Moisture-proof and anti-static carrier tape applied to semiconductor chip

Abstract

The utility model relates to the technical field of semiconductor chip packaging, and discloses a moisture-proof anti-static carrier tape applied to a semiconductor chip, which comprises a base, a moisture-proof assembly and an anti-static assembly, clamping grooves are arranged on two sides of the inner bottom of the base, one end of each clamping groove is fixedly connected with a carrier disc, and the moisture-proof assembly and the anti-static assembly are arranged on the base. The moisture-proof assembly comprises two groups of moisture-proof grooves formed in the inner walls of the carrying discs, a moisture-proof block is clamped in each moisture-proof groove, one ends of the pair of carrying discs are jointly and rotationally connected with a rotating roller, and a carrying belt is wound on the outer wall of the rotating roller; the effect of effectively improving the moisture-proof effect of the device is achieved, the water absorption and moisture-proof effects of the device are improved through the arrangement of the two groups of moisture-proof blocks, then the influence of moisture in the environment on the semiconductor chip is effectively isolated through the mutual cooperation of the waterproof groove, the cover sealing belt and the insulating layer, the moisture-proof effect of the device is further improved, and the service life of the device is prolonged. The problem that it is difficult to effectively reduce the influence of moisture on the semiconductor chip is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip packaging, in particular to a moisture-proof and anti-static carrier tape used for semiconductor chips. Background Art

[0002] Carrier tape refers to a strip product used in the field of semiconductor chip packaging. It has a specific thickness and has holes (also called pockets) for holding semiconductor chips and positioning holes for indexing and positioning evenly distributed along its length. Carrier tape is mainly used in the semiconductor chip mounting industry. It is used in conjunction with a cover tape (upper sealing tape) to carry and store semiconductor chips in the pockets of the carrier tape, and the cover tape is sealed on top of the carrier tape to form a closed package, which is used to prevent semiconductor chips from being contaminated and damaged during transportation.

[0003] The patent with announcement number CN216213353U discloses an antistatic semiconductor chip carrier, which belongs to the field of chip carriers. An antistatic semiconductor chip carrier includes two fixed disks, a rotating roller is rotatably connected between the two fixed disks, a carrier body is wound around the outer side of the rotating roller, the inside of the carrier body is provided with index holes arranged at equal distances, the inside of the carrier body is provided with placement grooves arranged at equal distances, a group of the placement grooves are each provided with a fixing component, and an antistatic component is provided between the two fixed disks.

[0004] The device is convenient for reducing the phenomenon of static electricity generated by the carrier tape, and can effectively fix and place electronic components, reduce the phenomenon of static electricity generated by shaking and friction, reduce the phenomenon of dust adsorbed by the carrier tape and the outside of the electronic components due to static electricity, and reduce the impact on the electronic components.

[0005] However, the device still has the following problems. The device rolls up the carrier body by rotating rollers, and then effectively reduces the impact of static electricity on semiconductor chips through anti-static components. During the actual production and transportation process, the packaged semiconductor chip carrier tape also needs to effectively protect the semiconductor chips from being damaged by moisture. However, the device lacks corresponding moisture-proof components, making it difficult to effectively reduce the impact of moisture on semiconductor chips. Utility Model Content

[0006] 1. Technical issues to be resolved

[0007] In view of the deficiencies in the prior art, the utility model provides a moisture-proof and anti-static carrier tape for semiconductor chips, which solves the problem that the above-mentioned device lacks corresponding moisture-proof components and is difficult to effectively reduce the impact of moisture on semiconductor chips.

[0008] (II) Technical solution

[0009] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a moisture-proof and anti-static carrier tape for semiconductor chips, comprising a base, wherein both sides of the inner bottom of the base are provided with card slots, one end of each of the card slots is fixedly connected to a carrier plate, and also comprising a moisture-proof component and an anti-static component;

[0010] The moisture-proof component includes two groups of moisture-proof grooves opened on the inner wall of the carrier, each of the moisture-proof grooves is clamped with a moisture-proof block, one end of a pair of the carriers is connected to a rotating roller for common rotation, a carrier belt is wrapped around the outer wall of the rotating roller, a group of pockets are evenly opened along the length direction on the top of the carrier belt, the inner wall of the pocket is fixedly connected with a waterproof groove, a cover belt is provided at the top of the waterproof groove, and the top of the waterproof groove and the bottom of the cover belt are fixedly connected with an insulating layer.

[0011] Preferably, the anti-static component includes a limiting groove opened on one side of the outer wall of one of the carriers, the inner wall of the limiting groove is slidably connected with a storage frame, and one end of the storage frame is snap-fitted with the inner wall of the other carrier.

[0012] Preferably, a conductive plate is fixedly connected to the inner bottom of the storage frame, a conductive rod is fixedly connected to the other end of the storage frame, a grounding chain is fixedly connected to the bottom end of the conductive rod, and an antistatic layer is fixedly connected to the bottom of the carrier tape.

[0013] Preferably, a plurality of fixing grooves are provided on the outer wall of each carrier plate near the moisture-proof groove, and one end of each moisture-proof block is fixedly connected to a group of fixing blocks matched with the fixing grooves.

[0014] Preferably, a group of evenly distributed index holes are provided on the top of the carrier tape near the pocket.

[0015] Preferably, each of the moisture-proof blocks is arranged in a cylindrical structure, and each of the fixing blocks is arranged in an L-shaped structure.

[0016] (III) Beneficial effects

[0017] 1. The moisture-proof and anti-static carrier tape applied to semiconductor chips improves the water absorption and moisture-proof effect of the device by setting two groups of moisture-proof blocks, and then effectively isolates the influence of moisture in the environment on the semiconductor chip through the mutual cooperation between the waterproof groove, the cover tape and the insulating layer, further improves the moisture-proof effect of the device, and effectively prevents the semiconductor chip from being damaged by moisture.

[0018] 2. The moisture-proof and anti-static carrier used for semiconductor chips is simple to operate and ingeniously designed. Through the mutual cooperation between multiple fixing blocks and fixing grooves, it is easy to plug and replace the moisture-proof blocks, which effectively improves the convenience of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1This is a schematic diagram of the three-dimensional structure of the utility model from the first viewing angle;

[0020] Figure 2 It is a three-dimensional structural diagram of some components of the utility model;

[0021] Figure 3 This is a schematic diagram of the three-dimensional structure of some moisture-proof components of the utility model;

[0022] Figure 4 It is a cross-sectional three-dimensional structural schematic diagram of some components of the utility model.

[0023] In the figure: 1. base; 2. card slot; 3. carrier plate; 4. rotating roller; 5. moisture-proof groove; 6. fixing groove; 7. moisture-proof block; 8. fixing block; 9. limit groove; 10. storage frame; 11. conductive plate; 12. conductive rod; 13. grounding chain; 14. carrier tape; 15. index hole; 16. pocket; 17. antistatic layer; 18. waterproof groove; 19. cover tape; 191. insulation layer. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Example: Figure 1 As shown, a moisture-proof and anti-static carrier tape for semiconductor chips includes a base 1, wherein the base 1 is made of a composite organic material to improve the overall stability of the device and reduce the cost of the device. The base 1 is provided with card slots 2 on both sides of the inner bottom, and one end of each of the card slots 2 is fixedly connected to a carrier plate 3 by bolts, and also includes a moisture-proof component and an anti-static component;

[0026] The moisture-proof assembly includes two groups of moisture-proof grooves 5 opened on the inner wall of the carrier 3, each of the moisture-proof grooves 5 is clamped with a moisture-proof block 7, wherein the moisture-proof block 7 is made of silicon dioxide and calcium chloride materials, which effectively improves the water absorption and moisture-proof effect of the device, one end of a pair of the carriers 3 is rotatably connected to a rotating roller 4 through a bearing, the outer wall of the rotating roller 4 is wound with a carrier belt 14, and a group of pockets 16 are evenly opened on the top of the carrier belt 14 along the length direction, and the inner wall of the pocket 16 is fixedly connected with a waterproof groove 18, wherein the waterproof groove 18 is made of silicon dioxide and calcium chloride. The waterproof groove 18 is made of adhesive material to isolate moisture. A covering tape 19 is arranged on the top of the waterproof groove 18. The covering tape 19 is made of silicon dioxide-coated polyethylene terephthalate layer (silicon-coated PET) material and has a good waterproof effect to prevent the semiconductor chip from being damaged by moisture. The top of the waterproof groove 18 and the bottom of the covering tape 19 are fixedly connected with an insulating layer 191. The insulating layer 191 is made of polyethylene (easy-to-tear ESD-PE) material, which facilitates the covering tape 19 and the waterproof groove 18 to fit each other and is not easy to generate static electricity.

[0027] like Figure 1 and Figure 2 As shown, in a certain embodiment, in order to improve the antistatic effect of the device, the antistatic component includes a limiting groove 9 opened on one side of the outer wall of one of the carriers 3, the inner wall of the limiting groove 9 is slidably connected with a storage frame 10, and one end of the storage frame 10 is snapped with the inner wall of the other carrier 3, wherein the storage frame 10 plays the role of guiding the carrier tape 14 to be wound around the outer wall of the rotating roller 4, the inner bottom of the storage frame 10 is fixedly connected with a conductive plate 11, wherein the conductive plate 11 is made of conductive metal material, and plays the role of absorbing static electricity attached to the surface of the carrier tape 14, the other end of the storage frame 10 is fixedly connected with a conductive rod 12, and the bottom end of the conductive rod 12 is fixedly connected with a grounding chain 13, through the mutual cooperation between the conductive rod 12 and the grounding chain 13, the static electricity that may be on the surface of the carrier tape 14 is eliminated, and the antistatic effect of the device is effectively improved, and the bottom of the carrier tape 14 is fixedly connected with an antistatic layer 17, wherein the antistatic layer 17 is made of polyethylene terephthalate material, has a good antistatic effect, and avoids static electricity from damaging semiconductor chips.

[0028] like Figure 2-Figure 4 As shown, in a certain embodiment, in order to improve the convenience of the device, a plurality of fixing grooves 6 are provided on the outer wall of each of the carrier plates 3 near the moisture-proof groove 5, and a group of fixing blocks 8 compatible with the fixing grooves 6 are fixedly connected to one end of each of the moisture-proof blocks 7. The setting of the fixing blocks 8 facilitates the plugging and replacement of the moisture-proof blocks 7, thereby improving the convenience of the device. A group of evenly distributed index holes 15 are provided on the top of the carrier tape 14 near the pocket 16, wherein the setting of the index holes 15 facilitates the positioning of the semiconductor chip, and each of the moisture-proof blocks 7 is arranged in a cylindrical structure, and each of the fixing blocks 8 is arranged in an L-shaped structure.

[0029] Working principle: When in use, place the semiconductor chip in the waterproof groove 18, and then fit the cover tape 19 to the top of the waterproof groove 18. The setting of the insulating layer 191 facilitates the cover tape 19 and the waterproof groove 18 to fit each other, and it is not easy to generate static electricity. The cooperation between the waterproof groove 18 and the cover tape 19 effectively improves the waterproof effect of the device to prevent the semiconductor chip from being damaged by moisture. Then, guided by the storage frame 10, the carrier tape 14 is wound around the outer wall of the rotating roller 4. At the same time, the conductive plate 11 fixedly connected to the bottom of the storage frame 10 absorbs the static electricity that may be on the surface of the carrier tape 14. Then, through the cooperation of the conductive rod 12 and the grounding chain 13, the static electricity is guided into the ground, which improves the anti-static effect of the device. Then, the moisture-proof block 7 is clamped in the moisture-proof groove 5, wherein the moisture-proof block 7 is made of water-absorbing and moisture-proof material, which further improves the moisture-proof effect of the device. The mutual cooperation between the fixed groove 6 and the fixed block 8 facilitates the plugging and replacement of the moisture-proof block 7, which improves the convenience of the device.

[0030] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A moisture-proof and anti-static carrier tape for semiconductor chips, comprising a base (1), wherein both sides of the inner bottom of the base (1) are provided with card slots (2), and one end of each of the card slots (2) is fixedly connected to a carrier plate (3), characterized in that: It also includes moisture-proof components and anti-static components; The moisture-proof component comprises two groups of moisture-proof grooves (5) opened on the inner wall of the carrier (3), each of the moisture-proof grooves (5) is clamped with a moisture-proof block (7), one end of a pair of carriers (3) is rotatably connected to a rotating roller (4), the outer wall of the rotating roller (4) is wound with a carrier belt (14), the top of the carrier belt (14) is evenly opened with a group of pockets (16) along the length direction, the inner wall of the pocket (16) is fixedly connected with a waterproof groove (18), the top of the waterproof groove (18) is provided with a cover belt (19), and the top of the waterproof groove (18) and the bottom of the cover belt (19) are fixedly connected with an insulating layer (191).

2. The moisture-proof and antistatic carrier tape for semiconductor chips according to claim 1, characterized in that: The antistatic component comprises a limiting groove (9) formed on one side of the outer wall of one of the carrier plates (3); the inner wall of the limiting groove (9) is slidably connected to a storage frame (10), and one end of the storage frame (10) is snap-fitted to the inner wall of the other carrier plate (3).

3. The moisture-proof and antistatic carrier tape for semiconductor chips according to claim 2, characterized in that: The inner bottom of the storage frame (10) is fixedly connected to a conductive plate (11), the other end of the storage frame (10) is fixedly connected to a conductive rod (12), the bottom end of the conductive rod (12) is fixedly connected to a grounding chain (13), and the bottom of the carrier tape (14) is fixedly connected to an antistatic layer (17).

4. The moisture-proof and antistatic carrier tape for semiconductor chips according to claim 1, characterized in that: A plurality of fixing grooves (6) are provided on the outer wall of each carrier (3) near the moisture-proof groove (5), and one end of each moisture-proof block (7) is fixedly connected to a group of fixing blocks (8) matched with the fixing grooves (6).

5. The moisture-proof and antistatic carrier tape for semiconductor chips according to claim 1, characterized in that: A group of evenly distributed index holes (15) are provided at the top of the carrier tape (14) near the pocket (16).

6. The moisture-proof and antistatic carrier tape for semiconductor chips according to claim 4, characterized in that: Each moisture-proof block (7) is arranged in a cylindrical structure, and each fixing block (8) is arranged in an L-shaped structure.

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