Transistor forming die assembly
By designing a transistor forming module assembly including cylinders, connecting plates and automated forming modules, the problems of low manual trimming efficiency and difficult to control quality are solved, and efficient and automated pin forming and cutting are achieved.
Patent Information
- Application Number
- CN202421316110.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-06-11
AI Technical Summary
In the prior art, pin trimming of transistors requires manual operation, low efficiency and difficult to control quality.
A transistor forming mold assembly is designed, including a mounting frame, cylinder, connecting plate, guide rod, spring, pressure plate, convex module and cutting board. By combining the drive cylinder and spring, the bending and cutting of transistor pins is automatically completed. deal with.
It improves the working efficiency of transistor pin molding, ensures the quality consistency of the finished product, and reduces the occurrence of human errors.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of transistor molding, in particular to a transistor molding die assembly. Background Art
[0002] Transistor refers to any single component based on semiconductor materials. Transistor has multiple functions such as detection, rectification, amplification, switching, voltage regulation, signal modulation, etc. Transistor can be used for a variety of digital and analog functions.
[0003] Transistors are generally composed of a tube body and injection-molded pins. Pins are generally metal pins. When transistor pins are first produced, they are relatively long to adapt to different usage scenarios. When the transistor is used specifically, the pins of the transistor generally need to be cut.
[0004] During the processing, the transistor pins need to be trimmed to facilitate chip soldering. Manual trimming is not only inefficient but also difficult to control quality. Utility Model Content
[0005] In order to make up for the above shortcomings, the utility model provides a transistor forming mold assembly, which aims to improve the problem that the transistor pins need to be trimmed during the processing process in the prior art to facilitate the welding of the chip. Manual trimming is not only inefficient but also difficult to control the quality.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a transistor forming mold assembly, comprising a mounting frame, wherein the interior of the mounting frame is provided with a storage groove, the interior of the storage groove is fixedly connected to a concave mold part, the top of the mounting frame is fixedly connected to a first cylinder, the output end of the first cylinder is fixedly connected to a first connecting plate, the interior of the first connecting plate is slidably connected to a guide rod, the interior of the mounting frame is slidably connected to a guide rod, the bottom end of the guide rod is fixedly connected to a second connecting plate, the bottom of the first connecting plate is fixedly connected to a spring, the bottom end of the spring is fixedly connected to the top of the second connecting plate, the bottom of the second connecting plate is fixedly connected to a pressure plate, and the top of the mounting frame is fixedly connected to a bending assembly.
[0007] Furthermore, the bending assembly includes a second cylinder, an output end of the second cylinder is fixedly connected to a third connecting plate, and a convex module is fixedly connected to the bottom of the third connecting plate.
[0008] Furthermore, transistors are arranged inside the concave mold parts, pins are fixedly connected to the front sides of the transistors, and convex modules are arranged on the tops of the pins.
[0009] Furthermore, the pressure plates are all arranged on top of the transistors.
[0010] Furthermore, a support frame is fixedly connected to the front side of the mounting frame, and a third cylinder is fixedly connected to the top of the support frame.
[0011] Furthermore, a cutting plate is fixedly connected to the output end of the third cylinder, the cutting plate is slidably connected to the inner side of the support frame, and a cutting blade is fixedly connected to the bottom of the cutting plate.
[0012] Furthermore, a collection box is fixedly connected to the front side of the mounting frame, and a filter plate is arranged inside the collection box.
[0013] The utility model has the following beneficial effects:
[0014] 1. In the utility model, the first connecting plate is driven by the first cylinder, the first connecting plate compresses the second connecting plate through the spring, the second connecting plate drives the pressure plate to fix the transistor, and then the third connecting plate and the convex module are driven by the second cylinder to bend the pins of the transistor, so that the pins of the transistor to be shaped are bent, which improves the work efficiency and the yield rate.
[0015] 2. In the utility model, the pressing plate and the convex module are pressed down and fixed, and then the cutting plate and the cutting blade are driven to move by driving the third cylinder. The cutting blade cuts the pins of the transistor, so that when the transistor pins are cut, the position of the transistor will not be shifted, and the cutting accuracy will not be affected. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A three-dimensional diagram of a transistor forming die assembly proposed by the utility model;
[0017] Figure 2 A partial structural cross-sectional view of a transistor molding die assembly proposed by the utility model;
[0018] Figure 3 for Figure 2 Enlarged view of point A in the middle.
[0019] Legend:
[0020] 1. Mounting frame; 2. Storage slot; 3. Concave mold; 4. First cylinder; 5. First connecting plate; 6. Second connecting plate; 7. Spring; 8. Guide rod; 9. Press plate; 10. Transistor; 11. Second cylinder; 12. Third connecting plate; 13. Male module; 14. Pin; 15. Support frame; 16. Third cylinder; 17. Cutting plate; 18. Cutting disc; 19. Collecting box; 20. Filter plate. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] Reference Figure 1 , Figure 2 and Figure 3 The utility model provides an embodiment: a transistor forming mold assembly, including a mounting frame 1, the mounting frame 1 is provided with a storage slot 2, the storage slot 2 is fixedly connected to a concave mold 3, the top of the mounting frame 1 is fixedly connected to a first cylinder 4, the output end of the first cylinder 4 is fixedly connected to a first connecting plate 5, the first connecting plate 5 is slidably connected to a guide rod 8, the interior of the mounting frame 1 is slidably connected to the guide rod 8, the bottom end of the guide rod 8 is fixedly connected to a second connecting plate 6, the bottom of the first connecting plate 5 is fixedly connected to a spring 7, the bottom end of the spring 7 is fixedly connected to the top of the second connecting plate 6, the bottom of the second connecting plate 6 is fixedly connected to a pressing plate 9, the top of the mounting frame 1 is fixedly connected to a bending assembly, the bending assembly includes a second cylinder 11, the output end of the second cylinder 11 is fixedly connected to a third connecting plate 12, and the bottom of the third connecting plate 12 is fixedly connected to a convex module 13.
[0023] The storage groove 2 is used to prevent the concave mold part 3. The first cylinder 4 cooperates with the guide rod 8 to drive the first connecting plate 5 to compress the second connecting plate 6 through the spring 7. The second connecting plate 6 is compressed and descended to drive the pressure plate 9 to descend. The pressure plate 9 presses and fixes the transistor 10. The spring 7 plays a role of buffer protection. The second cylinder 11 drives the third connecting plate 12 and the convex module 13 to bend the pin 14.
[0024] Reference Figure 1 , Figure 2 and Figure 3 , transistors 10 are arranged inside the concave mold parts 3, pins 14 are fixedly connected to the front sides of the transistors 10, convex modules 13 are arranged on the tops of the pins 14, pressure plates 9 are arranged on the tops of the transistors 10, support frames 15 are fixedly connected to the front sides of the mounting frames 1, and third cylinders 16 are fixedly connected to the tops of the support frames 15.
[0025] The female mold part 3 is used for placing the transistor 10 , the male mold part 13 is used for bending the pins 14 , the pressing plate 9 is used for pressing the transistor 10 to prevent it from shifting during bending, and the supporting frame 15 is used for installing the third cylinder 16 .
[0026] Reference Figure 1 and Figure 2The output end of the third cylinder 16 is fixedly connected with a cutting plate 17, and the cutting plate 17 is slidably connected to the inner side of the support frame 15. The bottom of the cutting plate 17 is fixedly connected with a cutting blade 18. The front side of the mounting frame 1 is fixedly connected with a collecting box 19, and a filter plate 20 is arranged inside the collecting box 19.
[0027] The cutting plate 17 and the cutting blade 18 are driven by the third cylinder 16 to cut the pins 14 of the transistor 10. The collection box 19 is used to collect the transistor 10 and the cut excess pins 14. The filter plate 20 is used to filter the transistor 10 so that the excess pins 14 fall to the bottom of the collection box 19, thereby facilitating the collection of the transistor 10.
[0028] Working principle: When using the device, the transistor 10 is placed on the concave mold part 3 in the storage groove 2. After placement, the first connecting plate 5 is driven by driving the first cylinder 4. The first connecting plate 5 compresses the second connecting plate 6 through the spring 7. The second connecting plate 6 drives the pressing plate 9 to fix the transistor 10. Then, the second cylinder 11 drives the third connecting plate 12 and the convex module 13 to bend the pin 14 of the transistor 10, so that the pin 14 of the transistor 10 to be shaped is bent, which improves the work efficiency. After the bending process, the excessively long pin 14 is cut. Under the fixation of the pressing plate 9 and the convex module 13, the cutting plate 17 and the cutting blade 18 are driven by driving the third cylinder 16 to move, and the cutting blade 18 cuts the pin 14 of the transistor 10, so that when the pin 14 of the transistor 10 is cut, the position of the transistor 10 will not be offset, which will not affect the accuracy of the cutting, and the cut excess pin 14 falls into the collection box 19.
[0029] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A transistor molding die assembly, comprising a mounting frame (1), characterized in that: The mounting frame (1) is provided with a storage groove (2) inside, and the inside of the storage groove (2) is fixedly connected with a concave mold part (3), the top of the mounting frame (1) is fixedly connected with a first cylinder (4), the output end of the first cylinder (4) is fixedly connected with a first connecting plate (5), the inside of the first connecting plate (5) is slidably connected with a guide rod (8), the inside of the mounting frame (1) is slidably connected with a guide rod (8), the bottom end of the guide rod (8) is fixedly connected with a second connecting plate (6), the bottom of the first connecting plate (5) is fixedly connected with a spring (7), the bottom end of the spring (7) is fixedly connected to the top of the second connecting plate (6), the bottom of the second connecting plate (6) is fixedly connected with a pressure plate (9), and the top of the mounting frame (1) is fixedly connected with a bending component.
2. A transistor forming die assembly according to claim 1, characterized in that: The bending assembly comprises a second cylinder (11), the output end of the second cylinder (11) is fixedly connected to a third connecting plate (12), and the bottom of the third connecting plate (12) is fixedly connected to a convex module (13).
3. A transistor forming die assembly according to claim 1, characterized in that: A transistor (10) is arranged inside each of the concave mold parts (3), a pin (14) is fixedly connected to the front side of each of the transistors (10), and a convex mold part (13) is arranged on the top of each of the pins (14).
4. A transistor forming die assembly according to claim 1, characterized in that: The pressure plates (9) are all arranged on the top of the transistors (10).
5. The transistor forming die assembly according to claim 1, characterized in that: The front side of the mounting frame (1) is fixedly connected to a support frame (15), and the top of the support frame (15) is fixedly connected to a third cylinder (16).
6. A transistor forming die assembly according to claim 5, characterized in that: The output end of the third cylinder (16) is fixedly connected to a cutting plate (17), the cutting plate (17) is slidably connected to the inner side of the support frame (15), and the bottom of the cutting plate (17) is fixedly connected to a cutting blade (18).
7. A transistor molding die assembly according to claim 1, characterized in that: A collection box (19) is fixedly connected to the front side of the mounting frame (1), and a filter plate (20) is arranged inside the collection box (19).