Thin-sheet diode and photovoltaic module with built-in protection module
By incorporating thin diodes in photovoltaic modules, the problems of large junction box volume and poor heat dissipation caused by diode placement in the prior art are solved, and the effect of reducing production costs and improving component performance is achieved.
Patent Information
- Application Number
- CN202421106023.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-05-20
AI Technical Summary
In existing photovoltaic modules, the placement of diodes in the junction box results in large volume and large materials used, which is not conducive to the heat dissipation of the diodes and affects the performance and reliability of the components.
The thin-sheet diode design is adopted, and the diode body is built into the photovoltaic module, and the thin-sheet diode is formed through copper foil and adhesive film, reducing the use of packaging adhesive film, reducing production costs, and improving the flexibility and fit of the diode.
It realizes reducing the volume of the junction box, reducing production costs, improving the fitting quality between the diode and the cell, enhancing the performance and reliability of the photovoltaic modules, and avoiding potential damage to the cell.
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Figure CN222509903U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solar photovoltaic components, in particular to a thin-film diode and a photovoltaic component with a built-in protection module. Background Art
[0002] Solar power generation is sustainable and pollution-free. As a green energy source, it is increasingly valued. Single solar cells cannot be used directly as a power source. To be used as a power source, several single cells must be connected in series and parallel and tightly sealed into a component. Photovoltaic components (also called solar panels) are the core part of the solar power generation system and the most important part of the solar power generation system. Its function is to convert solar energy into electrical energy and send it to the battery for storage or to drive the load to work.
[0003] At present, the industry installs a battery management device on the outside of the photovoltaic module, and first connects multiple batteries inside the photovoltaic module to form a battery string. Then the positive and negative poles of the battery string are led out of the module, and the diode is implanted in the external junction box to protect the battery string inside the module. However, whether it is a split or single junction box, the diode is placed inside the junction box. This structure makes the junction box large in size, uses a lot of materials, and wastes costs. In addition, since the diode is inside the junction box, it is not conducive to heat dissipation.
[0004] Although there are structures that embed diodes into photovoltaic modules, such as CN218004881U, which discloses a photovoltaic module with built-in diodes, including a first substrate, a first silicone sealing layer, a battery cell, a bus bar, a second silicone sealing layer, and a second substrate, wherein the battery cell includes a plurality of battery strings arranged in series, the bus bar is electrically connected to the battery string, and a diode is arranged on the bus bar. That is, CN218004881U greatly reduces the volume of the junction box by embedding the diode inside the photovoltaic module, and the packaging structure of CN218004881U has better heat dissipation capacity, which is more conducive to the heat dissipation of the diode.
[0005] However, the diode used in CN218004881U is a conventional diode. On the one hand, due to its large thickness, this type of diode requires more packaging film filling during production, which has a high production cost. On the other hand, this type of diode has poor flexibility. When the battery cell has a certain curvature, the diode is difficult to fit tightly, that is, the fitting quality between the diode and the battery cell is poor, affecting the performance and reliability of the photovoltaic module. Utility Model Content
[0006] The purpose of the utility model is to address the defects and shortcomings in the prior art, and to provide a thin-film diode and a photovoltaic component with a built-in protection module.
[0007] The utility model provides a thin-film diode adopting a technical solution: a thin-film diode, comprising: a diode body, the diode body having a positive terminal and a negative terminal, the diode body comprising:
[0008] A first copper foil and a second copper foil, wherein the first copper foil and the second copper foil are arranged opposite to each other in an up-and-down manner, and adhesive films are provided on upper and lower sides of the first copper foil and the second copper foil;
[0009] A wafer is arranged between the first copper foil and the second copper foil, a wafer N junction and a wafer P junction are formed on both sides of the wafer respectively, through holes matching the wafer are opened on the adhesive films on the opposite sides of the first copper foil and the second copper foil, and the wafer N junction and the wafer P junction are respectively welded to the first copper foil and the second copper foil after passing through the through holes; and
[0010] The tin layer, which is in two groups, is respectively arranged between the wafer N junction and the first copper foil and between the wafer P junction and the second copper foil, and is used to protect the wafer N junction and the wafer P junction.
[0011] Preferably, the adhesive film is a PI film.
[0012] Preferably, the number of the wafers is one or two.
[0013] Preferably, the first copper foil and the second copper foil are arranged in a strip shape.
[0014] The utility model also provides a photovoltaic component with a built-in protection module, comprising a packaging surface material, a first packaging film material, a protection module, a battery cell layer, a second packaging film material and a packaging back material arranged in sequence from top to bottom, the protection module is arranged on the battery cell layer, and the protection module comprises a welding strip and a plurality of thin-film diodes as described above, the welding strip is adapted to the length of the battery cell layer, a plurality of the diode bodies are evenly arranged along the length direction of the welding strip, a plurality of the diode bodies are all welded to the welding strip, and the positive and negative electrodes of the battery cell layer are connected to the welding strip via leads.
[0015] Preferably, the protection module also includes an insulating spacer and an adhesive film layer arranged on the insulating spacer, the sizes of the insulating spacer and the adhesive film layer are adapted to the welding strip, the insulating spacer is attached to the battery cell layer, the welding strip is arranged above the adhesive film layer, and the diode body is located on the side of the welding strip away from the adhesive film layer.
[0016] Preferably, the adhesive film layer is a PI film.
[0017] Preferably, the packaging surface material is one of glass, FPE, PET, TPT, and ETFE.
[0018] Preferably, the packaging back material is one of glass, FPE, PET, TPT, ETFE, and PPF.
[0019] Preferably, the first encapsulation film material and the second encapsulation film material are made of the same material, and the first encapsulation film material and the second encapsulation film material are both one of EVA and POE.
[0020] After adopting the above technical solution, the beneficial effects of the utility model are:
[0021] The present application forms a diode body by forming a first copper foil, a second copper foil, an adhesive film, a wafer and a tin layer. Compared with the diode in the prior art, the present application uses copper foil and an adhesive film, and replaces the packaging adhesive film with the adhesive film. The filling of the packaging adhesive film can be reduced during production, thereby reducing the production cost and having a thinner thickness. The thin-film diode in the present application has better flexibility and can conform to the curvature of the battery cell, that is, the fitting quality of the diode and the battery cell is improved, thereby ensuring the performance and reliability of the photovoltaic module. In addition, the thin-film diode in the present application can also be used to avoid the risk of hidden cracks and fragments of the battery cell caused by installation in the battery cell. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0023] Figure 1 is a schematic diagram of the overall structure of the thin-film diode in this embodiment;
[0024] Figure 2 is an exploded view of the thin-film diode in this embodiment;
[0025] Figure 3 is a cross-sectional view of the thin-film diode in this embodiment;
[0026] Figure 4 is a schematic diagram of the overall structure of the photovoltaic module in this embodiment;
[0027] Figure 5 It is a schematic diagram used to reflect the assembly relationship between the battery layer, welding ribbon and diode body;
[0028] Figure 6 yes Figure 5 A partial display diagram of
[0029] Figure 7It is a schematic diagram used to reflect the positional relationship between the welding strip, insulating spacer and film layer.
[0030] Explanation of the reference numerals: 100, diode body; 110, first copper foil; 120, second copper foil; 130, adhesive film; 140, wafer; 141, wafer N junction; 142, wafer P junction; 150, tin layer; 200, packaging surface material; 300, first packaging adhesive film material; 400, protection module; 401, welding ribbon; 402, insulating spacer; 403, adhesive film layer; 500, battery cell layer; 600, second packaging adhesive film material; 700, packaging back material. DETAILED DESCRIPTION
[0031] The following will be combined with the attached embodiment of the present utility model Figure 1-7 , clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0032] It should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "back", "side", "circumferential" and the like in the present invention indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present invention. In addition, the words "first", "second" and the like are only used to distinguish multiple components or structures with the same or similar structures, and do not represent any special limitation on the setting order or connection relationship.
[0033] This embodiment relates to a thin film diode, referring to Figure 1 , Figure 2 and Figure 3 , including a diode body 100, the diode body 100 has a positive terminal and a negative terminal, the diode body 100 includes a first copper foil 110 and a second copper foil 120, the first copper foil 110 and the second copper foil 120 are arranged opposite to each other up and down, the first copper foil 110 is located above the second copper foil 120, and adhesive films 130 are arranged on the upper and lower sides of the first copper foil 110 and the second copper foil 120.
[0034] A wafer 140 is arranged between the first copper foil 110 and the second copper foil 120, and a wafer N junction 141 and a wafer P junction 142 are respectively formed on the upper and lower sides of the wafer 140. Through holes matching the wafer 140 are opened on the adhesive film 130 on the opposite side of the first copper foil 110 and the second copper foil 120, and the wafer N junction 141 and the wafer P junction 142 are respectively welded to the first copper foil 110 and the second copper foil 120 after passing through the through holes.
[0035] In addition, in order to enable the wafer N junction 141 and the wafer P junction 142 on the wafer 140 to be stably soldered to the first copper foil 110 and the second copper foil 120, a tin layer 150 is arranged between the wafer N junction 141 and the first copper foil 110, and between the wafer P junction 142 and the second copper foil 120. The two groups of tin layers 150 are used to protect the wafer N junction 141 and the wafer P junction 142, respectively.
[0036] Furthermore, in this embodiment, the adhesive film 130 is a PI film. The full name of PI film is polyimide film, which is a new type of high-temperature resistant molecular polymer film with excellent mechanical properties, dielectric properties, chemical stability, and high radiation resistance, corrosion resistance, and high and low temperature resistance. It is one of the best super engineering polymer materials in the world. That is, the PI film is used as the adhesive film 130 and is arranged on the upper and lower sides of the first copper foil 110 and the second copper foil 120, which can ensure the overall performance and stability of the thin-film diode.
[0037] Furthermore, in this embodiment, the number of wafers 140 is one or two, that is, this embodiment can be divided into a single wafer 140 thin-chip diode and a double wafer 140 thin-chip diode according to the number of wafers 140 to meet different circuit requirements.
[0038] Furthermore, in this embodiment, the first copper foil 110 and the second copper foil 120 are both arranged in a long strip shape.
[0039] In addition, in this embodiment, the thickness of the first copper foil 110 and the second copper foil 120 are both 0.1 mm. By setting the thickness of the first copper foil 110 and the second copper foil 120 to 0.1 mm, the thickness of the thin-film diode provided in this embodiment can reach less than 0.8 mm, thereby meeting the manufacturer's "extremely thin" diode requirements.
[0040] This embodiment also provides a photovoltaic module with a built-in protection module 400, referring to Figure 4 , Figure 5 , Figure 6 and Figure 7, including a packaging surface material 200, a first packaging film 130 material, a protection module 400, a battery layer 500, a second packaging film material 600 and a packaging back material 700 arranged in sequence from top to bottom, wherein the protection module 400 is arranged on the battery layer 500, and the protection module 400 includes a welding strip 401 and a plurality of thin-film diodes as described above, the battery layer 500 includes a plurality of battery strings arranged in series, the welding strip 401 is adapted to the length of the battery layer 500, a plurality of diode bodies 100 are evenly arranged along the length direction of the welding strip 401, the plurality of diode bodies 100 are all welded to the welding strip 401, and the positive and negative electrodes of the battery layer 500 are connected to the welding strip 401 through leads.
[0041] When packaging a photovoltaic module, first, a plurality of diode bodies 100 are evenly arranged along the length direction of the welding tape 401, and then the welding tape 401 is attached to the battery cell layer 500. Since the battery cell layer 500 is composed of a plurality of batteries connected in series, when connecting the battery cell layer 500 to the welding tape 401, the positive and negative electrodes of each battery string are led out through leads and connected to the welding tape 401, thereby realizing the connection among the welding tape 401, the diode body 100 and the battery cell layer 500, and further realizing the protection of the battery cell layer 500.
[0042] In addition, it should be noted that in this embodiment, there are two welding strips 401 on the battery cell layer 500, and the diode bodies 100 on each welding strip 401 are divided into two columns, the two columns of diode bodies 100 are staggered, and the two columns of diode bodies 100 are evenly distributed along the length direction of the welding strip 401. In other embodiments, the number of welding strips 401 on the battery cell layer 500 can be one, three, or other numbers, and the number of diode bodies 100 on each welding strip 401 can also be one, three, or other numbers, which can be adjusted accordingly according to specific circumstances, and no further limitation is made here.
[0043] Furthermore, the protection module 400 also includes an insulating spacer 402 and a film layer 403 arranged on the insulating spacer 402. The sizes of the insulating spacer 402 and the film layer 403 are adapted to the welding strip 401. The insulating spacer 402 is attached to the battery cell layer 500, the welding strip 401 is arranged above the film layer 403, and the diode body 100 is located on the side of the welding strip 401 away from the film layer 403.
[0044] By combining the insulating spacer 402, the film layer 403, the welding strip 401 and the diode body 100 to form a protection module 400, that is, the diode body 100 is built into the photovoltaic module, the volume of the junction box can be greatly reduced, which is beneficial to the heat dissipation of the diode body 100, thereby reducing the number of cells in the photovoltaic module affected by hot spots.
[0045] Furthermore, in this embodiment, the adhesive film layer 403 is a PI film.
[0046] Furthermore, in this embodiment, the packaging surface material 200 is one of glass, FPE, PET, TPT, and ETFE.
[0047] Furthermore, in this embodiment, the packaging back material 700 is one of glass, FPE, PET, TPT, ETFE, and PPF.
[0048] Furthermore, in the present embodiment, the first encapsulation film 130 material and the second encapsulation film material 600 are made of the same material, and both the first encapsulation film 130 material and the second encapsulation film material 600 are one of EVA and POE.
[0049] It should be noted that the thin-film diode provided in this embodiment can be implanted in all types of photovoltaic modules. The types of photovoltaic modules are divided into cardboard and flexible boards. However, the materials used by different manufacturers for these two types are not consistent. Therefore, in this embodiment, the packaging surface material 200, the packaging back material 700, the first packaging film 130 material and the second packaging film material 600 are used to summarize.
[0050] The above is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.
Claims
1. A thin film diode, characterized in that: include: A diode body (100), the diode body (100) having a positive terminal and a negative terminal, the diode body (100) comprising: A first copper foil (110) and a second copper foil (120), wherein the first copper foil (110) and the second copper foil (120) are arranged opposite to each other in an upper and lower direction, and adhesive films (130) are provided on upper and lower sides of the first copper foil (110) and the second copper foil (120); A wafer (140) is arranged between the first copper foil (110) and the second copper foil (120), a wafer N junction (141) and a wafer P junction (142) are respectively formed on both sides of the wafer (140), a through hole matching the wafer (140) is opened on the adhesive film (130) on the opposite side of the first copper foil (110) and the second copper foil (120), and the wafer N junction (141) and the wafer P junction (142) are respectively welded to the first copper foil (110) and the second copper foil (120) after passing through the through hole; and The tin layer (150) is provided in two groups, respectively disposed between the wafer N junction (141) and the first copper foil (110) and between the wafer P junction (142) and the second copper foil (120), and is used to protect the wafer N junction (141) and the wafer P junction (142).
2. A thin film diode according to claim 1, characterized in that: The adhesive film (130) is a PI film.
3. A thin film diode according to claim 2, characterized in that: The number of the wafers (140) is one or two.
4. The thin-film diode according to claim 1, characterized in that: The first copper foil (110) and the second copper foil (120) are arranged in a long strip shape.
5. A photovoltaic module with a built-in protection module (400), characterized in that: The invention comprises a packaging surface material (200), a first packaging film material (300), a protection module (400), a battery cell layer (500), a second packaging film material (600) and a packaging backside material (700) which are arranged in sequence from top to bottom, wherein the protection module (400) is arranged on the battery cell layer (500), and the protection module (400) comprises a welding strip (401) and a plurality of thin-film diodes according to any one of claims 1 to 4, wherein the welding strip (401) is adapted to the length of the battery cell layer (500), a plurality of diode bodies (100) are evenly arranged along the length direction of the welding strip (401), a plurality of diode bodies (100) are all welded to the welding strip (401), and the positive and negative electrodes of the battery cell layer (500) are connected to the welding strip (401) via leads.
6. The photovoltaic assembly with a built-in protection module (400) according to claim 5, characterized in that: The protection module (400) further comprises an insulating spacer (402) and an adhesive film layer (403) arranged on the insulating spacer (402); the sizes of the insulating spacer (402) and the adhesive film layer (403) are adapted to the welding strip (401); the insulating spacer (402) is bonded to the battery cell layer (500); the welding strip (401) is arranged above the adhesive film layer (403); and the diode body (100) is located on a side of the welding strip (401) that is away from the adhesive film layer (403).
7. The photovoltaic assembly with a built-in protection module (400) according to claim 6, characterized in that: The adhesive film layer (403) is a PI film.
8. The photovoltaic assembly with a built-in protection module (400) according to claim 5, characterized in that: The packaging surface material (200) is one of glass, FPE, PET, TPT, and ETFE.
9. The photovoltaic assembly with a built-in protection module (400) according to claim 5, characterized in that: The packaging back material (700) is one of glass, FPE, PET, TPT, ETFE, and PPF.
10. The photovoltaic assembly with a built-in protection module (400) according to claim 5, characterized in that: The first encapsulation film material (300) and the second encapsulation film material (600) are made of the same material, and the first encapsulation film material (300) and the second encapsulation film material (600) are both one of EVA and POE.
Citation Information
Patent Citations
Photovoltaic module with built-in diode
CN218004881U