Radiator and power equipment

Abstract

The embodiment of the utility model provides a radiator and power equipment. The power equipment comprises a power module, the power module comprises a heating device, a metal heat dissipation substrate and a packaging body, the heating device is arranged on the surface of the metal heat dissipation substrate, and the packaging body packages the heating device. The radiator is used for radiating heat for the heating device, specifically, when the radiator is arranged, the radiator comprises a radiator body and an insulation structure arranged on the surface of the radiator body, the insulation structure covers part of the surface of the radiator body, and the insulation structure is used for being in heat conduction connection with the metal radiating substrate. The surface of the radiator body is provided with the insulation structure, so that the radiator has a self-insulation function, a ceramic substrate in the power module can be omitted when the power module is arranged, the problem that the insulation and voltage resistance of the power module fails due to the fact that the ceramic substrate cracks in the packaging process is solved, and the service life of the power module is prolonged. And the production yield and the reliability of the power module are improved.

Description

Technical Field

[0001] The present application relates to the field of power electronics technology, and in particular to a heat sink and a power device. Background Art

[0002] In scenarios with energy storage systems, such as power systems, data centers, or new energy vehicles, power devices are usually used to convert the current or voltage of the energy storage system to match the power of the energy storage system with that of the external power supply device or power-consuming device. As the power of power devices increases, the heat generated by the internal power modules also increases. If the heat cannot be dissipated in time, the power modules are easily damaged due to overheating. Therefore, good heat dissipation performance is an important feature to ensure the reliable operation of high-power modules.

[0003] Considering the high heat dissipation and insulation requirements of the power module, the power module usually uses a metal-coated ceramic substrate as a carrier of the electrical device, and then uses a heat sink arranged outside the ceramic substrate to dissipate heat for the electrical device. The ceramic substrate acts as an insulator between the electrical device and the heat sink, and can conduct heat. However, in the packaging process of the power module, the ceramic substrate inevitably undergoes processes such as chip loading, sintering, reflow, wire binding, and plastic sealing. In the above process, the ceramic substrate needs to repeatedly experience large temperature changes, and the temperature change easily causes the ceramic substrate to warp. After the ceramic substrate warps, in the subsequent process, under the action of the tooling fixture or mold, the warped end of the ceramic substrate will be subjected to pressure. Due to the low tensile strength, poor plasticity and toughness of the ceramic material, the warped ceramic substrate is prone to cracking after being compressed, resulting in the failure of the insulation withstand voltage performance of the power module. Utility Model Content

[0004] The present application provides a heat sink and a power device, which dissipates heat for a heating device in a power module by providing a self-insulating heat sink and makes it possible to eliminate a ceramic substrate in the power module, thereby improving the production yield and reliability of the power module.

[0005] In the first aspect, the present application provides a heat sink for dissipating heat for a heating device in a power module. The power module also includes a metal heat dissipation substrate and a package. The heating device is arranged on the surface of the metal heat dissipation substrate, and the package encapsulates the heating device. The package protects the heating device and insulates the heating device from some external devices. At least part of the metal heat dissipation substrate is exposed from the package, and the metal heat dissipation substrate can conduct the heat generated by the heating device to the heat sink. The heat sink includes a heat sink body and an insulating structure arranged on the surface of the heat sink body. The heat sink can be a device with a heat dissipation function made of a metal material. The good thermal conductivity of the metal material can improve the heat dissipation capacity of the heat sink. The insulating structure covers part of the surface of the heat sink body, and the insulating structure is used for thermal connection with the above-mentioned metal heat dissipation substrate. With respect to the insulating structure, the insulating structure has insulating properties. The insulating structure avoids the electrical connection between the heating device and the heat sink body by isolating the heating device and the heat sink body, so that the heating device and the heat sink body are insulated. In addition, the insulating structure can play a role in heat transfer between the heating device and the heat sink body. During the operation of the power device, the heat generated by the heat generating device can be transferred to the insulating structure through the metal heat dissipation substrate, and the insulating structure then transfers the heat to the radiator body. The radiator body exchanges heat with the low-temperature cooling medium, thereby achieving the purpose of heat dissipation for the heat generating device and preventing the power module from working in a high-temperature environment. In view of the above characteristics of the insulating structure, when preparing the insulating structure, a material with good insulation and thermal conductivity can be selected for preparation. For example, one or more of ceramics, diamonds and high molecular polymers can be selected to prepare the insulating structure.

[0006] In the radiator provided by the present application, the surface of the radiator body has an insulating structure, and the insulating structure can form an insulating barrier on the surface of the radiator body to prevent the radiator body and the heating device from being electrically connected. Therefore, when designing the power module, there is no need to set a ceramic substrate to insulate the heating device from the radiator. The power module can use a metal heat dissipation substrate as a carrier of the heating device, and the metal heat dissipation substrate can play the role of support, heat conduction and electrical connection. By making the metal heat dissipation substrate and the insulating structure thermally connected, the heat generated by the heating device can be conducted to the radiator body. After the ceramic substrate is cancelled, since the ceramic substrate is no longer involved in the packaging process of the power module, the problem of cracking of the ceramic substrate in the packaging process causing the insulation withstand voltage performance of the power module to fail can be avoided, thereby improving the production yield and reliability of the power module. In addition, after the ceramic substrate is cancelled, the structure of the power module is simplified, which provides the possibility for the design of more high-performance structures.

[0007] When the insulating structure is specifically set, multiple optional technical solutions are included. In one optional technical solution, the insulating structure includes an insulating layer, and the insulating layer is used to be thermally connected to the metal heat dissipation substrate. The insulating layer can be a ceramic layer, a diamond layer, or a polymer coating. In the power device, the heat sink body, the insulating layer, and the metal heat dissipation substrate are stacked in sequence along the first direction.

[0008] In another optional technical solution, in addition to the insulating layer, the insulating structure also includes a metal layer. The insulating layer and the metal layer are stacked, and the metal layer is located on the side of the insulating layer away from the radiator body. The metal layer is used for thermal connection with the metal heat dissipation substrate. In the power device, the radiator body, the insulating layer, the metal layer and the metal heat dissipation substrate are stacked in sequence along the first direction. When the above-mentioned metal layer and the metal heat dissipation substrate are specifically connected, the metal layer and the metal heat dissipation substrate can be directly connected by welding or sintering, thereby avoiding the use of thermal conductive adhesive, reducing the thermal resistance between the connection interfaces, and improving the heat transfer efficiency between the connection interfaces.

[0009] In the above technical solution, the number of metal heat dissipation substrates can be multiple, and the multiple metal heat dissipation substrates are arranged at intervals, and one or more heating devices can be arranged on the surface of each metal heat dissipation substrate. The metal layer includes multiple metal connecting plates, and the multiple metal connecting plates are also arranged at intervals. In the specific setting, the metal heat dissipation plate can be connected to the metal heat dissipation substrate in a one-to-one correspondence. When the power module and the radiator are assembled, the projection of the metal heat dissipation substrate along the first direction and the projection of the corresponding metal connecting plate along the first direction at least partially overlap. Optionally, the projection of the metal heat dissipation substrate along the first direction can be completely located within the projection of the corresponding metal connecting plate along the first direction, so that the metal heat dissipation substrate and the metal connecting plate have a larger contact area, and the metal heat dissipation substrate can be prevented from contacting other metal connecting plates.

[0010] In order to improve the strength of the insulating structure, a coating may be provided on the periphery of the insulating structure, and the coating covers the peripheral surface of the insulating structure. The coating may protect the insulating structure on all sides to prevent the edges of the insulating structure from being bumped or worn. Alternatively, a coating may be provided in a local area of ​​the insulating structure that is susceptible to bumping or wearing, so that the coating provides intensive protection for the above-mentioned area. For example, taking the insulating structure as a rectangle as an example, a coating may be provided at the end corners of the insulating structure to protect the end corners of the insulating structure and prevent the end corners from being bumped or worn. When preparing the coating, an organic material or composite material with protective and insulating effects such as a resin may be selected, and may be applied to the area of ​​the insulating structure that needs to be protected to form a coating.

[0011] In an optional technical solution, the insulating structure includes a first surface, the first surface is arranged toward the power module, and the first surface is connected to the above-mentioned peripheral side surface. In addition to covering the peripheral side surface of the insulating structure, the covering portion can also cover the edge area of ​​the peripheral side of the first surface, so that the connection position between the first surface and the peripheral side surface can be covered by the covering portion, avoiding the connection position from being bumped or worn, and improving the strength of the insulating structure.

[0012] When the above technical solution is specifically implemented, the covering portion may include a first portion, and the first portion covers the edge area of ​​the periphery of the first surface. The first portion is an annular structure, and the first portion and the first surface form a receiving cavity. The receiving cavity can accommodate the protrusion of the metal heat dissipation substrate protruding from the surface of the package body. By locating the protrusion in the receiving cavity, the protrusion can be thermally connected to the first surface, so that the heat generated by the heating device can be transferred to the insulating structure.

[0013] In a second aspect, the present application further provides a power device, which includes a power module and the heat sink described in the first aspect. The power module includes a heating device, a metal heat dissipation substrate and a package body, wherein the heating device is arranged on the surface of the metal heat dissipation substrate, and the metal heat dissipation substrate and the insulating structure on the surface of the heat sink are thermally connected. The package body encapsulates the heating device and isolates the heating device from the external environment, thereby protecting the heating device.

[0014] In the above-mentioned power device, the surface of the radiator body has an insulating structure, and the insulating structure can form an insulating barrier on the surface of the radiator body to prevent the radiator body and the heating device from being electrically connected, so that the radiator has a self-insulating function. In view of the self-insulating function of the radiator, the ceramic substrate can be eliminated in the power module, and a metal heat dissipation substrate can be used as a carrier of the heating device. After the ceramic substrate is eliminated, the problem of the ceramic substrate being prone to cracks in the packaging process of the power module is avoided, and the production yield and reliability of the power module are improved. In addition, after the ceramic substrate is eliminated, the structure of the power module is simplified, which provides the possibility for the design of more high-performance structures.

[0015] When the power module is specifically set, the power module includes a variety of structures that can connect the metal heat dissipation substrate and the insulating structure, so that the heat generated by the heating device can be sequentially conducted to the radiator body through the metal heat dissipation substrate and the insulating structure. In an optional technical solution, the metal heat dissipation substrate is located in the package body, and the surface of the package body has a hollow structure, and at least part of the metal heat dissipation substrate is exposed through the hollow structure. From the outside, the exposed part of the metal heat dissipation substrate can be flush with the outer surface of the package body, or it can be recessed in the hollow structure. The metal heat dissipation substrate can be thermally connected to the insulating structure through the hollow structure. In another optional technical solution, the metal heat dissipation substrate has a protrusion, which is exposed from the package body and is thus located outside the package body. The protrusion can be thermally connected to the insulating structure, thereby playing a role in heat transfer. With the surface of the package body as a reference, the protrusion has a certain thickness in the direction away from the above surface, that is, the protrusion has a certain volume and has a large heat dissipation area. In addition, since the protrusion protrudes from the outer surface of the package body, the protrusion is more convenient for thermal connection with the insulating structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of a power device provided in an embodiment of the present application;

[0017] Figure 2 A schematic diagram of the structure of a power module provided in an embodiment of the present application;

[0018] Figure 3 A schematic diagram of the structure of a power module provided in an embodiment of the present application;

[0019] Figure 4 A schematic diagram of the structure of another power device provided in an embodiment of the present application;

[0020] Figure 5 A schematic diagram of the structure of another power device provided in an embodiment of the present application;

[0021] Figure 6 A schematic diagram of the structure of another power device provided in an embodiment of the present application;

[0022] Figure 7 A schematic diagram of the structure of another power device provided in an embodiment of the present application;

[0023] Figure 8 A schematic diagram of the structure of a heat sink provided in an embodiment of the present application.

[0024] Reference numerals:

[0025] 10-power module; 11-heating device; 12-metal heat dissipation substrate; 121-thermal connection area; 122-protrusion; 13-package; 131-hollow structure; 20-heat sink; 21-heat sink body; 22-insulating structure; 220-first surface; 221-insulating layer; 222-metal layer; 2221-metal connecting piece; 30-coating; 31-first part; 40-accommodating cavity. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. However, the example implementation can be implemented in various forms and should not be construed as being limited to the implementations set forth herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all illustrated by taking the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0027] It should be noted that specific details are described in the following description to facilitate understanding of the present application. However, the embodiments of the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the embodiments of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.

[0028] Power devices are widely used in photovoltaic systems, energy storage systems, or powertrain systems of new energy vehicles to convert current or voltage in the application system. For example, power devices may include inverters and micro inverters in photovoltaic systems, or converters in energy storage systems, or motor controllers, range extender engine controllers, and on-board chargers in powertrains of new energy vehicles.

[0029] The power module is the core component of the power device to realize the power conversion function. The power module can include various electrical devices such as chips, inductors, capacitors, etc. These electrical devices are connected according to a certain functional combination and then packaged as a whole through a packaging process. In order to prevent the electrical device from working in a high temperature environment, the heat sink can be used to dissipate heat for the electrical device. The heat sink is usually a metal structure. Considering the insulation requirements of the electrical device, in one prior art, a metal-coated ceramic substrate can be used as a carrier of the electrical device, and then a heat sink arranged outside the ceramic substrate can be used to dissipate heat for the electrical device. The ceramic substrate plays an insulating role between the electrical device and the heat sink, and can conduct heat. However, in the packaging process of the power module, the ceramic substrate inevitably undergoes processes such as chip loading, sintering, reflow soldering, wire binding, and plastic sealing. In the above process, the ceramic substrate will repeatedly experience large temperature changes. The ceramic substrate includes a ceramic substrate and a metal layer arranged on the surface of the ceramic substrate. The temperature change easily causes the metal layer on the surface of the ceramic substrate to deform, and then causes the ceramic substrate to deform. From the appearance, under the influence of temperature, the entire ceramic substrate will warp. After the ceramic substrate is warped, the warped end of the ceramic substrate will be subjected to pressure under the action of the jig or mold in the subsequent process. Since the ceramic material has low tensile strength, poor plasticity and toughness, the above ceramic substrate is prone to cracking after being compressed, resulting in the failure of the insulation withstand voltage performance of the power module.

[0030] In view of this, the embodiment of the present application provides a heat sink and a power device, which dissipates heat for the heating device in the power module by setting a self-insulating heat sink, and makes it possible to eliminate the ceramic substrate in the power module, thereby improving the production yield and reliability of the power module. The heat sink and the power device provided in the embodiment of the present application are described in detail below in conjunction with the accompanying drawings.

[0031] Figure 1 This is a schematic diagram of the structure of a power device provided in an embodiment of the present application. Figure 1As shown, in one embodiment, the power device includes a power module 10, and the power module 10 includes a heating device 11, a metal heat dissipation substrate 12 and a package 13. The heating device 11 is arranged on the surface of the metal heat dissipation substrate 12, and the heat generated by the heating device 11 can be conducted to the metal heat dissipation substrate 12 and dissipated to the outside through the metal heat dissipation substrate 12. The package 13 encapsulates the heating device 11, and the package 13 is a protective shell formed on the outside of the electrical device such as the heating device 11 by a packaging process during the packaging process of the power module 10. Common packaging processes include plastic shell packaging (housing packaging) and molding packaging (molding packaging), wherein the housing packaging is a packaging method that uses a plastic shell and a carrier substrate carrying various electrical devices to form a receiving cavity, and injects silicone gel into the cavity to protect the electrical device. The molding packaging is a packaging method that places the carrier substrate carrying various electrical devices into a special injection mold, uses a softened epoxy resin or other plastic packaging material as a packaging material, and encapsulates and wraps the electrical device under certain pressure and temperature conditions to achieve protection of the electrical device. The package body 13 may be formed by housing packaging or molding packaging.

[0032] Please continue to refer to Figure 1 In addition to the power module 10, the power device also includes a radiator 20, which is used to dissipate heat for the heating device 11. When the radiator 20 is specifically set, the radiator 20 includes a radiator body 21 and an insulating structure 22 arranged on the surface of the radiator body 21. The insulating structure 22 is used to be thermally connected to the metal heat dissipation substrate 12 in the power module 10. The insulating structure 22 can play an insulating role between the metal heat dissipation substrate 12 and the radiator body 21, and can conduct heat. The heat generated by the heating device 11 is sequentially conducted to the radiator body 21 through the metal heat dissipation substrate 12 and the insulating structure 22. The radiator body 21 can transfer the heat of the heating device 11 to the cooling medium by heat exchange with the low-temperature cooling medium, thereby achieving the effect of heat dissipation for the heating device 11. When specifically set, the insulating structure 22 can cover part of the surface of the radiator body 21, so that the area of ​​the radiator body 21 not covered by the insulating structure 22 and the external cooling medium have a higher heat exchange efficiency.

[0033] As for the radiator body 21, the radiator body 21 can be a device with a heat dissipation function made of metal materials. The good thermal conductivity of metal materials can improve the heat dissipation capacity of the radiator 20. Optionally, the radiator body 21 can be made of metal materials such as copper or aluminum. When the radiator body 21 is specifically set, the radiator body 21 includes a variety of possible structures. In one embodiment, Figure 1As shown, the radiator body 21 includes a heat dissipation substrate 21, and a plurality of heat dissipation fins 22 are arranged on a side of the heat dissipation substrate 21 away from the power module 10, and the plurality of heat dissipation fins 22 are arranged at intervals. The heat dissipation fins 22 can increase the surface area of ​​the radiator body 21, thereby improving the heat exchange efficiency between the radiator body 21 and the cooling medium. In other embodiments, the radiator body may also include a cold plate, the cold plate having a flow channel, and a low-temperature cooling medium can flow through the flow channel, and the cooling medium and the heating device realize heat exchange through the cold plate.

[0034] As for the insulating structure 22, the insulating structure 22 has insulating properties. The insulating structure 22 avoids the electrical connection between the heating device 11 and the radiator body 21 by isolating the heating device 11 and the radiator body 21, so that the heating device 11 and the radiator body 21 are insulated. In addition, the insulating structure 22 can play a role in heat transfer between the heating device 11 and the radiator body 21. During the operation of the power device 10, the heat generated by the heating device 11 can be transferred to the insulating structure 22, and the insulating structure 22 then transfers the heat to the radiator body 21. The radiator body 21 exchanges heat with a low-temperature cooling medium, thereby achieving the purpose of heat dissipation for the heating device 11 to ensure the normal operation of the power module 10. The better the thermal conductivity of the insulating structure 22, the higher the heat transfer efficiency between the heating device 11 and the radiator body 21, and the better the heat dissipation effect of the heating device 11. In view of the above characteristics of the insulating structure 22, when preparing the insulating structure 22, a material with good insulation and thermal conductivity can be selected for preparation, so that while ensuring the insulation between the heating device 11 and the radiator body 21, the heat transfer efficiency between the heating device 11 and the radiator body 21 can be high. For example, one or more of ceramics, diamonds and high molecular polymers can be selected to prepare the above insulating structure 22.

[0035] The insulating structure 22 is disposed on the surface of the radiator body 21, and the connection method between the insulating structure 22 and the radiator body 21 includes a variety of options. For example, the insulating structure 22 and the radiator body 21 can be bonded by a thermally conductive adhesive. For another example, in order to reduce the thermal resistance between the insulating structure 22 and the radiator body 21 and improve the heat transfer efficiency between the insulating structure 22 and the radiator body 21, the insulating structure 22 and the radiator body 21 can be combined together by welding or sintering; or, the radiator body 21 can be used as a substrate, and the insulating structure 22 can be formed on the surface of the radiator body 21 by spraying, spin coating, lamination or in-situ growth, so that the insulating structure 22 and the radiator body 21 are combined together.

[0036] In the embodiment provided by the present application, since the surface of the radiator body 21 has an insulating structure 22, the insulating structure 22 can form an insulating barrier on the surface of the radiator body 21 to prevent the radiator body 21 from being electrically connected to the heating device 11, so that the radiator 20 has a self-insulating function. In view of the self-insulating function of the radiator 20, when the power module 10 is set, the ceramic substrate can be eliminated in the power module 10, and the metal heat dissipation substrate 12 can be used as a carrier of the heating device 11. The metal heat dissipation substrate 12 can support, conduct heat and electrically connect the heating device 11. When the power module 10 and the radiator 20 are assembled, the metal heat dissipation substrate 12 and the insulating structure 22 can be connected by thermal conduction, so that the heat generated by the heating device 11 can be conducted to the radiator body 21. After the ceramic substrate is eliminated, since the ceramic substrate no longer participates in the packaging process of the power module 10, the problem of the ceramic substrate cracking in the packaging process causing the insulation withstand voltage performance of the power module 10 to fail can be avoided, thereby improving the production yield and reliability of the power module 10. In addition, after the ceramic substrate is removed, the structure of the power module 10 is simplified, which provides the possibility for the design of more high-performance structures.

[0037] When the power module 10 is specifically configured, the power module 10 includes a variety of structures that can thermally connect the metal heat dissipation substrate 12 and the insulating structure 22 , so that the heat generated by the heating device 11 can be sequentially transferred to the radiator body 21 through the metal heat dissipation substrate 12 and the insulating structure 22 . Figure 2 A schematic diagram of a power module structure provided in an embodiment of the present application is shown in FIG. Figure 2 As shown, in one embodiment, the metal heat dissipation substrate 12 is located in the package body 13, and the surface of the package body 13 has a hollow structure 131, at least part of the metal heat dissipation substrate 12 is exposed through the hollow structure 131, and the metal heat dissipation substrate 12 can be thermally connected to the insulating structure through the hollow structure 131. Specifically, the metal heat dissipation substrate 12 includes a thermally conductive connection area 121, and the thermally conductive connection area 121 and the hollow structure 131 are opposite. If the first direction Z represents the thickness direction of the metal heat dissipation substrate 12, the projection of the thermally conductive connection area 121 along the first direction Z is located within the projection of the hollow structure 131 along the first direction Z. The thermally conductive connection area 121 can be thermally connected to the insulating structure 22, so that the heat generated by the heating device 11 can be conducted to the insulating structure 22. In a specific embodiment, the above-mentioned thermally conductive connection area 121 and the surface of the package body 13 are located in the same plane, or in other words, the above-mentioned thermally conductive connection area 121 can be flush with the surface of the package body 13. In another specific embodiment, the thermally conductive connection area may not be in the same plane as the surface of the package body, and the thermally conductive connection area is recessed in the hollow structure.

[0038] Figure 3 This is a schematic diagram of the structure of another power module provided in an embodiment of the present application. Figure 3 As shown, in another embodiment, the metal heat dissipation substrate 12 has a protrusion 122, and the protrusion 122 protrudes from the surface of the package body 13, so as to be located outside the package body 13. Specifically, if the surface of the package body 13 is used as a reference, the protrusion 122 has a certain thickness in the direction away from the above surface, or in other words, the protrusion 122 has a certain volume. The protrusion 122 can be thermally connected to the insulating structure 22, so as to transfer heat to the insulating structure 22. In this embodiment, since the protrusion 122 protrudes from the outer surface of the package body 13, the protrusion 122 is more convenient to be thermally connected to the insulating structure 22. In addition, the protrusion 122 has more surfaces, so there can be a larger contact area between the protrusion 122 and the insulating structure 22. Specifically, the protrusion 122 includes a top surface and a side surface, wherein the top surface is arranged toward the insulating structure 22; the side surface is connected to the top surface and is arranged on the peripheral side of the top surface. When the protrusion 122 and the insulating structure 22 are specifically connected, the top surface and the side surface of the protrusion 122 can be thermally connected to the insulating structure 22, thereby increasing the contact area between the heating device 11 and the insulating structure 22 and improving the heat transfer efficiency.

[0039] There are many options for connecting the metal heat dissipation substrate 12 and the insulating structure 22. For example, the metal heat dissipation substrate 12 and the insulating structure 22 can be bonded together using a thermally conductive adhesive. For another example, the metal heat dissipation substrate 12 and the insulating structure 22 can also be combined together by hot pressing, welding or sintering. It is worth noting that the connection methods of hot pressing, welding and sintering can, on the one hand, make the metal heat dissipation substrate 12 and the insulating structure 22 have a certain bonding force, thereby ensuring the connection reliability between the metal heat dissipation substrate 12 and the insulating structure 22; on the other hand, it can avoid setting a thermally conductive adhesive between the metal heat dissipation substrate 12 and the insulating structure 22, and by making the metal heat dissipation substrate 12 and the insulating structure 22 directly contact, thereby reducing the thermal resistance between the metal heat dissipation substrate 12 and the insulating structure 22, and improving the heat transfer efficiency between the metal heat dissipation substrate 12 and the insulating structure 22. Of course, other methods can also be used to combine the metal heat dissipation substrate 12 and the insulating structure 22 without using thermally conductive adhesive, which are not listed one by one in this application.

[0040] In the heat sink provided in the present application, the insulating structure 22 includes a variety of possible structural forms. Figure 1In the power device shown, the insulating structure 22 includes an insulating layer 221, and the insulating layer 221 is thermally connected to the metal heat dissipation substrate 12. Specifically, the heat sink body 21, the insulating layer 221 and the metal heat dissipation substrate 12 are stacked in sequence along the first direction Z. In the production process of the power device, the insulating layer 221 and the heat sink body 21 can be directly contacted and connected, and the insulating layer 221 and the metal heat dissipation substrate 12 can also be directly contacted and connected, thereby avoiding the use of thermal conductive glue, reducing the thermal resistance between the connection interfaces, and improving the heat transfer efficiency between the connection interfaces.

[0041] Figure 4 A schematic diagram of the structure of another power device provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, the insulation structure 22 and Figure 1 Compared with the insulating structure 22 in the power device shown in the figure, the insulating structure 22 in the power device has another structural form. Specifically, the insulating structure 22 includes a metal layer 222 in addition to an insulating layer 221. The insulating layer 221 and the metal layer 222 are stacked in sequence along the first direction Z, and the metal layer 222 is located on the side of the insulating layer 221 away from the heat sink body 21. Figure 4 In the power device, the heat sink body 21, the insulating layer 221, the metal layer 222 and the metal heat dissipation substrate 12 are stacked in sequence along the first direction Z, and the metal layer 222 and the metal heat dissipation substrate 12 are thermally connected. When connecting the metal layer 222 and the metal heat dissipation substrate 12, the metal layer 222 and the metal heat dissipation substrate 12 can be combined together by welding or sintering, thereby avoiding the use of thermal conductive glue, reducing the thermal resistance between the metal layer 222 and the metal heat dissipation substrate 12, and improving the heat transfer efficiency between the metal layer 222 and the metal heat dissipation substrate 12. Specifically, the metal layer 222 and the metal heat dissipation substrate 12 can be the same metal, such as copper, to further reduce the thermal resistance between the connection interfaces and improve the heat transfer efficiency between the connection interfaces.

[0042] When the insulating layer 221 is specifically set, the insulating layer 221 includes a variety of options. Specifically, according to the different materials of the insulating layer 221, the insulating layer 221 can be divided into different types. In an optional embodiment, the insulating layer 221 can be an inorganic material layer. For example, the insulating layer 221 can be a ceramic layer or a diamond layer, wherein the ceramic layer can include one or more of aluminum oxide, aluminum nitride and silicon nitride. The above-mentioned insulating layer 221 can be combined with the radiator body 21 by welding, sintering or in-situ growth, so as to be directly in contact with and connected to the radiator body 21, and thus have a higher heat transfer efficiency with the radiator body 21.

[0043] In another optional embodiment, the insulating layer 221 can be a thinner layer of organic material, and the organic material used includes but is not limited to epoxy resin, polyimide, etc. When preparing the above-mentioned insulating layer 221, the radiator body 21 can be used as a substrate, and the above-mentioned material can be applied to the surface of the radiator body by spin coating or spraying, so as to form a layer of layered structure with insulating properties on the surface of the radiator body 21. Alternatively, a layer of layered structure with insulating properties can be formed on the surface of the radiator body 21 by in-situ growth or lamination. After preparation, the insulating layer 221 can be combined with the radiator body 21, so as to have a higher heat transfer efficiency with the radiator body 21.

[0044] In other optional embodiments, the insulating layer 221 may also be a composite material layer formed by organic materials and inorganic materials. The organic materials include but are not limited to epoxy resin or polyimide, and the inorganic materials include but are not limited to ceramics or diamond.

[0045] In the power device, the number of metal heat dissipation substrates 12 can be one or more, and one or more heating devices 11 can be set on the surface of each metal heat dissipation substrate 12. The number of metal heat dissipation substrates 12 is related to the application scenario, specifications, etc. of the power module 10, and can be set according to actual conditions. Figure 4 As shown, in this embodiment, the number of metal heat dissipation substrates 12 is multiple, and the multiple metal heat dissipation substrates 12 are arranged at intervals. Correspondingly, the metal layer 222 includes multiple metal connecting sheets 2221, which are also arranged at intervals, and the metal connecting sheets 2221 are used to be connected to the above-mentioned metal heat dissipation substrates 12 one by one. In a specific embodiment, the projection of the metal heat dissipation substrate 12 along the first direction Z and the projection of the corresponding metal connecting sheet 2221 in the first direction Z at least partially overlap. Optionally, the projection of the metal heat dissipation substrate 12 along the first direction Z can be completely located within the projection of the corresponding metal connecting sheet 2221 along the first direction Z, so that there is a large contact area between the metal heat dissipation substrate 12 and the metal connecting sheet 2221, and the metal heat dissipation substrate 12 can be prevented from contacting other metal connecting sheets 2221. In order to improve the insulation effect between two adjacent metal connecting sheets 2221, the gap between two adjacent metal connecting sheets 2221 is filled with an insulating material, and the insulating material can be an organic material or a composite material with an insulating effect such as a resin.

[0046] Figure 5 A schematic diagram of the structure of another power device provided in an embodiment of the present application is shown in FIG. Figure 5As shown, in one embodiment, a covering portion 30 is provided on the periphery of the insulating structure 22, and the covering portion 30 covers the peripheral side surface of the insulating structure 22. The above-mentioned covering portion 30 is an annular structure, and the covering portion 30 is provided around the insulating structure 22, covering the entire side surface of the insulating structure 22. The covering portion 30 can play a protective role around the insulating structure 22 to prevent the edge of the insulating structure 22 from being bumped or rubbed. In other embodiments, the covering portion 30 can also be provided in a local area of ​​the insulating structure 22 that is easily bumped or worn, so that the covering portion 30 focuses on protecting the above-mentioned area. For example, taking the insulating structure 22 as a rectangle as an example, the covering portion 30 can be provided at the four end corners of the insulating structure 22, so that the covering portion 30 covers the surface at the end corners; or, the covering portion 30 can also be provided on the opposite sides of the insulating structure 22, so that the covering portion 30 covers the side of the corresponding side. Of course, the covering portion 30 can also be provided in other areas of the insulating structure 22, and this application does not list them one by one.

[0047] Please continue to refer to Figure 5 In this embodiment, the insulating structure 22 includes an insulating layer 221, and the covering portion 30 covers the peripheral side surface of the insulating layer 221. Taking the insulating layer 221 as a ceramic layer as an example, since the material of the ceramic layer is relatively brittle, the edge of the ceramic layer is easily damaged. By making the covering portion 30 cover the peripheral side surface of the ceramic layer, the covering portion 30 can play a better protective role around the ceramic layer to prevent the edge of the ceramic layer from being bumped or rubbed.

[0048] Figure 6 A schematic diagram of the structure of another power device provided in an embodiment of the present application is shown in FIG. Figure 6 As shown, the power device and Figure 5 The power devices shown in the figure all include a covering portion 30, the difference being that the insulating structure 22 and Figure 5 The insulation structure 22 in the power device shown is different. Specifically, Figure 6 As shown, the insulating structure 22 in the power device includes an insulating layer 221 and a metal layer 222, and the projection of the metal layer 222 along the first direction Z is located within the projection of the insulating layer 221 along the first direction Z. When the covering portion 30 is specifically set, the covering portion 30 can cover the peripheral side surface of the insulating layer 221 and the peripheral side surface of the metal layer 222. In addition, the covering portion 30 can also cover the edge area of ​​the upper surface of the insulating layer 221 that is not covered by the metal layer 222. Among them, the upper surface of the insulating layer 221 refers to the side of the insulating layer 221 that is away from the radiator body 21. In other embodiments, the projection of the metal layer 222 along the first direction Z can also completely overlap with the projection of the insulating layer 221 along the first direction Z.

[0049] In the above embodiments, the material of the coating 30 can be an organic material or a composite material such as resin that has protective and insulating functions. When the coating 30 is specifically prepared, the insulating material can be coated on the side surface of the insulating structure 22 to form the coating 30. It is worth noting that Figure 6 In the illustrated embodiment, the covering portion 30 may be made of the same material as the insulating material between two adjacent metal connecting sheets 2221. In the process of preparing the above-mentioned covering portion 30, in addition to coating the insulating material on the side surface of the insulating structure 22 to form the covering portion 30, the insulating material may also be filled in the gap between two adjacent metal connecting sheets 2221, thereby enhancing the insulation effect between the two adjacent metal connecting sheets 2221. In other words, the covering portion 30 and the insulating material between two adjacent metal connecting sheets 2221 may be prepared in the same process step, thereby forming an integrated structure.

[0050] Continue to refer Figure 6 The insulating structure 22 further includes a first surface 220, which is the top surface of the insulating structure 22 facing the metal heat dissipation substrate 12, and the first surface 220 is connected to the peripheral side surface of the insulating structure 22. The covering portion 30 covers the peripheral side surface of the insulating structure 22 and is flush with the first surface 220.

[0051] Figure 7 This is a schematic diagram of the structure of another power device provided in an embodiment of the present application. Figure 7 As shown, the power device and Figure 6 The power devices shown all include a covering portion 30, the difference being that the covering portion 30 in the power device not only covers the peripheral surface of the insulating structure 22, but also covers the peripheral edge area of ​​the first surface 220, so that the connection position between the first surface 220 and the peripheral surface is covered by the covering portion 30, which prevents the connection position from being bumped or worn, and improves the strength of the insulating structure 22. Specifically, the covering portion 30 includes a first portion 31, the first portion 31 covers the above-mentioned edge area, and the first portion 31 and the first surface 220 form a receiving cavity 40. In the above-mentioned power device, the metal heat dissipation substrate 12 has a protrusion 122, and the protrusion 122 is exposed from the package body 13. The protrusion 122 is located in the above-mentioned receiving cavity 40 and is thermally connected to the first surface 220. In an optional embodiment, the protrusion 122 can be combined with the first surface 220 by welding, sintering or hot pressing to achieve direct contact, thereby reducing the thermal resistance between the metal heat dissipation substrate 12 and the insulating structure 22 and improving the heat transfer efficiency between the metal heat dissipation substrate 12 and the insulating structure 22.

[0052] Figure 8 A schematic diagram of the structure of a heat sink provided in an embodiment of the present application is shown in FIG. Figure 8As shown, the first part 31 is arranged along the circumferential direction on the first surface 220 and forms a ring structure. The first part 31 covers the edge area of ​​the first surface 220. The first part 31 has a certain thickness along the first direction Z, and the first part 31 and the first surface 220 surround a receiving cavity 40, which can accommodate the protrusion of the metal heat dissipation substrate. In the above embodiment, a part of the metal heat dissipation substrate is protruded from the surface of the package body to form a protrusion, so that the protrusion can extend into the receiving cavity 40, thereby being thermally connected with the first surface 220, so that the heat generated by the heating device can be conducted to the insulating structure 22, and then conducted to the radiator body 21 through the insulating structure 22. In an optional embodiment, the height of the protrusion along the first direction Z can be greater than or equal to the thickness of the first part 31 along the first direction Z. After the protrusion extends into the receiving cavity 40, it can contact the first surface 220, so that the heat generated by the heating device 11 can be transferred to the insulating structure 22. In another optional embodiment, the height of the protrusion along the first direction Z can also be less than the thickness of the first part 31 along the first direction Z. In the above embodiment, the first portion 31 may be deformed after being squeezed by the package body, so that the protrusion may contact the first surface 220 , thereby transferring the heat generated by the heating device 11 to the insulating structure 22 .

[0053] In the above embodiments, the preparation process of the insulating structure is independent of the packaging process of the power module, and the radiator body can be used as a substrate first, and the insulating structure can be formed on the surface of the radiator body, and then the insulating structure and the metal heat dissipation substrate can be thermally connected. Since the radiator body has a large structural strength, when the insulating structure is prepared on the surface of the radiator body, the radiator body can provide effective support for the insulating structure, and the surface of the formed insulating structure is relatively flat, so that the connection effect between the insulating structure and the metal heat dissipation substrate is better.

[0054] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A radiator, characterized in that: Used to dissipate heat for the heating device in the power module, the power module also includes a metal heat dissipation substrate and a packaging body, the heating device is arranged on the surface of the metal heat dissipation substrate, and the packaging body encapsulates the heating device; the radiator includes a radiator body and an insulating structure arranged on the surface of the radiator body, the insulating structure covers a part of the surface of the radiator body, and the insulating structure is used for thermal connection with the metal heat dissipation substrate.

2. The heat sink according to claim 1, characterized in that The insulating structure comprises an insulating layer, and the insulating layer is used for thermally conducting connection with the metal heat dissipation substrate.

3. The radiator according to claim 1 or 2, characterized in that: The insulating structure comprises an insulating layer and a metal layer, wherein the insulating layer and the metal layer are stacked and the metal layer is located on a side of the insulating layer away from the radiator body; the metal layer is used for thermally conductive connection with the metal heat dissipation substrate.

4. The heat sink according to claim 3, characterized in that There are multiple metal heat dissipation substrates, and the metal layer includes multiple metal connecting plates. The multiple metal connecting plates are arranged at intervals, and the metal connecting plates are used to be connected to the metal heat dissipation substrates in a one-to-one correspondence.

5. The radiator according to any one of claims 1 to 4, characterized in that: A covering portion is disposed on the outer periphery of the insulating structure, and the covering portion covers the peripheral side surface of the insulating structure.

6. The heat sink according to claim 5, characterized in that The insulating structure includes a first surface, the first surface is away from the heat sink body, and the first surface is connected to the peripheral surface; the covering portion also covers an edge area of ​​the first surface.

7. The radiator according to any one of claims 1 to 6, characterized in that: The insulating structure includes one or more of ceramic, diamond and high molecular polymer.

8. The heat sink according to any one of claims 1 to 7, characterized in that: The insulating structure is a coating applied on the surface of the radiator body.

9. The heat sink according to any one of claims 1 to 7, characterized in that: The insulating structure is arranged on the surface of the heat sink body by any one of welding, sintering, lamination or in-situ growth.

10. A power device, characterized in that: It comprises a power module and a heat sink as described in any one of claims 1 to 9; the power module comprises a heating device, a metal heat dissipation substrate and a packaging body; the heating device is arranged on the surface of the metal heat dissipation substrate, the metal heat dissipation substrate and the insulating structure are thermally connected, and the packaging body encapsulates the heating device.

11. The power device according to claim 10, characterized in that The metal heat dissipation substrate is located in the packaging body, and the packaging body has a hollow structure, and the metal heat dissipation substrate is thermally connected to the insulating structure through the hollow structure; or, the metal heat dissipation substrate has a protrusion, and the protrusion is located outside the packaging body, and the protrusion is thermally connected to the insulating structure.

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