Finishing mechanism for semiconductor devices

Abstract

The utility model discloses an arrangement mechanism for semiconductor devices, the arrangement mechanism is installed on a semiconductor appearance detection device, and the semiconductor appearance detection device is provided with a transmission linear track and a visual detection device. The arrangement mechanism comprises a mounting seat, a driving mechanism arranged on the mounting seat, two connecting rods and an arrangement module arranged between the two connecting rods, and the arrangement module comprises an upper arrangement module and a lower arrangement module; the upper tidying module comprises two upper cross rods fixedly installed on the two connecting rods, an upper pressing block installed between the two upper cross rods and an upper rolling brush installed between the two upper cross rods, and the lower tidying module comprises two lower cross rods fixedly installed on the two connecting rods, a lower pressing block installed between the two lower cross rods and a lower rolling brush installed between the two lower cross rods. According to the utility model, the surface of the semiconductor device in the frame is cleaned, and the surface is cleaned while the surface is pressed and flattened, so that the arrangement effect of the semiconductor device is realized.

Description

Technical Field

[0001] The utility model specifically relates to the technical field of semiconductor production equipment, in particular to a finishing mechanism for semiconductor devices. Background Art

[0002] During the manufacturing process of semiconductor devices, it is usually necessary to sort and inspect the appearance of the semiconductors. However, most of the existing semiconductor sorting processes are completed manually with the assistance of mechanical equipment. This sorting and processing method is inefficient, and the defective rate of semiconductor devices after shaping is high, and the stability and uniformity of product quality are poor. At present, although some companies have developed automated shaping devices, for example, the patent number is: 201922080650.2, and the patent name is a Chinese patent for a semiconductor device shaping device, which discloses a semiconductor device shaping device, including a preliminary shaping mechanism, the preliminary shaping mechanism is connected to a conveying shaping mechanism, and the conveying shaping mechanism is also connected to a discharge control mechanism. The semiconductor device enters the preliminary shaping mechanism, passes through the conveying shaping mechanism, and performs semiconductor shaping. The shaped components are transported out via the discharge control mechanism. Although this patent realizes the automatic shaping of semiconductor components, realizes the automation of semiconductor shaping, reduces personnel costs, and improves the stability of product quality. However, the overall structure of the equipment is relatively complex, and special equipment is used, and the equipment manufacturing cost is high. Utility Model Content

[0003] The purpose of the utility model is to provide a semiconductor device arrangement mechanism to solve the problems raised in the above-mentioned background technology in view of the defects and shortcomings of the prior art.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows: the tidying mechanism includes a mounting seat, two connecting rods arranged on the mounting seat, and a tidying module arranged between the two connecting rods. A fixed seat is connected to the bottom of the mounting seat through a slider rail structure, and the fixed seat is installed on the semiconductor appearance detection equipment; the mounting seat moves forward and backward on the fixed seat under the action of a driving mechanism; the tidying module includes an upper tidying module and a lower tidying module, the upper tidying module includes two upper cross bars fixedly mounted on the two connecting rods, an upper pressure block installed between the two upper cross bars, and an upper roller brush installed between the two upper cross bars, and the lower tidying module includes two lower cross bars fixedly mounted on the two connecting rods, a lower pressure block installed between the two lower cross bars, and a lower roller brush installed between the two lower cross bars. Furthermore, the connecting rod is set to an L-shaped structure.

[0005] Preferably, the fixing seat is provided with two adjusting devices, the adjusting device is provided with an adjusting bolt, and the free end of the adjusting bolt is provided with a circular positioning block.

[0006] Furthermore, the upper roller brush is arranged at the rear end of the upper pressing block, and the lower roller brush is arranged at the rear end of the lower pressing block. The upper pressing block corresponds to the lower pressing block up and down, and the upper roller brush corresponds to the lower roller brush up and down.

[0007] Furthermore, the upper cross bar and the lower cross bar are both configured to be in a broken line shape.

[0008] Furthermore, the driving mechanism is a cylinder drive or an electric telescopic rod drive.

[0009] Furthermore, the upper roller brush and the lower roller brush include a rotating shaft and two groups of bristles arranged on the rotating shaft, and the two groups of bristles are centrally symmetrically arranged along the length direction of the rotating shaft.

[0010] Preferably, couplings for connecting the rotating shafts are provided on the two upper cross bars and the two lower cross bars.

[0011] Preferably, one of the upper cross bars and one of the lower cross bars is provided with a micro drive motor for driving the rotating shaft to rotate, a driving wheel is provided on the output shaft of the drive motor, a driven wheel is provided on the rotating shaft, and the driving wheel and the driven wheel are connected by a belt.

[0012] Furthermore, the end surfaces of the upper pressing block and the lower pressing block are provided with pressing protection rubber blocks.

[0013] After adopting the above structure, the beneficial effects of the utility model are as follows: the semiconductor device sorting mechanism of the utility model drives the connecting rod to move forward and backward through the driving mechanism, driving the two upper cross bars and the two lower cross bars to move, thereby driving the upper pressure block and the lower pressure block to move forward and backward, so that the upper pressure block and the lower pressure block press the semiconductor device in the frame to flatten it; at the same time, the upper roller brush and the lower roller brush follow the connecting rod, the two upper cross bars and the two lower cross bars to move together to clean the surface of the semiconductor device in the frame, and realize cleaning the surface while pressing and flattening it, thereby realizing the sorting effect of the semiconductor device. This patent realizes that there is no need to use a special sorting device, and the sorting function is realized while the appearance is inspected. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model.

[0015] Figure 2 It is a top view of the upper finishing module of the present utility model.

[0016] Explanation of the reference numerals in the accompanying drawings: 1. Transmission linear track; 2. Frame; 3. Mounting seat; 4. Connecting rod; 5. Fixed seat; 6. Driving mechanism; 7. Upper cross bar; 8. Upper pressure block; 9. Lower cross bar; 10. Lower pressure block; 11. Upper roller brush; 12. Lower roller brush; 13. Adjusting device; 14. Adjusting bolt; 15. Circular positioning block; 16. Pressing protection rubber block; 111. Rotating shaft; 112. Bristles; 113. Driving motor; 114. Driving wheel; 115. Driven wheel; 116. Belt. DETAILED DESCRIPTION

[0017] The utility model is further described below in conjunction with the accompanying drawings.

[0018] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described here are only used to explain the utility model and are not used to limit the utility model.

[0019] See also Figure 1 and Figure 2The utility model provides a technical solution: a semiconductor device sorting mechanism, the sorting mechanism is installed on a semiconductor appearance inspection device, the semiconductor appearance inspection device is provided with a transmission linear track 1 and a visual inspection device; the transmission linear track 1 is used to transmit semiconductor devices installed in a frame 2, and the transmission linear track 1 can adopt an electric transmission method for conveying appearance inspection and sorting. The sorting mechanism includes a mounting seat 3, two connecting rods 4 arranged on the mounting seat 3, and a sorting module arranged between the two connecting rods 4. A fixed seat 5 is connected to the lower side of the mounting seat 3 through a slider rail structure, and the fixed seat 5 is installed on the semiconductor appearance inspection device; the mounting seat 3 moves forward and backward on the fixed seat 5 under the action of a driving mechanism 6; the sorting module includes an upper sorting module and a lower sorting module, the upper sorting module includes two upper cross bars 7 fixedly installed on the two connecting rods 4, an upper pressure block 8 installed between the two upper cross bars 7, and an upper roller brush 11 installed between the two upper cross bars 7, and the lower sorting module includes two lower cross bars 9 fixedly installed on the two connecting rods 4, a lower pressure block 10 installed between the two lower cross bars 9, and a lower roller brush 12 installed between the two lower cross bars 9. The driving mechanism is a cylinder drive or an electric telescopic rod drive. In practical application, a suitable driving mode can be selected. In the utility model, when the transmission linear track 1 drives the frame 2 and the semiconductor device to move to the position of the sorting device, the transmission linear track 1 stops. At this time, the driving mechanism 6 drives the connecting rod 4 to move forward and backward, driving the two upper cross bars 7 and the two lower cross bars 9 to move, thereby driving the upper pressing block 8 and the lower pressing block 10 to move forward and backward, so that the upper pressing block 8 and the lower pressing block 10 press and flatten the semiconductor device in the frame 2; at the same time, the upper roller brush 11 and the lower roller brush 12 follow the connecting rod, the two upper cross bars 7 and the two lower cross bars 9 to move together to clean the surface of the semiconductor device in the frame 2, and realize the cleaning of the surface while pressing and flattening, thereby realizing the sorting effect of the semiconductor device. This patent realizes that there is no need to use a special sorting device, and the sorting function is realized while the appearance is detected. After this section of sorting, the transmission linear device continues to drive the frame 2 and the semiconductor device to move, and the next section of sorting is carried out. The distance moved by the transmission linear device each time is adapted to the width of the upper pressing block 8. After the semiconductor device is flattened, the transmission linear device moves the frame and the semiconductor device to the bottom of the visual inspection equipment for appearance inspection.

[0020] In a further embodiment of the present invention, the connecting rod 4 is arranged in a U-shaped structure or an L-shaped structure. In actual use, the specific structure of the connecting rod 4 can be determined according to the equipment.

[0021] In a further embodiment of the utility model, a fixed seat 5 is connected to the lower part of the mounting seat 3 through a slider rail structure, and the fixed seat 5 is mounted on the semiconductor appearance inspection equipment. Preferably, two adjustment devices 13 are provided on the fixed seat 5, and an adjustment bolt 14 is provided on the adjustment device 13, and a circular positioning block 15 is provided at the free end of the adjustment bolt 14. The utility model is installed on the appearance inspection equipment through the fixed seat 5, the mounting seat 3 is slidably connected to the fixed seat 5, and the sliding distance is adjusted by the adjustment device 13, so as to adjust the position of the fixed seat 5, thereby expanding the overall use range.

[0022] In a further embodiment of the utility model, the upper roller brush 11 is arranged at the rear end of the upper pressing block 8, and the lower roller brush 12 is arranged at the rear end of the lower pressing block 10. The upper pressing block 8 corresponds to the lower pressing block 10 up and down, and the upper roller brush 11 corresponds to the lower roller brush 12 up and down.

[0023] In a further embodiment of the present invention, the upper cross bar 7 and the lower cross bar 9 are both configured as a broken line shape, and the broken line-shaped upper cross bar 7 and the lower cross bar 9 facilitate the installation and use of the upper roller brush 11 and the lower roller brush 12.

[0024] In a further embodiment of the utility model, the upper roller brush 11 and the lower roller brush 12 each include a rotating shaft 111 and two groups of bristles 112 arranged on the rotating shaft 111. The two groups of bristles 112 are centrally symmetrically arranged along the length direction of the rotating shaft 111, and the bristles 112 are spirally arranged. Such an arrangement can gather impurities in the middle position after the action of the upper roller brush 11 and the lower roller brush 12, and the impurities can be recovered by providing a recovery port on the transmission linear track 1.

[0025] Preferably, couplings for connecting the rotating shaft 111 are provided on the two upper cross bars 7 and the two lower cross bars 9 .

[0026] Preferably, one of the upper crossbars 7 and one of the lower crossbars 9 is provided with a micro-drive motor 113 for driving the rotating shaft 111 to rotate, a driving wheel 114 is provided on the output shaft of the driving motor 113, a driven wheel 115 is provided on the rotating shaft 111, the driving wheel 114 and the driven wheel 115 are connected by a belt 116, and the use is more automated by the driving motor 113. The forward and reverse rotation of the micro-drive motor 113 can realize the cleaning of the surface of the semiconductor device while flattening the semiconductor device.

[0027] In a further embodiment of the present invention, the end surfaces of the upper pressing block 8 and the lower pressing block 10 are provided with pressing protection rubber blocks 16 , and the pressing protection rubber blocks 16 act on the surface of the semiconductor device to protect the semiconductor device.

[0028] The above description is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.

Claims

1. A semiconductor device arrangement mechanism, the arrangement mechanism is installed on a semiconductor appearance inspection device, the semiconductor appearance inspection device is provided with a transmission linear track and a visual inspection device; the transmission linear track is used to transport semiconductor devices installed in a frame; characterized in that: The tidying mechanism includes a mounting seat, two connecting rods arranged on the mounting seat and a tidying module arranged between the two connecting rods, a fixed seat is connected to the bottom of the mounting seat through a slider rail structure, and the fixed seat is installed on the semiconductor appearance inspection equipment; the mounting seat moves back and forth on the fixed seat under the action of a driving mechanism; the tidying module includes an upper tidying module and a lower tidying module, the upper tidying module includes two upper cross bars fixedly installed on the two connecting rods, an upper pressure block installed between the two upper cross bars, and an upper roller brush installed between the two upper cross bars, and the lower tidying module includes two lower cross bars fixedly installed on the two connecting rods, a lower pressure block installed between the two lower cross bars, and a lower roller brush installed between the two lower cross bars.

2. A semiconductor device arrangement mechanism according to claim 1, characterized in that: The connecting rod is configured as an L-shaped structure.

3. The semiconductor device arrangement mechanism according to claim 1, characterized in that: The fixing seat is provided with two adjusting devices, the adjusting device is provided with an adjusting bolt, and the free end of the adjusting bolt is provided with a circular positioning block.

4. The semiconductor device arrangement mechanism according to claim 1, characterized in that: The upper roller brush is arranged at the rear end of the upper pressing block, and the lower roller brush is arranged at the rear end of the lower pressing block. The upper pressing block corresponds to the lower pressing block in vertical correspondence, and the upper roller brush corresponds to the lower roller brush in vertical correspondence.

5. The semiconductor device arrangement mechanism according to claim 1, characterized in that: The upper cross bar and the lower cross bar are both configured in a broken line shape.

6. The semiconductor device arrangement mechanism according to claim 1, characterized in that: The driving mechanism is a cylinder drive or an electric telescopic rod drive.

7. The semiconductor device arrangement mechanism according to claim 1, characterized in that: The upper roller brush and the lower roller brush include a rotating shaft and two groups of bristles arranged on the rotating shaft, and the two groups of bristles are centrally symmetrically arranged along the length direction of the rotating shaft.

8. The semiconductor device arrangement mechanism according to claim 7, characterized in that: The two upper cross bars and the two lower cross bars are provided with couplings for connecting the rotating shafts.

9. The semiconductor device arrangement mechanism according to claim 7, characterized in that: A micro drive motor for driving the rotating shaft to rotate is arranged on one of the upper cross bars and one of the lower cross bars, a driving wheel is arranged on the output shaft of the driving motor, a driven wheel is arranged on the rotating shaft, and the driving wheel and the driven wheel are connected by a belt.

10. The semiconductor device arrangement mechanism according to claim 1, characterized in that: The end surfaces of the upper pressing block and the lower pressing block are provided with pressing protection rubber blocks.

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