Modular reflective heating system for use in a process chamber and process system

Abstract

A modular reflective heating system for a processing chamber is provided. The modular reflective heating system includes: a plurality of connectors; a plurality of luminaires, each luminaire connected to at least one of the connectors; the reflector comprises a base, a reflector body and a reflector cover, and a reflective assembly including a first plurality of reflective portions and a second plurality of reflective portions. Each of the first plurality of reflective portions and the second plurality of reflective portions is connected to the base, and each of the first plurality of reflective portions and the second plurality of reflective portions is configured to be individually disconnected from the base. The modular reflective heating system further includes a spare reflective portion configured to replace a first reflective portion of the first plurality of reflective portions or the second plurality of reflective portions.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to improved reflectors for use in processing chambers, such as semiconductor processing chambers. Background Art

[0002] Processing chambers, such as semiconductor processing chambers, are often heated to high temperatures to perform various processes on substrates, such as semiconductor substrates. Many processing chambers include one or more reflectors positioned around the substrate (e.g., above a substrate support) to reflect energy (e.g., infrared energy) toward the substrate during processing. These reflectors can help control the temperature of the substrate during processing and the temperature uniformity across the substrate during processing. The temperature control and temperature uniformity of the substrate can be affected by the reflectors used in the processing chamber. Reflectors are often replaced with different reflectors in an attempt to improve the temperature control and temperature uniformity of a given process.

[0003] When a reflector with different reflective properties is to be used, the existing reflector is replaced. Replacing a reflector of a processing chamber is a time-consuming process that includes (1) disconnecting and removing the existing reflector and many other components of the processing chamber (e.g., covers, lamps, etc.), and (2) installing a new reflector and reinstalling the removed and / or disconnected components. This time-consuming process results in significant downtime of the processing chamber. Therefore, there is a continuing need for methods and related apparatus that can reduce the amount of downtime associated with reflector replacement. Utility Model Content

[0004] In one embodiment, a modular reflective heating system for use in a process chamber is provided. The modular reflective heating system comprises: a plurality of connectors; a plurality of lamps, each lamp being connected to at least one of the connectors; a reflector, the reflector comprising: a base; and

[0005] A reflective assembly comprising a first plurality of reflective portions and a second plurality of reflective portions, wherein each of the first plurality of reflective portions and the second plurality of reflective portions is connected to the base, and each of the first plurality of reflective portions and the second plurality of reflective portions is configured to be individually disconnected from the base; and a spare reflective portion configured to replace a first reflective portion of the first plurality of reflective portions or the second plurality of reflective portions.

[0006] In another embodiment, a processing system is provided, comprising: a processing chamber, the processing chamber comprising: a chamber body, the chamber body being arranged to surround a processing volume; a substrate support, the substrate support being in the processing volume; a reflector, the reflector being positioned above or below the substrate support, the reflector comprising: a base; and a reflective assembly, the reflective assembly comprising a first plurality of reflective portions and a second plurality of reflective portions, wherein each of the first plurality of reflective portions and the second plurality of reflective portions is connected to the base, and each of the first plurality of reflective portions and the second plurality of reflective portions is configured to be individually disconnected from the base; and a spare reflective portion, the spare reflective portion being configured to replace a first reflective portion of the first plurality of reflective portions or the second plurality of reflective portions.

[0007] In another embodiment, a processing system is provided, the processing system comprising: a processing chamber, the processing chamber comprising: a chamber body, the chamber body being arranged to surround a processing volume; a substrate support, the substrate support being in the processing volume; a plurality of lamps; a reflector, the reflector being positioned above or below the substrate support, the reflector comprising: a base; and a reflective assembly, the reflective assembly comprising a first plurality of reflective portions and a second plurality of reflective portions, wherein the plurality of lamps are positioned between the substrate support and the reflector, each of the first plurality of reflective portions and the second plurality of reflective portions being connected to the base, and each of the first plurality of reflective portions and the second plurality of reflective portions being configured to be individually disconnected from the base; and a spare reflective portion, the spare reflective portion being configured to replace a first reflective portion of the first plurality of reflective portions or the second plurality of reflective portions, wherein when the spare reflective portion is coupled to the base, the spare reflective portion has a reflective surface configured to face one of the lamps, and the reflective surface on the spare reflective portion has a different radius of curvature, a different size, or a different coating than a corresponding reflective surface on the first reflective portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to be able to understand in detail the manner in which the above-mentioned features of the present disclosure are achieved, a more specific description of the present disclosure briefly summarized above may be made by reference to embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate exemplary embodiments and therefore should not be considered as limiting the scope thereof, and other equivalent embodiments may be recognized.

[0009] Figure 1 is a cross-sectional view of a processing system 100 according to one embodiment.

[0010] Figure 2AAccording to one embodiment Figure 1 Bottom view of the upper reflector.

[0011] Figure 2B According to one embodiment Figure 1 Schematic bottom view of the upper base.

[0012] Figure 2C According to one embodiment Figure 1 Top view of the lower reflector.

[0013] Figure 2D According to one embodiment Figure 1 Schematic top view of the lower base 250L.

[0014] Figure 3A A lamp according to one embodiment and Figure 2A A side cross-sectional view of an exemplary reflective portion.

[0015] Figure 3B is a side cross-sectional view of an alternate reflective portion and a lamp according to one embodiment.

[0016] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0017] Embodiments of the present disclosure are generally directed to improved reflectors for use in processing chambers, such as semiconductor processing chambers. The improved reflectors have a modular design that allows one or more reflective portions of the reflector to be easily replaced with one or different reflective portions that can change the thermal performance of the reflector, while other portions of the reflector remain installed. For example, a reflective portion of a reflector can be replaced with a new portion having a different reflective surface (e.g., a different coating or a different radius of curvature) or a different set of internal cooling channels to allow the thermal performance of the reflector to be improved without removing the entire reflector.

[0018] Figure 1 1 is a cross-sectional view of a processing system 100 according to one embodiment. The processing system 100 includes a processing chamber 101, one or more gas sources 140, an exhaust pump 145, an upper cooling source 190U, a lower cooling source 190L, and a controller 155. The processing system 100 may be configured to perform a deposition process, such as an epitaxial deposition process, on a substrate in the processing chamber 101.

[0019] The processing chamber 101 includes a chamber body 102, which includes a top 103, a bottom 104, and one or more sides 105. In some embodiments, the chamber body 102 can be made of a process-resistant material (e.g., aluminum or stainless steel, such as 316L stainless steel). The chamber body 102 is disposed around structural components of the processing chamber 101, such as an upper window 106U, a lower window 106L, an inner liner 136, and an outer liner 137. The liners 136, 137 can be positioned between the windows 106U, 106L and the chamber body 102 to isolate the windows 106U, 106L from the chamber body 102. The windows 106U, 106L and the liners 136, 137 surround an interior volume 110 (also referred to as a processing volume) of the processing chamber 101. In one embodiment, the windows 106U, 106L can each be formed of quartz.

[0020] The processing chamber 101 includes an upper reflector 200U positioned between the upper window 106U and the top 103 of the chamber body 102. The processing chamber 101 further includes a lower reflector 200L positioned between the lower window 106L and the bottom 104 of the chamber body 102. The reflectors 200U, 200L help to heat the substrate during processing and maintain temperature uniformity of the substrate during processing. Additional details about the reflectors 200U, 200L are provided below.

[0021] The processing chamber 101 further includes a substrate support assembly 116. The substrate support assembly 116 may include a support 117 and a shaft 118 connected to the support 117. The pedestal 115 may be positioned on the support 117. The processing chamber 101 may further include an actuator 119 coupled to the shaft 118 of the substrate support assembly 116. The actuator 119 is configured to rotate the shaft 118 and the pedestal 115 about a central vertical axis C extending through the center of the shaft 118 and the pedestal 115. During processing, such as during epitaxial deposition, the substrate 50 may be positioned on the pedestal 115.

[0022] During deposition or other processes, gases may be provided to the interior volume 110 from a gas source 140. These gases may be exhausted from the interior volume 110 by an exhaust pump 145. The processing chamber 101 may further include a preheat ring 114 that may be positioned around the susceptor 115. In some embodiments, a purge gas (not shown) may be provided below the susceptor 115 to help prevent process gases from reaching areas in the processing chamber 101 below the susceptor 115 and causing unintended deposition.

[0023] The processing chamber 101 may further include a plurality of upper lamps 220U and a plurality of lower lamps 220L to heat the substrate 50 and components in the interior volume 110, such as the susceptor 115. The upper lamps 220U are positioned between the upper window 106U and the upper reflector 200U. The lower lamps 220L are positioned between the lower window 106L and the lower reflector 200L. In one embodiment, the upper lamps 220U and the lower lamps 220L are infrared (IR) lamps.

[0024] For ease of explanation, Figure 1 200U and 200L and lamps 220U and 220L. Additional details about the reflectors 200U, 200L and lamps 220U and 220L are provided below. The upper reflector 200U includes an upper base 250U and an upper reflective assembly 210U coupled (e.g., fastened) to the upper base 250U. A support (not shown) may be used to support the upper reflector 200U above the upper window 106U in the processing chamber 101.

[0025] The upper reflective assembly 210U is positioned between the upper lamp 220U and the upper base 250U. The upper reflective assembly 210U includes a plurality of reflective portions 211-214 (see FIG. 2 ) configured to reflect radiation (eg, infrared radiation) toward the substrate 50 during processing. Figure 2A ). The upper base 250U may be fluidly coupled to the upper cooling source 190U. In one embodiment, the upper cooling source 190U may include a cooling water source and a cooling air source. Cooling water and cooling air from the upper cooling source 190U may be provided to or circulated through the upper base 250U during processing, helping to maintain a temperature set point of the upper reflector 200U during processing, and helping to maintain temperature uniformity across the upper reflector 200U.

[0026] Similarly, the lower reflector 200L includes a lower base 250L and a lower reflective assembly 210L coupled to (e.g., fastened to) the lower base 250L. The lower base 250L and the lower reflective assembly 210 may each surround the axis 118. A support (not shown) may be used to support the lower reflector 200L below the lower window 106L in the processing chamber 101. The lower reflective assembly 210L is positioned between the lower lamp 220L and the lower base 250L. The lower reflective assembly 210L includes a plurality of reflective portions 211-214 (see FIG. 2 ) configured to reflect radiation (e.g., infrared radiation) toward the substrate 50 during processing. Figure 2C ).

[0027] In some embodiments, the reflective portion of the reflective assembly 210U, 210L may be formed of gold, aluminum oxide, or another metal or alloy coated with gold or aluminum oxide, so that the reflective surface is formed of gold or aluminum oxide. In some embodiments, the bottom surface of the upper base 250U and the upper surface of the lower base 250L may be coated with aluminum oxide to reflect any radiation from the lamp and reaching these surfaces. The lower base 250L may be fluidly coupled with the lower cooling source 190L. In one embodiment, the lower cooling source 190U may include a cooling water source and a cooling air source. The cooling water and cooling air from the lower cooling source 190L may be provided to or circulated through the lower base 250L during processing, which helps to maintain the temperature set point of the lower reflector 200L during processing, and helps to maintain the temperature uniformity on the lower reflector 200L.

[0028] As described in further detail below, the upper reflective assembly 210U may be individually removed from the corresponding base 250U, 250L. Figure 2A ) and the lower reflective component 210L( Figure 2C ) in each reflective portion 211-214, so that each reflective portion can be individually disconnected from the corresponding base 250U, 250L and replaced by a different reflective portion. In semiconductor processing, the ability to replace a single portion of a reflector rather than replacing the entire reflector as is conventionally done can allow for a significant reduction in downtime of the processing chamber when replacing a reflector.

[0029] The processing chamber 101 may further include a plurality of upper temperature sensors 290U and a plurality of lower temperature sensors 290L. The plurality of upper temperature sensors 290U may be positioned above the upper reflector 200U and may be configured to monitor the temperature of different portions of the substrate 50 and / or the susceptor 115 during processing. Similarly, the plurality of lower temperature sensors 290L may be positioned below the lower reflector 200L and may be configured to monitor the temperature of different portions of the substrate 50 and / or the susceptor 115 during processing. In one embodiment, the temperature sensors 290U, 290L may each be a pyrometer. The temperature sensors 290U, 290L may be connected to the controller 155. The controller 155 may use the measurements from the temperature sensors 290U, 290L to control the power provided to the corresponding lamps 220U, 220L during processing, which may be used to control the temperature of different portions of the substrate 50 during processing.

[0030] The processing system 100 also includes a controller 155 for controlling the processes performed by the processing system 100. The controller 155 can be any type of controller used in an industrial setting, such as a programmable logic controller (PLC). The controller 155 includes a processor 157, a memory 156, and input / output (I / O) circuits 158. The controller 155 may further include one or more of the following components (not shown), such as one or more power supplies, a clock, communication components (e.g., a network interface card), and a user interface typically found in controllers for semiconductor devices.

[0031] The memory 156 may include non-transitory memory. The non-transitory memory may be used to store programs and settings described below. The memory 156 may include one or more readily available types of memory, such as read-only memory (ROM) (e.g., electrically erasable programmable read-only memory (EEPROM)), flash memory, floppy disk, hard disk, or random access memory (RAM) (e.g., non-volatile random access memory (NVRAM)).

[0032] The processor 157 is configured to execute various programs stored in the memory 156, such as epitaxial deposition processes and other processes (e.g., cleaning processes). During the execution of these programs, the controller 155 can communicate with I / O devices through the I / O circuit 158. For example, during the execution of these programs and the communication through the I / O circuit 158, the controller 155 can control outputs, such as the power provided to the lamps 220U, 220L for heating the components in the internal volume 110, and the position of the valve and / or the speed of the pump for controlling the flow rate of cooling water or cooling gas through the reflector 200U, 200L. The memory 156 may further include various operating settings for controlling the processing system 100. For example, the settings may include temperature set points for the substrate 50 and / or the pedestal 115 during different processes.

[0033] Figure 2A According to one embodiment Figure 1 FIG2 is a bottom view of the upper reflector 200U. As described in further detail below, FIG2 also shows an upper lamp 220 and two connectors 221, 222. The upper reflector 200U, the upper lamp 220 and the connectors 221, 222 may be collectively referred to as a modular reflective heating system.

[0034] The upper reflector 200U includes an upper reflective assembly 210U coupled (e.g., fastened) to an upper base 250U. The upper reflective assembly 210U includes a plurality of reflective portions 211-214 arranged in a plurality of regions 201-204. The plurality of regions 201-204 include a first region 201, a second region 202, a third region 203, and a fourth region 204.

[0035] The first area 201 may include a first plurality of four reflective portions 211A-211D forming a central portion of the upper reflective assembly 210U. In some embodiments, the first area 201 may be circular, elliptical, rectangular, diamond-shaped, or irregularly shaped. Each reflective portion 211A-211D may be positioned at a different angular position around the center C of the upper reflective assembly 210U. For example, each reflective portion 211A-211D is shown as occupying a different quadrant around the center C of the upper reflective assembly 210U.

[0036] The second area 202 may be an annular area positioned between the first area 211 and the third area 213. The second area 202 includes a second plurality of six reflective portions 212A-212F arranged in an annular pattern around the first area 201. The first plurality of reflective portions 211A-211D are positioned within the annular pattern of the second plurality of reflective portions 212A-212F. An annular shape as used herein includes a circular, elliptical, polygonal, or any combination thereof. The reflective portions and lamps described herein may be arranged in an annular pattern.

[0037] The third region 203 may be an annular region positioned between the second region 202 and the fourth region 204. The third region 203 includes a third plurality of eight reflective portions 213A-213H arranged around the second region 202 in an annular pattern.

[0038] The fourth region 204 may be an annular region positioned as an outermost region around the third region 203. The fourth region 204 includes a fourth plurality of ten reflective portions 214A-214J arranged around the third region 203 in an annular pattern.

[0039] Referring to the reflective portion 214B, each reflective portion 211-214 may include a first opening 231 and a second opening 232. Referring to the reflective portion 214A, the first connector 221 extends into the first opening 231 to establish a first connection (e.g., a power connection) with one of the upper lamps 220U. Similarly, the second connector 222 extends into the second opening 232 of the reflective portion 214A to establish a second connection (e.g., a ground connection) with one of the upper lamps 220U. In some embodiments, the openings 231, 232 may extend to the edge of the corresponding reflective portion 211-214 and align with the openings of the adjacent reflective portions 211-214, so that a larger opening is formed by aligning the openings of the two adjacent reflective portions 211-214. The connectors 221, 222 may extend through the openings in the base 250U and the reflective assembly 210U. Although two connectors 221, 222 are shown for the light fixture 220U, in some embodiments, a single connector, such as a single connector providing both power and ground connections, may extend through corresponding single holes in the base and reflector assembly.

[0040] Although Figure 2A Only one lamp 220U and a set of connectors 221, 222 are shown in order to make the drawing less cluttered, but a set of connectors 221, 222 can extend into or through the openings 231, 232 of each reflective portion 211-214 so that the lamp 220U can be connected to each of these connectors 221, 222. Each lamp 220U, 220L (see Figure 2C ) may be connected across each reflective portion 211-214, for example, directly below each reflective portion 211-214 of the upper reflective component 210U or directly below the lower reflective component 210L (see Figure 2C ) above each reflective portion 211-214. In some embodiments, each lamp 220U, 220L is configured to be completely located below or above a single reflective portion 211-214 of the corresponding reflective assembly 210U, 210L. Connectors 221, 222 can mechanically support each lamp 220U, 220L and provide power to each corresponding lamp 220U, 220L. Controller 155 ( Figure 1 ) can adjust the power provided to each lamp 220U, 220L so that the heat provided by each lamp 220U, 220L can be individually adjusted to control the temperature of different portions (e.g., different radial locations) of the substrate 50 during processing, for example based on measurements from corresponding temperature sensors 290U, 290L.

[0041] The upper reflective assembly 210U further includes a slot 230U extending radially outward from a location at or near a center C of the upper reflective assembly 210U in the first region 201 to a location in the third region 203. The slot 230U is an opening positioned to allow the upper temperature sensor 290U to measure the temperature of the substrate 50 and / or the susceptor 115 during processing.

[0042] Referring to the reflective portion 211D, each reflective portion 211-214 may further include a plurality of cooling holes 241 for cooling the corresponding reflective portion 211-214 and a plurality of fastener holes 242 for mounting the corresponding reflective portion 211-214 to the upper base 250U. In some embodiments, each reflective portion 211-214 may include a plurality of (e.g., ten or more) cooling holes 241 and a plurality of (e.g., ten or more) fastener holes 242. In order to make the drawings less cluttered, only one cooling hole 241 and one fastener hole 242 are shown. During processing, cooling air from the cooling source 190U may be directed through the plurality of cooling holes 241 to cool the reflective portions 211-214.

[0043] Figure 2B According to one embodiment Figure 1 Schematic bottom view of the upper base 250U. The upper base 250U is shown as transparent so that the cooling channels described below can be more clearly shown. The upper base 250U includes an inner body 251U and an outer edge 252. The upper reflective assembly 210U ( Figure 2A ) is configured to be mounted to the inner body 251U.

[0044] The upper base 250U may include a first plurality of openings 253 and a second plurality of openings 254. Figure 2A ) is mounted to the upper base 250U, each opening 253 of the first plurality of openings 253 is positioned to align with one of the first openings 231 of the upper reflective assembly 210U. Similarly, when the upper reflective assembly 210( Figure 2A ) is mounted to the upper base 250U, each opening 254 of the second plurality of openings 254 is positioned to align with one of the second openings 232 of the upper reflective assembly 210U.

[0045] The upper base 250U may further include a plurality of cooling holes 281 to help guide the cooling gas from the upper cooling source 190U to the reflective portions 211-214 of the upper reflective assembly 210U. Figure 2A ) is mounted to the upper base 250U, each cooling hole 281 is positioned to align with one of the cooling holes 241 on one of the reflective portions 211-214 of the upper reflective assembly 210.

[0046] The upper base 250U may further include a plurality of fastener holes 282 (eg, threaded holes) for mounting the corresponding reflective portions 211-214 to the upper base 250U. Figure 2A ) is positioned to be mounted (e.g., fastened) to the upper base 250U, each fastener hole 282 is positioned to align with one of the fastener holes 242 on one of the reflective portions 211-214 of the upper reflective assembly 210.

[0047] The upper base 250U may further include a cooling channel 260 configured to cool the upper base 250 and the reflective assembly 210U. The cooling channel 260 may extend through the interior of the inner body 251U of the upper base 250U. The cooling channel 260 includes an inlet 261, an outlet 262, and an inner channel 263 extending from the inlet 261 through the interior of the inner body 251U of the upper base 250U to the outlet 262. Cooling water or another coolant from the upper cooling source 190U may be directed through the cooling channel 260 during processing, helping to prevent the upper reflector 200U from overheating during processing. Although the cooling channel 260 is shown as a single arc at a radial position relative to the center C of the upper base 250U, in some embodiments, the cooling channel 260 may extend through more positions inside the inner body 251U, such as extending to a position closer to the center C of the upper base 250U. Although not shown, in some embodiments, the cooling channel 260 can be configured to have multiple inlets and outlets along the inner channel 263 that are aligned with the inlets and outlets on the corresponding reflective portions 211-214 so that a cooling fluid can circulate through each of the reflective portions 211-214 during processing.

[0048] The upper base 250U may further include a portion configured to engage with the slot 230U (see FIG. 21A ) when the upper reflective assembly 210U is mounted to the upper base 250U. Figure 2A The alignment of the slots 230U, 270U provides an opening that allows the temperature sensor 290U to measure the temperature of the substrate 50 and / or the susceptor 115 during processing.

[0049] Figure 2C According to one embodiment Figure 1 200L. Although not required, the lower reflector 200L can be substantially similar to the upper reflector 200U. Unless otherwise specified, the description provided above for the upper reflector 200U also applies to the lower reflector 200L, because if the upper reflector 200U is turned upside down, the lower reflector 200L is the same or equivalent to the upper reflector 200U in many aspects.

[0050] The lower reflector 200L includes a lower reflective assembly 210L coupled (eg, fastened) to a lower base 250L. Figure 2D Description Upper base 250U( Figure 2B ) and the difference between the lower base 250L. Except for the differences described below, the lower reflective assembly 210L is the same as the upper reflective assembly 210U. The lower reflective assembly 210L includes a base for accommodating the substrate support assembly 116 ( Figure 1) of the axis 118. The central opening 285 makes the reflective portions 211A-211D in the first region 201 slightly smaller than the corresponding reflective portions 211A-211D in the first region 201 of the upper reflective assembly 210U. Moreover, the lower reflective assembly 210L includes a slot 230L that is smaller than the corresponding slot 230U described above. The slot 230L provides an opening for the temperature measurement performed by the lower temperature sensor 290L.

[0051] Figure 2D According to one embodiment Figure 1 250U is shown as transparent so that the cooling channel 260 can be more clearly shown. The lower base 250L is the same as the upper base 250U described above, except that the lower base 250L includes an inner body 251L that is different from the inner body 251U included in the upper base 250U. The lower base 250L includes the inner body 251L and the outer edge 252. The lower reflective assembly 210L ( Figure 2C ) is configured to be mounted to the inner body 251L.

[0052] In addition to (1) the inner body 251L of the lower base 250L includes a Figure 1 ) of the shaft 118, and (2) the inner body 251L includes a slot 270L that is smaller than a corresponding slot 270U included in the inner body 251 of the upper base 250U, and the inner body 251L of the lower base 250L is identical to the upper base 250U described above ( Figure 2B ) is the same as the inner body 251U. The narrow groove 270L provides for the lower temperature sensor 290L ( Figure 1 When the lower reflective assembly 210L is mounted to the lower base 250L, the slot 270L is aligned with the slot 230L.

[0053] Figure 3A According to one embodiment, the lamp 220U and Figure 2A A side cross-sectional view of the reflective portion 214H. Figure 3A The view is along Figure 2A Although the reference reflection portion 214H is described Figure 3A , but unless otherwise stated, Figure 3A The description of applies to all reflecting portions 211-214 on both the upper reflector 200U and the lower reflector 200L.

[0054] like Figure 3AAs shown, the reflective portion 214H includes a first side 301, a second side 302, a third side 303 and a reflective surface 304 (also referred to as a fourth side). The third side 303 extends between the first side 301 and the second side 302. When the reflective portion 214H is mounted to the base 250U, the third side 303 can be configured to contact the base 250U. The reflective surface 304 is opposite to the third side 303 and also extends between the first side 301 and the second side 302. When the reflective portion 214H is mounted to the upper base 250U, the reflective surface 304 is configured to face one of the lamps 220U. Each reflective portion 211-214 on each reflector 200U, 200L is configured to face the corresponding lamp 220U, 220L in a similar configuration.

[0055] The reflective portion 214H has a height H1 corresponding to the length of the first side 301 and the second side 302 in the vertical direction. The reflective portion 214H has a width W1 corresponding to the distance between the first side 301 and the second side 302 in the horizontal direction. The reflective surface 304 of the reflective portion 214H is spaced a first distance D1 from the lamp 220U. The reflective surface 304 may be a curved surface having a radius of curvature RC1. The reflective portion 214H may further include a first cooling hole 241A and a second cooling hole 241B to guide the cooling gas through the holes 241A, 241B during processing. The reflective surface 304 may be formed by a coating C1 (e.g., a gold or aluminum oxide coating having a first thickness).

[0056] Figure 3B is a side cross-sectional view of a backup reflective portion 215S and a lamp 220U according to one embodiment. The backup reflective portion 215S is configured to refer to Figure 3A Replace the reflecting portion 214H described above.

[0057] Alternate reflective portion 215S has different reflective characteristics compared to reflective portion 214H. Alternate reflective portion 215S may be replaced with reflective portion 214H to modify the intensity of radiation received at different portions of the substrate (eg, near an edge of the substrate) during processing.

[0058] The height H2 of the alternate reflective portion 215S in the vertical direction is smaller than the height H1 of the reflective portion 214H described above. When the alternate reflective portion 215S is mounted to the base 250U, the reduced height H2 separates the alternate reflective portion 215S from the lamp 220U by a distance D2. The distance D2 is greater than the distance D1 described above for the distance between the reflective portion 214H and the lamp 220U. Although the width W1 of the alternate reflective portion 215S is the same as the width of the reflective portion 214H, in some embodiments, when replacing a reflective portion with another reflective portion, the width of the reflective portion may also be changed.

[0059] The radius of curvature RC2 of the reflective surface 304 on the alternate reflective portion 215S is greater than the radius of curvature RC1 of the reflective surface 304 of the reflective portion 214H described above. The reflective surface 304 on the alternate reflective portion 215S may be formed by a coating C2 that is different from the coating C1 of the reflective surface 304 of the reflective portion 214H described above (e.g., different material, different thickness). In addition, the material (e.g., copper) forming the body of the alternate reflective portion 215S may also be different from the material (e.g., gold) forming the body of the reflective portion 214H. The alternate reflective portion 215S may further include a first cooling hole 341A and a second cooling hole 341B to guide cooling gas through the holes 341A, 341B during processing. The cooling holes 341A, 341B are larger than the corresponding cooling holes 241A, 241B described above for the reflective portion 214H. Furthermore, the cooling holes 341A, 341B are positioned closer to the sides 301, 302 of the backup reflecting portion 215S than the cooling holes 241A, 241B are positioned relative to the sides 301, 302 of the reflecting portion 214H.

[0060] In general, relative to the reflective portion 214H described above, the alternate reflective portion 215S has different dimensions (e.g., height H2 is less than height H1), a different shape (radius of curvature RC2 is greater than radius of curvature RC1), a different coating (coating C2 instead of coating C1), a different distance from the luminaire 220 (distance D2 instead of D1), and includes a different cooling configuration (holes 341A, 341B instead of holes 241A, 241B). Each of these differences may be sufficient, individually, to substantially modify the reflective characteristics of the alternate reflective portion compared to the existing reflective portion that has already been installed. Although not shown, the reflective portions 214H, 215S may include the same set of fastener holes 242 (see Figure 2B), so that the reflective portion 214H can be easily replaced with a spare reflective portion 215S using the same fasteners. Compared to conventional practice, the modular reflectors described herein enable relatively small portions of the reflector to be quickly and easily replaced, while conventional practice replaces the entire reflector when modifications related to the reflector are made. For example, in some embodiments, each of the individually replaceable reflective portions 211-214 (see, e.g., Figure 2A ) may have a reflective surface 304 (see Figure 3A ), the surface area of ​​the reflective surface 304 is smaller than that of the reflective component 210U ( Figure 2A )、210L( Figure 2C ) of the total reflective surface, for example less than 25%, for example less than 12.5%, for example less than 6%, for example less than 3% or less than 1%.

[0061] Although Figure 3B A spare reflective portion 215S is shown configured to replace the reflective portion 214H, but the modular system may include one or more spare reflective portions (not shown) having a plurality of spare reflective portions for each of the reflective portions 211-214 (e.g., Figure 2A The modular reflector system described above also enables easy replacement of reflective portions with identical reflective portions, for example, when a reflective portion is damaged (e.g., scratched). Replacing a single reflective portion, for example to address a scratched surface, can be much faster than replacing an entire reflector as is done in conventional practice.

[0062] In addition, the modular reflector system of the present disclosure may also allow the position of one or more reflective portions to be switched with the position of another reflective portion to see if the processing uniformity can be improved by switching the position of the reflective portion. Figure 2A, the position of the reflective portion 212F can be switched with the position of the reflective portion 212C to determine whether the processing uniformity can be improved by switching the positions of the two reflective portions. As another embodiment, the positions of the reflective portions 212A, 212B, and 212C can be switched with the positions of the reflective portions 212F, 212E, and 212D to see whether the processing uniformity can be improved. The position of the reflective portion 212A can be switched with the position of the reflective portion 212F, the position of the reflective portion 212B can be switched with the position of the reflective portion 212E, and the position of the reflective portion 212C can be switched with the position of the reflective portion 212D. In some embodiments, the modular reflector can be configured so that the modular reflector, such as the upper reflector 200U (see Figure 2A ) can be switched with the position of another reflecting portion of the modular reflector. Another advantage provided by the modular reflector disclosed herein is having a configuration that allows the positions of different reflecting portions to be switched on the modular reflector to improve processing uniformity, which is not available from a conventional reflector that is replaced as an entire unit.

[0063] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope of the disclosure, and the scope of the disclosure is determined by the claims that follow.

Claims

1. A modular reflective heating system for a process chamber, characterized in that include: Multiple connectors; a plurality of light fixtures, each light fixture connected to at least one of the connectors; A reflector, the reflector comprising: Base; and A reflective assembly comprising a first plurality of reflective portions and a second plurality of reflective portions, wherein Each of the first plurality of reflective sections and the second plurality of reflective sections is connected to the base, and Each of the first plurality of reflective sections and the second plurality of reflective sections is configured to be individually disconnected from the base; and A spare reflecting portion, wherein the spare reflecting portion is configured to replace a first reflecting portion in the first plurality of reflecting portions or the second plurality of reflecting portions.

2. A modular reflective heating system as described in claim 1, wherein when the backup reflective portion is coupled to the base, the backup reflective portion has a reflective surface configured to face one of the lamps, and the reflective surface on the backup reflective portion has a different radius of curvature, a different size or a different coating than the corresponding reflective surface on the first reflective portion.

3. The modular reflective heating system of claim 1, wherein each of the plurality of light fixtures is located completely below or above a single reflective portion of the first plurality of reflective portions or the second plurality of reflective portions.

4. The modular reflective heating system of claim 1, wherein the second plurality of reflective sections are arranged in an annular pattern.

5. The modular reflective heating system of claim 4, wherein the first plurality of reflective portions are disposed inside the annular pattern of the second plurality of reflective portions.

6. The modular reflective heating system of claim 5, wherein the reflective assembly further comprises a third plurality of reflective sections connected to the base, wherein each reflective section of the third plurality of reflective sections is configured to be individually disconnected from the base.

7. The modular reflective heating system of claim 6, wherein the third plurality of reflective portions are arranged in an annular pattern around the second plurality of reflective portions.

8. The modular reflective heating system of claim 1, wherein the base includes cooling channels configured to cool the reflective assembly.

9. The modular reflective heating system of claim 1, wherein each connector extends through the base and one of the reflective sections in the first plurality of reflective sections or the second plurality of reflective sections.

10. A processing system, characterized in that include: A processing chamber, the processing chamber comprising: a chamber body disposed to surround a processing volume; a substrate support in the processing volume; a reflector positioned above or below the substrate support, the reflector comprising: Base; and A reflective assembly comprising a first plurality of reflective portions and a second plurality of reflective portions, wherein Each of the first plurality of reflective sections and the second plurality of reflective sections is connected to the base, and Each of the first plurality of reflective sections and the second plurality of reflective sections is configured to be individually disconnected from the base; and A spare reflecting portion, wherein the spare reflecting portion is configured to replace a first reflecting portion in the first plurality of reflecting portions or the second plurality of reflecting portions.

11. The processing system of claim 10, wherein the alternate reflective portion has a reflective surface having a different radius of curvature, a different size, or a different coating than a corresponding reflective surface on the first reflective portion.

12. The processing system of claim 10, wherein the second plurality of reflective portions are arranged in an annular pattern.

13. The processing system of claim 12, wherein the first plurality of reflective portions are disposed inside the annular pattern of the second plurality of reflective portions.

14. The processing system of claim 13, wherein the reflective assembly further comprises a third plurality of reflective portions connected to the base, wherein each reflective portion of the third plurality of reflective portions is configured to be individually disconnected from the base.

15. The processing system of claim 14, wherein the third plurality of reflective portions are arranged in an annular pattern around the second plurality of reflective portions.

16. The processing system of claim 10, wherein the base of the reflector includes cooling channels configured to cool the reflective assembly.

17. The processing system of claim 10, wherein the base of the reflector includes a plurality of holes configured to direct cooling gas onto the reflective assembly.

18. A processing system, characterized in that include: A processing chamber, the processing chamber comprising: a chamber body disposed to surround a processing volume; a substrate support in the processing volume; Multiple light fixtures; a reflector positioned above or below the substrate support, the reflector comprising: Base; and A reflective assembly comprising a first plurality of reflective portions and a second plurality of reflective portions, wherein the plurality of lamps being positioned between the substrate support and the reflector, Each of the first plurality of reflective sections and the second plurality of reflective sections is connected to the base, and Each of the first plurality of reflective sections and the second plurality of reflective sections is configured to be individually disconnected from the base; and a spare reflective portion, the spare reflective portion being configured to replace a first reflective portion in the first plurality of reflective portions or the second plurality of reflective portions, wherein The backup reflective portion has a reflective surface configured to face toward one of the light fixtures when the backup reflective portion is coupled to the base, and The reflective surface on the backup reflective portion has a different radius of curvature, a different size, or a different coating than the corresponding reflective surface on the first reflective portion.

19. The processing system of claim 18, wherein the reflective assembly further comprises a third plurality of reflective portions connected to the base, wherein each reflective portion of the third plurality of reflective portions is configured to be individually disconnected from the base.

20. The processing system of claim 19, wherein the second plurality of reflecting portions are arranged in an annular pattern around the first plurality of reflecting portions, The third plurality of reflective portions are arranged in an annular pattern around the second plurality of reflective portions, and Each of the plurality of light fixtures is located completely beneath or above a single reflective portion of the first plurality of reflective portions, the second plurality of reflective portions, or the third plurality of reflective portions.

Images