Mobile phone fixing support injection mold

Abstract

The utility model relates to an injection mold for a mobile phone fixing bracket. The injection mold comprises a bedplate, the lower mold is arranged at the top of the platen, the cooling pipeline is arranged in the lower mold, and the water tank is arranged at the bottom of the platen; the water inlet valve pipe and the water outlet valve pipe are arranged on one side of the water tank; the cooling water supply mechanism is arranged between the water tank and the lower mold; wherein the cooling water supply mechanism comprises a pipe body arranged between the cooling pipeline and the water tank, water or cooling liquid is injected into the water tank through a water inlet valve pipe, a storage battery is used for supplying power to a semiconductor chilling plate, and a refrigeration surface of the semiconductor chilling plate cools the interior of the water tank, so that the temperature of the water in the water tank is low; liquid cooled in the water tank is input into the pipe body through the driving pump and finally enters the cooling pipeline in the lower mold to absorb heat of the lower mold, water entering the cooling pipeline is drained out of the water tank through the drainage pipeline, and the mold is rapidly cooled so that rapid demolding can be facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of injection mold equipment, in particular to an injection mold for a mobile phone fixing bracket. Background Art

[0002] The manufacture of mobile phone brackets requires an injection mold, which is a tool that gives plastic products a complete structure and precise dimensions. Injection molds mostly use natural cooling for injection parts, which results in a long injection time and demoulding time, resulting in low work efficiency. There is a lack of better cooling equipment to quickly cool the mold for rapid demoulding.

[0003] An injection mold for a mobile phone protective cover (application number: 202122035149.1), comprising a bracket, an upper mold assembly, a fixing seat and a lower mold assembly; the bracket comprises a bottom plate, a top plate and a side plate connecting the bottom plate and the top plate; the upper mold assembly comprises a first electric telescopic rod installed on the top plate near the bottom plate side and an upper mold fixed to the first electric telescopic rod at one end away from the top plate; the fixing seat is fixedly connected to the bottom plate near the top plate side; the lower mold assembly comprises a lower mold fixed to the fixing seat at one side away from the bottom plate, a mold cavity formed by a depression from the side of the lower mold near the upper mold to the direction away from the upper mold, a through hole running through the bottom of the mold cavity and a second electric telescopic rod matching the through hole, one end of the second electric telescopic rod is fixed to the bottom plate near the top plate side, and the other end is inserted into the through hole to form a sliding connection. The utility model provides an injection mold for a mobile phone protective cover to realize automatic demoulding, and there is no need to demould the mobile phone protective cover manually, thereby improving the demoulding efficiency.

[0004] The above patented injection molds mostly use natural cooling for the injection parts, which makes the injection time longer and the demoulding time longer, resulting in low work efficiency. There is a lack of better cooling equipment to quickly cool the mold for rapid demoulding. Therefore, we need to provide a mobile phone fixing bracket injection mold. Utility Model Content

[0005] The purpose of the utility model is to provide an injection mold for a mobile phone fixing bracket to solve the problems raised in the above background technology.

[0006] To achieve the above purpose, the utility model provides the following technical solution: an injection mold for a mobile phone fixing bracket, comprising:

[0007] tabletop;

[0008] A lower mold is disposed on the top of the platen, and a cooling pipe is opened inside the lower mold, and

[0009] A water tank disposed at the bottom of the platform;

[0010] A water inlet valve pipe and a drain valve pipe provided on one side of the water tank;

[0011] A cooling water supply mechanism provided between the water tank and the lower mold;

[0012] Wherein, the cooling water supply mechanism comprises:

[0013] A pipe body is arranged between the cooling pipeline and the water tank, the interior of the pipe body is connected to a driving pump, and the lower end of the pipe body is connected to a filter valve.

[0014] Preferably, the cooling water supply mechanism further comprises:

[0015] A semiconductor refrigeration sheet is arranged on the inner wall of a water tank, and a battery for powering the semiconductor refrigeration sheet is installed on one side of the water tank. The cooling surface of the semiconductor refrigeration sheet is located inside the water tank, and the heating surface of the semiconductor refrigeration sheet is located outside the water tank. The interior of the battery is electrically connected to the semiconductor refrigeration sheet.

[0016] Preferably, a top plate is fixedly mounted on the top of the platform via four supporting columns, an upper mold is mounted on the bottom of the top plate via two cylinders, and a feed pipe is connected to the surface of the upper mold.

[0017] Preferably, two sliding seats are fixedly mounted on both sides of the upper mold, and the interior of the sliding seats is movably sleeved with the surface of the support column.

[0018] Preferably, four guide posts are integrally processed on the top of the lower mold, and guide grooves matching the four guide posts are opened inside the upper mold.

[0019] Preferably, a drainage pipe is connected between the bottom of the cooling pipe and the top of the water tank, and a heat insulation board is fixedly installed on the top of the water tank.

[0020] Compared with the prior art, the beneficial effects of the utility model are:

[0021] The utility model injects water or coolant into the water tank through the water inlet valve pipe, uses the battery to power the semiconductor refrigeration sheet, and the refrigeration surface of the semiconductor refrigeration sheet cools the water tank, thereby making the water temperature in the water tank lower, and inputs the cooled liquid in the water tank into the pipe body through the driving pump, and finally enters the cooling pipe in the lower mold, absorbs the heat of the lower mold, and drains the water entering the cooling pipe into the water tank through the drainage pipe, and circulates in sequence, quickly cools the mold to facilitate rapid demoulding. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0023] Figure 2 It is a three-dimensional cross-sectional view of the lower mold of the utility model;

[0024] Figure 3It is a partial structural stereogram of the utility model.

[0025] In the figure: 1. platen; 2. lower mold; 3. cooling pipe; 4. water tank; 5. water inlet valve pipe; 6. drain valve pipe; 7. cooling water supply mechanism; 71. pipe body; 72. drive pump; 73. filter valve; 8. semiconductor refrigeration plate; 9. battery; 10. top plate; 11. upper mold; 12. feed pipe; 13. sliding seat; 14. guide column; 15. drain pipe; 16. insulation board; 17. support column; 18. cylinder. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-3 The utility model provides a technical solution: an injection mold for a mobile phone fixing bracket, comprising:

[0028] platen1;

[0029] A lower mold 2 is disposed on the top of the platen 1, and a cooling pipe 3 is opened inside the lower mold 2, and

[0030] A water tank 4 is provided at the bottom of the platform 1;

[0031] A water inlet valve pipe 5 and a water discharge valve pipe 6 are arranged on one side of the water tank 4;

[0032] A cooling water supply mechanism 7 provided between the water tank 4 and the lower mold 2;

[0033] Wherein, the cooling water supply mechanism 7 comprises:

[0034] The pipe body 71 is disposed between the cooling pipe 3 and the water tank 4 . The interior of the pipe body 71 is connected to a driving pump 72 . The lower end of the pipe body 71 is connected to a filter valve 73 .

[0035] The cooling water supply mechanism 7 also includes:

[0036] A semiconductor refrigeration sheet 8 is arranged on the inner wall of the water tank 4, and a battery 9 for powering the semiconductor refrigeration sheet 8 is installed on one side of the water tank 4. The cooling surface of the semiconductor refrigeration sheet 8 is located inside the water tank 4, and the heating surface of the semiconductor refrigeration sheet 8 is located outside the water tank 4. The interior of the battery 9 is electrically connected to the semiconductor refrigeration sheet 8. It should be noted that the battery 9 is used to power the semiconductor refrigeration sheet 8, and the cooling surface of the semiconductor refrigeration sheet 8 cools the inside of the water tank 4, thereby making the water temperature in the water tank 4 lower. The cooled liquid in the water tank 4 is input into the pipe body 71 by driving the pump 72, and finally enters the cooling pipe 3 in the lower mold 2 to absorb the heat of the lower mold 2.

[0037] A top plate 10 is fixedly mounted on the top of the table 1 by four support columns 17, an upper mold 11 is mounted on the bottom of the top plate 10 by two cylinders 18, and a feed pipe 12 is connected to the surface of the upper mold 11. It is worth noting that the two cylinders 18 are synchronous cylinders 18 used to drive the height adjustment of the upper mold 11, and the feed pipe 12 inside is used for external injection molding raw materials.

[0038] Two sliding seats 13 are fixedly installed on both sides of the upper mold 11. The interior of the sliding seat 13 is movably connected to the surface of the support column 17. Furthermore, the sliding seat 13 is movably connected to the surface of the support column 17 to enhance the stability of the movement of the upper mold 11.

[0039] Four guide posts 14 are integrally processed on the top of the lower mold 2, and guide grooves matching the four guide posts 14 are opened inside the upper mold 11. By setting the guide grooves matching the four guide posts 14 inside the upper mold 11, the connection between the lower mold 2 and the upper mold 11 has a guiding function.

[0040] A drainage pipe 15 is connected between the bottom of the cooling pipe 3 and the top of the water tank 4, and a heat insulation board 16 is fixedly installed on the top of the water tank 4. The heat insulation board 16 is provided to reduce the heat transfer from the lower mold 2 to the water tank 4. At the same time, the drainage pipe 15 is provided to discharge the water entering the cooling pipe 3 into the water tank 4 for circulation in sequence.

[0041] The device injects water or coolant into the water tank 4 through the water inlet valve pipe 5, uses the battery 9 to power the semiconductor refrigeration plate 8, and the cooling surface of the semiconductor refrigeration plate 8 cools the water tank 4, thereby making the water temperature in the water tank 4 relatively low. The cooled liquid in the water tank 4 is input into the pipe body 71 by driving the pump 72, and finally enters the cooling pipe 3 in the lower mold 2, absorbs the heat of the lower mold 2, and the drainage pipe 15 discharges the water entering the cooling pipe 3 into the water tank 4, and circulates in sequence.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mobile phone fixing bracket injection mold, characterized in that: include: tabletop; A lower mold is disposed on the top of the platen, and a cooling pipe is opened inside the lower mold, and A water tank disposed at the bottom of the platform; A water inlet valve pipe and a drain valve pipe provided on one side of the water tank; A cooling water supply mechanism provided between the water tank and the lower mold; Wherein, the cooling water supply mechanism comprises: A pipe body is arranged between the cooling pipeline and the water tank, the interior of the pipe body is connected to a driving pump, and the lower end of the pipe body is connected to a filter valve.

2. The mobile phone fixing bracket injection mold according to claim 1, characterized in that: The cooling water supply mechanism also includes: A semiconductor refrigeration sheet is arranged on the inner wall of a water tank, and a battery for powering the semiconductor refrigeration sheet is installed on one side of the water tank. The cooling surface of the semiconductor refrigeration sheet is located inside the water tank, and the heating surface of the semiconductor refrigeration sheet is located outside the water tank. The interior of the battery is electrically connected to the semiconductor refrigeration sheet.

3. The mobile phone fixing bracket injection mold according to claim 1, characterized in that: A top plate is fixedly mounted on the top of the platform via four supporting columns, an upper mold is mounted on the bottom of the top plate via two cylinders, and a feed pipe is connected to the surface of the upper mold.

4. The mobile phone fixing bracket injection mold according to claim 3, characterized in that: Two sliding seats are fixedly installed on both sides of the upper mold, and the interior of the sliding seat is movably sleeved with the surface of the support column.

5. The mobile phone fixing bracket injection mold according to claim 4, characterized in that: Four guide posts are integrally processed on the top of the lower mold, and guide grooves matching the four guide posts are opened inside the upper mold.

6. The mobile phone fixing bracket injection mold according to claim 1, characterized in that: A drainage pipe is connected between the bottom of the cooling pipe and the top of the water tank, and a heat insulation board is fixedly installed on the top of the water tank.

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