Semiconductor dehumidifier

Abstract

The utility model belongs to the technical field of dehumidification electric appliances, and particularly relates to a semiconductor dehumidifier. Comprising a shell and a first semiconductor refrigeration assembly; the first semiconductor refrigeration assembly comprises a first refrigeration part, a first cold conduction part and a first heat dissipation part. The first heat dissipation part comprises a heat conduction part attached to the hot end of the first refrigeration part, a heat conduction copper pipe connected with the heat conduction part and extending in the transverse direction, and a plurality of heat dissipation fins arranged on the heat conduction copper pipe and arranged at intervals in the transverse direction. A traditional structure that aluminum fins are directly adopted as heat dissipation ends is changed, the combined structure of the transversely-extending heat conduction copper pipes and the fins is adopted, the heat conductivity is high, the good heat conduction and heat dissipation effect on refrigeration parts is achieved, through the layout arrangement of the structure, contact between airflow and the first heat dissipation part can be increased, and therefore the heat dissipation effect is greatly improved, and the heat dissipation efficiency is improved. And the dehumidification effect is more remarkable.

Description

Technical Field

[0001] The utility model belongs to the technical field of dehumidification appliances, and in particular relates to a semiconductor dehumidifier. Background Art

[0002] Semiconductor dehumidifiers use the Peltier effect between P-type and N-type semiconductor materials to achieve refrigeration and dehumidification. When current passes through the two semiconductor materials, heat and cold are generated. When the temperature difference between the cold end and the ambient temperature is large, the water molecules in the air will be condensed into water to achieve the dehumidification effect.

[0003] The dehumidification effect of a semiconductor dehumidifier depends largely on whether the temperature difference between the end that generates cold and the environment is large enough. Current semiconductor dehumidifiers generally extend aluminum fins from the hot end of the refrigeration plate to dissipate heat, and rely on the outgoing airflow to take away the heat for dissipation. However, the traditional heat dissipation structure has a limited heat dissipation area, resulting in poor heat dissipation, which ultimately affects the dehumidification effect. Utility Model Content

[0004] The utility model aims to provide a semiconductor dehumidifier, which improves the heat dissipation structure of the hot end and greatly improves the heat dissipation effect.

[0005] Based on this, the utility model provides a semiconductor dehumidifier, including a shell and a first semiconductor refrigeration component;

[0006] The shell is provided with a first air inlet cavity and an air outlet cavity connected to the first air inlet cavity, and the outer periphery of the shell is provided with a first air inlet portion connected to the first air inlet cavity and an air outlet portion connected to the air outlet cavity;

[0007] The first semiconductor refrigeration assembly includes a first refrigeration element provided on the housing, a first cooling element provided at a cold end of the first refrigeration element and located in the first air inlet cavity, and a first heat dissipation element provided at a hot end of the first refrigeration element and located in the air outlet cavity, wherein the first heat dissipation element extends in a transverse direction in the air outlet cavity and is opposite to the air outlet portion;

[0008] The first heat sink comprises a heat conducting portion attached to the hot end of the first refrigeration element, a heat conducting copper tube connected to the heat conducting portion and extending in the transverse direction, and a plurality of heat dissipating fins arranged on the heat conducting copper tube and spaced in the transverse direction.

[0009] In the semiconductor dehumidifier as described above, the plurality of heat dissipation fins are all aluminum fins.

[0010] In the semiconductor dehumidifier as described above, some of the heat dissipation fins are aluminum fins and copper fins.

[0011] In a semiconductor dehumidifier as described above, a cavity is provided in the shell, and a first mounting frame is also provided in the cavity, the first mounting frame divides the cavity into the first air inlet cavity and the air outlet cavity, and the first air inlet cavity and the air outlet cavity are connected at the lower side of the first mounting frame.

[0012] In the semiconductor dehumidifier as described above, the first refrigeration component is arranged on the first mounting frame.

[0013] In the semiconductor dehumidifier as described above, the air outlet portion includes an air outlet located above the first heat sink, and the first heat sink is transversely arranged on a blowing path of airflow flowing from the bottom of the air outlet cavity to the upper air outlet.

[0014] A semiconductor dehumidifier as described above also includes a second semiconductor refrigeration component, which includes a second refrigeration element, a second cooling element arranged at the cold end of the second refrigeration element, and a second heat dissipation element arranged at the hot end of the second refrigeration element, and the second heat dissipation element and the first heat dissipation element are arranged along the blowing path.

[0015] A semiconductor dehumidifier as described above, wherein a second mounting frame is further provided in the housing, and the second mounting frame separates a second air inlet cavity in communication with the air outlet cavity in the cavity;

[0016] The second refrigeration component is arranged on the second mounting frame, and the second cooling conductive component is located in the second air inlet cavity.

[0017] In the semiconductor dehumidifier as described above, a second air inlet portion communicating with the second air inlet cavity is further provided on the outer periphery of the shell.

[0018] Implementing the embodiments of the utility model has the following beneficial effects:

[0019] The utility model provides a semiconductor dehumidifier, which changes the traditional structure of directly using aluminum fins as the heat dissipation end, and adopts a combined structure of transversely extended heat-conducting copper tubes and fins. The thermal conductivity is high and the heat dissipation effect on the refrigeration parts is good. Through the layout of the structure, the contact between the airflow and the first heat dissipation part can be increased, thereby greatly improving the heat dissipation effect and making the dehumidification effect more significant. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1A schematic diagram of a semiconductor dehumidifier provided by an embodiment of the utility model;

[0022] Figure 2 for Figure 1 Exploded diagram of

[0023] Figure 3 for Figure 1 AA cross-section diagram;

[0024] Figure 4 for Figure 1 An exploded view of the first semiconductor refrigeration component inside;

[0025] Figure 5 It is a schematic diagram of the second embodiment of the semiconductor dehumidifier of the utility model;

[0026] Figure 6 for Figure 5 BB cross-section diagram. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] like Figures 1 to 4As shown, the embodiment of the utility model provides a semiconductor dehumidifier, including a shell 1 and a first semiconductor refrigeration component 2; the shell 1 is provided with a first air inlet cavity 1011 and an air outlet cavity 1012 connected to the first air inlet cavity 1011, the outer periphery of the shell 1 is provided with a first air inlet portion 11 connected to the first air inlet cavity 1011, and an air outlet portion 12 connected to the air outlet cavity 1012, the first semiconductor refrigeration component 2 includes a first refrigeration element 21 provided on the shell 1, a first cooling element 21 provided at the cold end of the first refrigeration element 21 and located in the first air inlet cavity 1011 Part 22, a first heat dissipation part 23 provided at the hot end of the first refrigeration part 21 and located in the air outlet cavity 1012, the first heat dissipation part 23 extends in the air outlet cavity 1012 in a horizontal direction and is opposite to the air outlet portion 12; when the dehumidifier of this scheme is working, the external air is introduced into the first air inlet cavity 1011 through the first air inlet portion 11, and the airflow contacts the first cold-conducting part 22 in the first air inlet cavity 1011 for dehumidification, and then contacts the first heat dissipation part 23 and flows out from the air outlet portion 12 after entering the air outlet cavity 1012, thereby taking away the heat and achieving the effect of heat dissipation. Moreover, in order to improve the heat dissipation effect, the first heat dissipation part 23 of this scheme includes a heat-conducting part 231 attached to the hot end of the first refrigeration part 21, a heat-conducting copper tube 232 connected to the heat-conducting part and extending in the horizontal direction, and a plurality of heat dissipation fins 233 provided on the heat-conducting copper tube 232 and arranged in a horizontal direction at intervals. This solution changes the traditional structure of directly using aluminum fins as the heat dissipation end, and adopts a combined structure of transversely extended heat-conducting copper tubes and fins. The structure has high thermal conductivity and has a good thermal conductivity and heat dissipation effect on the refrigeration components. Through the layout of the structure, the contact between the airflow and the first heat dissipation component can be increased, thereby greatly improving the heat dissipation effect and making the dehumidification effect more significant.

[0029] In this solution, a heat-conducting copper tube 212 is used, which mainly utilizes the characteristics of copper material and has a fast heat conduction. The thermal conductivity of pure copper is as high as 401W / m*K. Among common metals, it is second only to silver 429W / m*K and far higher than aluminum 240W / m*K. This greatly improves the first heat dissipation element 23 to guide the heat from the hot end of the first cooling element 21 to the heat dissipation fins 233, thereby greatly improving the heat dissipation effect.

[0030] In the embodiment of the utility model, the first embodiment of the heat dissipation fin is: the plurality of heat dissipation fins 233 are all aluminum fins. The function of the heat dissipation fins 233 is to increase the contact area with the airflow so that the heat is taken out by the airflow to achieve heat dissipation. The advantage of the first embodiment is that the aluminum fins are used at a lower cost.

[0031] In the embodiment of the utility model, the first embodiment of the heat dissipation fin is: some of the heat dissipation fins 233 are aluminum fins and copper fins. That is, some of the multiple fins are aluminum fins and some are copper fins, which ensures the heat dissipation efficiency while being lighter in weight. Of course, a solution in which all the fins are copper fins can also be adopted, which can make the heat dissipation fins themselves lighter and thinner, and have better thermal conductivity.

[0032] In the embodiment of the utility model, a cavity is provided in the shell 1, and a first mounting frame 31 is also provided in the cavity, and the first mounting frame 31 divides the cavity into the first air inlet cavity 1011 and the air outlet cavity 1012, and the first air inlet cavity 1011 and the air outlet cavity 1012 are connected at the lower side of the first mounting frame 31. In this solution, the first mounting frame 31 is used to separate the cavity, so that the structure is simpler. Moreover, the first refrigeration component 21 is arranged on the first mounting frame 31. The first mounting frame 31 also serves as the mounting structure of the first refrigeration component 21, which facilitates the assembly of the product. Specifically, a through mounting port is provided on the first mounting frame 31, so that when the first refrigeration component 21 is installed thereon, the cold end can be directed toward the first air inlet cavity 1011, and the hot end can be directed toward the air outlet cavity 1012.

[0033] In the embodiment of the utility model, the air outlet 12 includes an air outlet located above the first heat sink 23, and the first heat sink 23 is horizontally arranged on the blowing path of the airflow from the bottom of the air outlet cavity 1012 to the upper air outlet. Its reasonable mechanism design is conducive to increasing the contact area between the airflow and the first heat sink 23 when it flows out, thereby improving the heat dissipation effect.

[0034] The utility model can increase the heat dissipation effect by arranging more heat dissipation fins in the horizontal direction of the heat-conducting copper tube. Of course, a plurality of heat dissipation components can also be arranged on the blowing path to increase the heat dissipation effect.

[0035] like Figure 5 , Figure 6 As shown, the utility model includes an embodiment of a double refrigeration component, which specifically includes a second semiconductor refrigeration component 4, the second semiconductor refrigeration component 4 includes a second refrigeration element 41, a second cooling element 42 provided at the cold end of the second refrigeration element 41, and a second heat sink 43 provided at the hot end of the second refrigeration element 21, and the second heat sink 43 and the first heat sink 23 are arranged along the blowing path. It is applicable to the solution of multiple refrigeration components, and the first heat sink 23 and the second heat sink 43 can be reasonably arranged, so that the airflow flows through the first heat sink 23 and the second heat sink 43 respectively when flowing out, and a good heat dissipation effect is achieved.

[0036] Specifically, a second mounting frame 32 is further provided in the housing 1, and the second mounting frame 32 separates a second air inlet cavity 1013 in communication with the air outlet cavity 1012 in the cavity;

[0037] The second refrigeration element 41 is arranged on the second mounting frame 32, and the second cooling element 42 is located in the second air inlet cavity 1013. This facilitates the installation of the second semiconductor refrigeration assembly 4. In addition, a second air inlet portion 13 connected to the second air inlet cavity 1013 is also arranged on the outer periphery of the housing 1. That is, this solution greatly increases the area of ​​air intake, making the overall dehumidification efficiency of the dehumidifier higher. Moreover, the structure is simple, and there is no need to consider the difficulty of processing.

[0038] The utility model provides a semiconductor dehumidifier, which changes the traditional structure of directly using aluminum fins as the heat dissipation end, and adopts a combined structure of transversely extended heat-conducting copper tubes and fins. The thermal conductivity is high and the heat dissipation effect on the refrigeration parts is good. Through the layout of the structure, the contact between the airflow and the first heat dissipation part can be increased, thereby greatly improving the heat dissipation effect and making the dehumidification effect more significant.

[0039] It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information. In addition, the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the protection scope of the present invention.

Claims

1. A semiconductor dehumidifier, characterized in that: It comprises a shell (1) and a first semiconductor refrigeration component (2); A first air inlet cavity (1011) and an air outlet cavity (1012) in communication with the first air inlet cavity (1011) are provided in the shell (1); a first air inlet portion (11) in communication with the first air inlet cavity (1011) and an air outlet portion (12) in communication with the air outlet cavity (1012) are provided on the outer periphery of the shell (1); The first semiconductor refrigeration component (2) comprises a first refrigeration element (21) arranged on the shell (1), a first cooling element (22) arranged at the cold end of the first refrigeration element (21) and located in the first air inlet cavity (1011), and a first heat dissipation element (23) arranged at the hot end of the first refrigeration element (21) and located in the air outlet cavity (1012), wherein the first heat dissipation element (23) extends laterally in the air outlet cavity (1012) and is opposite to the air outlet portion (12); The first heat dissipation component (23) comprises a heat conduction portion (231) affixed to the hot end of the first refrigeration component (21), a heat conduction copper tube (232) connected to the heat conduction portion and extending laterally, and a plurality of heat dissipation fins (233) arranged on the heat conduction copper tube (232) and spaced apart laterally.

2. A semiconductor dehumidifier according to claim 1, characterized in that: Several of the heat dissipation fins (233) are aluminum fins.

3. A semiconductor dehumidifier according to claim 1, characterized in that: Some of the heat dissipation fins (233) are aluminum fins and copper fins.

4. A semiconductor dehumidifier according to claim 1, characterized in that: A cavity is provided in the shell (1), and a first mounting frame (31) is also provided in the cavity; the first mounting frame (31) divides the cavity into the first air inlet cavity (1011) and the air outlet cavity (1012); and the first air inlet cavity (1011) and the air outlet cavity (1012) are connected at the bottom of the first mounting frame (31).

5. A semiconductor dehumidifier according to claim 4, characterized in that: The first refrigeration component (21) is arranged on the first mounting frame (31).

6. A semiconductor dehumidifier according to claim 4, characterized in that: The air outlet portion (12) comprises an air outlet located above the first heat sink (23), and the first heat sink (23) is arranged transversely on a blowing path of airflow flowing from the bottom of the air outlet cavity (1012) to the upper air outlet.

7. A semiconductor dehumidifier according to claim 6, characterized in that: The invention also comprises a second semiconductor refrigeration component (4), wherein the second semiconductor refrigeration component (4) comprises a second refrigeration element (41), a second cooling element (42) provided at the cold end of the second refrigeration element (41), and a second heat dissipation element (43) provided at the hot end of the second refrigeration element (41), wherein the second heat dissipation element (43) and the first heat dissipation element (23) are arranged along a blowing path.

8. A semiconductor dehumidifier according to claim 7, characterized in that: A second mounting frame (32) is also provided in the shell (1), and the second mounting frame (32) separates a second air inlet cavity (1013) in the cavity that is in communication with the air outlet cavity (1012); The second refrigeration component (41) is arranged on the second mounting frame (32), and the second cooling component (42) is located in the second air inlet cavity (1013).

9. A semiconductor dehumidifier according to claim 8, characterized in that: A second air inlet portion (13) communicating with the second air inlet cavity (1013) is also provided on the outer periphery of the shell (1).

Images