High-precision repairing device for developing coating of ceramic substrate

Abstract

The utility model provides a high-precision repairing device for a developing coating of a ceramic substrate, which comprises a detection mechanism used for carrying out visual detection on the upper surface and the lower surface of the ceramic substrate so as to obtain missing position information of the coating on the upper surface and the lower surface of the ceramic substrate; the two repairing mechanisms are used for repairing the upper surface and the lower surface of the ceramic substrate respectively; and the turn-over mechanism is arranged between the two repairing mechanisms and used for turning over the substrate repaired by one repairing mechanism and conveying the substrate to the other repairing mechanism. Through the arrangement, the repairing precision and the repairing efficiency of the ceramic substrate are greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electric component production, in particular to a high-precision repair device for a developing coating of a ceramic substrate. Background Art

[0002] With the development of modern electrical technology, electrical intelligence has penetrated into all aspects of people's lives. At present, the requirements for the volume and insulation of related electrical components are getting higher and higher, and traditional materials can no longer meet people's requirements for large current and high insulation. Due to the excellent insulation and high temperature resistance of ceramic materials, they are now widely used in intelligent electrical appliances, solar energy, wind energy, new energy vehicles and other fields. In the above applications, ceramic copper clad laminates are often used to manufacture ITBG (power electrical components) components.

[0003] In the production process of ceramic copper clad laminates, development and etching (photocopying the protective coating on the surface of the copper clad laminate and then corroding the excess material) are key steps in the entire production process. The effects of development and etching will directly affect the quality of subsequent products. If the surface coating is missing during the development step, the entire ceramic copper clad laminate will be scrapped during the subsequent etching. The traditional production process uses manual inspection or semi-automatic inspection in each section of the production of ceramic copper clad laminates. After inspection, the missing coating is manually repaired, which requires a lot of manpower and material resources and has low production efficiency. In addition, the repair accuracy is not high and the repair effect is poor.

[0004] Therefore, it is necessary to design a high-precision repair device for the developing coating of a ceramic substrate to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a high-precision repair device for the developing coating of a ceramic substrate which is improved in various aspects such as detection, repair and transmission between various work sections, can greatly improve the repair efficiency and repair accuracy, and save manpower.

[0006] To achieve the above purpose, the utility model adopts the following technical solution: a high-precision repair device for a developing coating of a ceramic substrate, which includes a detection mechanism, two repair mechanisms and a flipping mechanism, wherein:

[0007] The detection mechanism is used to perform visual inspection on the upper surface and the lower surface of the ceramic substrate to obtain position information of missing coatings on the upper surface and the lower surface of the ceramic substrate;

[0008] The two repair mechanisms are used to repair the upper surface and the lower surface of the ceramic substrate respectively;

[0009] The flipping mechanism is arranged between the two repairing mechanisms, and is used for flipping the substrate repaired by one of the repairing mechanisms and transferring it to the other repairing mechanism.

[0010] As a further improved technical solution of the utility model, the detection mechanism includes a detection fixture that carries a substrate, a moving component that drives the detection fixture to move in a horizontal direction, a first visual component arranged above the detection fixture, and a second visual component arranged below the detection fixture.

[0011] As a further improved technical solution of the utility model, the moving component is an X-axis linear drive, and the first vision component and the second vision component are line scan cameras.

[0012] As a further improved technical solution of the utility model, the repair mechanism includes a substrate conveyor line, a mobile repair component arranged above the substrate conveyor line, a baking oven, and a baking conveyor line passing through the baking oven and docking with the substrate conveyor line. The mobile repair component can perform mobile repair on the substrate on the substrate conveyor line.

[0013] As a further improved technical solution of the utility model, the mobile repair component includes a bracket, an X-axis linear module arranged on the bracket, a Y-axis linear module arranged on the X-axis linear module, and a visual component and a spraying component arranged on the Y-axis linear module.

[0014] As a further improved technical solution of the utility model, the visual component includes a mounting plate and a camera, a lens and a light source arranged in sequence from top to bottom, the camera, the lens and the light source are respectively arranged on the mounting plate through separate mounting seats, a vertical slide groove is opened on the mounting plate, and a slide rail cooperating with the slide groove is provided on the mounting seat.

[0015] As a further improved technical solution of the utility model, the spraying assembly includes a mounting plate, a lifting drive arranged on the mounting plate, a nozzle and an ink supply assembly, the lifting drive drives the nozzle to lift and lower, and the ink supply assembly is connected to the nozzle for controlling the nozzle to spray ink according to the defect image information obtained by the visual component.

[0016] As a further improved technical solution of the utility model, the baking oven includes a box body, a heating tube arranged in the box body, a cover body arranged above the box body and a fan arranged on the cover body, and openings for the baking conveyor line to pass through are provided on the left and right sides of the box body, and the baking conveyor line is located below the heating tube.

[0017] As a further improved technical solution of the utility model, the flipping mechanism includes a first conveyor line, a second conveyor line and a flipping assembly arranged between the first conveyor line and the second conveyor line, the flipping assembly includes a flipping motor, a rotating shaft, and a flipping fork arranged on the rotating shaft, the flipping fork forms a gap for placing the substrate, the flipping motor drives the rotating shaft and the flipping fork thereon to rotate so as to dock the gap opening of the flipping fork with the first conveyor line or the second conveyor line, the first conveyor line docks with the first repair mechanism, and the second conveyor line docks with the second repair mechanism.

[0018] As a further improved technical solution of the utility model, there are two flip forks, and the two flip forks are arranged along the axial direction of the rotating shaft and in the same direction; the first conveyor line and the second conveyor line respectively include two parallel belts, and when the flip fork is docked with the first conveyor line or the second conveyor line, the two flip forks are located between the two belts of the first conveyor line or the second conveyor line.

[0019] As a further improved technical solution of the utility model, it also includes a loading mechanism, a material frame transfer mechanism and a unloading mechanism, the loading mechanism is used to transfer the ceramic substrate to the detection mechanism, the unloading mechanism is used to unload the repaired ceramic substrate on the second repair mechanism, the material frame transfer mechanism includes two material frame clamping assemblies, a material frame belt line and two material frame lifting assemblies, the material frame belt line is arranged between the two material frame lifting assemblies, and the two material frame clamping assemblies are respectively located above the material frame lifting assemblies; one of the material frame clamping assemblies is arranged at the loading mechanism to transport the empty frame generated by the loading mechanism to the material frame lifting assembly; the other material frame clamping assembly is arranged at the unloading mechanism to transport the empty frame on the material frame lifting assembly to the unloading mechanism.

[0020] It can be seen from the above technical scheme that the high-precision repair device for the developing coating of a ceramic substrate of the utility model has the following effects: first, the front and back sides of the ceramic substrate are inspected by the upper and lower sets of visual components to obtain the defect position information on the front and back sides of the substrate, so that the defects can be located quickly and the detection efficiency is high; then, the missing parts of the coating on the front and back sides of the substrate after inspection are repaired and baked in turn: the visual component is used to quickly guide the nozzle to inkjet repair, which not only greatly improves the repair efficiency, but also has high defect positioning and image information accuracy, further improving the repair accuracy; the repaired substrate is dynamically baked by the cooperation of the baking furnace and the baking conveyor line, integrating the baking and transmission processes, which not only has a uniform baking effect, but also further improves the repair speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1It is a schematic diagram of a high-precision repair device for a developer coating of a ceramic substrate according to an embodiment of the utility model.

[0022] Figure 2 for Figure 1 A three-dimensional diagram of the feeding mechanism, detection mechanism and transfer mechanism.

[0023] Figure 3 for Figure 2 A three-dimensional diagram of the detection mechanism.

[0024] Figure 4 for Figure 2 A perspective view of the mid-base clamp assembly.

[0025] Figure 5 for Figure 4 A partial enlarged view of the middle base plate clamp assembly.

[0026] Figure 6 for Figure 1 A three-dimensional diagram of the first repair mechanism and the flipping mechanism.

[0027] Figure 7 for Figure 6 Stereoscopic view of the mobile repair component.

[0028] Figure 8 for Figure 7 A partial enlarged view of the visual component and the spray component.

[0029] Fig. 9 for Figure 6 A perspective view of the baking oven.

[0030] Fig.10 for Figure 6 A partial enlarged view of the flipping mechanism and baking conveyor line.

[0031] Fig.11 for Fig.10 A three-dimensional diagram of the flip mechanism.

[0032] Fig.12 for Fig.11 Stereoscopic view of the flip fork.

[0033] Fig.13 for Figure 1 A three-dimensional diagram of the middle and lower feeding mechanism. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] Please refer to Figure 1As shown, the utility model provides a high-precision repair device for a developing coating of a ceramic substrate, which comprises a loading mechanism 1, a detection mechanism 2, a transfer mechanism 3, a first repair mechanism 4, a turning mechanism 5, a second repair mechanism 6 and a unloading mechanism 7 which are arranged in sequence.

[0036] The loading mechanism 1 is used to load the substrates in the material frame full of substrates one by one to the detection mechanism 2. Figure 2 As shown, the loading mechanism 1 includes a material frame buffer line 11, a material frame loading conveyor line 12, a material frame flipping assembly 13, a substrate loading conveyor line 14 and a substrate loading clamp assembly 15. The material frame buffer line 11 is used to buffer a number of fully loaded material frames to be loaded, and the fully loaded material frames are manually placed on the material frame buffer line 11 in sequence. The material frame loading conveyor line 12 is docked with the material frame buffer line 11, and is used to load the material frames on the material frame buffer line 11 one by one. The material frame flipping assembly 13 is arranged between the material frame loading conveyor line 12 and the substrate loading conveyor line 14, and is used to flip the material frame transferred to it by the material frame loading conveyor line 12, so that the material frame is flipped from a position with the opening facing upward to a position with the opening facing the substrate loading conveyor line 14, and the material frame is docked with the substrate loading conveyor line 14, so as to transfer the ceramic substrates in the material frame one by one. Among them, the material frame buffer line 11, the material frame loading conveyor line 12 and the substrate loading conveyor line 14 can all adopt belt lines in the prior art, and their structures are not described in detail here.

[0037] The detection mechanism 2 is used to visually detect the upper and lower surfaces of the ceramic substrate at the same time to obtain the positions where the coating on the upper and lower sides of the ceramic substrate is missing. Figure 3 As shown, the detection mechanism 2 includes a carrier 21, a bracket 22 arranged on the upper and lower sides of the carrier 21, a moving component 25 arranged on the carrier 21, a detection fixture 26, a first visual component 23 arranged above the detection fixture 26, and a second visual component 24 arranged below the detection fixture 26. The first visual component 23 and the second visual component 24 are respectively arranged on the bracket 22. The detection fixture 26 is arranged on the moving component 25 and moves in the horizontal direction under the drive of the moving component 25. The detection fixture 26 is provided with an opening that runs through the upper and lower parts, and the ceramic substrate is arranged on the opening. The first visual component 23 and the second visual component 24 respectively detect the upper and lower surfaces of the ceramic substrate on the detection fixture 26 through the opening. The moving component 25 is preferably an X-axis linear drive, which is arranged on the carrier 21. The first visual component 23 and the second visual component 24 are preferably line scan cameras, which can dynamically detect the upper and lower surfaces of the substrate when the substrate moves horizontally, greatly improving the substrate detection speed.

[0038] Please refer to Figure 1 and Figure 2As shown, the transfer mechanism 3 is arranged between the detection mechanism 2 and the first repair mechanism 4, and is used to transfer the ceramic substrate on the detection fixture 26 to the first repair mechanism 4. The transfer mechanism 3 includes a substrate clamping assembly 31 and two parallel substrate transfer lines 32. Figure 4 and Figure 5 As shown, the substrate clamping claw assembly 31 includes a Y-axis linear module 311, an X-axis linear module 312, a Z-axis linear module 313, an R-axis module 314, a clamping claw cylinder 315 and a clamping claw 316 which are arranged in sequence. The clamping claw cylinder 315 drives the clamping claw 316 to grasp the substrate. The Y-axis linear module 311, the X-axis linear module 312 and the Z-axis linear module 313 are used to drive the clamping claw 316 to move in the horizontal direction and the vertical direction. The R-axis module 314 is used to drive the clamping claw to rotate on the horizontal plane so that the position of the long side and the short side of the substrate is changed to change the transmission state of the substrate.

[0039] Preferably, a circular rib 317 is provided on the outside of the clamping jaw 316, and the circular rib 317 and the substrate clamped by the clamping jaw 316 are located in the same plane to prevent the substrate from accidentally hitting other components during rotation, thereby avoiding damage to the substrate. In other embodiments, the transfer mechanism can also be configured as a substrate suction cup assembly, the difference being that the clamping jaw cylinder and the clamping jaw are replaced with a vacuum suction cup assembly, which can also achieve the grasping of ceramic substrates.

[0040] The first repair mechanism 4 is used to repair the coating defect position on the upper layer of the substrate. Figure 6 As shown, the first repair mechanism 4 includes two substrate conveyor lines 41 arranged side by side, a mobile repair assembly 42 respectively mounted above one end of each substrate conveyor line 41, a baking conveyor line 44 and a baking oven 43 connected to each substrate conveyor line 41. The two substrate conveyor lines 41 respectively receive the substrates grasped by the transfer mechanism 3; the substrate conveyor line 41 transfers the substrate to the repair position of the mobile repair assembly 42. In other embodiments, one or more parallel groups of <substrate conveyor line-mobile repair assembly-baking oven-baking conveyor line> can also be adaptively set according to actual needs, such as according to the detection speed and the repair speed and baking speed of each substrate.

[0041] Please refer to Figure 7 As shown, the mobile repair component 42 includes a bracket, an X-axis linear module 421 disposed on the bracket, a Y-axis linear module 422 disposed on the X-axis linear module 421, and a synchronously moving visual component 423 and a spraying component 424 disposed on the Y-axis linear module 422. Figure 8As shown, the visual component 423 includes a mounting plate 4231 and a camera 4232, a lens 4233 and a light source 4234 arranged in sequence from top to bottom. The camera 4232, the lens 4233 and the light source 4234 are respectively arranged on the mounting plate 4231 through separate mounting seats. Preferably, a vertical slide 4235 is provided on the mounting plate 4231, and a slide rail matching the slide 4235 is provided on the mounting seat. The nozzle 424 includes a mounting plate 4241, a lifting drive 4242 arranged on the mounting plate 4241, a nozzle 4243 and an ink supply assembly (not shown). The lifting drive 4242 drives the nozzle 4243 to rise and fall. The ink supply assembly is connected to the nozzle 4243, and is used to control the nozzle 4243 to spray ink according to the defect image information obtained by the visual component 423.

[0042] The action flow of the mobile repair component 42 is as follows: the X-axis linear module 421 and the Y-axis linear module 422 move the visual component 423 to the top of the substrate to take pictures, obtain the substrate image and locate the position to be repaired; the X-axis linear module 421 and the Y-axis linear module 422 move the nozzle 4243 to the top of the position to be repaired according to the positioning data, and control the lifting drive 4242 to adjust the nozzle 4243 to the repair height, and the nozzle 4243 sprays the repair ink to repair the positions to be repaired on the substrate one by one.

[0043] Please refer to Fig. 9 As shown, the baking oven 43 is used to bake the repaired substrate on the baking conveyor line 44. The baking oven 43 includes a box body 431, a heating tube 432 arranged in the box body 431, a cover body 433 arranged above the box body 431, and a fan 434 arranged on the cover body 433. The box body 431 is provided with openings on both sides, the left and right sides, and the upper and lower sides. The openings 435 on the left and right sides are used for the baking conveyor line 44 to pass through. The baking conveyor line 44 is located below the heating tube 432. One side of the cover body 433 is hinged to the box body 431, and the cover body 433 and the upper opening of the box body 431 form an acute angle. The repaired substrate passes through the baking conveyor line 44 and enters the baking oven 43, and is transported at a uniform speed in the baking oven 43 to dry the repaired position until the substrate flows out of the baking oven 43.

[0044] Please refer to Figure 1 and Figure 6 As shown, the flipping mechanism 5 is disposed between the first repairing mechanism 4 and the second repairing mechanism 6, and is used to flip the substrate transmitted from the baking conveyor line 44 and transfer it to the second repairing mechanism 6. Fig.10 As shown, the flipping mechanism 5 includes a first conveying line 51, a second conveying line (not shown) and a flipping assembly 52. ​​The first conveying line 51 includes a motor 511, two belts 512 driven by the motor 511 and a blocking member 513 arranged in front of the conveying direction of the belts 512. The second conveying line has the same structure as the first conveying line 51, and will not be described in detail here.

[0045] Please also refer to Fig.11 As shown, the flip assembly 52 is located between the first conveyor line 51 and the second conveyor line, and includes a mounting plate 521, two vertical plates 522 arranged on the mounting plate 521, a flip motor 523, a rotating shaft 524, a flip fork 525 arranged on the rotating shaft 524, a lifting drive 526 arranged below the mounting plate 521, and a sensor 527 arranged on one side of the mounting plate 521. The flip motor 523 and the rotating shaft 524 are arranged on the two vertical plates 522, and the flip motor 523 drives the rotating shaft 524 and the flip fork 525 thereon to rotate. The lifting drive 526 is used to lift and lower the flip fork.

[0046] Preferably, a pointer 58 is radially provided at the end of the rotating shaft 524 , and a slot sensor 59 cooperating with the pointer 58 is provided on the outer side of the vertical plate 522 . The slot sensors 59 are distributed along the circumferential direction and are used to sense the rotation position of the rotating shaft 524 .

[0047] Please also refer to Fig.12 As shown, the flip fork 525 includes a fixed block 5251 fixed on the rotating shaft 524 and a first baffle 5252 and a second baffle 5252' arranged on the fixed block 5251. The fixed block 5251 is preferably cylindrical, and a mounting plane is provided on one side of the fixed block 5251 for mounting the first baffle 5252 and the second baffle 5252'. Preferably, the first baffle 5252 and the second baffle 5252' are fixed to the mounting plane by bolts, and the first baffle 5252 and the second baffle 5252' of different specifications can be flexibly replaced to be compatible with substrates of different specifications. A gap for placing the substrate is formed between the first baffle 5252 and the second baffle 5252'. When turning over, the length of the substrate in the gap is greater than the length outside the gap. The width of the gap is slightly greater than the thickness of the substrate so that the substrate can enter the gap smoothly. In addition, in order to reduce the friction between the substrate and the first baffle 5252 and the second baffle 5252', so as to make the transmission smoother, the flip fork 525 opens in an eight-shaped shape at one end facing the substrate. In this embodiment, there are two flip forks 525, which are arranged along the axial direction of the rotating shaft 524.

[0048] The action flow of the flipping mechanism 5 is as follows: first, the gap opening of the flip fork 525 faces the first conveyor line 51 and is flush with the conveying plane of the first conveyor line 51. The substrate that has completed the front repair is transmitted forward through the first conveyor line 51 and partially inserted into the gap of the flip fork 525. After the substrate is in place, the flip motor 523 drives the flip fork 525 and the substrate thereon to rotate 180°, so that the substrate is flipped to the reverse side facing up. After the sensor 527 senses that the substrate is flipped in place, the second conveyor line starts and drives the substrate to flow to the second repair mechanism 6. As set above, the flipping mechanism 5 has a simple and compact structure, and can effectively realize the automatic flipping function, thereby reducing the waste of manpower caused by manual flipping, reducing equipment costs, and improving flipping efficiency.

[0049] The second repair mechanism 6 is used to repair the coating defect position of the lower layer of the substrate, and its structure and operation process are the same as those of the first repair mechanism 4. After the substrate is turned over at the turning mechanism 5, it enters the second repair mechanism 6 through the second conveyor line to complete spraying and baking. The detailed process is not repeated here.

[0050] Please refer to Fig.13 As shown, the unloading mechanism 7 includes a substrate unloading clamp assembly 71, a substrate unloading conveyor line 72, a material frame flip assembly 73 and a material frame unloading line 74. The substrate unloading clamp assembly 71 is used to grab the substrate on the second repair mechanism 6 to the substrate unloading conveyor line 72. The substrate unloading conveyor line 72 docks with the material frame on the material frame flip assembly 73 to transfer the substrates to the material frame one by one. The material frame flip assembly 73 has the same structure as the material frame flip assembly 13, and the action is opposite. It is used to flip the position where the right opening of the fully loaded material frame faces one side to the position where the opening faces upward. The substrate unloading clamp assembly 71 has the same structure as the substrate clamp assembly 31. The substrate unloading conveyor line 72 and the material frame unloading line 74 are both belt lines, and the detailed structure is not repeated here.

[0051] Please refer to Figure 1 As shown, in this embodiment, the high-precision repair device for the developing coating of a ceramic substrate further includes a material frame transfer mechanism 8, which is used to move the empty frame generated at the loading mechanism 1 to the unloading mechanism 7 to receive the repaired substrate.

[0052] Please also refer to Figure 2 , Figure 6 and Fig.13 As shown, the material frame transfer mechanism 8 includes a material frame clamping assembly 81, a material frame belt line 82, a material frame lifting assembly 83, a material frame clamping assembly 84 and a material frame lifting assembly 85. The material frame clamping assembly 81 and the material frame lifting assembly 83 are arranged at the feeding mechanism 1. Specifically, the material frame lifting assembly 83 is located on one side of the material frame flip assembly 13, and the material frame clamping assembly 81 is located above the material frame lifting assembly 83 and the material frame flip assembly 13. The material frame clamping assembly 83 and the material frame lifting assembly 85 are arranged at the unloading mechanism 7. Specifically, the material frame lifting assembly 85 is located on one side of the material frame flip assembly 73, and the material frame clamping assembly 84 is located above the material frame lifting assembly 85 and the material frame flip assembly 73. The material frame belt line 82 is arranged between the material frame lifting assembly 83 and the material frame lifting assembly 85, and is connected to the two. Preferably, the material frame belt line 82 is arranged below the mounting plate 10, and the material frame lifting components 83 and the material frame lifting components 85 are provided with openings at positions on the mounting plate 10 corresponding to the material frame lifting components 83 and the material frame lifting components 85. The material frame lifting components 83 and the material frame lifting components 85 lift the material frame through the openings. Such an arrangement greatly reduces the overall volume of the device.

[0053] The action flow of the material frame transfer mechanism 8 is as follows: when loading, the material frame clamping assembly 81 grabs the empty frame after loading from the material frame flipping assembly 13 to the material frame lifting assembly 84 on one side of the material frame flipping assembly 13, and the material frame lifting assembly 84 lowers the empty frame to a position aligned with the material frame belt line 82, and the two are docked and transfer the material frame to the material frame lifting assembly 84 at the other end of the material frame belt line 82; the material frame lifting assembly 84 lifts the empty frame, and the material frame clamping assembly 83 transports the empty frame to the material frame flipping assembly 73, which is used to receive the repaired ceramic substrate transmitted from the substrate unloading conveyor line 72 for unloading, so as to realize the reuse of the empty frame in the process.

[0054] The terms used in this article, such as "upper", "lower", "front", "back", "X-axis", "Y-axis", "Z-axis", etc., which indicate relative positions in space, are used for the purpose of convenience to describe the relationship of one feature relative to another feature as shown in the accompanying drawings. It is understood that, depending on the placement of the product, the terms of relative positions in space may be intended to include different orientations in addition to the orientation shown in the drawings, and should not be construed as limitations on the claims. In addition, the term "fixed" used in this article to indicate the connection relationship between components means non-detachable fixation or detachable fixation, and only limits the connection between the two components to a relatively fixed connection, and does not limit the static or active state of other positions of the components.

[0055] In addition, the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of this specification should be based on the technical personnel in the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or make equivalent substitutions to the present invention, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A high-precision repair device for a developing coating of a ceramic substrate, characterized in that: It includes a detection mechanism, two repair mechanisms and a flipping mechanism, among which: The detection mechanism is used to perform visual inspection on the upper surface and the lower surface of the ceramic substrate to obtain position information of missing coatings on the upper surface and the lower surface of the ceramic substrate; The two repair mechanisms are used to repair the upper surface and the lower surface of the ceramic substrate respectively; The flipping mechanism is arranged between the two repairing mechanisms, and is used for flipping the substrate repaired by one of the repairing mechanisms and transferring it to the other repairing mechanism.

2. The high-precision repair device for the developer coating of a ceramic substrate according to claim 1, characterized in that: The detection mechanism includes a detection fixture for carrying a substrate, a moving component for driving the detection fixture to move in a horizontal direction, a first visual component arranged above the detection fixture, and a second visual component arranged below the detection fixture.

3. The high-precision repair device for the developer coating of a ceramic substrate according to claim 2, characterized in that: The moving component is an X-axis linear drive, and the first visual component and the second visual component are line scan cameras.

4. The high-precision repair device for the developer coating of a ceramic substrate according to claim 1, characterized in that: The repair mechanism includes a substrate conveying line, a mobile repair component arranged above the substrate conveying line, a baking oven, and a baking conveying line passing through the baking oven and docking with the substrate conveying line. The mobile repair component can perform mobile repair on the substrate on the substrate conveying line.

5. The high-precision repair device for the developer coating of a ceramic substrate according to claim 4, characterized in that: The mobile repair component includes a bracket, an X-axis linear module arranged on the bracket, a Y-axis linear module arranged on the X-axis linear module, and a visual component and a spraying component arranged on the Y-axis linear module.

6. The high-precision repair device for the developer coating of a ceramic substrate according to claim 5, characterized in that: The visual component includes a mounting plate and a camera, a lens and a light source arranged in sequence from top to bottom. The camera, the lens and the light source are respectively arranged on the mounting plate through separate mounting seats. A vertical slide groove is opened on the mounting plate, and a slide rail cooperating with the slide groove is provided on the mounting seat.

7. The high-precision repair device for the developer coating of a ceramic substrate according to claim 5, characterized in that: The spraying assembly includes a mounting plate, a lifting drive arranged on the mounting plate, a nozzle and an ink supply assembly. The lifting drive drives the nozzle to rise and fall. The ink supply assembly is connected to the nozzle and is used to control the nozzle to spray ink according to the defect image information obtained by the visual assembly.

8. The high-precision repair device for the developer coating of a ceramic substrate according to claim 4, characterized in that: The baking oven comprises a box body, a heating tube arranged in the box body, a cover body arranged above the box body and a fan arranged on the cover body. Openings for the baking conveyor line to pass through are arranged on the left and right sides of the box body. The baking conveyor line is located below the heating tube.

9. The high-precision repair device for the developer coating of a ceramic substrate according to claim 1, characterized in that: The flipping mechanism includes a first conveyor line, a second conveyor line and a flipping assembly arranged between the first conveyor line and the second conveyor line, the flipping assembly includes a flipping motor, a rotating shaft, and a flip fork arranged on the rotating shaft, the flipping fork forms a gap for placing the substrate, the flipping motor drives the rotating shaft and the flipping fork thereon to rotate so as to connect the gap opening of the flipping fork with the first conveyor line or the second conveyor line, the first conveyor line connects with the first repair mechanism, and the second conveyor line connects with the second repair mechanism.

10. The high-precision repair device for the developer coating of a ceramic substrate according to claim 9, characterized in that: There are two flip forks, which are arranged along the axial direction of the rotating shaft and in the same direction; the first conveyor line and the second conveyor line respectively include two parallel belts, and when the flip fork is docked with the first conveyor line or the second conveyor line, the two flip forks are located between the two belts of the first conveyor line or the second conveyor line.

11. The high-precision repair device for the developer coating of a ceramic substrate according to claim 1, characterized in that: It also includes a loading mechanism, a material frame transfer mechanism and a material unloading mechanism, wherein the loading mechanism is used to transfer the ceramic substrate to the detection mechanism, and the unloading mechanism is used to unload the repaired ceramic substrate on the second repair mechanism, and the material frame transfer mechanism includes two material frame clamping assemblies, a material frame belt line and two material frame lifting assemblies, wherein the material frame belt line is arranged between the two material frame lifting assemblies, and the two material frame clamping assemblies are respectively located above the material frame lifting assemblies; in One of the material frame clamping claw components is arranged at the loading mechanism to transport the empty frame generated by the loading mechanism to the material frame lifting component; the other material frame clamping claw component is arranged at the unloading mechanism to transport the empty frame on the material frame lifting component to the unloading mechanism.

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