Anti-static ceramic arm

Abstract

The utility model discloses an anti-static ceramic arm which comprises an arm body, a stepped groove is formed in one side of the arm body in the length direction, the stepped groove with the smaller inner diameter is an air groove, the stepped groove with the larger inner diameter is a conductive groove, a plurality of first air holes are formed in the air groove, and a conductive shell is connected to the side wall of the conductive groove. A plurality of stepped grooves are formed in one side of the arm body, first air holes are formed in the stepped grooves, air channels are formed between the first air holes and the stepped grooves, a plurality of mounting sinking tables are arranged on the other side of the arm body, conductive holes and conductive accessories are arranged in the mounting sinking tables, the conductive holes are communicated with the conductive grooves, and conductive coatings are arranged on the inner walls of the mounting sinking tables, the conductive holes and the conductive grooves. The utility model has the advantages that the structure is simple, and static electricity is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor transmission, in particular to an antistatic ceramic arm. Background Art

[0002] Alumina ceramic robot arm, also known as alumina ceramic fork and wafer transfer end effector, is a part made of alumina ceramic. The ceramic arm is the "porter" of the wafer in the integrated circuit manufacturing process. It is installed on the wafer handling robot, which is equivalent to the robot's hand. It is responsible for carrying the silicon wafer to the designated position, and its surface is in direct contact with the wafer. The alumina ceramic robot arm is light in weight, has the characteristics of high temperature resistance, wear resistance, corrosion resistance, low friction coefficient, light weight, and can effectively reduce the equipment load and increase the service life of the equipment. The ceramic arm is almost involved in the entire process of chip manufacturing. Precision ceramic arms are indispensable in equipment such as lithography machines, CVD, PVD, coating development, cleaning, and testing. However, the existing ceramic arms, such as a transmission arm for wafer manufacturing disclosed in Chinese patent CN103035553A, often cause static electricity to be generated during the repeated contact between the ceramic arm and the silicon wafer and the instruments and equipment during the transportation of the silicon wafer. The electromagnetic field effect caused by static electricity will cause trouble to semiconductor manufacturing and application. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an anti-static ceramic arm with a simple structure and reduced static electricity generation.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] An anti-static ceramic arm comprises an arm body, wherein a stepped groove is provided on one side of the arm body along the length direction, wherein the stepped groove with a smaller inner diameter is an air groove, and the stepped groove with a larger inner diameter is a conductive groove, wherein a plurality of first air holes are provided in the air groove, and a conductive shell is connected to the side wall of the conductive groove to form an air passage between the first air holes and the stepped groove, wherein a plurality of mounting sinks are provided on the other side of the arm body, wherein each mounting sink is provided with a conductive hole and a conductive accessory, wherein the conductive hole is connected to the conductive groove, and wherein the mounting sink, the conductive hole and the inner wall of the conductive groove are all provided with a conductive coating.

[0006] As a further improvement of the above technical solution:

[0007] The mounting sink is coaxially arranged with the first air hole and communicated with the first air hole. The conductive accessory is provided with a second air hole communicated with the first air hole.

[0008] The conductive shell and the side wall of the conductive slot, and the conductive accessories and the mounting sink are all connected by bonding.

[0009] The bonding method uses epoxy resin or sealing glass as an adhesive.

[0010] The conductive coating is a silver powder layer, a resin layer, or a silver powder glass composite material layer.

[0011] The conductive shell is a stainless steel shell or an alumina ceramic shell or a silicon carbide ceramic shell.

[0012] The conductive fitting is a polyetherketone resin part or a silicon carbide part.

[0013] The resistivity of the conductive accessory is 10 6 -10 8 Ω·cm.

[0014] The arm body includes a U-shaped wafer placing part and a mounting part arranged at the bottom of the U-shaped wafer placing part, the step groove is arranged along the circumferential direction of the U-shaped wafer placing part and the length direction of the mounting part, and the plurality of first air holes are arranged at intervals along the circumferential direction of the U-shaped wafer placing part and the length direction of the mounting part.

[0015] The mounting portion is provided with a positioning hole for connecting with the outside.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] The anti-static ceramic arm disclosed by the utility model evacuates air from one or more first air holes and makes the remaining first air holes present a negative pressure through the air duct, so as to adsorb the wafer. At the same time, it is connected to the conductive shell through the conductive accessories, the conductive coating of the mounting sink, the conductive holes, and the conductive coating of the conductive groove to realize circuit connectivity, thereby dissipating static electricity and effectively avoiding the generation of static electricity during the wafer transportation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The utility model is a three-dimensional structural diagram of the anti-static ceramic arm.

[0019] Figure 2 for Figure 1 Enlarged view of point A in the middle.

[0020] Figure 3 It is another three-dimensional structural schematic diagram of the utility model.

[0021] Figure 4 It is a rear view structural schematic diagram of the utility model.

[0022] The numbers in the figure represent: 1. arm body; 11. first air hole; 12. wafer placement part; 13. mounting part; 131. positioning hole; 2. air groove; 3. conductive groove; 4. conductive shell; 5. mounting sink; 51. conductive hole; 52. conductive accessories; 521. second air hole. DETAILED DESCRIPTION

[0023] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0026] In the present invention, unless otherwise clearly specified and limited, the terms "assemble", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Figures 1 to 4 An embodiment of the utility model is shown. The anti-static ceramic arm of this embodiment includes an arm body 1. A stepped groove is opened on one side of the arm body 1 along the length direction. The stepped groove with a smaller inner diameter is an air groove 2, and the stepped groove with a larger inner diameter is a conductive groove 3. A plurality of first air holes 11 are arranged in the air groove 2. The side wall of the conductive groove 3 is connected to a conductive shell 4 to form an air passage between the first air hole 11 and the stepped groove. A plurality of mounting sinkers 5 are arranged on the other side of the arm body 1. Each mounting sinker 5 is provided with a conductive hole 51 and a conductive accessory 52. ​​The conductive hole 51 is connected to the conductive groove 3. The mounting sinker 5, the conductive hole 51 and the inner wall of the conductive groove 3 are all provided with a conductive coating.

[0028] The anti-static ceramic arm evacuates one or more first air holes 11 and makes the remaining first air holes 11 present a negative pressure through the air duct, so as to adsorb the wafer. At the same time, it is connected to the conductive shell 4 through the conductive accessories 52, the conductive coating of the mounting sink 5, the conductive holes 51, and the conductive coating of the conductive groove 3 to achieve circuit connectivity, thereby dissipating static electricity and effectively avoiding the generation of static electricity during wafer transportation.

[0029] In this embodiment, the mounting platform 5 is coaxially arranged with the first air hole 11 and communicated with the first air hole 11, and the conductive fitting 52 is provided with a second air hole 521 communicated with the first air hole 11. The structure is more compact and convenient for adsorption of wafers.

[0030] In this embodiment, the conductive housing 4 and the side wall of the conductive slot 3, and the conductive fitting 52 and the mounting sink 5 are all connected by bonding, which reduces stress concentration and has high bonding strength.

[0031] In this embodiment, the bonding method uses epoxy resin or sealing glass as an adhesive, which has strong bonding strength, good chemical resistance and stability.

[0032] In this embodiment, the conductive coating is a silver powder layer or a resin layer or a silver powder glass composite material layer, which has good conductivity and strong corrosion resistance.

[0033] In this embodiment, the conductive shell 4 is a stainless steel shell or an alumina ceramic shell or a silicon carbide ceramic shell, which has strong corrosion resistance.

[0034] In this embodiment, the conductive accessory 52 is a polyetherketone resin part or a silicon carbide part. It has good conductivity, high temperature resistance, and strong corrosion resistance. Preferably, in this embodiment, the resistivity of the conductive accessory 52 is 10 6 -10 8 Ω·cm.

[0035] In this embodiment, the arm body 1 includes a U-shaped wafer placement portion 12 and a mounting portion 13 disposed at the bottom of the U-shaped wafer placement portion 12, the stepped groove is disposed along the circumferential direction of the U-shaped wafer placement portion 12 and the length direction of the mounting portion 13, and a plurality of first air holes 11 are arranged at intervals along the circumferential direction of the U-shaped wafer placement portion 12 and the length direction of the mounting portion 13. The U-shaped wafer placement portion 12 is used to place wafers, and the mounting portion 13 is connected to an external conveying structure to realize wafer conveying.

[0036] In this embodiment, a positioning hole 131 for connecting with the outside is provided on the mounting portion 13, so as to facilitate the mounting of the ceramic arm on the external conveying structure to realize wafer conveying.

[0037] Although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention. Any technician familiar with the art can use the above disclosed technical content to make many possible changes and modifications to the technical solution of the present invention without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment with equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention should fall within the scope of protection of the technical solution of the present invention.

Claims

1. An anti-static ceramic arm, characterized in that: The invention comprises an arm body (1), wherein one side of the arm body (1) is provided with a stepped groove along the length direction, wherein the stepped groove with a smaller inner diameter is an air groove (2), and the stepped groove with a larger inner diameter is a conductive groove (3), wherein a plurality of first air holes (11) are provided in the air groove (2), and a conductive shell (4) is connected to the side wall of the conductive groove (3) so that an air passage is formed between the first air holes (11) and the stepped groove, and a plurality of mounting sinkers (5) are provided on the other side of the arm body (1), wherein each mounting sinker (5) is provided with a conductive hole (51) and a conductive accessory (52), wherein the conductive hole (51) is connected to the conductive groove (3), and the mounting sinker (5), the conductive hole (51) and the inner wall of the conductive groove (3) are all provided with a conductive coating.

2. The antistatic ceramic arm according to claim 1, characterized in that: The mounting sink (5) is coaxially arranged with the first air hole (11) and is in communication with the first air hole (11); the conductive accessory (52) is provided with a second air hole (521) in communication with the first air hole (11).

3. The antistatic ceramic arm according to claim 2, characterized in that: The conductive housing (4) and the side wall of the conductive slot (3), and the conductive fitting (52) and the mounting sink (5) are all connected by bonding.

4. The antistatic ceramic arm according to claim 3, characterized in that: The bonding method uses epoxy resin or sealing glass as an adhesive.

5. The antistatic ceramic arm according to claim 1, characterized in that: The conductive coating is a silver powder layer, a resin layer, or a silver powder glass composite material layer.

6. The antistatic ceramic arm according to claim 1, characterized in that: The conductive shell (4) is a stainless steel shell or an alumina ceramic shell or a silicon carbide ceramic shell.

7. The antistatic ceramic arm according to claim 1, characterized in that: The conductive accessory (52) is a polyetherketone resin part or a silicon carbide part.

8. The antistatic ceramic arm according to claim 1, characterized in that: The resistivity of the conductive accessory (52) is 10 6 -10 8 Ω·cm.

9. The antistatic ceramic arm according to any one of claims 1 to 8, characterized in that: The arm body (1) comprises a U-shaped wafer placement portion (12) and a mounting portion (13) arranged at the bottom of the U-shaped wafer placement portion (12); the stepped groove is arranged along the circumferential direction of the U-shaped wafer placement portion (12) and the length direction of the mounting portion (13); and a plurality of the first air holes (11) are arranged at intervals along the circumferential direction of the U-shaped wafer placement portion (12) and the length direction of the mounting portion (13).

10. The antistatic ceramic arm according to claim 9, characterized in that: The mounting portion (13) is provided with a positioning hole (131) for connecting to the outside.

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