Semiconductor wafer dust removal cleaning machine

Abstract

The semiconductor wafer dust removal cleaning machine comprises a table body, cross rods are rotatably connected to the two opposite inner side walls of the table body, rotating barrels and grooved wheels are coaxially and fixedly connected to the outer walls of the cross rods, rotating rods are arranged on the side walls of the table body in a penetrating mode and rotatably connected to the side walls of the table body, and rotating discs are coaxially and fixedly connected to the ends, located in the table body, of the rotating rods; according to the technical scheme, after wafers needing the same cleaning liquid are fixed in the circumferential direction through the suction cups, the cleaning liquid matched with the wafers below the inner cavity of the liquid collecting box is injected into the inner cavity of the liquid collecting box through the liquid injection box, and then the wafers can be cleaned conveniently. The rotating disc rotates by a circle, the grooved wheel drives the rotating barrel to rotate by a fixed angle, the sliding block rotationally connected with the rotating disc through the connecting rod drives the liquid injection pipe to move up and down once, and when the placing hole is located under the liquid injection pipe, the liquid injection pipe moves to the lowest position to clean the wafer in the liquid injection pipe.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor wafers, and in particular to a semiconductor wafer dust removal and cleaning machine. Background Art

[0002] A semiconductor wafer is a silicon chip used to make semiconductor circuits. The manufacturing process involves dissolving high-purity polysilicon and doping it with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, a silicon wafer is formed, i.e. a semiconductor wafer. The diameter of the wafer is usually 4 to 10 inches, and it can be doped as needed to form P-type or N-type semiconductor materials.

[0003] The traditional cleaning method is to directly rinse with cleaning liquid. "Publication No. 'CN213855985U' A semiconductor wafer dust removal and cleaning machine" discloses that the dust removal and cleaning of the wafer is achieved by the cooperation between the lifting cleaning pipe and the aggregate shell. Different types of wafers require different types and concentrations of cleaning liquids when cleaning. However, the above-mentioned semiconductor wafer dust removal and cleaning machine cleans the wafers at the same time by rotating the aggregate shell, and it is impossible to use cleaning liquids of different concentrations to remove dust from different types of wafers. Therefore, in order to solve the above problems, the present application provides a semiconductor wafer dust removal and cleaning machine.

[0004] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0005] In order to solve the problem of different concentrations of cleaning solutions required for different wafers, the present application provides a semiconductor wafer dust removal and cleaning machine.

[0006] A semiconductor wafer dust removal and cleaning machine provided by the present application includes a platform body, wherein two opposite inner side walls of the platform body are rotatably connected to a cross bar, and the outer wall of the cross bar is coaxially fixedly connected to a rotating barrel and a groove wheel, and a rotating rod is arranged through the side wall of the platform body and rotatably connected, and one end of the rotating rod located inside the platform body is coaxially fixedly connected to a rotating disk, and the rotating disk is fixedly connected to a shifting rod, which is coupled to the groove wheel, and a slidable slider is arranged above the platform body, and a connecting seat is fixedly arranged on the side wall of the slider, and the connecting seat is rotatably connected to the connecting rod, and the side wall of the rotating disk away from the shifting rod is fixedly connected to a fixed seat, and the lower end of the connecting rod is rotatably connected to the fixed seat.

[0007] Preferably, the outer wall of the rotating barrel is provided with a plurality of evenly distributed placement holes, and the placement holes in the same row distributed along the axial direction of the rotating barrel are a group, and the number of groups of placement holes is the same as the number of grooves of the groove wheel.

[0008] Preferably, a suction cup connected to an external air pump is provided inside the placement holes.

[0009] Preferably, a sliding rod is fixedly provided on the upper wall of the platform, the sliding block is slidably connected to the sliding rod, and a liquid collecting box is fixedly connected to the side wall of the sliding block away from the sliding rod. The interior of the liquid collecting box is divided into multiple liquid collecting chambers, each liquid collecting chamber has a lower wall connected to a liquid injection tube, and each liquid collecting chamber has an upper wall provided with a liquid injection box. The liquid injection tubes are all arranged through the upper wall of the platform, and the number of the liquid injection tubes is the same as the number of the placement holes in each group.

[0010] Preferably, a fixing rod is fixedly arranged above the platform, and the fixing rod passes through the liquid collecting box and is slidably connected thereto.

[0011] Preferably, a water collecting box is slidably arranged inside the platform below the rotating barrel.

[0012] Preferably, a through hole is provided through the upper wall of the platform, and the through hole cooperates with the connecting rod.

[0013] Preferably, a motor for driving the rotating rod to rotate is fixedly provided on the side wall of the platform body.

[0014] Preferably, the front side wall of the platform body is an openable door.

[0015] In summary, this application includes the following beneficial technical effects:

[0016] After the wafers that require the same cleaning liquid are fixed along the circumferential direction by the suction cup, the cleaning liquid matching the wafer below is injected into the inner cavity of the liquid collecting box through the liquid injection box, the motor is started, the rotating disk rotates one circle, the groove wheel drives the rotating barrel to rotate a fixed angle, and the slider connected to the rotating disk through the connecting rod drives the liquid injection tube to move up and down once. When the placement hole is located directly below the liquid injection tube, the liquid injection tube moves to the lowest position to clean the wafer inside it, thereby realizing multiple dust removal of wafers with different concentrations. At the same time, the liquid injection tube extends into the placement hole to avoid splashing of the cleaning liquid and contamination of nearby wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure in Example 1 of the present application;

[0018] Figure 2 It is a schematic diagram of the internal structure from a first viewing angle in the first embodiment of the present application;

[0019] Figure 3 is a schematic diagram of the internal structure of the second viewing angle in the first embodiment of the present application;

[0020] Figure 4 It is a schematic diagram of the internal structure from the third viewing angle in the first embodiment of the present application.

[0021] Explanation of the accompanying reference numerals: 1. platform body; 2. opening fan; 3. water collecting box; 4. rotating barrel; 5. placement hole; 6. liquid collecting box; 7. liquid injection pipe; 8. liquid injection box; 9. fixing rod; 10. sliding rod; 11. slider; 12. through hole; 13. motor; 14. rotating disk; 15. rotating rod; 16. lever; 17. connecting seat; 18. connecting rod; 19. fixing seat; 20. groove wheel; 21. cross bar. DETAILED DESCRIPTION

[0022] The following is combined with Figure 1-4 This application is described in further detail.

[0023] Embodiment 1

[0024] Reference Figure 1-4 A semiconductor wafer dust removal and cleaning machine includes a platform 1, the front side wall of the platform 1 is an openable fan 2, and the wafer can be placed through the open fan 2. A water collection box 3 is slidably arranged under a rotating barrel 4 inside the platform 1, and the cleaned cleaning liquid falls into the water collection box 3 for unified treatment.

[0025] The two opposite inner side walls of the platform body 1 are rotatably connected with a crossbar 21, and the outer wall of the crossbar 21 is coaxially fixedly connected with a rotating barrel 4 and a groove wheel 20. A rotating rod 15 is provided through the side wall of the platform body 1 and is rotatably connected. A motor 13 for driving the rotating rod 15 to rotate is fixedly provided on the side wall of the platform body 1. The rotating rod 15 is coaxially fixedly connected with a rotating disk 14 at one end inside the platform body 1. The rotating disk 14 is fixedly connected with a lever 16. The lever 16 cooperates with the groove wheel 20. During the rotation process of the lever 16, the lever 16 will slide into the groove, thereby driving the groove wheel 20 to rotate. During the rotation process, the lever 16 will slide out of the groove, and the groove wheel 20 will stop rotating. That is, the rotating disk 14 rotates one circle and the groove wheel 20 rotates a fixed angle.

[0026] A slidable slider 11 is provided above the platform body 1, a connecting seat 17 is fixedly provided on the side wall of the slider 11, a connecting rod 18 is rotatably connected to the connecting seat 17, a through hole 12 is provided through the upper wall of the platform body 1, and the through hole 12 cooperates with the connecting rod 18. A fixing seat 19 is fixedly connected to the side wall of the rotating disk 14 away from the lever 16, and the lower end of the connecting rod 18 is rotatably connected to the fixing seat 19.

[0027] Start the motor 13, the rotating rod 15 drives the rotating disk 14 to rotate one circle, the groove wheel 20 coupled with the lever 16 rotates a fixed angle, thereby driving the rotating barrel 4 to rotate a fixed angle, and the slider 11 connected to the rotating disk 14 through the connecting rod 18 moves up and down once.

[0028] The outer wall of the rotating barrel 4 is provided with a plurality of evenly distributed placement holes 5, and each placement hole 5 is provided with a suction cup connected to an external air pump for fixing the wafer. The placement holes 5 in the same row distributed along the axial direction of the rotating barrel 4 are grouped as one group, and the number of groups of the placement holes 5 is the same as the number of grooves of the groove wheel 20.

[0029] A sliding rod 10 is fixedly arranged on the upper wall of the platform body 1, and a slider 11 is slidably connected to the sliding rod 10. A liquid collecting box 6 is fixedly connected to the side wall of the slider 11 away from the sliding rod 10. The interior of the liquid collecting box 6 is divided into multiple liquid collecting chambers, and each liquid collecting chamber is connected to a liquid injection tube 7 on the lower wall. A liquid injection box 8 is opened on the upper wall of each liquid collecting chamber. The liquid injection tubes 7 are all set through the upper wall of the platform body 1 and are controlled by electromagnetic valves below. The number of liquid injection tubes 7 is the same as the number of placement holes 5 in each group. A fixed rod 9 is fixedly arranged on the upper part of the platform body 1, and the fixed rod 9 is set through the liquid collecting box 6 and is slidably connected to it.

[0030] After the wafers that require the same cleaning liquid are fixed along the circumferential direction of the rotating barrel 4 by the suction cup, the cleaning liquid matching the wafers below is injected into the multiple inner cavities of the liquid collecting box 6 through the liquid injection box 8. The rotating disk 14 rotates one circle to drive the slider 11 to move up and down once, so that the liquid injection tube 7 moves up and down once. When the placement hole 5 is located directly below the liquid injection tube 7, the liquid injection tube 7 moves to the lowest position to clean the wafers in the placement hole 5 below it. The rotating disk 14 rotates one circle, and the other group of placement holes 5 rotates to be directly below the liquid injection tube 7. The liquid injection tube 7 moves up and down once and is located inside the placement hole 5 again for cleaning. The liquid injection tube 7 extends into the placement hole 5, which also avoids splashing of the cleaning liquid and causing contamination of nearby wafers.

[0031] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor wafer dust removal and cleaning machine, comprising a platform (1), characterized in that: The two opposite inner side walls of the platform body (1) are rotatably connected with a cross bar (21), and the outer wall of the cross bar (21) is coaxially fixedly connected with a rotating barrel (4) and a groove wheel (20). A rotating rod (15) is provided through the side wall of the platform body (1) and is rotatably connected. One end of the rotating rod (15) located inside the platform body (1) is coaxially fixedly connected with a rotating disk (14). The rotating disk (14) is fixedly connected with a shifting rod (16). The shifting rod (16) is coupled with the groove wheel (20). A slidable slider (11) is provided above the platform body (1). A connecting seat (17) is fixedly provided on the side wall of the slider (11). The connecting seat (17) is rotatably connected with a connecting rod (18). The side wall of the rotating disk (14) away from the shifting rod (16) is fixedly connected with a fixing seat (19), and the lower end of the connecting rod (18) is rotatably connected to the fixing seat (19).

2. A semiconductor wafer dust removal and cleaning machine according to claim 1, characterized in that: The outer wall of the rotating barrel (4) is provided with a plurality of evenly distributed placement holes (5), and the placement holes (5) in the same row distributed along the axial direction of the rotating barrel (4) are grouped as one, and the number of groups of placement holes (5) is the same as the number of grooves of the groove wheel (20).

3. A semiconductor wafer dust removal and cleaning machine according to claim 2, characterized in that: The placement holes (5) are each provided with a suction cup connected to an external air pump.

4. A semiconductor wafer dust removal and cleaning machine according to claim 2, characterized in that: A sliding rod (10) is fixedly arranged on the upper wall of the platform body (1), the sliding block (11) is slidably connected to the sliding rod (10), and a side wall of the sliding block (11) away from the sliding rod (10) is fixedly connected to a liquid collecting box (6), the interior of the liquid collecting box (6) is divided into a plurality of liquid collecting cavities, the lower wall of each liquid collecting cavity is connected to a liquid injection tube (7), the upper wall of each liquid collecting cavity is provided with a liquid injection box (8), and the liquid injection tubes (7) are all arranged through the upper wall of the platform body (1), and the number of the liquid injection tubes (7) is the same as the number of the placement holes (5) in each group.

5. A semiconductor wafer dust removal and cleaning machine according to claim 4, characterized in that: A fixing rod (9) is fixedly arranged above the platform body (1), and the fixing rod (9) passes through the liquid collecting box (6) and is slidably connected thereto.

6. The semiconductor wafer dust removal and cleaning machine according to claim 1, characterized in that: A water collection box (3) is slidably arranged inside the platform body (1) and below the rotating barrel (4).

7. The semiconductor wafer dust removal and cleaning machine according to claim 1, characterized in that: A through hole (12) is provided through the upper wall of the platform body (1), and the through hole (12) cooperates with the connecting rod (18) to work.

8. The semiconductor wafer dust removal and cleaning machine according to claim 1, characterized in that: A motor (13) for driving the rotating rod (15) to rotate is fixedly arranged on the side wall of the platform body (1).

9. The semiconductor wafer dust removal and cleaning machine according to claim 1, characterized in that: The front side wall of the platform body (1) is an openable opening fan (2).

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