Chip suction nozzle and chip welding device formed by same

Abstract

The utility model provides a chip suction nozzle and a chip welding device formed by the chip suction nozzle, and belongs to the technical field of semiconductor packaging, the chip suction nozzle comprises a rod part and a head part, and further comprises a through gas channel extending from the rod part to the head part, the gas channel comprises a first gas channel located in the rod part and a second gas channel located in the head part, first elastic buffer parts are arranged in the middle and above the first gas channel and on the circumferential outer wall of the second gas channel, second elastic buffer parts are arranged on the first elastic buffer parts and the circumferential outer wall below the middle of the first gas channel, and the first elastic buffer parts and the second elastic buffer parts are mutually clamped and tightly fixed; through cooperative work of the first elastic buffer part made of high-density sponge and the second elastic buffer part made of rubber, the problems that chips crack due to the brittle characteristic of gallium arsenide materials and circuits on the surfaces of the chips are damaged due to chip air bridge design can be solved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, and in particular to a chip suction nozzle and a chip welding device composed of the same. Background Art

[0002] The chip loading process in the conductor packaging process is to install the chip on the fixed area base island of the substrate & frame according to the position requirements of the drawing. During the fixing process, the nozzle is required to suck the chip, and then the chip is placed on the fixed mounting area of ​​the substrate; however, with the rapid development of semiconductors, the requirements for chips are getting higher and higher. The chips are required to improve electron mobility, high temperature resistance, high breakdown voltage, or direct energy band operation. Therefore, the chip material has been transformed from silicon to gallium arsenide. However, gallium arsenide material is brittle and easily causes chip cracks, or the air arch bridge design of the chip causes the middle of the bridge to bulge, forming a suspended air bridge. Therefore, the conventional nozzle structure cannot meet the production of such products. Summary of the invention

[0003] Purpose of the invention: The purpose of the present invention is to address the deficiencies in the prior art and to provide a chip suction nozzle and a chip welding device composed of the same. The coordinated work of a first elastic buffer portion made of high-density sponge and a second elastic buffer portion made of rubber can solve the problems of chip cracks caused by the brittle nature of gallium arsenide materials and chip surface circuit damage caused by the chip air bridge design.

[0004] Technical solution: The chip suction nozzle described in the present invention includes a stem and a head, and also includes a penetrating gas channel extending from the stem to the head, the gas channel includes a first gas channel located in the stem and a second gas channel located in the head, a first elastic buffer portion is provided in the middle and above the first gas channel and on the circumferential outer wall of the second gas channel, a second elastic buffer portion is provided on the first elastic buffer portion and on the circumferential outer wall of the middle and below the first gas channel, the first elastic buffer portion and the second elastic buffer portion are engaged with each other and tightly fixed.

[0005] Furthermore, the material of the first elastic buffer part is a high-density sponge. Since the sponge itself is not a fully sealed structure but has tiny pores, the vacuum leaks out from the tiny pores to increase the adsorption area.

[0006] Furthermore, the second elastic buffer portion is made of rubber, and the use of rubber to design a circle around the outer edge of the suction nozzle can prevent vacuum leakage, and at the same time can increase the hardness of the suction nozzle to prevent the sponge from being deformed by force.

[0007] Furthermore, the first elastic buffer portion includes a working end flush with the surface of the working surface of the second gas channel, and the bottom sides of the working end are inclined outward to form an inclined surface, the bottom of the inclined surface extends vertically downward to form a side wall, and the side wall extends vertically outward to form a connecting portion.

[0008] Furthermore, the connecting portion extends a first ridge and a second ridge in two directions, downward and outward, respectively.

[0009] Further, the diameter of the first gas channel is greater than the diameter of the second gas channel.

[0010] A chip welding device comprises the chip suction nozzle.

[0011] Beneficial effects: Compared with the prior art, the advantages of the present invention are:

[0012] (1) Since gallium arsenide is relatively brittle, a normal suction nozzle presses on the chip surface due to hardness problems, causing chip cracks. The present invention uses a sponge to contact the chip as a whole. Since the sponge is relatively soft, it can improve the problem of cracks caused by pressure on the chip surface;

[0013] (2) The chip is contacted with the whole sponge to solve the problem of the hardness of the material directly in contact with the chip surface decreasing, thus solving the problem of chip surface circuit damage caused by the chip air bridge design;

[0014] (3) The present invention can improve packaging efficiency through the coordinated work of the first elastic buffer portion and the second elastic buffer portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the present invention;

[0016] Figure 2 is a cross-sectional view of the present invention;

[0017] Figure 3 It is a structural schematic diagram of the first elastic buffer part in the present invention;

[0018] Figure 4 It is a perspective view of the present invention. DETAILED DESCRIPTION

[0019] The technical solution of the present invention is described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the embodiments.

[0020] like Figures 1 to 4A chip suction nozzle shown includes a stem 1 and a head 2, and also includes a penetrating gas channel 3 extending from the stem 1 to the head 2, the gas channel 3 includes a first gas channel 3-1 located in the stem 1 and a second gas channel 3-2 located in the head 2, and the diameter of the first gas channel 3-1 is greater than the diameter of the second gas channel 3-2. A first elastic buffer 4 is provided on the middle and above of the first gas channel 3-1 and the circumferential outer wall of the second gas channel 3-2, and a second elastic buffer 5 is provided on the first elastic buffer 4 and the circumferential outer wall of the middle and below of the first gas channel 3-1, and the first elastic buffer 4 and the second elastic buffer 5 are mutually engaged and tightly fixed. Figure 2 In the figure, the first gas channel 3-1 is the device for installing the welding head area of ​​the machine, and the second gas channel 3-2 is the vacuum hole. The connection is shown by a dotted line. The dotted line represents that the sponge can be designed to be fully enclosed, and the vacuum leaks out from the gaps in the sponge. This place can also be connected, or a hole can be opened in the middle to enhance the vacuum suction.

[0021] The first elastic buffer portion 4 includes a working end 4-1 flush with the surface of the working surface of the second gas channel 3-2, and the two sides of the bottom of the working end 4-1 are inclined outward to form an inclined surface 4-2, and the bottom of the inclined surface 4-2 vertically extends a side wall 4-3 downward, and the side wall 4-3 vertically extends outward to form a connecting portion 4-4; the connecting portion 4-4 extends a first ridge 4-5 and a second ridge 4-6 in two directions downward and outward respectively.

[0022] In this embodiment, the nozzle can be reduced by 3 to 10 um on both sides of the structure facing the new product according to the chip size; the material of the first elastic buffer part 4 is high-density sponge; the material of the second elastic buffer part 5 is rubber, wherein the high-density sponge and rubber can be related products of Meike Precision Machinery (Suzhou) Co., Ltd.

[0023] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes in form and details may be made without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A chip suction nozzle, comprising a stem (1) and a head (2), and further comprising a penetrating gas channel (3) extending from the stem (1) to the head (2), wherein the gas channel (3) comprises a first gas channel (3-1) located in the stem (1) and a second gas channel (3-2) located in the head (2), characterized in that: A first elastic buffer portion (4) is provided at and above the middle portion of the first gas channel (3-1) and on the circumferential outer wall of the second gas channel (3-2); a second elastic buffer portion (5) is provided on the first elastic buffer portion (4) and on the circumferential outer wall of and below the middle portion of the first gas channel (3-1); the first elastic buffer portion (4) and the second elastic buffer portion (5) are mutually engaged and tightly fixed.

2. A chip suction nozzle according to claim 1, characterized in that: The material of the first elastic buffer part (4) is high-density sponge.

3. The chip suction nozzle according to claim 1, characterized in that: The material of the second elastic buffer part (5) is rubber.

4. The chip suction nozzle according to claim 1, characterized in that: The first elastic buffer portion (4) comprises a working end (4-1) flush with the surface of the working surface of the second gas channel (3-2), the bottom of the working end (4-1) is inclined outwards on both sides to form an inclined surface (4-2), the bottom of the inclined surface (4-2) vertically extends downward to form a side wall (4-3), and the side wall (4-3) vertically extends outwards to form a connecting portion (4-4).

5. The chip suction nozzle according to claim 4, characterized in that: The connecting portion (4-4) extends a first convex ridge (4-5) and a second convex ridge (4-6) in two directions, downward and outward, respectively.

6. The chip suction nozzle according to claim 1, characterized in that: The diameter of the first gas channel (3-1) is greater than the diameter of the second gas channel (3-2).

7. A chip bonding device, characterized in that: The invention comprises a chip suction nozzle as described in any one of claims 1 to 5.

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