slidably connected to the mounting bracket and faces the chip guide groove cover plate, and the vertical part is fixedly connected to the movable end of the material stopping cylinder, and the material stopping plate is installed on the horizontal part of the L-shaped sliding block.
[0008] Furthermore, a heating hole is provided at the upper end of the chip guiding groove cover plate corresponding to the chip guiding groove, a heating rod is installed in the heating hole, and an avoidance groove is provided on the material blocking plate corresponding to the heating rod.
[0009] Furthermore, the chip pin protection mechanism includes a pin abutment block, which is installed on the side of the chip guide slot cover corresponding to the gap, and the pin abutment block corresponds to the pin of the test chip protruding from the gap blocked by the blocking plate.
[0010] Furthermore, the sliding mechanism is located on the side of the offset guide rail where there is no gap, and the sliding mechanism includes a vertical sliding plate, which is installed on the sorting machine. The sliding plate is perpendicular to the offset guide rail, and a slider is provided on the side of the guide rail where there is no gap. A horizontal sliding rail is provided on the sliding plate corresponding to the slider, and a driving cylinder for driving the slider to slide is installed on the sliding plate.
[0011] Furthermore, the pressure testing mechanism also includes a testing device, which includes a test circuit board. The test circuit board is installed on the sorting machine through a circuit board fixing frame and is located next to the offset guide rail. The test circuit board is provided with a plurality of pin test probes corresponding to the pin abutment blocks on the side facing the offset guide rail, and the test circuit board is provided with a test gold finger on the side facing away from the offset guide rail.
[0012] Furthermore, there are at least two pressure-testing mechanisms, and a cache track is connected between two adjacent pressure-testing mechanisms, and a heating rod for heat preservation is arranged in the cache track.
[0013] Compared with the prior art, the present invention has the following beneficial effects: reasonable design, which solves the problem that when the test pins in the existing chip sorting machine touch the chip pins, the chip pins are excessively bent and damaged due to excessive impact force; at the same time, the track has a heat preservation function, and there will be no problem of chip temperature drop and inaccurate performance test due to chip track transportation, which facilitates professional chip high-temperature testing and sorting. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 The structure of the embodiment of the utility model is shown in FIG. Figure 1 ;
[0015] Figure 2 for Figure 1 Schematic diagram without pin abutment block;
[0016] Figure 3 The structure of the embodiment of the utility model is shown in FIG. Figure 2 ;
[0017] Figure 4 This is a structural schematic diagram of the pressure testing mechanism of an embodiment of the utility model (excluding the testing device) 1;
[0018] Figure 5 This is a structural diagram of the pressure testing mechanism of an embodiment of the utility model (excluding the testing device) 2;
[0019] Figure 6 This is a structural schematic diagram of the pressure testing mechanism of an embodiment of the utility model (excluding the testing device and the chip guide slot cover);
[0020] Figure 7 for Figure 4 Schematic diagram of the structure of the center offset guide rail after being cut along the conveying direction.
[0021] In the figure: 1-pressure testing mechanism; 2-cache track; 3-offset guide rail; 4-blocking mechanism; 5-sliding mechanism; 6-chip pin protection mechanism; 7-track plate; 8-chip guide slot; 9-chip guide slot cover; 10-gap; 11-test chip; 12-test pin; 13-mounting bracket; 14-blocking plate; 15-socket; 16-blocking cylinder; 17-L-shaped sliding block; 18-heating hole; 19-heating rod; 20-avoidance groove; 21-pin abutment block; 22-sliding plate; 23-sliding block; 24-horizontal slide rail; 25-driving cylinder; 26-test circuit board; 27-circuit board fixing frame; 28-pin test probe; 29-test gold finger. DETAILED DESCRIPTION
[0022] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0023] It should be noted that the following detailed descriptions are exemplary and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.
[0024] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.
[0025] like Figure 1-7 As shown, a high-temperature dynamic stress testing device for a semiconductor device sorting machine comprises at least one stress testing mechanism 1, which is installed on the sorting machine, and the stress testing mechanism comprises an offset guide rail 3, a material blocking mechanism 4 is installed on the output end of the offset guide rail, a sliding mechanism 5 for driving the offset guide rail to move forward and backward is installed on the side of the offset guide rail, and a chip pin protection mechanism 6 is arranged on the offset guide rail. When in use, under normal conditions, the offset guide rail is connected to the input and output slide rails of the sorting machine to realize the falling of the chip, and the falling chip to be tested is blocked by the material blocking mechanism, and then the offset guide rail is driven to slide by the sliding mechanism until the test pin of the chip to be tested is connected to the test device on the sorting machine for dynamic testing. At this time, the chip pin protection mechanism is used to prevent the test probe of the test device from damaging the test pin of the chip. After the test, the sliding mechanism drives the offset guide rail to slide and reset, and then the material blocking mechanism is released, and the chip to be tested falls to the next stress testing mechanism or output.
[0026] In this embodiment, the offset guide rail includes a track plate body 7, a chip guide groove 8 is arranged on the track plate body along the length direction, a chip guide groove cover plate 9 is provided on one side of the chip guide groove of the track plate body, one side of the chip guide groove cover plate is fixedly connected to the track plate body, and a gap 10 is provided between the other side and the track plate body for the chip pin to extend. Specifically, a plurality of parallel test pins 12 are arranged on one side of the body of the test chip 11. When in use, the test chip falls into the chip guide groove of the offset guide rail. When falling, the body of the test chip slides into the chip guide groove, and the test pin extends out of the gap, so that the test pin contacts the test mechanism when the offset guide rail slides later.
[0027] In this embodiment, in order to achieve material blocking, the material blocking mechanism includes a mounting bracket 13, and the mounting bracket is fixed on the lower part of the chip guide groove cover plate. A horizontal material blocking plate 14 is slidably connected to the mounting bracket. The chip guide groove cover plate is provided with a socket 15 corresponding to the material blocking plate. The socket passes through the chip guide groove cover plate, and the material blocking plate is inserted into the chip guide groove through the socket, so that the material blocking plate cuts off the channel of the chip guide groove, thereby achieving material blocking.
[0028] In the present embodiment, further, in order to realize the sliding of the material blocking plate, a material blocking cylinder 16 perpendicular to the offset guide rail is installed on the mounting bracket, and the movable end of the material blocking cylinder faces the chip guide groove cover plate, and an L-shaped sliding block 17 is installed on the movable end of the material blocking, and the vertical part of the L-shaped sliding block is on the top and the horizontal part is on the bottom, and the horizontal part of the L-shaped sliding block is slidably connected to the mounting bracket and faces the chip guide groove cover plate, and the vertical part is fixedly connected to the movable end of the material blocking cylinder, and the material blocking plate is installed on the horizontal part of the L-shaped sliding block, and the sliding of the L-shaped sliding block is realized by the extension and retraction of the movable end of the material blocking cylinder, thereby driving the sliding of the material blocking plate.
[0029] In this embodiment, in order to achieve heat preservation, a heating hole 18 is opened at the upper end of the chip guide groove cover plate corresponding to the chip guide groove, and a heating rod 19 is installed in the heating hole to dissipate heat through the heating rod. The heating rod can be an existing electric heating rod to heat the chip guide groove cover plate, thereby achieving heat preservation of the chip guide groove. An avoidance groove 20 is provided on the baffle plate corresponding to the heating rod to avoid damage between the baffle plate and the heating rod when the baffle plate is inserted into the chip guide groove.
[0030] In this embodiment, in order to achieve pin protection, the chip pin protection mechanism includes a pin abutment block 21, and the pin abutment block is installed on the side of the chip guide slot cover plate corresponding to the gap. The pin abutment block corresponds to the pins of the test chip protruding from the gap blocked by the baffle plate. When in use, the test chip falls onto the baffle plate, and at this time, the pins of the test chip protruding from the gap just abut against the pin abutment block. When the pin contacts the test device, the presence of the pin abutment block can prevent the pin from being damaged by collision with the test device.
[0031] In this embodiment, in order to achieve the sliding of the offset guide rail, the sliding mechanism is located on the side of the offset guide rail where there is no gap. The sliding mechanism includes a vertical sliding plate 22, which is installed on the sorting machine. The sliding plate is perpendicular to the offset guide rail. A slider 23 is provided on the side of the guide rail where there is no gap. A horizontal slide rail 24 is provided on the sliding plate corresponding to the slider. A driving cylinder 25 for driving the slider to slide is installed on the sliding plate. When in use, the slider is pushed to slide on the horizontal slide rail by the driving cylinder, thereby driving the entire offset guide rail to move, thereby achieving the sliding of the offset guide rail.
[0032] In this embodiment, for the sake of reasonable design, the pressure testing mechanism also includes a testing device, which includes a test circuit board 26. The test circuit board is installed on the sorting machine and beside the offset guide rail through a circuit board fixing frame 27. The test circuit board is provided with a plurality of pin test probes 28 corresponding to the pin abutment blocks on the side facing the offset guide rail, and the test circuit board is provided with a test gold finger 29 on the side facing away from the offset guide rail. When in use, the test circuit board is connected to an existing external testing machine through the test gold finger.
[0033] In this embodiment, for the sake of reasonable design, there are at least two pressure testing mechanisms, and a cache track 2 is connected between two adjacent pressure testing mechanisms. An existing heating rod for insulation is provided in the cache track to prevent the temperature of the chip to be tested on the cache track from dropping.
[0034] Unless otherwise stated, any technical solution disclosed in the above utility model, if it discloses a numerical range, then the disclosed numerical range is a preferred numerical range. Any technician in the field should understand that the preferred numerical range is only a numerical value with a more obvious technical effect or representative value among many feasible numerical values. Since there are too many numerical values to be exhaustive, the utility model discloses only some numerical values to illustrate the technical solution of the utility model, and the numerical values listed above should not constitute a limitation on the scope of protection of the utility model.
[0035] If the words "first", "second" and so on are used in this article to limit components, those skilled in the art should know that the use of "first" and "second" is only for the convenience of description to distinguish the components. Unless otherwise stated, the above words have no special meaning.
[0036] If the present invention discloses or involves components or structures that are fixedly connected to each other, then, unless otherwise stated, the fixed connection can be understood as: a detachable fixed connection (for example, connection using bolts or screws), and can also be understood as: a non-detachable fixed connection (for example, riveting, welding). Of course, the mutual fixed connection can also be replaced by an integrated structure (for example, manufactured by one-piece molding using a casting process) (except when it is obviously impossible to use an one-piece molding process).
[0037] In addition, the orientations or positional relationships indicated by terms such as "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", and "outside" used in any of the technical solutions disclosed in the above-mentioned utility model are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this patent, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this patent. Unless otherwise stated, the terms used to indicate shapes used in any of the technical solutions disclosed in the above-mentioned utility model include shapes that are approximate, similar or close to them.
[0038] Any component provided by the utility model can be assembled from multiple separate components, or can be a separate component manufactured by an integrated forming process.
[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the utility model can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the utility model, which should be included in the scope of the technical solution for protection of the utility model.
Claims
1. A high temperature dynamic pressure test device for a semiconductor device sorting machine, characterized in that: It comprises at least one pressure-testing mechanism, which is installed on the sorting machine, and comprises a dislocation guide rail, a material-blocking mechanism is installed on the output end of the dislocation guide rail, a sliding mechanism for driving the dislocation guide rail to move forward and backward is installed on the side of the dislocation guide rail, and a chip pin protection mechanism is arranged on the dislocation guide rail; The offset guide rail comprises a track plate body, a chip guide groove is arranged on the track plate body along the length direction, a chip guide groove cover plate is arranged on one side of the chip guide groove of the track plate body, one side of the chip guide groove cover plate is fixedly connected to the track plate body, and a gap is provided between the other side and the track plate body for extending the chip pin; The material blocking mechanism comprises a mounting bracket, the mounting bracket is fixed on the lower part of the chip guide slot cover plate, a horizontal material blocking plate is slidably connected to the mounting bracket, a socket is provided on the chip guide slot cover plate corresponding to the material blocking plate, and the socket passes through the chip guide slot cover plate; A heating hole is provided on the upper end of the chip guide groove cover plate corresponding to the chip guide groove, a heating rod is installed in the heating hole, and an avoidance groove is provided on the material blocking plate corresponding to the heating rod.
2. The high temperature dynamic pressure test device for semiconductor device sorting machine according to claim 1, characterized in that; A material blocking cylinder perpendicular to the offset guide rail is installed on the mounting bracket, and the movable end of the material blocking cylinder faces the chip guide groove cover plate. An L-shaped sliding block is installed on the movable end of the material blocking block, and the vertical portion of the L-shaped sliding block is on the top and the horizontal portion is on the bottom. The horizontal portion of the L-shaped sliding block is slidably connected to the mounting bracket and faces the chip guide groove cover plate, and the vertical portion is fixedly connected to the movable end of the material blocking cylinder, and the material blocking plate is installed on the horizontal portion of the L-shaped sliding block.
3. The high temperature dynamic pressure test device for semiconductor device sorting machine according to claim 1, characterized in that; The chip pin protection mechanism comprises a pin abutment block, which is installed on the side of the chip guide slot cover plate corresponding to the gap, and the pin abutment block corresponds to the pin of the test chip protruding from the gap blocked by the blocking plate.
4. The high temperature dynamic pressure test device for semiconductor device sorting machine according to claim 1, characterized in that; The sliding mechanism is located on the side of the offset guide rail where there is no gap. The sliding mechanism includes a vertical sliding plate, which is installed on the sorting machine. The sliding plate is perpendicular to the offset guide rail. A slider is provided on the side of the guide rail where there is no gap. A horizontal sliding rail is provided on the sliding plate corresponding to the slider, and a driving cylinder for driving the slider to slide is installed on the sliding plate.
5. The high temperature dynamic pressure test device for semiconductor device sorting machine according to claim 3, characterized in that; The pressure testing mechanism also includes a testing device, which includes a testing circuit board. The testing circuit board is installed on the sorting machine and beside the offset guide rail through a circuit board fixing frame. A plurality of pin testing probes are provided on the corresponding pin abutment blocks on the side of the testing circuit board facing the offset guide rail, and a testing gold finger is provided on the side of the testing circuit board facing away from the offset guide rail.
6. The high temperature dynamic pressure test device for semiconductor device sorting machine according to claim 1, characterized in that; There are at least two pressure measuring mechanisms, and a buffer track is connected between two adjacent pressure measuring mechanisms. A heating rod for heat preservation is arranged in the buffer track.