Wafer transfer device with scratch-proof structure

Abstract

The utility model discloses a wafer transfer device with a scratch-proof structure, which belongs to the technical field of wafer transfer devices and comprises a clamping transfer component, an air cylinder part is arranged at the upper end of the clamping transfer component, a mounting seat is arranged on one side of the air cylinder part, and a support component is connected to the bottom wall of one end, far away from the air cylinder part, of the mounting seat. According to the utility model, by starting the electric slide rail, the connecting frame and the clamping arm can move left and right, the two groups of clamping blocks can be close to each other, a wafer can be clamped and placed in the groove, and the wear between the side walls of the wafer can be effectively reduced by using the wear-resistant layer, so that the service life of the wafer is prolonged. And the contact area between the wafer and the clamping block can be reduced through the arranged inclined plane part, the scratch-proof effect can be achieved, abrasion to the surface of the wafer is reduced, scratches are reduced, then the motor is started, the rotating frame can be driven to rotate, the mounting base, the air cylinder part and the clamping and transferring component are made to rotate, and the wafer can be transferred.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer transfer devices, in particular to a wafer transfer device provided with an anti-scratch structure. Background Art

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. Wafer transfer devices are mainly used in the semiconductor manufacturing industry and play a vital role in semiconductor production lines. They can ensure the efficient transfer of wafers between different process steps to ensure the stability and efficiency of the production line.

[0003] Currently, when using a transfer device to transfer wafers, the wafers are usually clamped by a clamping arm and then rotated so that the wafers can be transferred. However, during the use of the wafer transfer device, friction will occur between the wafer and the clamping arm, causing scratches on the wafer surface, affecting the quality and performance of semiconductor products.

[0004] Therefore, we propose a wafer transfer device with an anti-scratch structure to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer transfer device with an anti-scratch structure. By adopting the device to work, the problem of friction between the wafer and the clamping arm, resulting in scratches on the wafer surface, affecting the quality and performance of semiconductor products, is solved.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer transfer device with an anti-scratch structure, comprising a clamping and transferring member, a cylinder is provided at the upper end of the clamping and transferring member, a mounting seat is provided at one side of the cylinder, a bracket member is connected to the bottom wall of one end of the mounting seat away from the cylinder, a purge member for purge is provided at the outer side of the clamping and transferring member, and when the cylinder operates, the clamping and transferring member can be pushed to move;

[0007] The clamping and transporting component includes a fixed frame arranged at the telescopic end of the cylinder part and a sliding seat arranged at the upper end of the fixed frame. The upper end of the sliding seat is slidably connected with two groups of electric slide rails. A connecting frame is arranged on one side of the electric slide rail. A clamping arm is installed at the lower end of the connecting frame. A clamping block is arranged on the inner side of the clamping arm. A groove is opened on the inner side of the clamping block. An inclined portion is arranged on the bottom wall of the groove. The inclined portion can reduce the contact area between the wafer and the clamping block. When the electric slide rail drives the connecting frame and the clamping arm to slide on the sliding seat, the two groups of clamping blocks can approach each other, so that the wafer can be clamped, and the inclined portion can cooperate with the clamping arm to prevent scratches.

[0008] Preferably, the support member includes a base and a rotating frame, the rotating frame is placed at the upper end of the base, and a motor is arranged inside the base, the output end of the motor is connected to the rotating frame, and the other end of the rotating frame is connected to the bottom wall of the mounting seat.

[0009] Preferably, a wear-resistant layer is coated on the side wall of the groove.

[0010] Preferably, the purge component includes an air pump arranged on the outer wall of the clamping arm and an air intake pipe connected to an interface at one end of the air pump, an exhaust pipe is connected to an interface at the other end of the air pump, a pipe rack is arranged on the inner side of the clamping block, a pipe is arranged inside the pipe rack, an end of the exhaust pipe away from the air pump passes through the clamping arm and the clamping block and is connected to the pipe in the pipe rack, and a number of exhaust nozzles are evenly distributed on the side wall of the clamping arm, so that air can be ejected from the exhaust nozzles when the air pump is operating.

[0011] Preferably, the opening of the exhaust nozzle faces the groove, so that air can blow the groove.

[0012] Preferably, a filter for filtering gas is provided inside the air intake pipe.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] The wafer can be clamped and transported by the provided cylinder parts and clamping and transporting components, and the inclined surface can be used to reduce the contact area when the clamping block contacts the wafer, and the wear-resistant layer can be used to reduce wear, thereby effectively avoiding scratches on the wafer surface and having a good anti-scratch effect.

[0015] By means of the provided purge component, the groove of the clamping block can be cleaned, so that the clamping part is cleaner and scratches that affect the quality are avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the support component structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the clamping and transporting component of the utility model;

[0019] Figure 4 It is a schematic diagram of the structure of the purge component of the utility model.

[0020] In the figure: 1. bracket component; 11. base; 12. rotating frame; 2. mounting seat; 3. cylinder member; 4. clamping and transporting component; 41. fixed frame; 42. slide seat; 43. electric slide rail; 44. connecting frame; 45. clamping arm; 46. clamping block; 47. groove; 48. wear-resistant layer; 49. inclined portion; 5. purge component; 51. air pump; 52. suction pipe; 53. filter screen; 54. exhaust pipe; 55. pipe rack; 56. exhaust nozzle. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Example 1: Please refer to Figure 1-3 A wafer transfer device with an anti-scratch structure includes a clamping and transferring member 4, a cylinder member 3 is provided at the upper end of the clamping and transferring member 4, a mounting seat 2 is provided on one side of the cylinder member 3, a bracket member 1 is connected to the bottom wall of the end of the mounting seat 2 away from the cylinder member 3, and a purge member 5 for purge is provided on the outer side of the clamping and transferring member 4. When the cylinder member 3 is in operation, the clamping and transferring member 4 can be pushed to move, which can drive the wafer to move up and down;

[0023] The clamping and transporting component 4 includes a fixed frame 41 arranged at the telescopic end of the cylinder member 3 and a slide seat 42 arranged at the upper end of the fixed frame 41. The upper end of the slide seat 42 is slidably connected with two groups of electric slide rails 43. A connecting frame 44 is arranged on one side of the electric slide rail 43. A clamping arm 45 is installed at the lower end of the connecting frame 44. A clamping block 46 is arranged on the inner side of the clamping arm 45. A groove 47 is opened on the inner side of the clamping block 46. A chamfer 49 is arranged on the bottom wall of the groove 47. The chamfer 49 can reduce the contact area between the wafer and the clamping block 46. When the electric slide rail 43 drives the connecting frame 44 and the clamping arm 45 to slide on the slide seat 42, the two groups of clamping blocks 46 can approach each other, so as to clamp the wafer, and cooperate with the chamfer 49 to play a role in preventing scratches and reducing the wear on the wafer surface.

[0024] The support component 1 includes a base 11 and a rotating frame 12. The rotating frame 12 is placed at the upper end of the base 11, and a motor is arranged inside the base 11. The output end of the motor is connected to the rotating frame 12, and the other end of the rotating frame 12 is connected to the bottom wall of the mounting seat 2. When the motor is running, it can drive the rotating frame 12 to rotate, so that the mounting seat 2, the cylinder 3 and the clamping and transferring component 4 also rotate.

[0025] The sidewall of the groove 47 is coated with a wear-resistant layer 48, which can reduce the wear between the groove 47 and the sidewall of the wafer.

[0026] In this embodiment: when the cylinder part 3 is operating, it can push the clamping and transporting component 4 to move downward, and start the electric slide rail 43, which can make the connecting frame 44 and the clamping arm 45 move left and right, and the two groups of clamping blocks 46 can approach each other, so as to clamp the wafer. The wafer is placed in the groove 47, and the wear-resistant layer 48 provided can effectively reduce the wear between the side walls of the wafer, and the inclined portion 49 provided can reduce the contact area between the wafer and the clamping block 46, which can play an anti-scratch role, reduce the wear on the surface of the wafer, and reduce scratches. Then the motor is started to drive the rotating frame 12 to rotate, so that the mounting seat 2, the cylinder part 3 and the clamping and transporting component 4 also rotate, so as to transport the wafer.

[0027] Embodiment 2: This embodiment is an improvement made on the basis of embodiment 1. For details, please refer to Figure 4 The purge component 5 includes an air pump 51 arranged on the outer wall of the clamping arm 45 and an air suction pipe 52 connected to an interface at one end of the air pump 51, and an exhaust pipe 54 is connected to the interface at the other end of the air pump 51. A pipe rack 55 is arranged on the inner side of the clamping block 46, and a pipeline is arranged inside the pipe rack 55. One end of the exhaust pipe 54 away from the air pump 51 passes through the clamping arm 45 and the clamping block 46 and is connected to the pipeline in the pipe rack 55. A number of exhaust nozzles 56 are evenly distributed on the side wall of the clamping arm 45. When the air pump 51 is operating, air can be ejected from the exhaust nozzles 56.

[0028] The opening of the exhaust nozzle 56 is directed toward the groove 47 , so that air can be blown to the groove 47 , thereby reducing dust in the groove 47 and completing the cleaning of the groove 47 , thereby reducing the risk of scratches on the wafer and facilitating the transportation of the wafer.

[0029] A filter 53 for filtering gas is provided inside the air intake pipe 52 , which can filter the inhaled air to prevent dust contained in the gas ejected from the exhaust nozzle 56 from adhering to the groove 47 .

[0030] In this embodiment: before the wafer is transferred and clamped, the air pump 51 is started to suck the gas from the suction pipe 52 and filter it with the filter 53, and then the filtered gas is ejected from the exhaust pipe 54, the pipeline and the exhaust nozzle 56, so that the groove 47 can be purged, making the groove 47 relatively clean and tidy, so as to reduce the risk of scratches on the wafer and facilitate the transfer of the wafer.

[0031] Working principle: Before transferring and clamping the wafer, start the air pump 51 to inhale the gas from the suction pipe 52, and then spray the filtered gas from the exhaust pipe 54, the pipeline and the exhaust nozzle 56, so as to purge the groove 47 and complete the cleaning of the groove 47. When the cylinder part 3 is operating, it can push the clamping and transporting component 4 to move downward, and start the electric slide rail 43 to enable the connecting frame 44 and the clamping arm 45 to move left and right. The two sets of clamping blocks 46 can approach each other to clamp the wafer. Start the motor to drive the rotating frame 12 to rotate, so that the mounting seat 2, the cylinder part 3 and the clamping and transporting component 4 also rotate, and the wafer can be transferred.

[0032] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0033] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer transfer device provided with an anti-scratch structure, comprising a clamping transfer member (4), characterized in that: The upper end of the clamping and transporting member (4) is provided with a cylinder member (3), a mounting seat (2) is provided on one side of the cylinder member (3), a bracket member (1) is connected to the bottom wall of one end of the mounting seat (2) away from the cylinder member (3), and a purge member (5) for purge is provided on the outer side of the clamping and transporting member (4); The clamping and transporting member (4) comprises a fixing frame (41) arranged at the telescopic end of the cylinder member (3) and a slide seat (42) arranged at the upper end of the fixing frame (41); the upper end of the slide seat (42) is slidably connected with two sets of electric slide rails (43); a connecting frame (44) is arranged on one side of the electric slide rail (43); a clamping arm (45) is installed at the lower end of the connecting frame (44); a clamping block (46) is arranged on the inner side of the clamping arm (45); a groove (47) is opened on the inner side of the clamping block (46); and an inclined portion (49) is arranged on the bottom wall of the groove (47).

2. The wafer transfer device with an anti-scratch structure according to claim 1, characterized in that: The support member (1) comprises a base (11) and a rotating frame (12); the rotating frame (12) is placed at the upper end of the base (11); a motor is arranged inside the base (11); an output end of the motor is connected to the rotating frame (12); and the other end of the rotating frame (12) is connected to the bottom wall of the mounting seat (2).

3. The wafer transfer device with an anti-scratch structure according to claim 2, characterized in that: A wear-resistant layer (48) is coated on the side wall of the groove (47).

4. The wafer transfer device with an anti-scratch structure according to claim 3, characterized in that: The purge component (5) comprises an air pump (51) arranged on the outer wall of the clamping arm (45) and an air suction pipe (52) connected to an interface at one end of the air pump (51); an interface at the other end of the air pump (51) is connected to an exhaust pipe (54); a pipe rack (55) is arranged on the inner side of the clamping block (46); a pipeline is arranged inside the pipe rack (55); an end of the exhaust pipe (54) away from the air pump (51) passes through the clamping arm (45) and the clamping block (46) and is connected to the pipeline in the pipe rack (55); and a plurality of exhaust nozzles (56) are evenly distributed on the side wall of the clamping arm (45).

5. The wafer transfer device with an anti-scratch structure according to claim 4, characterized in that: The opening of the exhaust nozzle (56) faces the groove (47).

6. The wafer transfer device with an anti-scratch structure according to claim 5, characterized in that: A filter screen (53) for filtering gas is arranged inside the air intake pipe (52).

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