Electronic device

Abstract

The utility model relates to the technical field of servers, and provides an electronic device which comprises a shell, a main board and a chip assembly, the main board and the chip assembly are arranged in the shell, the main board is electrically connected with the chip assembly, the chip assembly is located between the main board and the shell, and a heat conduction piece is arranged between the chip assembly and the shell. The main board is connected with the shell through the floating component and is suitable for driving the chip assembly to float, so that the heat conduction piece is kept in contact with the chip assembly and the shell. According to the utility model, the mainboard is connected with the shell through the floating part, so that the mainboard drives the chip assembly to float, and the heat conduction part is respectively contacted with the chip assembly and the shell so as to compensate the clearance tolerance between the chip assembly and the shell; therefore, heat of the chip assembly can be conducted to the shell through the heat conduction piece for heat dissipation, and the situation that due to the fact that the gap between the chip assembly and the shell is too small, the compression amount of the heat conduction piece is too large, the stress effect is generated on the chip assembly, and the chip assembly is deformed or damaged can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of servers, in particular to an electronic device. Background Art

[0002] Security monitoring scenes are personalized and fragmented. Early servers equipped with cameras either did not have AI functions or the AI ​​algorithms were not sufficient to meet the application requirements of more security monitoring scenarios. Therefore, new smart servers need to be added to achieve intelligent upgrades. The more comprehensive the functions of the server, the more electronic components are packaged in the server shell, which gradually increases the number of printed circuit boards and the density, resulting in poor heat dissipation of the printed circuit boards.

[0003] In the related art, the heat dissipation of the chip assembly of this type of server is mainly carried out by transferring the heat of the chip assembly to the shell for heat dissipation through a heat conductive member. Since the gap tolerance between the chip assembly and the shell is difficult to control, if a heat conductive member with a smaller thickness is used between the chip assembly and the shell, the chip assembly and the shell cannot be overlapped, resulting in the heat of the chip assembly cannot be effectively transferred to the shell for heat dissipation; if a heat conductive member with a larger thickness is used between the chip assembly and the shell, although the structural tolerance between the chip assembly and the shell can be absorbed, the thickness of the thermal pad increases, and its heat dissipation effect will also become worse, affecting the heat dissipation effect of the whole machine; and if the gap is too small, the compression of the heat conductive member will be too large, which is easy to cause greater stress on the chip, or even damage it. Utility Model Content

[0004] The utility model provides an electronic device to solve the above defects in the prior art. It can not only conduct the heat of the chip component to the shell through the heat-conducting member for heat dissipation, but also avoid the stress on the chip component caused by excessive compression of the heat-conducting member due to the small gap between the chip component and the shell, thereby preventing the chip component from being deformed or damaged.

[0005] The utility model provides an electronic device, comprising a housing, and a mainboard and a chip assembly arranged in the housing, wherein the mainboard and the chip assembly are electrically connected, the chip assembly is located between the mainboard and the housing, and a heat conducting member is arranged between the chip assembly and the housing;

[0006] The mainboard is connected to the housing through a floating component and is suitable for driving the chip assembly to float so that the heat conducting member keeps in contact with the chip assembly and the housing respectively.

[0007] According to the electronic device provided by the utility model, the floating component includes:

[0008] A floating body, disposed on the shell;

[0009] An adjusting body, threadedly connected to the floating body, wherein at least one of the adjusting body and the floating body is provided with a limiting portion for providing a floating space for the main board;

[0010] The elastic member is sleeved on the outer side of the floating body or the adjusting body and is used to provide a pre-tightening effect for the main board.

[0011] According to the electronic device provided by the utility model, the adjusting body is provided with a first step to form the limiting portion, and the adjusting body is provided with a thread connected to the floating body thread at a position close to the end thereof;

[0012] When the adjusting body is threadedly connected to the floating body, the floating space is limited between the first step and the end surface of the floating body.

[0013] According to the electronic device provided by the utility model, a second step is provided on the floating body to form the limiting portion;

[0014] When the adjusting body is threadedly connected to the floating body, the floating space is limited between the first step and the second step.

[0015] According to the electronic device provided by the utility model, a mounting seat is provided on the floating body, the cross-sectional area of ​​the mounting seat is larger than the cross-sectional area of ​​the floating body, and the mounting seat is connected to the housing.

[0016] According to the electronic device provided by the utility model, the chip assembly includes a smart card and a chip, the chip is welded to the smart card, and the smart card is electrically connected to the mainboard.

[0017] According to the electronic device provided by the utility model, the chip assembly also includes a connector, and the smart card is electrically connected to the mainboard through the connector so that the distance between the chip and the mainboard is greater than the height of any component on the mainboard facing the chip side.

[0018] According to the electronic device provided by the utility model, the shell is a graphene shell.

[0019] According to the electronic device provided by the utility model, the shell includes a box body and a cover body that are detachably connected, the mainboard is connected to the cover body through a floating component, and is suitable for driving the chip component to float, so that the heat conductive part is kept in contact with the chip component and the cover body respectively.

[0020] According to the electronic device provided by the utility model, a plurality of heat dissipation ribs are arranged on the outer surface of the cover body.

[0021] The utility model provides an electronic device, in which a mainboard is connected to a shell through a floating component, so that the mainboard drives a chip component to float, and then a heat conducting member keeps contact with the chip component and the shell respectively, so as to compensate for the gap tolerance between the chip component and the shell.

[0022] When the gap between the chip assembly and the shell is too large, the mainboard moves toward the direction of the chip assembly under the action of the floating component, ensuring that the heat conductor can maintain contact with both the chip assembly and the shell, so that the heat of the chip assembly is transferred to the shell through the heat conductor for heat dissipation.

[0023] When the gap between the chip assembly and the shell is too small, the mainboard moves away from the chip assembly under the action of the floating component to increase the gap between the chip assembly and the shell, so as to avoid stress on the chip assembly due to excessive compression of the heat conductor due to the small gap between the chip assembly and the shell, resulting in deformation or damage of the chip assembly.

[0024] In addition, since the mainboard can float under the action of the floating component, and the mainboard can simultaneously drive the chip assembly to float to compensate for the gap tolerance between the chip assembly and the housing, there is no need to increase the thickness of the heat conductor to compensate for the gap tolerance between the chip assembly and the housing, and the thickness of the heat conductor between the chip assembly and the housing can be reduced, thereby reducing the thermal resistance of the heat conductor to improve the heat dissipation effect of the chip assembly. Avoid using a thicker heat conductor to balance the gap tolerance between the chip assembly and the housing, which will reduce the heat transfer efficiency between the chip assembly and the housing and affect the heat dissipation performance of the chip assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 It is a structural schematic diagram of an electronic device provided by an embodiment of the utility model;

[0027] Figure 2 is a top view of an electronic device provided by an embodiment of the utility model;

[0028] Figure 3 yes Figure 2 Sectional view along line AA;

[0029] Figure 4 yes Figure 3 Enlarged view of middle part B;

[0030] Figure 5 It is a structural schematic diagram of a floating component in an electronic device provided by an embodiment of the utility model;

[0031] Figure 6 It is a schematic diagram of the structural decomposition of a floating component in an electronic device provided by an embodiment of the utility model.

[0032] Reference numerals:

[0033] 100, housing; 110, box body; 111, interface; 120, cover body; 121, heat dissipation ribs;

[0034] 200, main board; 300, chip assembly; 310, smart card; 320, chip; 400, heat conductor; 500, floating component; 510, floating body; 511, second step; 512, mounting seat; 520, adjustment body; 521, first step; 530, elastic member; 600, connector. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0037] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0039] Figure 1 It is a structural schematic diagram of an electronic device provided by an embodiment of the utility model; Figure 2 is a top view of an electronic device provided by an embodiment of the utility model; Figure 3 yes Figure 2 Sectional view along line AA; Figure 4 yes Figure 3 Enlarged view of part B in the middle.

[0040] See also Figures 1 to 3 The embodiment of the utility model provides an electronic device, which includes a housing 100, and a mainboard 200 and a chip assembly 300 disposed in the housing 100, the mainboard 200 and the chip assembly 300 are electrically connected, the chip assembly 300 is located between the mainboard 200 and the housing 100, and a heat conducting member 400 is disposed between the chip assembly 300 and the housing 100. The mainboard 200 is connected to the housing 100 through a floating member 500, and is suitable for driving the chip assembly 300 to float, so that the heat conducting member 400 is kept in contact with the chip assembly 300 and the housing 100, respectively.

[0041] This is equivalent to the mainboard 200 being able to float relative to the shell 100 under the action of the floating component 500, and the chip assembly 300 being arranged on the mainboard 200, and the mainboard 200 being able to synchronously drive the chip assembly 300 to float, so as to compensate for the gap tolerance between the chip assembly 300 and the shell 100, so that the heat conducting member 400 maintains good contact with the chip assembly 300 and the shell 100 respectively, so as to improve the heat dissipation efficiency of the chip assembly 300.

[0042] It should be noted that the heat conducting member 400 includes a heat conducting pad, a heat conducting phase change material, a heat conducting graphite foam, etc. Any structure is acceptable as long as it has good heat conducting properties and can be deformed under extrusion.

[0043] It can be understood that the electronic device provided by the embodiment of the utility model connects the mainboard 200 to the shell 100 through the floating component 500, so that the mainboard 200 drives the chip assembly 300 to float, and then the heat conductor 400 maintains contact with the chip assembly 300 and the shell 100 respectively to compensate for the gap tolerance between the chip assembly 300 and the shell 100.

[0044] When the gap between the chip assembly 300 and the shell 100 is too large, the mainboard 200 moves toward the direction of the chip assembly 300 under the action of the floating component 500, ensuring that the heat conductive member 400 can maintain contact with both the chip assembly 300 and the shell 100, so that the heat of the chip assembly 300 is transferred to the shell 100 through the heat conductive member 400 for heat dissipation.

[0045] When the gap between the chip assembly 300 and the housing 100 is too small, the mainboard 200 moves away from the chip assembly 300 under the action of the floating component 500 to increase the gap between the chip assembly 300 and the housing 100, thereby avoiding the stress on the chip assembly 300 caused by excessive compression of the heat conducting member 400 due to the small gap between the chip assembly 300 and the housing 100, thereby causing deformation or damage to the chip assembly 300.

[0046] In addition, since the mainboard 200 can float under the action of the floating component 500, and the mainboard 200 can simultaneously drive the chip assembly 300 to float to compensate for the gap tolerance between the chip assembly 300 and the housing 100, there is no need to increase the thickness of the heat conductive member 400 to compensate for the gap tolerance between the chip assembly and the housing, and the thickness of the heat conductive member 400 located between the chip assembly 300 and the housing 100 can be reduced, thereby reducing the thermal resistance of the heat conductive member 400 to improve the heat dissipation effect of the chip assembly 300. Avoid using a heat conductive member 400 with a larger thickness to balance the gap tolerance between the chip assembly 300 and the housing 100, so as to reduce the heat transfer efficiency between the chip assembly 300 and the housing 100 and affect the heat dissipation performance of the chip assembly 300.

[0047] Figure 5 It is a structural schematic diagram of a floating component in an electronic device provided by an embodiment of the utility model; Figure 6 It is a schematic diagram of the structural decomposition of a floating component in an electronic device provided by an embodiment of the utility model.

[0048] See also Figure 5 and Figure 6 In some embodiments of the present invention, the floating component 500 includes a floating body 510 , an adjusting body 520 and an elastic member 530 .

[0049] The floating body 510 is a cylindrical structure, and the floating body 510 is arranged on the shell 100, that is, the floating body 510 can be integrally formed with the shell 100. For example, when the shell 100 is an alloy part, the floating body 510 can be a columnar structure protruding from the surface of the shell 100; the floating body 510 can also be set as a component independent of the shell 100, and the floating body 510 is fixed to the shell 100 by welding, or the floating body 510 is fixed to the shell 100 by fasteners such as bolts and screws.

[0050] The adjusting body 520 is threadably connected to the floating body 510, and at least one of the adjusting body 520 and the floating body 510 is provided with a limiting portion for providing a floating space for the main board 200, that is, the limiting portion can be set on the floating body 510, or on the adjusting body 520, or on both the adjusting body 520 and the floating body 510. When the limiting portions are set on both the adjusting body 520 and the floating body 510, the floating space is located between the two limiting portions.

[0051] The elastic member 530 is sleeved on the outer side of the floating body 510 or the adjusting body 520, and is used to provide a pre-tightening effect for the mainboard 200, so that the mainboard 200 can float adaptively, thereby driving the chip assembly 300 to float, so as to adjust the gap between the chip assembly 300 and the housing 100, and adapt to different gap tolerances. The elastic member 530 can be a spring, etc.

[0052] When the limiting portion is provided on the floating body 510, that is, a first step 521 is provided on the adjusting body 520 to form the limiting portion, and an external thread threadedly connected to the floating body 510 is provided near the end of the adjusting body 520, and the main board 200 is overlapped on the floating body 510, and the connecting hole on the main board 200 is aligned with the threaded hole on the floating body 510, and the elastic member 530 is sleeved on the outside of the adjusting body 520 to form a combination, and the combination is threadedly connected to the floating body 510. At this time, one side of the main board 200 is limited by the limiting portion formed by the first step 521, and the other side of the main board 200 is limited by the elastic member 530, and the elastic member 530 provides support and pre-tightening for the main board 200.

[0053] When the gap between the chip assembly 300 and the shell 100 is too large, the heat conducting member 400 is not in contact with the shell 100, that is, the squeezing effect of the shell 100 on the heat conducting member 400 disappears, and the elastic force of the elastic member 530 cannot be overcome. The elastic member 530 restores its elastic deformation to push the mainboard 200 to move in the direction of the chip assembly 300, ensuring that the heat conducting member 400 can maintain contact with both the chip assembly 300 and the shell 100, so that the heat of the chip assembly 300 is transferred to the shell 100 through the heat conducting member 400 for heat dissipation.

[0054] When the gap between the chip assembly 300 and the housing 100 is too small, the extrusion effect of the housing 100 on the heat conducting member 400 is more obvious, that is, when the pressure on the heat conducting member 400 increases to overcome the elastic force of the elastic member 530, the elastic member 530 continues to be compressed to undergo elastic deformation, so that the mainboard 200 moves away from the chip assembly 300 to increase the gap between the chip assembly 300 and the housing 100, so as to avoid the situation where the gap between the chip assembly 300 and the housing 100 is too small, resulting in excessive compression of the heat conducting member 400 and stress on the chip assembly 300, causing deformation or damage to the chip assembly 300.

[0055] It should be noted that in addition to the above structure, the floating component 500 may also adopt other components. For example, the floating component 500 includes two relatively arranged support members, and spring plates are arranged at the opposite ends of the two support members. The main board 200 is located between the two relatively arranged support members, and the main board 200 abuts against the spring plates at the ends of the support members. The main board 200 can float between the two spring plates to adjust the gap between the main board 200 and the chip component 300 arranged on the main board 200 and the shell 100, thereby compensating for the gap tolerance between the chip component 300 and the shell 100.

[0056] Continue reading Figures 1 to 6 In some embodiments of the utility model, a threaded hole is provided on the floating body 510 along its own axial direction from the end face, and a second step 511 is provided on the floating body 510 to form a limiting portion. When the adjusting body 520 is threadedly connected to the threaded hole, the floating space is located between the first step 521 and the second step 511.

[0057] This is equivalent to providing a position for installing the main board 200 on the outer surface of the floating body 510. Since the floating body 510 is disposed on the shell 100, the main board 200 is first sleeved on the floating body 510, and then the adjusting body 520 is connected to the floating body 510. The floating body 510 can provide positioning for the main board 200, making installation more convenient.

[0058] The adjusting body 520 may be a screw, and the floating body 510 may be a stud. The floating component 500 is formed by improving the structure of the screw and stud used for installing the mainboard 200 and matching them with the elastic member 530.

[0059] When the mainboard 200 is fixed to the shell 100 by means of the above-mentioned studs and screws, the mainboard 200 has a certain floating value in a direction perpendicular to the shell 100. The floating value of the mainboard 200 and the compression amount of the heat conductor 400 jointly eat up the gap tolerance between the chip assembly 300 and the shell 100, thereby compensating for the gap tolerance between the chip assembly 300 and the shell 100.

[0060] In some embodiments of the present invention, an anti-skid pad (not shown in the figure) is provided outside the floating body 510 or the adjusting body 520 and at the location of the floating space, and the main board 200 is sleeved on the outside of the anti-skid pad. This arrangement is used to increase the friction between the main board 200 and the floating body 510 or the adjusting body 520, prevent the main board 200 from floating randomly, and improve the stability and reliability of the overall structure.

[0061] Continue reading Figure 5 and Figure 6 In some embodiments of the present invention, a mounting seat 512 is provided on the floating body 510 , the cross-sectional area of ​​the mounting seat 512 is larger than the cross-sectional area of ​​the floating body 510 , and the mounting seat 512 is connected to the housing 100 .

[0062] Such a configuration is equivalent to increasing the contact area between the floating body 510 and the housing 100 , thereby improving the connection stability between the floating body 510 and the housing 100 .

[0063] Continue reading Figures 1 to 4 In some embodiments of the present invention, the chip assembly 300 includes a smart card 310 (ie, a buckle board) and a chip 320 . The chip 320 is soldered to the smart card 310 , and the smart card 310 is electrically connected to the mainboard 200 .

[0064] Furthermore, the chip assembly 300 further includes a connector 600, and the smart card 310 is electrically connected to the mainboard 200 via the connector 600, so that the distance between the chip 320 and the mainboard 200 is greater than the height of any component on the mainboard 200 facing the chip 320. That is, the connector 600 is connected to the smart card 310 and the mainboard 200 respectively, so that the smart card 310 and the chip 320 are suspended on the mainboard 200, that is, a gap is provided between the chip 320 and the mainboard 200.

[0065] In this way, the smart card 310 with the chip 320 is connected to the mainboard 200 through the connector 600, which is equivalent to raising the height of the chip 320, so that the gap between the chip 320 and the housing 100 is not affected by the height of other components. The gap between the chip 320 and the housing 100 can determine the thickness of the heat conductor 400, that is, the chip 320 can directly conduct heat to the housing 100 through the heat conductor 400 for heat dissipation, ensuring that the heat dissipation path between the chip 320 and the housing 100 is shorter and the heat dissipation effect is better. Avoid adding a heat dissipation boss between the chip 320 and the housing 100, so that the chip 320 conducts heat to the housing 100 for heat dissipation through the heat dissipation boss and the heat conductor 400, which prolongs the heat dissipation path of the chip 320 and affects the heat dissipation effect of the chip 320.

[0066] In the related art, due to the influence of high components or solder pins on the mainboard 200, the mainboard 200 will be raised relative to the shell 100 of the chassis, which results in a larger gap between the chip 320 and the shell 100. Generally, a heat dissipation boss is added to overlap the chip 320, which results in a longer heat transfer path of the chip 320 and poor heat dissipation effect. However, the embodiment of the utility model designs a smart card 310 separately for the chip 320, so that the smart card 310 is fixed to the mainboard 200 through a SODIMM connector, which is equivalent to raising the position of the chip 320 and reducing the gap between the chip 320 and the shell 100. There is no need to set a heat dissipation boss to ensure that the heat conduction path between the chip 320 and the shell 100 is the shortest and the heat dissipation efficiency is the highest.

[0067] It should be noted that the shell 100 provided in the embodiment of the utility model is a graphene shell, and the thermal conductivity of graphene can be used in a variety of ways, including thermal interface material (TIM), heat sink, thermal grease (usually a thin layer located between the chip component and the heat source of the heat sink), graphene-based nanocomposites, etc.

[0068] The housing 100 includes a detachably connected box body 110 and a cover body 120, the motherboard 200 is connected to the cover body 120 via a floating component 500, and is suitable for driving the chip assembly 300 to float so that the heat conductive member 400 maintains contact with the chip assembly 300 and the cover body 120 respectively.

[0069] Continue reading Figures 1 to 4 A plurality of heat dissipation ribs 121 are provided on the outer surface of the cover body 120 , and the heat dissipation ribs 121 increase the heat dissipation area of ​​the cover body 120 and improve the heat dissipation efficiency of the cover body 120 .

[0070] Taking the AIBOX product as an example in the embodiment of the utility model, the chip assembly 300 mainly conducts the heat of the chip assembly 300 to the aluminum profile shell 100 through the heat conductor 400 for heat dissipation. Since the mainboard 200 is fixed to the cover body 120 through the floating component 500, the gap tolerance between the chip assembly 300 and the cover body 120 is driven by the floating component 500 to float and balance the mainboard 200.

[0071] Among them, the floating range of the mainboard 200 depends on the size of the floating gap, and the size of the floating gap depends on the position of the opening of the external interface 111 on the mainboard 200 on the shell 100. The gap between the opening on the shell 100 and the device connected to the external interface 111 is generally about 0.3mm on one side, and the gap of the floating space on the floating body 510 is generally required to be no more than 0.2mm on one side.

[0072] When the studs in the prior art are used to support the mainboard 200, the gap tolerance between the chip assembly 300 and the shell 100 is δ, while when the floating body 510 improved by the present application is used to support the mainboard 200, the gap tolerance between the chip assembly 300 and the shell 100 is δ-0.4mm. The thickness of the corresponding heat conductor 400 is calculated based on a compression amount of 20%. The thickness of the heat conductor 400 can be reduced by 2mm, thereby reducing the thermal resistance of the heat conductor 400 and improving the heat dissipation efficiency of the chip assembly 300.

[0073] Since the clearance tolerance between the chip assembly 300 and the housing 100 is mainly affected by multiple factors such as the height of the floating body 510 (stud), the thickness of the mainboard 200, the flatness of the housing 100, etc., the clearance tolerance between the chip assembly 300 and the housing 100 is generally around ±0.2mm. If the ±0.2mm tolerance is eaten up by increasing the thickness of the heat conductor 400, the thickness of the heat conductor 400 is calculated to be around 2mm based on a 20% baseline compression amount, and the clearance between the chip assembly 300 and the housing 100 needs to be designed to be around 1.8mm.

[0074] When the floating component 500 provided by the embodiment of the utility model is used to fix the mainboard 200, the floating gaps above and below the mainboard 200 are designed to be 0.1mm respectively, which can offset the tolerance of 0.2mm, which is equivalent to reducing the gap tolerance between the chip component 300 and the shell 100 to ±0.1mm. The thickness of the heat conductor 400 can be set to 1mm. Generally, the nominal value of the gap is 0.9mm, which can meet the design requirements.

[0075] Specifically, when the gap tolerance between the chip component 300 and the shell 100 reaches the limit tolerance, that is, the gap tolerance is 1.1mm, the thickness of the heat conductor 400 is 1mm. At this time, the gap tolerance is greater than the thickness of the heat conductor 400, and the heat conductor 400 cannot maintain contact with the shell 100. However, since there is a gap of 0.1mm at the position of the heat conductor 400, the mainboard 200 moves toward the direction of the chip 320 under the elastic force of the spring, and the limit distance of movement, that is, the maximum value of the floating gap, is 0.1mm. At this time, after the mainboard 200 moves 0.1mm, the gap between the chip 320 and the shell 100 is reduced from 1.1mm to 1mm, and the heat conductor 400 theoretically just maintains contact with the shell 100.

[0076] If the gap tolerance between the chip assembly 300 and the housing 100 goes below the limit tolerance, the theoretical gap between the chip assembly 300 and the housing 100 is 0.7mm. At this time, the heat conductor 400 is theoretically compressed by 30%, exceeding the 20% compression limit of the heat conductor 400. Since the position of the mainboard 200 is not completely fixed in the embodiment of the utility model, the mainboard 200 can float under the action of the floating component 500 to effectively avoid the compression of the heat conductor 400 exceeding the preset compression, which causes the heat conductor 400 to produce stress on the mainboard 200. In order to solve the problem that in the prior art, the mainboard 200 and the housing 100 are completely fixed by screws, and the gap between the chip assembly 300 and the housing 100 is small, the stress of the chip assembly 300 on the mainboard 200 is relatively large due to the compression of the heat conductor 400, and even causes the chip assembly 300 device.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. An electronic device, characterized in that: It comprises a housing, and a mainboard and a chip assembly arranged in the housing, the mainboard is electrically connected to the chip assembly, the chip assembly is located between the mainboard and the housing, and a heat conducting member is arranged between the chip assembly and the housing; The mainboard is connected to the housing through a floating component and is suitable for driving the chip assembly to float so that the heat conducting member keeps in contact with the chip assembly and the housing respectively.

2. The electronic device according to claim 1, characterized in that: The floating component comprises: A floating body, disposed on the shell; An adjusting body, threadedly connected to the floating body, wherein at least one of the adjusting body and the floating body is provided with a limiting portion for providing a floating space for the main board; The elastic member is sleeved on the outer side of the floating body or the adjusting body and is used to provide a pre-tightening effect for the main board.

3. The electronic device according to claim 2, characterized in that: The adjusting body is provided with a first step to form the limiting portion, and the adjusting body is provided with a thread connected to the floating body thread at a position close to the end thereof; When the adjusting body is threadedly connected to the floating body, the floating space is limited between the first step and the end surface of the floating body.

4. The electronic device according to claim 3, characterized in that: The floating body is provided with a second step to form the limiting portion; When the adjusting body is threadedly connected to the floating body, the floating space is limited between the first step and the second step.

5. The electronic device according to any one of claims 2 to 4, characterized in that: A mounting seat is provided on the floating body, the cross-sectional area of ​​the mounting seat is larger than the cross-sectional area of ​​the floating body, and the mounting seat is connected to the shell.

6. The electronic device according to any one of claims 1 to 4, characterized in that: The chip assembly comprises a smart card and a chip, the chip is welded to the smart card, and the smart card is electrically connected to the mainboard.

7. The electronic device according to claim 6, characterized in that: The chip assembly further includes a connector, and the smart card is electrically connected to the mainboard via the connector, so that the distance between the chip and the mainboard is greater than the height of any component on the mainboard facing the chip.

8. The electronic device according to any one of claims 1 to 4, characterized in that: The shell is a graphene shell.

9. The electronic device according to claim 8, characterized in that: The shell comprises a box body and a cover body which are detachably connected. The mainboard is connected to the cover body via a floating component and is suitable for driving the chip assembly to float so that the heat conducting member is kept in contact with the chip assembly and the cover body respectively.

10. The electronic device according to claim 9, characterized in that: A plurality of heat dissipation ribs are arranged on the outer surface of the cover body.

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