Capacitor and MOS module installation integrated support

Abstract

The utility model discloses an integrated support for installing a capacitor and an MOS module. The integrated support comprises a fixed support, a PCB, the capacitor and the MOS module. The bottom of the fixing support is connected with the PCB, the fixing support is provided with a first containing groove for containing the capacitor and a second containing groove for containing the MOS module, line banks are arranged at the two ends of the first containing groove, the capacitor is contained in the first containing groove, and the positive electrode and the negative electrode of the capacitor make contact with the line banks. The MOS module is contained in the second containing groove, and a PIN of the MOS module is welded to the PCB. The capacitor mounting structure has the advantages that the capacitor is mounted in the first accommodating groove, the MOS module is mounted in the second accommodating groove, then the fixing support is assembled on the PCB and welded, the capacitor and the MOS module are fixed through the fixing support firstly, then the fixing support and the PCB are positioned, the product precision requirement is met, and the mounting efficiency and the mounting precision of the capacitor and the MOS module are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of automobile controllers, in particular to an integrated bracket for mounting capacitors and MOS modules. Background Art

[0002] At present, the installation method of capacitors and MOS modules in most controllers is to install the capacitor on a bracket, then install the bracket for assembling the capacitor on the PCB board and weld it, and weld the MOS module on the PCB board through positioning fixtures, limit fixtures, etc. to ensure the welding height of the MOS module. In this method, since the MOS module is welded on the PCB board separately, the MOS module needs to be positioned separately, and the installation efficiency and installation accuracy are low. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide an integrated bracket for mounting a capacitor and a MOS module in view of the deficiencies in the prior art.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions.

[0005] A capacitor and MOS module mounting integrated bracket comprises a fixed bracket, a PCB board, a capacitor and a MOS module; the bottom of the fixed bracket is connected to the PCB board, the fixed bracket is provided with a first receiving groove for receiving the capacitor and a second receiving groove for receiving the MOS module, both ends of the first receiving groove are provided with wiring banks, the capacitor is received in the first receiving groove and the positive and negative electrodes of the capacitor are in contact with the wiring banks, the MOS module is received in the second receiving groove and the PIN pins of the MOS module are welded to the PCB board.

[0006] A preferred solution is that the fixing bracket is injection molded from a plastic material, the wiring bar is a copper bar, and the copper bar and the fixing bracket are fixed by injection molding.

[0007] A preferred solution is that a positioning column is provided at the bottom of the fixing bracket, and the PCB board is provided with a positioning hole corresponding to the positioning column, and the positioning column is connected to the positioning hole.

[0008] A preferred solution is to provide support feet at the bottom of the fixing bracket, and the support feet are fixedly connected to the PCB board.

[0009] A preferred solution is that a PIN pin guide hole is penetrated through the bottom of the second receiving groove, and the PIN pin of the MOS module passes through the PIN pin guide hole and is welded to the PCB board.

[0010] A preferred solution is that the wiring row is provided with a supporting groove, and the positive and negative electrodes of the capacitor are supported in the supporting groove.

[0011] A preferred solution is that arc-shaped clamping plates are provided on both sides of the first accommodating groove, the capacitor is located in the first accommodating groove, and the arc-shaped clamping plates are clamped on the surface of the capacitor.

[0012] A preferred solution is that a heat dissipation groove runs through the bottom of the first containing groove.

[0013] The integrated bracket for mounting capacitors and MOS modules provided by the embodiment of the utility model has at least the following beneficial effects: the capacitor is installed in the first accommodating groove, the MOS module is installed in the second accommodating groove, and then the fixed bracket is assembled on the PCB board and welded, the capacitor and the MOS module are first fixed by the fixed bracket, and then the fixed bracket is positioned with the PCB board, so as to meet the product precision requirements and improve the installation efficiency and installation precision of the capacitor and the MOS module.

[0014] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of the utility model;

[0016] Figure 2 This is a three-dimensional diagram of the utility model when the PCB board is removed;

[0017] Figure 3 It is a three-dimensional fixed bracket in the utility model. Figure 1 ;

[0018] Figure 4 It is a three-dimensional fixed bracket in the utility model. Figure 2 . DETAILED DESCRIPTION

[0019] In order to explain the idea and purpose of the present application, the present application will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", "left", "right", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0021] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] like Figures 1 to 4 As shown, an embodiment of the present application provides an integrated bracket for installing a capacitor and a MOS module, comprising a fixed bracket 10, a PCB board 20, a capacitor 30 and a MOS module 40; the bottom of the fixed bracket 10 is connected to the PCB board 20, the fixed bracket 10 is provided with a first receiving groove 11 for accommodating the capacitor 30 and a second receiving groove 12 for accommodating the MOS module 40, both ends of the first receiving groove 11 are provided with wiring banks 13, the capacitor 30 is accommodated in the first receiving groove 11 and the positive and negative electrodes of the capacitor 30 are in contact with the wiring bank 13, the MOS module 40 is accommodated in the second receiving groove 12 and the PIN needle 41 of the MOS module 40 is welded to the PCB board 20.

[0023] like Figures 1 to 4 As shown, the capacitor 30 is installed in the first receiving groove 11, the MOS module 40 is installed in the second receiving groove 12, and then the fixing bracket 10 is assembled on the PCB board 20 and welded. The capacitor 30 and the MOS module 40 are first fixed by the fixing bracket 10, and the fixing bracket 10 is then positioned with the PCB board 20, which meets the product precision requirements and improves the installation efficiency and installation precision of the capacitor 30 and the MOS module 40.

[0024] like Figures 1 to 4 As shown, the fixing bracket 10 is made of plastic material by injection molding, and the wiring bar 13 is a copper bar, which is fixed to the fixing bracket 10 by injection molding. The wiring bar 13 penetrates the fixing bracket 10 and is connected to the PCB board 20.

[0025] like Figures 1 to 4 As shown, the bottom of the fixing bracket 10 is provided with a positioning column 14, and the PCB board 20 is provided with a positioning hole corresponding to the positioning column 14, and the positioning column 14 is connected to the positioning hole. The positioning column 14 plays a positioning and fixing role, which facilitates the positioning and fixing of the fixing bracket 10 and the PCB board 20.

[0026] like Figures 1 to 4 As shown, a support foot 15 is provided at the bottom of the fixing bracket 10, and the support foot 15 is fixedly connected to the PCB board 20. The support foot 15 ensures the installation height between the capacitor 30 and the MOS module 40 and the PCB board 20. When the support foot 15 is fixedly assembled with the PCB board 20, the fixing bracket 10 is installed on the PCB board 201.

[0027] like Figures 1 to 4 As shown, the bottom of the second receiving groove 12 is penetrated by a PIN guide hole 16, and the PIN pin 41 of the MOS module 40 passes through the PIN guide hole 16 and is welded to the PCB board 20. The PIN guide hole 16 ensures the welding position of the PIN pin 41 of the MOS module 40 and the PCB board 20.

[0028] like Figures 1 to 4 As shown, the wiring row 13 is provided with a supporting groove 131 , and the positive and negative electrodes of the capacitor 30 are supported in the supporting groove 131 .

[0029] like Figures 1 to 4 As shown, arc-shaped clamping plates 17 are provided on both sides of the first receiving groove 11, the capacitor 30 is located in the first receiving groove 11, and the arc-shaped clamping plates 17 are clamped on the surface of the capacitor 30. The arc-shaped clamping plates 17 play a role in clamping the capacitor 30 to prevent the capacitor 30 from escaping from the first receiving groove 11.

[0030] like Figures 1 to 4 As shown, a heat dissipation groove 111 runs through the bottom of the first receiving groove 11. The heat dissipation groove 111 plays a certain role in heat dissipation.

[0031] like Figures 1 to 4 As shown, the wiring blocks 13 are disposed at both ends of the first receiving groove 11 . When the capacitor 30 is placed in the first receiving groove 11 , the positive and negative electrodes of the capacitor 30 are in contact with and connected to the wiring blocks 13 , respectively.

[0032] The above is a specific implementation of the present utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present utility model. These improvements and modifications are also considered to be within the protection scope of the present utility model.

Claims

1. A capacitor and MOS module mounting integrated bracket, characterized in that: It comprises a fixing bracket, a PCB board, a capacitor and a MOS module; the bottom of the fixing bracket is connected to the PCB board, the fixing bracket is provided with a first receiving groove for receiving the capacitor and a second receiving groove for receiving the MOS module, both ends of the first receiving groove are provided with wiring banks, the capacitor is received in the first receiving groove and the positive and negative electrodes of the capacitor are in contact with the wiring banks, the MOS module is received in the second receiving groove and the PIN pins of the MOS module are welded to the PCB board.

2. The integrated bracket for mounting capacitor and MOS module according to claim 1, characterized in that: The fixing bracket is injection-molded from a plastic material, the wiring bar is a copper bar, and the copper bar and the fixing bracket are fixed by injection molding.

3. The integrated bracket for mounting capacitor and MOS module according to claim 1, characterized in that: A positioning column is provided at the bottom of the fixing bracket, and a positioning hole corresponding to the positioning column is provided on the PCB board, and the positioning column is connected to the positioning hole.

4. The integrated bracket for mounting capacitor and MOS module according to claim 1, characterized in that: A supporting foot is provided at the bottom of the fixing bracket, and the supporting foot is fixedly connected to the PCB board.

5. The integrated bracket for mounting capacitor and MOS module according to claim 1, characterized in that: A PIN guide hole is formed through the bottom of the second receiving groove, and the PIN pins of the MOS module pass through the PIN guide hole and are welded to the PCB board.

6. The integrated bracket for mounting capacitor and MOS module according to claim 1, characterized in that: The wiring row is provided with a supporting groove, and the positive and negative electrodes of the capacitor are supported in the supporting groove.

7. The integrated support for mounting capacitor and MOS module according to claim 1, characterized in that: Arc-shaped clamping plates are arranged on both sides of the first accommodating groove, the capacitor is located in the first accommodating groove, and the arc-shaped clamping plates are clamped on the surface of the capacitor.

8. The integrated support for mounting capacitor and MOS module according to claim 1, characterized in that: A heat dissipation groove runs through the bottom of the first containing groove.

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