Semiconductor device pin tinning tool and device

Abstract

The utility model provides a semiconductor device pin tinning tool, and belongs to the technical field of semiconductor device tinning equipment, the semiconductor device pin tinning tool comprises a rotary drum, an even number of rectangular grooves are formed in the outer wall of the rotary drum along a circumferential array, and elastic strips are arranged on the inner wall and the two side walls of each rectangular groove and are parallel to the rectangular grooves. Limiting plates are arranged on the two sides of the opening end of the rectangular groove, and a gap between the two limiting plates is parallel to the rectangular groove. The semiconductor device pin tinning device comprises a tin liquid tank and the semiconductor device pin tinning tool, the two ends of the rotary drum are rotationally arranged above the tin liquid tank through a support, the rotary drum is driven by a motor, the motor for driving is installed on the support, two parallel material tanks are arranged at the end of the rotary drum, and the two parallel material tanks are arranged on the support. And when the two rectangular grooves which are oppositely arranged along the circumference of the rotary drum are in a horizontal state, any ends of the two rectangular grooves are respectively aligned with the two material grooves. The scheme can effectively improve the tinning efficiency.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor device tinning equipment, and in particular relates to a semiconductor device pin tinning tool and device. Background Art

[0002] The pins of semiconductor devices are usually made of copper, which is easy to oxidize in the air. Once the pins of semiconductor devices are oxidized, they will affect the circuit performance. Tinning the pins can effectively prevent the pins from oxidizing, thereby protecting the semiconductor devices. The patent with application number CN201810177402.7 discloses a fixture for pin tinning, which uses the mounting groove opened on the rotating plate to place the device to be tinned, and then drives the rotating plate to rotate by gear rack transmission, and then makes the pins of the device rotate through the tin liquid groove, so as to achieve the purpose of tinning the pins. However, this fixture can only be tinned in batches, that is, after a batch of devices are tinned and taken out, the next batch of devices are placed in the mounting groove, and then the re-placed devices are tinned. The tinning efficiency is relatively low. Utility Model Content

[0003] In order to solve the deficiencies of the prior art, the utility model provides a semiconductor device pin tinning tool, which can effectively improve the tinning efficiency.

[0004] In order to achieve the purpose of this utility model, the following scheme is proposed:

[0005] A semiconductor device pin tinning tool comprises: a rotating drum, an outer wall of which is provided with an even number of rectangular grooves in a circumferential array, the length direction of the rectangular grooves is parallel to the axis of the rotating drum, and the two ends of the rectangular grooves pass through the ends of the rotating drum.

[0006] The inner wall and two side walls of the rectangular groove are both provided with elastic strips which are parallel to the rectangular groove.

[0007] Limiting plates are provided on both sides of the opening end of the rectangular groove. The gap between the two limiting plates is parallel to the rectangular groove and located in the middle of the width direction of the rectangular groove. The width of the gap is greater than the thickness of the pin and less than the thickness of the plastic package of the semiconductor device.

[0008] A semiconductor device pin tinning device comprises a tin liquid tank and the semiconductor device pin tinning tooling, wherein the two ends of a rotating drum are rotatably arranged above the tin liquid tank through a bracket, the rotating drum is driven by a motor, and the driving motor is installed on the bracket, and two mutually parallel material grooves are arranged at the end of the rotating drum, and when two rectangular grooves of the rotating drum that are arranged opposite to each other along the circumference are in a horizontal state, either end of the two rectangular grooves is aligned with the two material grooves respectively.

[0009] The beneficial effect of the utility model is that by arranging an even number of rectangular grooves in an array on the outside of the rotating drum, when the pins in some of the rectangular grooves are tinned, the other rectangular grooves located outside the tin liquid tank can be loaded and unloaded, thereby reducing the waiting time for tinning and improving the efficiency of the entire tinning work. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0011] Figure 1 Shown is a schematic diagram of the overall structure of the present application.

[0012] Figure 2 Shows Figure 1 A partial enlarged view of point A in the middle.

[0013] Markings in the figure: rotating drum-1, rectangular groove-11, elastic strip-2, limiting plate-3, gap-31, tin liquid groove-4, bracket-41, material groove-5. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings, but the embodiments described in the utility model are only part of the embodiments of the utility model, rather than all the embodiments.

[0015] Embodiment 1, as Figure 1 , Figure 2 As shown, a semiconductor device pin tinning tool comprises: a rotating drum 1, whose outer wall is provided with an even number of rectangular grooves 11 along a circumferential array, specifically, two, four, six, eight or ten rectangular grooves 11 can be provided, the length direction of the rectangular grooves 11 is parallel to the axis of the rotating drum 1, and the two ends of the rectangular grooves 11 pass through the ends of the rotating drum 1.

[0016] The inner wall and two side walls of the rectangular groove 11 are provided with elastic strips 2 which are parallel to the rectangular groove 11 to facilitate the input or output of semiconductor devices from both ends of the rectangular groove 11 .

[0017] A stopper plate 3 is provided on both sides of the opening end of the rectangular groove 11. A gap 31 between the two stopper plates 3 is parallel to the rectangular groove 11 and is located in the middle of the width direction of the rectangular groove 11. The width of the gap 31 is greater than the thickness of the pin and less than the thickness of the semiconductor device plastic package to prevent the semiconductor device placed in the rectangular groove 11 from falling.

[0018] When placing the semiconductor device, the plastic package of the semiconductor device is inserted from one end of the rectangular groove 11, and the pins are inserted into the gap 31. The elastic strips 2 arranged on the bottom surface and both sides of the rectangular groove 11 will be pressed against the end surface and both side surfaces of the plastic package respectively, which are used to fix the plastic package to prevent the semiconductor device from shaking freely in the rectangular groove 11, and facilitate the arrangement and fixation of the semiconductor device. A plurality of semiconductor devices can be arranged in one rectangular groove 11 at the same time.

[0019] By rotating the drum 1, the pins of the semiconductor devices placed in the rectangular grooves can be made to enter the tin-plating tank, which is usually arranged below the drum 1. During the tin-plating process, when the pins of the semiconductor devices in one of the rectangular grooves 11 are being tin-plated, the semiconductor devices can be placed in another rectangular groove 11 opposite to the rectangular groove 11 or in other rectangular grooves 11 outside the tin-plating tank. In this way, the tin-plating time can be used to prepare the semiconductor devices for the next round of tin-plating, thereby improving the efficiency of tin-plating.

[0020] Preferably, Figure 2 As shown, the elastic strip 2 is a spring sheet with a long strip structure. There is a gap between the elastic strip 2 and the inner wall of the rectangular groove 11. Specifically, there is a gap between the elastic strips 2 corresponding to the bottom and side surfaces of the rectangular groove to ensure sufficient elastic deformation space. The two ends of the elastic strip 2 are connected to the bottom surface of the rectangular groove 11 by welding.

[0021] As another preferred structure, the elastic strip 2 is made of a long rubber strip, which is adhered to the bottom surface and two side walls of the rectangular groove 11. The use of a rubber strip to make the elastic strip 2 can effectively prevent scratches on the surface of the plastic package body.

[0022] Preferably, Figure 1 As shown, the limit plate 3 is installed on the outer wall of the drum 1 by screws, so as to facilitate the setting of the elastic strip 2 on the inner wall of the rectangular groove 11, while reducing the difficulty of processing the drum 1; in an integrated drum 1 structure, the rectangular groove 11 and the gap 31 are both formed by processing on the outside of the drum 1, but this structure is more difficult to process and it is not easy to set the elastic strip 2.

[0023] Embodiment 2, a semiconductor device pin tinning device, including a tin liquid tank 4 and a semiconductor device pin tinning tooling recorded in Embodiment 1, the two ends of the rotating drum 1 are rotatably arranged above the tin liquid tank 4 through a bracket 41, the rotating drum 1 is driven by a motor, and the driving motor is installed on the bracket 41, and two mutually parallel material tanks 5 are arranged at the end of the rotating drum 1, when two rectangular tanks 11 of the rotating drum 1 that are arranged opposite to each other along the circumference are in a horizontal state, any end of the two rectangular tanks 11 is aligned with the two material tanks 5 respectively. In specific use, one of the material tanks 5 is used to feed semiconductor devices into the rectangular tank 11, and the other material tank 5 is used to receive the semiconductor devices after tinning discharged from the rectangular tank 11; according to the actual site layout, the two material tanks 5 can be set at the same end of the rotating drum 1 or at the two ends of the rotating drum 1 respectively.

[0024] The above is only a preferred embodiment of the utility model, and does not mean that it is the only one or limit the utility model. Those skilled in the art should understand that various changes or equivalent replacements made to the utility model without departing from the scope of the utility model are within the scope of protection of the utility model.

Claims

1. A semiconductor device pin tinning tool, characterized in that: include: A rotating drum (1) has an outer wall with an even number of rectangular grooves (11) arranged in a circumferential array, the length direction of the rectangular grooves (11) being parallel to the axis of the rotating drum (1), and both ends of the rectangular grooves (11) passing through the ends of the rotating drum (1); The inner wall and two side walls of the rectangular groove (11) are provided with elastic strips (2) which are parallel to the rectangular groove (11); Limiting plates (3) are provided on both sides of the opening end of the rectangular groove (11); a gap (31) between the two limiting plates (3) is parallel to the rectangular groove (11) and is located in the middle of the rectangular groove (11) in the width direction; the width of the gap (31) is greater than the thickness of the pin and less than the thickness of the plastic package of the semiconductor device.

2. A semiconductor device pin tinning tool according to claim 1, characterized in that: The elastic strip (2) is a spring sheet with a long strip structure, and there is a gap between the elastic strip (2) and the inner wall of the rectangular groove (11).

3. A semiconductor device pin tinning tool according to claim 1, characterized in that: The elastic strip (2) is made of a long rubber strip and is adhered to the bottom surface and two side walls of the rectangular groove (11).

4. A semiconductor device pin tinning tool according to claim 1, characterized in that: The limiting plate (3) is mounted on the outer wall of the rotating drum (1) by means of screws.

5. A semiconductor device pin tinning device, characterized in that: The invention comprises a tin liquid tank (4) and a semiconductor device pin tinning tool as claimed in any one of claims 1 to 4, wherein the two ends of a rotating drum (1) are rotatably arranged above the tin liquid tank (4) through a bracket (41), and two mutually parallel material tanks (5) are arranged at the end of the rotating drum (1). When two rectangular grooves (11) of the rotating drum (1) are arranged opposite to each other along the circumference are in a horizontal state, either end of the two rectangular grooves (11) is aligned with the two material tanks (5) respectively.

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