Sensor and electronic device

Abstract

The utility model discloses a sensor and an electronic device, the sensor comprises a substrate, a pedestal, a vibration mechanism, an acoustic-electric conversion assembly and a housing, the pedestal comprises a seat body and an accommodation chamber, the seat body is connected with the substrate and forms an accommodation space with the substrate, and the accommodation chamber is located in the accommodation space and divides the accommodation space into a first cavity and a second cavity; the vibration mechanism comprises a first vibration assembly, and the first vibration assembly comprises a first vibrating diaphragm and a first mass block; the acoustic-electric conversion assembly comprises a sensor chip and an integrated circuit chip, and the sensor chip is electrically connected with the integrated circuit chip through a substrate; the shell covers the substrate to form an accommodating cavity, and the accommodating bin is provided with a sound hole communicated with the accommodating cavity and the mounting space; the original longitudinal arrangement of the vibration assembly and the sensor chip is changed into transverse arrangement, so that the overall height of the sensor is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a sensor and an electronic device. Background Art

[0002] Traditional bone voiceprint sensors are divided into two parts: microphone component and vibration component. The microphone component usually adopts a three-layer PCB structure, and the vibration component is mounted on the microphone component as a separate component. The packaging process of this structure is relatively complicated, and the process requirements are high. At the same time, the product height is high, and the applicable scenarios are limited.

[0003] In view of this, it is necessary to provide a new sensor and electronic device to solve or at least alleviate the above technical defects. Utility Model Content

[0004] The main purpose of the utility model is to provide a sensor and an electronic device, aiming to solve the technical problem of the high height of the existing bone voiceprint sensor.

[0005] In order to achieve the above object, the utility model provides a sensor, the sensor comprising:

[0006] substrate;

[0007] A base, the base comprising a base body and a receiving chamber, the base body being connected to the substrate and forming a receiving space with the substrate, the receiving chamber being located in the receiving space and dividing the receiving space into a first cavity and a second cavity which are independent of each other and arranged in a horizontal direction;

[0008] A vibration mechanism, wherein the vibration mechanism comprises a first vibration component, wherein the first vibration component comprises a first diaphragm and a first mass block mounted on the first diaphragm, a first opening is formed on a side of the first cavity away from the substrate, and the first diaphragm is covered on the first opening;

[0009] An acoustic-to-electric conversion component, the acoustic-to-electric conversion component includes a sensor chip and an integrated circuit chip, a mounting space for accommodating the sensor chip is formed in the accommodating chamber, and the sensor chip is electrically connected to the integrated circuit chip;

[0010] The outer shell is covered on the substrate to form a receiving cavity, the base, the vibration mechanism and the sound-to-electric conversion component are all arranged in the receiving cavity, and the receiving compartment is provided with a sound hole connecting the receiving cavity and the installation space.

[0011] In one embodiment, the integrated circuit chip is embedded in the substrate, and the sensor chip is electrically connected to the integrated circuit chip through the substrate.

[0012] In one embodiment, the sensor chip is invertedly arranged in the installation space, the side of the sensor chip facing the substrate is welded to the substrate, and the side of the sensor chip facing away from the substrate is connected to the inner wall of the containing chamber; the integrated circuit chip is arranged below the sensor chip.

[0013] In one embodiment, the substrate is provided with a mounting groove having an opening facing the sensor chip, the integrated circuit chip is mounted in the mounting groove, and the sensor chip and the integrated circuit chip are electrically connected.

[0014] In one embodiment, the vibration mechanism also includes a second vibration component, the second vibration component includes a second diaphragm and a second mass block installed on the second diaphragm, a second opening is opened on the side of the second cavity away from the substrate, and the second diaphragm is covered on the second opening.

[0015] In one embodiment, the first diaphragm and the second diaphragm have the same size, and are symmetrically arranged on both sides of the sensor chip; the first mass block and the second mass block have the same size, and are symmetrically arranged on both sides of the sensor chip.

[0016] In one embodiment, the first mass block is provided with a first air leakage hole connected to the first cavity, and the first diaphragm is provided with a first air vent hole connected to the first air leakage hole and the accommodating cavity; the second mass block is provided with a second air leakage hole connected to the second cavity, and the second diaphragm is provided with a second air vent hole connected to the second air leakage hole and the accommodating cavity.

[0017] In one embodiment, the shell is provided with a pressure relief hole communicating with the accommodating cavity.

[0018] In one embodiment, the seat body and the accommodating chamber are integrally formed parts.

[0019] In addition, the utility model also provides an electronic device, which includes the above-mentioned sensor.

[0020] In the above technical scheme of the utility model, the substrate is a single-layer substrate, and its thickness is effectively reduced compared with the traditional three-layer substrate, thereby reducing the overall height of the sensor; the base includes a seat body and a accommodating chamber, and the base divides the accommodating space surrounded by the accommodating chamber and the substrate into a first cavity and a second cavity arranged horizontally, the first diaphragm is arranged at the first opening of the first cavity, and the second diaphragm is arranged at the second opening of the second cavity, and the sensor chip is arranged in the accommodating chamber, so that the vibration component and the sensor chip are changed from the original longitudinal arrangement to the horizontal arrangement, thereby further reducing the overall height of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the implementation mode of the utility model or the technical solution in the prior art, the drawings required for use in the implementation mode or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the utility model. For ordinary technicians in this field, other drawings can be obtained by using the structures shown in these drawings without paying any creative work.

[0022] Figure 1 This is a schematic diagram of the structure of a sensor according to an embodiment of the utility model;

[0023] Figure 2 for Figure 1 A schematic cross-sectional view of a part of the structure;

[0024] Figure 3 This is a schematic cross-sectional view of a portion of the structure of a sensor according to an embodiment of the utility model;

[0025] Figure 4 It is a partial structural schematic diagram of a sensor according to an embodiment of the utility model.

[0026] Description of Figure Numbers:

[0027] 1 sensor 11 substrate 12 Base 121 seat body 1211 Accommodation space 12111 First cavity 12112 Second cavity 12113 First opening 12114 Second opening 122 Storage room 1221 Installation space 1222 sound hole 13 Vibration mechanism 131 The first vibration component 1311 The first diaphragm 13111 First vent 1312 First mass 13121 First vent hole 132 The second vibration component 1321 Second diaphragm 13211 Second vent hole 1322 Second mass 13221 Second vent hole 14 Acoustic-electric conversion components 141 Sensor Chip 142 Integrated Circuit Chip 15 shell 151 Accommodation cavity 152 Pressure relief hole 16 Mounting slot

[0028] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] It should be noted that all directional indications (such as left and right) in the embodiments of the present invention are only used to explain the position of the user in a certain posture (such as the attached Figure 1 The relative position relationship, movement status, etc. between the various components under the specific posture are shown. If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" can explicitly or implicitly include at least one of the features.

[0032] Furthermore, the technical solutions between the various implementation modes of the present invention can be combined with each other, but this must be based on the fact that ordinary technicians in the field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0033] The utility model provides a sensor 1. In one embodiment, Figure 1 , Figure 2 and Figure 4 As shown, the sensor 1 includes a substrate 11, a base 12, a vibration mechanism 13, an acoustic-to-electric conversion component 14 and a housing 15, the base 12 includes a base body 121 and a receiving chamber 122 connected to each other, the base body 121 is connected to the substrate 11 and forms a receiving space 1211 with the substrate 11, the receiving chamber 122 is located in the receiving space 1211 and divides the receiving space 1211 into a first cavity 12111 and a second cavity 12112 that are independent of each other and arranged in a horizontal direction; the vibration mechanism 13 includes a first vibration component 131, the first vibration component 131 includes a first diaphragm 1311 and a first mass block 1312 installed on the first diaphragm 1311, and the first A first opening 12113 is provided on the side of the cavity 12111 facing away from the substrate 11, and the first diaphragm 1311 covers the first opening 12113; the sound-to-electric conversion component 14 includes a sensor chip 141 and an integrated circuit chip 142, and an installation space 1221 for accommodating the sensor chip 141 is formed in the accommodating chamber 122, and the sensor chip 141 is electrically connected to the integrated circuit chip 142 through the substrate 11; the outer shell 15 is covered on the substrate 11 to form a accommodating chamber 151, and the base 12, the vibration mechanism 13 and the sound-to-electric conversion component 14 are all arranged in the accommodating chamber 151, and the accommodating chamber 122 is provided with a sound hole 1222 connecting the accommodating chamber 151 and the installation space 1221.

[0034] Among them, the substrate 11 is a single-layer substrate, and its thickness is effectively reduced compared with the traditional three-layer substrate, thereby reducing the overall height of the sensor 1; the base 12 includes a base body 121 and a storage chamber 122, and the base 12 divides the storage space 1211 surrounded by the storage chamber 122 and the substrate 11 into a first cavity 12111 and a second cavity 12112 arranged horizontally, and the first diaphragm 1311 is arranged at the first opening 12113 of the first cavity 12111, and the sensor chip 141 is arranged in the storage chamber 122, so that the vibration component and the sensor chip 141 are changed from the original longitudinal arrangement to the horizontal arrangement, further reducing the overall height of the sensor 1, so as to facilitate the miniaturization design of the sensor 1. It should be noted that the base body 121 and the storage chamber 122 can be a split structure or an integrated structure. When the base body 121 and the storage chamber 122 are split structures, the base body 121 and the storage chamber 122 are both connected to the substrate 11.

[0035] In one embodiment, the integrated circuit chip 142 is embedded in the substrate 11, and the sensor chip 141 is electrically connected to the integrated circuit chip 142 through the substrate 11. The integrated circuit chip 142 is embedded in the substrate 11, thereby eliminating the gold wire connection, which not only reduces the cost of the sensor 1 but also effectively reduces the overall height of the sensor 1. It should be noted that the sensor chip 141 is connected to the integrated circuit chip 142 through the circuit inside the substrate 11. It should also be noted that the integrated circuit chip 142 and the ASIC chip.

[0036] In one embodiment, the sensor chip 141 is invertedly arranged in the installation space 1221, the side of the sensor chip 141 facing the substrate 11 is welded to the substrate 11, and the side of the sensor chip 141 facing away from the substrate 11 is connected to the inner wall of the accommodating chamber 122. The sensor chip 141 is invertedly arranged in the installation space 1221, so that the front of the sensor chip 141 is closer to the substrate 11, so that the sensor chip 141 can be connected to the pad of the substrate 11 by soldering solder balls. The integrated circuit chip 142 is arranged below the sensor chip 141. The integrated circuit chip 142 is arranged below the sensor chip 141, which helps to connect the sensor chip 141 and the integrated circuit chip 142 by soldering solder balls. It should be noted that the sensor chip 141 is a MEMS chip.

[0037] like Figure 3As shown, in one embodiment, the substrate 11 is provided with a mounting groove 16 having an opening toward the sensor chip 141, the integrated circuit chip 142 is mounted in the mounting groove 16, and the sensor chip 141 and the integrated circuit chip 142 are electrically connected. By providing the mounting groove 16 to accommodate the integrated circuit chip 142, the integrated circuit chip 142 is exposed to the opening of the mounting groove 16, and the sensor chip 141 is directly connected to the integrated circuit chip 142 by soldering solder balls, which not only helps to reduce the overall height of the sensor, but also facilitates the connection.

[0038] like Figure 1 , Figure 2 and Figure 4 As shown, in one embodiment, the vibration mechanism 13 further includes a second vibration component 132, the second vibration component 132 includes a second diaphragm 1321 and a second mass block 1322 mounted on the second diaphragm 1321, a second opening 12114 is provided on the side of the second cavity 12112 facing away from the substrate 11, and the second diaphragm 1321 covers the second opening 12114. The first vibration component 131 and the second vibration component 132 jointly pick up the external vibration signal, which effectively improves the sensitivity of the sensor 1 compared to using a single vibration component.

[0039] In one embodiment, the first diaphragm 1311 and the second diaphragm 1321 have the same size, and the first diaphragm 1311 and the second diaphragm 1321 are symmetrically arranged on both sides of the sensor chip 141. The first diaphragm 1311 and the second diaphragm 1321 have the same size and are symmetrically distributed on the left and right sides of the sensor chip 141, thereby further reducing the phase difference between the first diaphragm 1311 and the second diaphragm 1321 when vibrating. The first mass block 1312 and the second mass block 1322 have the same size, and the first mass block 1312 and the second mass block 1322 are symmetrically arranged on both sides of the sensor chip 141. The consistent size of the first mass block 1312 and the second mass block 1322 means that the masses of the first mass block 1312 and the second mass block 1322 are also the same, and the first mass block 1312 and the second mass block 1322 are symmetrically distributed on the left and right sides of the sensor chip 141, thereby further reducing the phase difference between the first diaphragm 1311 and the second diaphragm 1321 when vibrating. It should be noted that by ensuring that the first cavity 12111 and the second cavity 12112 are of the same size and symmetrically distributed on the left and right sides of the sensor chip 141, ensuring that the first diaphragm 1311 and the second diaphragm 1321 are of the same size and symmetrically distributed on the left and right sides of the sensor chip 141, and ensuring that the first mass block 1312 and the second mass block 1322 are of the same size and symmetrically distributed on the left and right sides of the sensor chip 141, it can be ensured that the first diaphragm 1311 and the second diaphragm 1321 will not produce a phase difference when vibrating. It should also be noted that the first mass block 1312 is located in the first cavity 12111, and the second mass block 1322 is located in the second cavity 12112.

[0040] In one embodiment, the first mass block 1312 is provided with a first air leakage hole 13121 connected to the first cavity 12111, and the first diaphragm 1311 is provided with a first air vent 13111 connected to the first air leakage hole 13121 and the accommodating cavity 151. By providing the first air leakage hole 13121 and the first air vent 13111, it is ensured that the air pressure of the first cavity 12111 is balanced with the air pressure of the accommodating cavity 151 during the gas reflux process, thereby improving the reliability of the sensor 1. The second mass block 1322 is provided with a second air leakage hole 13221 connected to the second cavity 12112, and the second diaphragm 1321 is provided with a second air vent 13211 connected to the second air leakage hole 13221 and the accommodating cavity 151. The second air leakage hole 13221 and the second air vent hole 13211 are provided to ensure that the air pressure of the second cavity 12112 is balanced with the air pressure of the accommodating cavity 151 during the gas reflux process, thereby improving the reliability of the sensor 1.

[0041] In one embodiment, the housing 15 is provided with a pressure relief hole 152 communicating with the accommodating chamber 151. By providing the pressure relief hole 152 on the housing 15, the air pressure of the accommodating chamber 151 and the external environment is balanced, which helps to improve the reliability of the sensor 1.

[0042] In one embodiment, the seat body 121 and the receiving chamber 122 are integrally formed parts. The seat body 121 and the receiving chamber 122 are integrally formed parts, and the seat body 121 is connected to the substrate 11. This arrangement facilitates the installation of the sensor and reduces the installation process.

[0043] In addition, the utility model also provides an electronic device, which includes the above-mentioned sensor 1. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0044] The above are only preferred implementations of the utility model, and do not limit the patent scope of the utility model. All equivalent structural changes made based on the concept of the utility model and the contents of the description and drawings of the utility model, or direct / indirect application in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A sensor, characterized in that: include: substrate; A base, the base comprising a base body and a receiving chamber, the base body being connected to the substrate and forming a receiving space with the substrate, the receiving chamber being located in the receiving space and dividing the receiving space into a first cavity and a second cavity which are independent of each other and arranged in a horizontal direction; A vibration mechanism, wherein the vibration mechanism comprises a first vibration component, wherein the first vibration component comprises a first diaphragm and a first mass block mounted on the first diaphragm, a first opening is formed on a side of the first cavity away from the substrate, and the first diaphragm is covered on the first opening; An acoustic-to-electric conversion component, the acoustic-to-electric conversion component includes a sensor chip and an integrated circuit chip, a mounting space for accommodating the sensor chip is formed in the accommodating chamber, and the sensor chip is electrically connected to the integrated circuit chip; The outer shell is covered on the substrate to form a receiving cavity, the base, the vibration mechanism and the sound-to-electric conversion component are all arranged in the receiving cavity, and the receiving compartment is provided with a sound hole connecting the receiving cavity and the installation space.

2. The sensor according to claim 1, characterized in that The integrated circuit chip is embedded in the substrate, and the sensor chip is electrically connected to the integrated circuit chip through the substrate.

3. The sensor according to claim 2, characterized in that The sensor chip is invertedly arranged in the installation space, the side of the sensor chip facing the substrate is welded to the substrate, and the side of the sensor chip facing away from the substrate is connected to the inner wall of the containing chamber; the integrated circuit chip is arranged below the sensor chip.

4. The sensor according to claim 1, characterized in that The substrate is provided with a mounting groove having an opening facing the sensor chip. The integrated circuit chip is mounted in the mounting groove. The sensor chip and the integrated circuit chip are electrically connected.

5. The sensor according to any one of claims 1 to 4, characterized in that: The vibration mechanism also includes a second vibration component, which includes a second vibration membrane and a second mass block installed on the second vibration membrane. A second opening is formed on a side of the second cavity away from the substrate, and the second vibration membrane covers the second opening.

6. The sensor according to claim 5, characterized in that The first diaphragm and the second diaphragm have the same size and are symmetrically arranged on both sides of the sensor chip. The first mass block and the second mass block have the same size and are symmetrically arranged on both sides of the sensor chip.

7. The sensor according to claim 5, characterized in that The first mass block is provided with a first air leakage hole connected to the first cavity, and the first diaphragm is provided with a first air vent hole connected to the first air leakage hole and the accommodating cavity; the second mass block is provided with a second air leakage hole connected to the second cavity, and the second diaphragm is provided with a second air vent hole connected to the second air leakage hole and the accommodating cavity.

8. The sensor according to any one of claims 1 to 4, characterized in that: The shell is provided with a pressure relief hole connected with the accommodating cavity.

9. The sensor according to any one of claims 1 to 4, characterized in that: The seat body and the accommodating chamber are integrally formed parts.

10. An electronic device, characterized in that: The electronic device comprises the sensor as described in any one of claims 1 to 9.

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