Compact semiconductor pulse laser source

Abstract

The technical scheme of the utility model provides a compact semiconductor pulse laser source. The compact semiconductor pulse laser source comprises a mainboard, an optical connector, a semiconductor laser diode and an indicating lamp group. The semiconductor laser diode and the optical connector are coaxially arranged on one side of the main board, and a heat dissipation copper sheet is arranged at the joint of the semiconductor laser diode and the main board; and the indicating lamp group is arranged on the mainboard and is connected with a pin of the semiconductor laser diode through the sampling amplifier group. The device has the advantages of compact volume, light weight, simple layout and convenient application, and does not occupy precious space around a target integrated circuit; the wave band, the energy density and the pulse width of the laser pulse meet the laser fault injection requirements of the integrated circuit, and an attack effect can be generated on the target integrated circuit so as to perform security assessment; a visual indication signal is provided, and the state of pulse laser injection can be observed in real time.

Description

Technical Field

[0001] The utility model relates to the field of integrated circuits and information security, in particular to a compact semiconductor pulse laser source. Background Art

[0002] As a carrier of information, semiconductor integrated circuits play a vital role in ensuring the security of information systems. Therefore, it is often necessary to use a variety of technical methods to evaluate the security of integrated circuits, among which laser fault injection is one of the most important and common methods. In order to generate lasers of suitable wavelengths for laser fault injection, laser sources can use solid-state lasers, fiber lasers and other types of lasers. When these types of laser sources are used in integrated circuit laser fault injection scenarios, the following problems exist:

[0003] 1. The large size and weight of the laser source cause heat to easily accumulate. When the volume exceeds a certain level, a dedicated water cooling system is required to dissipate heat, which occupies valuable space around the target integrated circuit and complicates the layout of internal components of the product.

[0004] 2. Although the existing laser source has a simple device operation status indication signal, it fails to combine the laser fault injection scenario requirements of the integrated circuit, and cannot intuitively understand the status of the pulsed laser injection in the current circuit.

[0005] The above two reasons lead to significant limitations on the implementation conditions of the existing laser fault injection method. Therefore, it is necessary to provide a new laser source with a compact structure and easy heat dissipation for laser fault injection of integrated circuits. Utility Model Content

[0006] The utility model provides a novel laser source with a compact structure that is easy to dissipate heat, which solves the problem of high space and equipment requirements in the process of implementing the existing laser fault injection method due to the large volume and weight of the laser source in the existing laser fault injection operation.

[0007] In order to achieve the above-mentioned purpose, the technical solution of the utility model provides a compact semiconductor pulse laser source, which includes: a mainboard, an optical connector, a semiconductor laser diode, and an indicator light group. The semiconductor laser diode and the optical connector are coaxially arranged on one side of the mainboard, and a heat dissipation copper sheet is provided at the connection between the semiconductor laser diode and the mainboard; the indicator light group is arranged on the mainboard, and is connected to the pins of the semiconductor laser diode through the circuit of the sampling amplifier group.

[0008] As a preferred embodiment of the above technical solution, preferably, the indicator light group includes a plurality of laser pulse energy indicator lights and a plurality of preset energy level indicator lights.

[0009] As a preferred embodiment of the above technical solution, preferably, a laser pulse emission status indicator light is connected to the semiconductor laser diode via a sampling amplifier group.

[0010] As a preferred embodiment of the above technical solution, preferably, a group of MCX interfaces, each of which is arranged on the other side of the mainboard opposite to the semiconductor laser diode, and the MCX interface is connected to the semiconductor laser diode via a power amplifier group.

[0011] As a preferred embodiment of the above technical solution, preferably, the upper cover and the lower cover, when fastened together, can cover the mainboard and the semiconductor laser diode, and the optical connector, the indicator light group and the line connection port are exposed.

[0012] As a preferred embodiment of the above technical solution, preferably, there is a groove on the outer ring of the optical connector, and the groove is configured to be fixed to an external optical instrument.

[0013] As a preferred embodiment of the above technical solution, it preferably includes a current monitoring interface and a power indicator light.

[0014] The technical solution of the utility model provides a compact semiconductor pulse laser source, which includes: a mainboard, an optical connector, a semiconductor laser diode, and an indicator light group. The semiconductor laser diode and the optical connector are coaxially arranged on one side of the mainboard, and a heat dissipation copper sheet is arranged at the connection between the semiconductor laser diode and the mainboard; the indicator light group is arranged on the mainboard, and is connected to the pins of the semiconductor laser diode through the circuit on the mainboard.

[0015] The advantages of the utility model are:

[0016] 1. It is compact and light in weight, has a simple layout, is easy to use, does not occupy the precious space around the target integrated circuit, simplifies the implementation conditions of the existing laser fault injection, and provides a compact semiconductor pulse laser source that is more conducive to the implementation of laser fault injection operations.

[0017] 2. The wavelength, energy density and pulse width of the laser pulse meet the requirements of laser fault injection of integrated circuits, and can produce an attack effect on the target integrated circuit for security assessment.

[0018] 3. It has intuitive indication signals and can observe the state of pulse laser injection in real time. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a schematic diagram of the appearance structure of the compact semiconductor pulse laser source provided by the utility model.

[0021] Figure 2 The present invention is a schematic structural diagram of an optical connector in a compact semiconductor pulse laser source provided by the present invention.

[0022] Figure 3 for Figure 1 The schematic diagram of the appearance structure shown is a schematic diagram of the structure after the upper cover is opened. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0024] The structure of the compact semiconductor pulse laser source provided by the utility model is now described. It should be noted that the positions of the electronic components in this embodiment are only used for illustration and are not intended to limit the technical solution of the present application. Figure 1 and Figure 3 As shown, it includes: an indicator light group consisting of a laser pulse energy indicator light 201, a preset energy level indicator light 202, a lower cover 203, a power indicator light 204, a laser pulse emission status indicator light 205, an optical connector 206, an upper cover 207, a main board 301, an MCX interface 302, an MCX interface 303, a power interface 304, a semiconductor laser diode 305, and a current monitoring interface 306.

[0025] The semiconductor laser diode 305 and the optical connector 206 are coaxially arranged, and both are arranged at the first edge of the main board 301. A heat dissipation copper sheet is arranged at the connection between the semiconductor laser diode 305 and the main board 301, and its range is, for example, Figure 3 Shown by the dashed line.

[0026] The laser pulse energy indicator light 201 in the indicator light group is connected to the pin of the semiconductor laser diode 305 via the sampling amplifier group on the main board 301. The preset energy level indicator light 202 in the indicator light group is connected to the power amplifier group (not shown) to display the energy storage level in the power amplifier group monitored by the sampling amplifier group (not shown). The indicator light group, the power interface 304, the power indicator light 204, and the laser pulse emission status indicator light 205 are sequentially arranged adjacent to each other on the second edge of the main board 301.

[0027] The MCX interface 302 and the MCX interface 303 are disposed on the third edge of the mainboard 301 , and the current monitoring interface 306 is separately disposed on the fourth edge of the mainboard 301 .

[0028] The lower edge of the upper cover 207 matches the upper edge of the lower cover 203 in shape, and the electronic components can be covered when the two are buckled relative to each other, while the optical connector 206, indicator light group and line connection port are exposed for easy use.

[0029] like Figure 2 As shown, there is a groove on the outer ring of the optical connector 206, and the fixing bolt is fixed to the external optical instrument through the groove.

[0030] The present invention is now described in conjunction with specific usage scenarios. Figures 1 to 3 As shown:

[0031] Specifically, the power cable is plugged into the power interface 304, and the staff sets the preset energy level required by the laser source, and the preset energy level indicator 202 is lit. The preset energy level indicator 202 is used to display the preset laser energy level of the device provided by the utility model, and is composed of a row of 10 LEDs, and each LED is lit to represent a 10% increase in the energy of the laser pulse.

[0032] The MCX interface 302 is used to connect the terminal for the worker to input the energy control signal (EGY), and the MCX interface 303 is used to connect the terminal for the worker to input the electrical pulse signal (BP). During operation, the electrical pulse signal (BP) and the energy control signal (EGY) input by the worker through the MCX interface 303 and the MCX interface 302 generate a strong driving current through the power amplifier group, so that the semiconductor laser diode 305 operates to generate laser pulses.

[0033] The semiconductor laser diode 305 generates laser pulses suitable for integrated circuit laser fault injection according to the electrical pulse signal (BP) and energy control signal (EGY) input by the staff. The pulsed laser emitted by it is injected into the external optical connector 206 along the central axis of the optical connector 206. The copper sheet between the main board 301 and the semiconductor laser diode 305 accelerates the dissipation of the heat energy generated by the semiconductor laser diode 305 during operation. The semiconductor laser diode 305 can generate a waveband suitable for integrated circuit laser fault injection, such as infrared wavebands 1064nm, 808nm, blue light 455nm, etc.

[0034] When the semiconductor laser diode 305 is operating, the laser pulse energy indicator light 201 displays the energy of the laser pulse generated when this embodiment is implemented through the mainboard 301 circuit connected thereto. It is composed of a row of 10 LEDs, and each LED that is lit represents a 10% increase in the energy of the laser pulse. During normal operation, the laser pulse emission status indicator light 205 is lit.

[0035] During operation, the current generated by the semiconductor laser diode 305 is monitored by the current monitoring interface 306. The staff determines whether the operation is normal through the monitoring signal output by the current monitoring interface 306. Usually, during normal operation, the monitoring signal is proportional to the driving current of the semiconductor laser diode 305.

[0036] The lower cover 203 and the upper cover 207 together form the main body of the embodiment, which is compact and light. The power indicator light 204 is used to display the power supply status of the embodiment. The laser pulse emission status indicator 205 is used to display the emission status of the laser pulse, and the indicator light will light up each time the laser pulse is emitted. The structure of the optical connector 206 is as shown in FIG. Figure 2 As shown, its function is to connect this embodiment to the optical instrument (through the groove of the outer ring, locked with a top screw). The upper surface of the upper cover 207 has an opening, which can expose the power indicator light 204, the laser pulse emission status indicator light 205 and the indicator light group, so that the staff can observe it conveniently.

[0037] The upper cover 207 and the lower cover 203 may be provided with through holes for providing fixing screws to fix the mainboard 301. The sampling amplifier in the sampling amplifier group is preferably: AD8000; the power amplifier in the power amplifier group is preferably: THS6042.

[0038] The compact semiconductor pulse laser source provided by the utility model fully utilizes the characteristics of integrated circuit laser fault injection in the form of laser pulse injection rather than continuous wave laser injection, and fully reduces the volume and weight of the utility model. Specifically, because the laser is injected in the form of pulses, the average heat generation of the semiconductor laser diode 305 is very small, but it can still ensure that the instantaneous laser intensity during the pulse opening period is large enough to meet the laser fault injection requirements of the integrated circuit. This makes it possible for the semiconductor laser diode 305 to not require a bulky and heavy heat sink, and at the same time, a heat dissipation copper sheet is designed for the semiconductor laser diode 305 on the circuit board to ensure that the temperature of the semiconductor laser diode 305 will not rise when the laser pulses are dense, which makes the utility model compact and light. Furthermore, the copper sheet covers the circuit board (main board) and has the dual functions of both conducting electricity and dissipating heat.

[0039] The main board 301 includes a driving module and a monitoring circuit to facilitate the operation of the staff, and can also serve as a heat sink for the semiconductor laser diode 305.

[0040] In summary, the utility model has the advantages of compact size and light weight, and in the application scenario of laser fault injection of integrated circuits, the layout is simple and the application is convenient.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A compact semiconductor pulse laser source, characterized in that: It includes: Mainboard, optical connector, semiconductor laser diode, indicator light group, The semiconductor laser diode and the optical connector are coaxially arranged on one side of the mainboard, and a heat dissipation copper sheet is provided at the connection between the semiconductor laser diode and the mainboard; The indicator light group is arranged on the main board and is connected to the pins of the semiconductor laser diode via a sampling amplifier group.

2. The compact semiconductor pulse laser source according to claim 1, characterized in that: The indicator light group includes a plurality of laser pulse energy indicator lights and a plurality of preset energy level indicator lights.

3. The compact semiconductor pulse laser source according to claim 1, characterized in that: It includes a laser pulse emission status indicator light, which is connected to the semiconductor laser diode via the sampling amplifier group.

4. The compact semiconductor pulse laser source according to claim 1, characterized in that: It comprises a group of MCX interfaces, each of the MCXs is arranged on the other side of the mainboard opposite to the semiconductor laser diode, and the MCX interface is connected to the semiconductor laser diode via a power amplifier group.

5. The compact semiconductor pulse laser source according to claim 1, characterized in that: It comprises an upper cover and a lower cover, which can cover the mainboard and the semiconductor laser diode when they are buckled together, and the optical connector, the indicator light group and the line connection port are exposed.

6. The compact semiconductor pulse laser source according to claim 5, characterized in that: The outer ring of the optical connector is provided with a groove, and the groove is configured to be fixed with an external optical instrument.

7. The compact semiconductor pulse laser source according to claim 1, characterized in that: Includes current monitoring interface and power indicator light.

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