Cooling liquid circulating device for silicon wafer cutting

Abstract

The utility model relates to the field of silicon wafer cutting, and particularly discloses a cooling liquid circulating device for silicon wafer cutting, which comprises a cutting machine, a circulating recovery mechanism arranged in the cutting machine, a recovery bin arranged in the circulating recovery mechanism, cooling bins mounted at two side ends above the recovery bin, and two push plates mounted in the recovery bin, piston gaskets are installed on the opposite faces of the two push plates, piston rods are installed at the ends, away from the piston gaskets, of the two push plates, hydraulic cylinders are connected to the positions, located in the cutting machine, of the ends of the piston rods, backflow holes are formed in the positions, located above the piston rods, of the outer side wall of the recycling bin in an array mode, and circulating liquid pipes are connected to the outer sides of the backflow holes. After the liquid level of the cooling liquid rises, the cooling liquid falls into the cavities in the two side ends of the recovery bin from the side end of the push plate, and the precipitated cooling supernatant can be recycled for cooling treatment again.

Description

Technical Field

[0001] The utility model relates to the field of silicon slice cutting, in particular to a cooling liquid circulation device for silicon slice cutting. Background Art

[0002] Diamond wire is made by uniformly consolidating diamond powder particles on a mother wire (usually a high-carbon steel wire) with a certain distribution density. The cutting purpose is achieved through high-speed grinding movement between the diamond wire and the object to be cut. The temperature during cutting is usually high, and coolant is needed to cool the cutting position.

[0003] However, since a large amount of coolant is consumed during the cutting process, the used coolant needs to be filtered before it can be used again. Therefore, when a large amount of coolant remains in the cutting machine, the machine needs to be stopped and removed before it can be cooled again. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a cooling liquid circulation device for silicon wafer cutting, which solves the problems mentioned in the above background.

[0005] The utility model provides the following technical solution: a cooling liquid circulation device for silicon wafer cutting, comprising a cutting machine, a circulation recovery mechanism is arranged inside the cutting machine, a recovery bin is arranged inside the circulation recovery mechanism, cooling bins are installed on both side ends above the recovery bin, two push plates are installed inside the recovery bin, piston gaskets are installed on opposite surfaces of the two push plates, piston rods are installed on the ends of the two push plates away from the piston gaskets, the ends of the piston rods are located inside the cutting machine and are connected to a hydraulic cylinder, the outer wall of the recovery bin is located above the piston rod and is provided with reflux holes in an array, and the outer sides of the reflux holes are connected to circulating liquid pipes.

[0006] As a further solution of the utility model: a cooling pipe rack is installed on the upper surface of the cutting machine, a liquid spraying pipe is arranged inside the cooling pipe rack, a steering shaft is connected between the two ends of the liquid spraying pipe and the cooling pipe rack, and a liquid injection pipe is connected above the liquid spraying pipe.

[0007] As a further solution of the utility model: an anti-overflow baffle is installed between the upper end of the recovery bin and the cooling bin, a first roller is installed on one side of the interior of the cutting machine, and a second roller is installed on the other side of the interior of the cutting machine.

[0008] As a further solution of the utility model: the reflux hole and the circulating liquid pipe are connected in a through-flow arrangement, and the piston gasket and the push plate are fixedly connected. The reflux hole and the circulating liquid pipe are connected in a through-flow arrangement, and the piston gasket and the push plate are fixedly connected.

[0009] As a further solution of the utility model: the height dimension length of the push plate is smaller than the depth dimension length of the recovery bin.

[0010] As a further solution of the utility model: the liquid spray pipe is movably connected to the cooling pipe rack through the direction adjustment shaft.

[0011] As a further solution of the utility model: the piston rod is fixedly connected to the push plate.

[0012] As a further solution of the utility model: a cutting wire is installed between the first roller and the second roller.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] Impurities remaining in the coolant will settle inside the recovery bin. When the coolant level rises, it will fall from the side ends of the push plate into the cavities on both sides of the recovery bin. The precipitated cooling supernatant can then be recycled for further cooling treatment.

[0015] The hydraulic cylinder as a whole uses the piston rod to control the push plate to move again in the direction close to the cooling chamber. The overflowing coolant inside is pushed into the circulating liquid pipe through the reflux hole and then sprayed to the outside of the first roller and the second roller and stored in the cooling chamber for cooling treatment. The spray pipe can be used for intermittent flushing and cooling treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a cooling liquid circulation device for silicon wafer cutting;

[0017] Figure 2 A cross-sectional view of a cutting machine in a cooling liquid circulation device for cutting silicon wafers;

[0018] Figure 3 It is a structural schematic diagram of a circulation recovery mechanism in a cooling liquid circulation device for silicon wafer cutting;

[0019] Figure 4 It is a schematic diagram of the structure of a coolant rack in a coolant circulation device for silicon wafer cutting;

[0020] Figure 5 A top view of a cutting machine in a coolant circulation device for cutting silicon wafers.

[0021] In the figure: 1, cutting machine; 2, first roller; 3, second roller; 4, cooling pipe rack; 5, circulating liquid pipe; 6, circulating recovery mechanism; 401, liquid spraying pipe; 402, liquid injection pipe; 403, steering shaft; 601, recovery bin; 602, push plate; 603, piston rod; 604, hydraulic cylinder; 605, piston gasket; 606, cooling bin; 607, anti-overflow baffle; 608, reflux hole. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] like Figure 1-5 As shown, this embodiment provides a cooling liquid circulation device for silicon wafer cutting, including a cutting machine 1, a circulation recovery mechanism 6 is arranged inside the cutting machine 1, a recovery bin 601 is arranged inside the circulation recovery mechanism 6, cooling bins 606 are installed on both sides above the recovery bin 601, two push plates 602 are installed inside the recovery bin 601, the height dimension length of the push plates 602 is less than the depth dimension length of the recovery bin 601, piston gaskets 605 are installed on the opposite surfaces of the two push plates 602, the piston gaskets 605 are fixedly connected to the push plates 602, piston rods 603 are installed at the ends of the two push plates 602 away from the piston gaskets 605, the piston rods 603 are fixedly connected to the push plates 602, the end of the piston rod 603 is located inside the cutting machine 1 and is connected to a hydraulic cylinder 604, the outer wall of the recovery bin 601 is located above the piston rod 603 and is provided with a reflux hole 608 in an array, the outer side of the reflux hole 608 is connected to a circulating liquid pipe 5, and the reflux hole 608 is connected to the circulating liquid pipe 5.

[0024] like Figure 2-5 As shown, in this embodiment, a cooling pipe rack 4 is installed on the upper surface of the cutting machine 1, and a liquid spraying pipe 401 is arranged inside the cooling pipe rack 4. Adjustment shafts 403 are connected between the two ends of the liquid spraying pipe 401 and the cooling pipe rack 4. The liquid spraying pipe 401 is movably connected to the cooling pipe rack 4 through the adjustment shaft 403. A liquid injection pipe 402 is connected above the liquid spraying pipe 401, and an anti-overflow baffle 607 is installed between the upper end of the recovery bin 601 and the cooling bin 606. A first roller 2 is installed on one side of the interior of the cutting machine 1, and a second roller 3 is installed on the other side of the interior of the cutting machine 1. A cutting wire is installed between the first roller 2 and the second roller 3.

[0025] The working principle of the utility model is as follows: when in use, the cooling tube rack 4 is arranged as a whole on both sides of the cut silicon rod, and the spray pipe 401 is used to rotate and adjust the angle through the adjustment shaft 403 and the cooling tube rack 4, so that the coolant is impacted at the inlet and outlet line positions corresponding to the contact between the silicon rod and the cutting line, and the flushed coolant will fall into the inside of the recovery bin 601, and the two push plates 602 inside the recovery bin 601 are moved as a whole to the position of the cooling bin 606 close to the two side ends, so that the cavity formed between the two push plates 602 and the recovery bin 601 is used to collect the used coolant, and the impurities retained in the coolant will be precipitated inside the recovery bin 601. After rising, it falls from the side end of the push plate 602 into the cavity at the two side ends of the recovery bin 601, and then the hydraulic cylinder 604 uses the piston rod 603 to control the push plate 602 to move again towards the cooling bin 606. The overflowing coolant inside is pushed into the inside of the circulating liquid pipe 5 through the reflux hole 608 and then sprayed to the outside of the first roller 2 and the second roller 3 and stored in the cooling bin 606 to cool the steel wire at the first roller 2 and the second roller 3. Therefore, the spray pipe 401 at the cooling pipe rack 4 can perform intermittent spray cooling for cooling, and the injection pipe 402 can use the overflowing coolant to absorb for recycling.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling liquid circulation device for silicon wafer cutting, comprising a cutting machine (1), characterized in that: A recycling mechanism (6) is provided inside the cutting machine (1), and a recycling bin (601) is provided inside the recycling mechanism (6). Cooling bins (606) are installed on both sides above the recycling bin (601). Two push plates (602) are installed inside the recycling bin (601), and piston gaskets (605) are installed on opposite surfaces of the two push plates (602). A piston rod (603) is installed at one end of the two push plates (602) away from the piston gasket (605). The end of the piston rod (603) is located inside the cutting machine (1) and is connected to a hydraulic cylinder (604). The outer wall of the recycling bin (601) is located above the piston rod (603) and is provided with a return hole (608) in an array. The outer side of the return hole (608) is connected to a circulating liquid pipe (5).

2. A cooling liquid circulation device for silicon wafer cutting according to claim 1, characterized in that: A cooling pipe rack (4) is installed on the upper surface of the cutting machine (1), a liquid spraying pipe (401) is arranged inside the cooling pipe rack (4), a direction adjustment shaft (403) is connected between the two ends of the liquid spraying pipe (401) and the cooling pipe rack (4), and a liquid injection pipe (402) is connected above the liquid spraying pipe (401).

3. The cooling liquid circulation device for silicon wafer cutting according to claim 1, characterized in that: An anti-overflow baffle (607) is installed between the upper end of the recovery bin (601) and the cooling bin (606), a first roller (2) is installed on one side of the interior of the cutting machine (1), and a second roller (3) is installed on the other side of the interior of the cutting machine (1).

4. The cooling liquid circulation device for silicon wafer cutting according to claim 1, characterized in that: The reflux hole (608) is arranged to be in communication with the circulating liquid pipe (5), and the piston gasket (605) is fixedly connected to the push plate (602).

5. The cooling liquid circulation device for silicon wafer cutting according to claim 1, characterized in that: The height dimension length of the push plate (602) is smaller than the depth dimension length of the recovery bin (601).

6. A cooling liquid circulation device for silicon wafer cutting according to claim 2, characterized in that: The liquid spray pipe (401) is movably connected to the cooling pipe rack (4) via the direction adjustment shaft (403).

7. The cooling liquid circulation device for silicon wafer cutting according to claim 1, characterized in that: The piston rod (603) is fixedly connected to the push plate (602).

8. The cooling liquid circulation device for silicon wafer cutting according to claim 3, characterized in that: A cutting wire is installed between the first roller (2) and the second roller (3).

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