Wafer non-contact positioning platform device

Abstract

The utility model discloses a wafer non-contact positioning platform device, which comprises a bottom plate, a first vertical plate, a second vertical plate, a first transverse plate and a second transverse plate, a centering platform is rotatably connected above the first transverse plate, a motor is connected below the middle of the centering platform, a lifting mechanism is arranged on the bottom plate, and a laser displacement sensor is arranged on the second vertical plate; the centering platform comprises a base plate, a first connecting plate, a first positioning block, a second connecting plate and a second positioning block, and the ends, away from the base plate, of the first positioning block and the second positioning block are each of a step-shaped structure. The beneficial effects of the utility model are that edge searching or V-Notch port detection of the wafer can be realized, the orientation of the wafer can be rapidly determined, and the position of the wafer can be rapidly positioned; the positioning platform device is only in contact with the edge of the wafer in the orientation process and is not in direct contact with a wafer chip, so that the scratch and abrasion risks of the wafer chip can be effectively reduced, the wafer is not physically damaged, and the orientation quality of the wafer is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to a non-contact wafer positioning platform device. Background Art

[0002] In the field of semiconductor processing technology, in order to distinguish the angular position of a circular wafer, there is usually a notch (V-notch) on the wafer to locate the angular position. Detecting the placement angle of the wafer can help with key processes such as rough positioning of subsequent grooving and cutting processes. Therefore, the equipment process requires that the wafer must first undergo edge finding, V-Notch finding, and centering processes before moving in multiple stations, and then move to the next station after the wafer position is determined. Existing wafer centering and calibration platforms mostly use a vacuum adsorption structure, which is easy to contact the wafer body chip, and there is a risk of chip scratches and wear. In addition, adverse conditions such as inadequate detection accuracy and detection failure occur. Utility Model Content

[0003] The utility model aims to provide a wafer non-contact positioning platform device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer non-contact positioning platform device, including a base plate, two first vertical plates arranged symmetrically in front and back are provided on the base plate, a second vertical plate is provided on the middle right side of the two first vertical plates, a first horizontal plate and a second horizontal plate are provided between the two first vertical plates from top to bottom, a centering platform is rotatably connected to the top of the first horizontal plate, a motor is connected to the middle and lower part of the centering platform, the motor is fixed on the second horizontal plate, a lifting mechanism is provided on the base plate, and a laser displacement sensor is provided on the second vertical plate; the centering platform includes a circular chassis, three first connecting plates are evenly arranged along the circumferential direction of the chassis, each of the first connecting plates is provided with a first positioning block and a second connecting plate, the second connecting plate is arranged on the side of the first positioning block away from the chassis, the second connecting plate is provided with a second positioning block, and the ends of the first positioning block and the second positioning block away from the chassis are both stepped structures.

[0005] Further preferably, a positioning boss with an inscribed equilateral triangle structure is provided above the chassis, and the three first connecting plates are respectively perpendicular to the centers of the three sides of the positioning boss, and three T-shaped slots for inserting the first connecting plates are provided on the chassis to ensure that the installation position of the first connecting plates is accurate and stable.

[0006] Further preferably, three fixing blocks corresponding to the first connecting plate are provided above the chassis, the fixing blocks are T-shaped structures and are pressed onto the first connecting plate, the fixing blocks are respectively connected to the positioning bosses and the first connecting plate, and the fixing blocks are used to fix the first connecting plate to ensure that the first connecting plate is firmly installed.

[0007] Further preferably, the first connecting plate is provided with a limiting groove for installing the first positioning block and the second connecting plate to ensure that the installation position of the first positioning block and the second connecting plate is accurate; the second connecting plate is provided with a limiting groove for installing the second positioning block to ensure that the installation position of the second positioning block is accurate; the chassis cover is provided with a disc to improve the aesthetics of the centering platform.

[0008] Further preferably, the lifting mechanism comprises a lifting plate and a lifting cylinder, the three lifting plates are arranged in a U-shaped structure and are slidably arranged on the two first vertical plates, the lifting cylinder is connected to the lifting plate and is vertically installed on the bottom plate, each of the lifting plates is connected to a third connecting plate, the three third connecting plates are evenly arranged along the circumferential direction of the chassis, each of the third connecting plates is vertically installed with a first mounting plate and a second mounting plate, and the upper ends of the first mounting plate and the second mounting plate are provided with clamping blocks. The lifting cylinder can drive the lifting plate to rise and fall, drive the third connecting plate to rise and fall synchronously, and then drive the first mounting plate, the second mounting plate and the clamping block to rise and fall, so as to drive the wafer to rise and fall.

[0009] Further preferably, the upper end of the clamping block is a stepped structure, ensuring that the clamping block can only contact the edge of the wafer and will not directly contact the wafer chip; the first mounting plate and the second mounting plate are both provided with limit grooves for installing the clamping block, ensuring accurate installation of the clamping block.

[0010] Further preferably, the three third connecting plates are staggered with the three first connecting plates respectively to prevent the lifting mechanism from conflicting with the centering platform and ensure the lifting mechanism to carry the wafer up and down; the height of the second mounting plate is higher than the first mounting plate to facilitate carrying larger wafers.

[0011] Further preferably, two of the three lifting plates are respectively slidably connected to the two first vertical plates and are connected to each other by linear guide rails to ensure that the lifting plates can be lifted and lowered smoothly; the last one of the three lifting plates is arranged on the side of the first vertical plate away from the second vertical plate.

[0012] Beneficial effects: The wafer non-contact positioning platform device of the utility model realizes the initial positioning of the wafer and drives the wafer to rise and fall through the lifting mechanism, realizes the secondary positioning and bearing of the center of the wafer through the centering platform, and drives the centering platform to rotate through the motor, and realizes the edge finding or V-Notch detection of the wafer through the laser displacement sensor, and quickly determines the wafer orientation, that is, realizes the rapid positioning of the wafer position; the wafer is supported by the first positioning block, the second positioning block and the clamping block, and they only contact the edge of the wafer and will not directly contact the wafer chip, which can effectively reduce the risk of scratches and wear of the wafer chip, will not cause physical damage to the wafer, and ensure the orientation quality of the wafer; the structural design of the positioning platform device is ingenious, the precision measurement is high, the detection is fast, and it can effectively avoid detection failure and defect, and it can also be applied to the mirror Taiko process products after grinding, and can detect and position 8-inch and 12-inch wafers, with wide applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the axial structure of the wafer non-contact positioning platform device disclosed in the embodiment of the utility model;

[0014] Figure 2 It is a schematic diagram of the front view structure of the wafer non-contact positioning platform device disclosed in the embodiment of the utility model;

[0015] Figure 3 This is a schematic diagram of the exploded structure of the centering platform disclosed in the embodiment of the utility model;

[0016] Figure 4 This is a schematic diagram of the installation structure of the lifting mechanism disclosed in the embodiment of the utility model.

[0017] Figure markings: 1-base plate, 2-first vertical plate, 3-second vertical plate, 4-first horizontal plate, 5-second horizontal plate, 6-centering platform, 61-chassis, 62-positioning boss, 63-first connecting plate, 64-first positioning block, 65-second connecting plate, 66-second positioning block, 67-fixed block, 68-disc, 7-lifting mechanism, 71-lifting plate, 72-lifting cylinder, 73-third connecting plate, 74-first mounting plate, 75-second mounting plate, 76-clamping block, 77-linear guide, 8-motor, 9-laser displacement sensor. DETAILED DESCRIPTION

[0018] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0019] like Figure 1-4As shown, a wafer non-contact positioning platform device is used for wafer edge finding or V-Notch detection to determine the orientation of the wafer, that is, to locate the position of the wafer. The positioning platform device includes a bottom plate 1, a first vertical plate 2, a second vertical plate 3, a first horizontal plate 4 and a second horizontal plate 5. A centering platform 6 is rotatably connected to the top of the first horizontal plate 4. A motor 8 is connected to the middle and bottom of the centering platform 6. The motor 8 is fixed to the second horizontal plate 5. A lifting mechanism 7 is provided on the bottom plate 1, and a laser displacement sensor 9 is provided on the second vertical plate 3. Among them, the bottom plate 1 serves as the base of the positioning platform device, the first vertical plate 2 is used for the installation of the centering platform 6, and the installation is realized through the first horizontal plate 4, the motor 8 is installed through the second horizontal plate 5, the motor 8 can drive the centering platform 6 to rotate, the centering platform 6 is used to locate the center position of the wafer, and is driven to rotate by the motor 8, and the edge finding of the wafer or the position detection of the V-Notch mouth is realized by the laser displacement sensor 9; the lifting mechanism 7 is installed on the bottom plate 1, and the guiding support is realized by the two first vertical plates 2, and the second vertical plate 3 is used for the installation of the laser displacement sensor 9.

[0020] In the present application, the centering platform 6 includes a circular chassis 61, and three first connecting plates 63 are evenly arranged along the circumferential direction of the chassis 61. Each first connecting plate 63 is provided with a first positioning block 64 and a second connecting plate 65. The second connecting plate 65 is arranged on the side of the first positioning block 64 away from the chassis 61. The second connecting plate 65 is provided with a second positioning block 66. The ends of the first positioning block 64 and the second positioning block 66 away from the chassis 61 are both stepped structures. Among them, the three first connecting plates 63 and the three first positioning blocks 64 form a three-claw centering structure, and the three first connecting plates 63 and the three second positioning blocks 66 form a second three-claw centering structure, which can detect and locate 8-inch and 12-inch wafers respectively. The installation of the three first positioning blocks 64 is realized by the chassis 61 and the first connecting plate 63, and the installation of the three second positioning blocks 66 is realized by the chassis 61, the first connecting plate 63, and the second connecting plate 65. The first positioning block 64 and the second positioning block 66 of the stepped structure only contact the edge of the wafer and do not directly contact the wafer chip, which can effectively reduce the risk of scratching the wafer chip and ensure the quality of the wafer.

[0021] In the present application, a positioning boss 62 with an inscribed regular triangle structure is provided above the chassis 61, and three first connecting plates 63 are respectively perpendicular to the centers of the three sides of the positioning boss 62, and three T-shaped card slots for inserting the first connecting plate 63 are provided on the chassis 61. The setting of the positioning boss 62 facilitates the connection and positioning of the first connecting plate 63, and facilitates the installation of the first connecting plate 63; and the first connecting plate 63 is fixed by the fixing block 67 provided on the chassis 61, the fixing block 67 is a T-shaped structure and is pressed on the first connecting plate 63, and the fixing block 67 is respectively connected to the positioning boss 62 and the first connecting plate 63, and the connection is easy. The T-shaped card slot on the chassis 61 facilitates the insertion and connection of the first connecting plate 63, and can limit the first connecting plate 63 to ensure the stable connection of the first connecting plate 63.

[0022] In the present application, the first connecting plate 63 is provided with a limiting groove for installing the first positioning block 64 and the second connecting plate 65, and the second connecting plate 65 is provided with a limiting groove for installing the second positioning block 66. The setting of the limiting groove facilitates the limiting and positioning of the first positioning block 64, the second connecting plate 65, and the second positioning block 66, thereby ensuring the accurate installation position of the first positioning block 64 and the second positioning block 66, and further ensuring the accurate centering of the centering platform 6. The upper cover of the chassis 61 is provided with a disc 68, which is used to cover the positioning boss 62 and the fixing block 67 to improve the aesthetics of the centering platform 6.

[0023] In the present application, the lifting mechanism 7 includes a lifting plate 71 and a lifting cylinder 72. The three lifting plates 71 are arranged in a U-shaped structure and are slidably arranged on the two first vertical plates 2. The lifting cylinder 72 is connected to the lifting plates 71 and is vertically installed on the bottom plate 1. Each lifting plate 71 is connected to a third connecting plate 73. The three third connecting plates 73 are evenly arranged along the circumferential direction of the chassis 61. A first mounting plate 74 and a second mounting plate 75 are vertically installed on each third connecting plate 73. The upper ends of the first mounting plate 74 and the second mounting plate 75 are provided with a clamping block 76. Among them, the lifting cylinder 72 is used to drive the lifting plate 71 to rise and fall, and drive the third connecting plate 73, the first mounting plate 74, the second mounting plate 75 and the clamping block 76 to rise and fall, so as to realize the lifting function of the lifting mechanism 7, and realize the placement of the wafer on the centering platform 6, and the lifting of the oriented wafer. The three third connecting plates 73, the three first mounting plates 74 and the clamping blocks 76 connected to the first mounting plates 74 form a first clamping structure. The three third connecting plates 73, the three second mounting plates 75 and the clamping blocks 76 connected to the second mounting plates 75 form a second clamping structure. The two clamping structures can clamp 8-inch and 12-inch wafers respectively, and the three-point centering principle is adopted to initially locate the position of the wafer.

[0024] In the present application, the upper end of the clamping block 76 is a stepped structure, which only contacts the edge of the wafer and does not directly contact the wafer chip, which can effectively reduce the risk of scratching the wafer chip and ensure the quality of the wafer. The first mounting plate 74 and the second mounting plate 75 are both provided with a limit groove for the installation of the clamping block 76, which plays a positioning role and ensures that the position of the clamping block 76 is accurately installed.

[0025] In the present application, the three third connecting plates 73 are respectively arranged in a staggered manner with the three first connecting plates 63, so as to prevent the first mounting plate 74 and the second mounting plate 75 from colliding with the first connecting plate 63 when the third connecting plate 73 is raised with the lifting plate 71; and the clamping block 76 on the first mounting plate 74 and the first positioning block 64, and the clamping block 76 on the second mounting plate 75 and the second positioning block 66 are respectively arranged correspondingly to realize the directional detection of 8-inch and 12-inch wafers. The height of the second mounting plate 75 is higher than that of the first mounting plate 74, that is, the first mounting plate 74 and the clamping block 76 thereon are used for clamping 8-inch wafers, and the second mounting plate 75 and the clamping block 76 thereon are used for clamping 12-inch wafers. Similarly, the height of the second positioning block 66 is higher than that of the first positioning block 64, and the first positioning block 64 is used for positioning and supporting 8-inch wafers; the second positioning block 66 is used for positioning and supporting 12-inch wafers.

[0026] In the present application, two of the three lifting plates 71 are respectively slidably connected to the two first vertical plates 2 and are connected to each other by linear guide rails 77 to ensure that the lifting plates 71 are lifted and lowered steadily and smoothly; the last of the three lifting plates 71 is arranged on the side of the first vertical plate 2 away from the second vertical plate 3 to prevent the third connecting plate 73 connected to the lifting plate 71 from colliding with the second vertical plate 3 and the laser displacement sensor 9 connected to the second vertical plate 3.

[0027] In the present application, the lifting mechanism 7 is actuated, the lifting cylinder 72 drives the lifting plate 71 to rise, driving the first mounting plate 74 and the second mounting plate 75 to rise synchronously, raising the clamping block 76 to the waiting position, and the wafer handling device transports the wafer to the clamping position formed by the three clamping blocks 76, supporting the edge of the wafer, and preliminarily locating the center of the wafer; then the lifting cylinder 72 drives the lifting plate 71 to descend, and places the wafer on the clamping block 76 on the corresponding positioning block of the centering platform 6, wherein the 8-inch wafer is clamped and The 12-inch wafer is placed on the first positioning block 64, and is clamped by the clamping block 76 on the second mounting plate 75 and placed on the second positioning block 66; the motor 8 is started to drive the centering platform 6 to rotate, and the laser displacement sensor 9 performs edge detection or V-Notch detection on the rotating wafer to determine the orientation of the wafer, that is, to locate the wafer position; finally, the lifting cylinder 72 drives the lifting plate 71 to rise, lifts the wafer positioned on the centering platform 6, and then transports the wafer to the next station through the wafer transport device.

[0028] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions recorded in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the utility model content within the protection scope of the utility model.

Claims

1. A wafer non-contact positioning platform device, comprising a base plate (1), two first vertical plates (2) arranged symmetrically in front and back are arranged on the base plate (1), a second vertical plate (3) is arranged on the right side of the middle of the two first vertical plates (2), and a first horizontal plate (4) and a second horizontal plate (5) are respectively arranged from top to bottom between the two first vertical plates (2), characterized in that: A centering platform (6) is rotatably connected to the top of the first horizontal plate (4), a motor (8) is connected to the middle and bottom of the centering platform (6), and the motor (8) is fixed on the second horizontal plate (5). A lifting mechanism (7) is provided on the bottom plate (1), and a laser displacement sensor (9) is provided on the second vertical plate (3); the centering platform (6) comprises a circular chassis (61), and three first connecting plates (63) are evenly arranged along the circumferential direction of the chassis (61), each of the first connecting plates (63) is provided with a first positioning block (64) and a second connecting plate (65), the second connecting plate (65) is arranged on the side of the first positioning block (64) away from the chassis (61), and the second connecting plate (65) is provided with a second positioning block (66), and the ends of the first positioning block (64) and the second positioning block (66) away from the chassis (61) are both stepped structures.

2. The wafer non-contact positioning platform device according to claim 1, characterized in that: A positioning boss (62) with an inscribed regular triangle structure is provided above the chassis (61); the three first connecting plates (63) are respectively perpendicular to the centers of the three sides of the positioning boss (62); and three T-shaped slots for inserting the first connecting plates (63) are provided on the chassis (61).

3. The wafer non-contact positioning platform device according to claim 2, characterized in that: Three fixing blocks (67) corresponding to the first connecting plate (63) are arranged above the chassis (61); the fixing blocks (67) are T-shaped structures and are pressed onto the first connecting plate (63); the fixing blocks (67) are respectively connected to the positioning boss (62) and the first connecting plate (63).

4. The wafer non-contact positioning platform device according to claim 1, characterized in that: The first connecting plate (63) is provided with a limiting groove for installing the first positioning block (64) and the second connecting plate (65), the second connecting plate (65) is provided with a limiting groove for installing the second positioning block (66), and the upper cover of the chassis (61) is provided with a disc (68).

5. The wafer non-contact positioning platform device according to claim 1, characterized in that: The lifting mechanism (7) comprises a lifting plate (71) and a lifting cylinder (72). The three lifting plates (71) are arranged in a U-shaped structure and are slidably arranged on the two first vertical plates (2). The lifting cylinder (72) is connected to the lifting plates (71) and is vertically installed on the bottom plate (1). Each of the lifting plates (71) is connected to a third connecting plate (73). The three third connecting plates (73) are evenly arranged along the circumferential direction of the chassis (61). A first mounting plate (74) and a second mounting plate (75) are vertically installed on each of the third connecting plates (73). The upper ends of the first mounting plate (74) and the second mounting plate (75) are each provided with a clamping block (76).

6. The wafer non-contact positioning platform device according to claim 5, characterized in that: The upper end of the clamping block (76) is a stepped structure, and both the first mounting plate (74) and the second mounting plate (75) are provided with limiting grooves for mounting the clamping block (76).

7. The wafer non-contact positioning platform device according to claim 5, characterized in that: The three third connecting plates (73) are respectively arranged in a staggered manner with the three first connecting plates (63), and the height of the second mounting plate (75) is higher than that of the first mounting plate (74).

8. The wafer non-contact positioning platform device according to claim 5, characterized in that: Two of the three lifting plates (71) are respectively slidably connected to the two first vertical plates (2) and are mutually connected via linear guide rails (77); the last of the three lifting plates (71) is arranged on a side of the first vertical plate (2) away from the second vertical plate (3).

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