Transportation guide device of magnetron sputtering coating machine

Abstract

The utility model relates to the technical field of magnetron sputtering coating equipment, in particular to a transportation guide device of a magnetron sputtering coating machine, which comprises a mounting frame, a transportation device is mounted on the mounting frame, a guide device for removing static electricity is mounted on the transportation device, the guide device comprises a first guide assembly, and a second guide assembly is mounted on the first guide assembly. The first guiding assembly comprises a first connecting plate, the first connecting plate is connected with the conveying device, and a first roller for guiding electrostatic charges is connected to the first connecting plate. The magnetron sputtering coating machine has the effect of improving the high efficiency of the magnetron sputtering coating machine in the using process.

Description

Technical Field

[0001] The present application relates to the technical field of magnetron sputtering coating equipment, and in particular to a transport and guiding device of a magnetron sputtering coating machine. Background Art

[0002] In order to improve the performance of silicon wafers and protect them, the surface of silicon wafers will be coated during the production process of silicon wafers. The coating method can be selected from magnetron sputtering coating machines to coat the surface of silicon wafers. During the coating process, silicon wafers are usually placed on a carrier, and the carrier is transported by a transportation device to realize the transportation of silicon wafers in the magnetron sputtering coating machine.

[0003] During the process of transporting the carrier to coat the silicon wafer, static electricity will be generated on the carrier. If the static electricity is not removed in time, the existence of static electricity will affect the coating process, reduce the effectiveness of silicon wafer coating, and affect the subsequent use of silicon wafers. Utility Model Content

[0004] In order to improve the efficiency of a magnetron sputtering coating machine during use, the present application provides a transport and guiding device for a magnetron sputtering coating machine.

[0005] The present application provides a transport guide device for a magnetron sputtering coating machine, which adopts the following technical solution:

[0006] A transport guide device for a magnetron sputtering coating machine includes a mounting frame, a transport device is mounted on the mounting frame, a static electricity removal guide device is mounted on the transport device, the guide device includes a first guide component, the first guide component includes a first connecting plate, the first connecting plate is connected to the transport device, and the first connecting plate is connected to a first roller for guiding static electricity charges.

[0007] By adopting the above technical solution, the silicon wafer is mounted on a carrier, the carrier is transported by a transport device, the carrier is guided by a guide device, and the first roller contacts the carrier. While guiding the movement of the carrier, the electrostatic charge on the carrier is conducted away from the carrier, thereby avoiding the influence of static electricity on the silicon wafer coating, which is beneficial to improving the efficiency of the magnetron sputtering coating machine during use.

[0008] In a specific feasible implementation scheme, a grounding wire is connected to the first connecting plate, a first connecting shaft is installed on the first connecting plate, a rotating plate is rotatably installed on the first connecting shaft, a second connecting plate is installed on the first connecting plate, the second connecting plate is arranged below the rotating plate, a first spring is installed on the second connecting plate, one end of the first spring away from the second connecting plate is connected to the rotating plate, a second connecting shaft is installed on the rotating plate, and the first roller is rotatably installed on the second connecting shaft.

[0009] By adopting the above technical solution, when transporting the carrier, the first spring pushes the rotating plate to rotate upward with the first connecting axis as the center, and the rotating plate drives the first roller to move upward and abut against the carrier. At the same time, the first spring ensures that the first roller is always in elastic contact with the carrier, and reduces the friction between the carrier and the carrier during the guiding process, which facilitates the movement of the carrier. The static electricity is conducted to the first connecting plate through the first roller and then conducted out from the first connecting plate, which can effectively prevent the static electricity from affecting the silicon wafer coating.

[0010] In a specific possible implementation scheme, the guiding device also includes a second guiding component, the second guiding component includes a third connecting plate, the third connecting plate is connected to the transport device, the third connecting plate is connected to a fourth connecting plate, the fourth connecting plate is mounted with a third connecting shaft, and the second roller is rotatably mounted on the third connecting shaft.

[0011] By adopting the above technical solution, when transporting the carrier, the second roller abuts against the carrier, and the second roller rotates as the carrier moves, which can reduce the friction between the carrier and the carrier, and at the same time guide the moving direction of the carrier so that the carrier can move in a straight line.

[0012] In a specific feasible implementation scheme, the third connecting plate is equipped with an adjusting component for adjusting the position of the second roller, the third connecting plate is provided with a first sliding groove, and the adjusting component includes a first screw rod, the first screw rod is threadedly connected to the third connecting plate, one end of the first screw rod is arranged in the first sliding groove, and the first slide is installed at one end of the first screw rod extending into the first sliding groove, and a push rod is installed on the first slide; the third connecting plate is provided with a second sliding groove, and the third connecting plate is equipped with a sliding rod, the sliding rod is arranged in the second sliding groove, and the second slide is slidably installed on the sliding rod, the push rod is connected with the second slide, and a sliding block is slidably installed on the sliding rod, and the sliding block is arranged on a side of the second slide block close to the second rotating drum, and a second spring is sleeved on the sliding rod, one end of the second spring is connected to the second slide, and the other end of the second spring is connected to the sliding block, and the sliding block is connected to the fourth connecting plate.

[0013] By adopting the above technical solution, when transporting the carrier, the side wall of the carrier preferentially contacts the second roller, the carrier pushes the second roller to squeeze the second spring, the second spring generates elastic force to push the second roller to contact the side wall of the carrier, and the second spring changes the contact mode between the second roller and the carrier from rigid contact to elastic contact with an adjustable range, so that the carrier is transported more smoothly, and the second spring can keep the second roller and the carrier in contact at all times and guide the carrier. The first screw rod is rotated to control the rotation of the first screw rod, the first screw rod moves on the third connecting plate and drives the first slide plate to slide, the first slide plate drives the push rod to drive the second slide plate to slide on the slide rod, and the elastic deformation degree of the second spring is adjusted by changing the distance between the second slide plate and the slide block, so as to change the elastic force of the second spring, thereby changing the tightness of the carrier plate and the second roller, which is convenient for rapid transportation of the carrier.

[0014] In a specific implementation manner, a rotating handle is installed at one end of the first screw rod away from the first slide plate.

[0015] By adopting the above technical solution, the first screw rod can be easily controlled by manipulating the rotating handle.

[0016] In a specific possible implementation scheme, the transport device includes a mounting cylinder, which is mounted on the mounting frame, a rotating shaft is rotatably mounted on the mounting cylinder, one end of the rotating shaft is connected to a synchronous wheel, the synchronous wheel is connected to a synchronous belt and a motor for controlling the rotation of the rotating shaft, and a rotating cylinder is mounted on the other end of the rotating shaft.

[0017] By adopting the above technical solution, the rotation of the rotating shaft is controlled by the motor, and the rotating shaft drives the rotating drum to rotate, so that the carrier plate can be transported quickly, thereby improving the transportation efficiency of the carrier plate.

[0018] In a specific possible implementation mode, a mounting groove is provided on the rotating drum, an anti-slip ring is installed on the rotating drum, and the anti-slip ring is embedded in the mounting groove.

[0019] By adopting the above technical solution, the contact between the rotating drum and the carrier plate is transformed into the contact between the anti-slip ring and the carrier plate, thereby increasing the friction between the anti-slip ring and the carrier plate and preventing the carrier plate from sliding on the rotating drum when transporting the carrier plate.

[0020] In summary, the present application includes at least one of the following beneficial technical effects:

[0021] 1. The silicon wafer is mounted on a carrier, and the carrier is transported by a transport device, and the guide device guides the carrier to move, and the first roller contacts the carrier. While guiding the carrier to move, the electrostatic charge on the carrier is conducted away from the carrier to avoid the influence of static electricity on the silicon wafer coating, which is beneficial to improve the efficiency of the magnetron sputtering coating machine during use.

[0022] 2. Through the setting of the first guiding component, when transporting the carrier, the first spring pushes the rotating plate to rotate upward with the first connecting axis as the center, and the rotating plate drives the first roller to move upward and abut against the carrier. At the same time, the first spring ensures that the first roller is always in elastic contact with the carrier, and reduces the friction between the carrier and the carrier during guiding the carrier, which facilitates the movement of the carrier. The static electricity is conducted to the first connecting plate through the first roller and then conducted out from the first connecting plate, which can effectively prevent the static electricity from affecting the silicon wafer coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the installation position relationship of the transportation device of Example 1 of the present application.

[0024] Figure 2 It is a schematic diagram of the transportation device of Example 1 of the present application.

[0025] Figure 3 It is a schematic diagram of the installation position relationship between the guiding device and the transport device of Example 1 of the present application.

[0026] Figure 4 This is a schematic diagram of the first guide component of Example 1 of the present application.

[0027] Figure 5 This is a schematic diagram of the adjustment component of Example 2 of the present application.

[0028] Explanation of the accompanying drawings: 1. mounting frame; 11. carrier plate; 2. transport device; 21. mounting cylinder; 22. rotating shaft; 23. synchronous wheel; 24. rotating cylinder; 241. mounting groove; 25. anti-slip ring; 3. guiding device; 31. first guiding assembly; 311. first connecting plate; 312. first connecting shaft; 313. rotating plate; 314. second connecting plate; 315. first spring; 316. second connecting shaft; 317. first roller; 32. second guiding assembly; 321. third connecting plate; 3211. first slide groove; 3212. second slide groove; 322. fourth connecting plate; 323. third connecting shaft; 324. second roller; 33. adjusting assembly; 331. first screw rod; 3311. rotating handle; 332. first slide plate; 333. push rod; 334. slide rod; 335. second slide plate; 336. slide block; 337. second spring. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-5 This application is described in further detail.

[0030] Embodiment 1:

[0031] The present application embodiment discloses a transport guide device for a magnetron sputtering coating machine, referring to Figure 1, including a mounting frame 1, a carrier plate 11 is mounted on the mounting frame 1, a transport device 2 for transporting the carrier plate 11 is mounted on the mounting frame 1, and a guiding device 3 for assisting the transport process of the carrier plate 11 is connected to the transport device 2.

[0032] The silicon wafers are arranged on the carrier 11, and the carrier 11 is transported by the transport device 2 to achieve rapid transportation of the carrier 11 in the magnetron sputtering coating machine. The transport device 2 is assisted by the guide device 3 to transport the carrier 11 to increase the stability during the transportation of the carrier 11, and the static electricity on the carrier 11 is removed at the same time, which is beneficial to improving the efficiency of the magnetron sputtering coating machine during use.

[0033] Reference Figure 1 and Figure 2 The transport device 2 includes a mounting cylinder 21, which is fixedly mounted on the mounting frame 1. Mounting cylinders 21 are arranged on both sides of the mounting frame 1 in the transport direction, and eight mounting cylinders 21 are fixedly mounted on each side. A rotating shaft 22 is rotatably mounted on the mounting cylinder 21, and a synchronous wheel 23 is fixedly connected to one end of the rotating shaft 22 located on the outer side of the mounting frame 1. In this embodiment, a motor and a synchronous belt for controlling the rotation of the rotating shaft 22 are arranged in the magnetron sputtering coating machine. The synchronous belt connects all the synchronous wheels 23 on the same side. The connection relationship between the synchronous wheel and the synchronous belt is a prior art and is not shown in the figure.

[0034] Reference Figure 2 and Figure 3 One end of the rotating shaft 22 away from the synchronous wheel 23 is fixedly connected to a rotating drum 24 , and four mounting grooves 241 are equidistantly provided on the rotating drum 24 . Four anti-slip rings 25 are installed on the rotating drum 24 , and the four anti-slip rings 25 are respectively embedded in the four mounting grooves 241 .

[0035] The carrier 11 is placed on the rotating drum 24, and the friction between the carrier 11 and the rotating drum 24 is increased by the anti-slip ring 25 to prevent the carrier 11 from sliding during the transportation of the carrier 11. The synchronous belt is controlled by the motor to rotate, and the synchronous belt drives the synchronous wheel 23 on the same side to rotate at the same time. The synchronous wheel 23 drives the rotating shaft 22 to rotate, thereby rotating the rotating drum 24 to realize the rapid transportation of the carrier 11.

[0036] Reference Figure 3 and Figure 4The guiding device 3 includes a first guiding assembly 31, which is arranged on the mounting cylinder 21. The mounting cylinder 21 is the mounting cylinder 21 that the carrier 11 passes through for the first time in the transportation direction. The first guiding assembly 31 of the transportation device 2 includes a first connecting plate 311, which is fixedly mounted on the mounting cylinder 21. A first connecting shaft 312 is fixedly mounted on the first connecting plate 311. The first connecting shaft 312 is horizontally arranged. A rotating plate 313 is rotatably mounted on the first connecting shaft 312. A second connecting plate 314 is fixedly mounted on the first connecting plate 311. The second connecting plate 314 is located below the rotating plate 313. A first spring 315 is fixedly mounted on the second connecting plate 314. The first spring 315 is fixedly connected to the rotating plate 313 at one end away from the second connecting plate 314, and the first spring 315 is arranged away from the first connecting shaft 312. A second connecting shaft 316 is fixedly installed on the side wall of the rotating plate 313 close to the carrier plate 11. The second connecting shaft 316 is horizontally arranged. A first roller 317 is rotatably installed on the second connecting shaft 316. The width of the first roller 317 is smaller than the width of the rotating drum 24. In this embodiment, the first roller 317, the second connecting shaft 316, the first connecting shaft 312 and the first connecting plate 311 are all made of conductive materials, and a grounding wire is connected to the first connecting plate 311.

[0037] When the carrier 11 is not placed on the first roller 317, the horizontal height of the first roller 317 is higher than the height of the rotating drum 24. When the carrier 11 is placed on the rotating drum 24, the carrier 11 will preferentially contact the first roller 317, and the carrier 11 presses down the first roller 317. The rotating plate 313 is under pressure and will rotate downward around the first connecting shaft 312. At this time, the first spring 315 is subjected to force to generate elastic force on the rotating plate 313. The first spring 315 will push the rotating plate 313 to make the rotating plate 313 tend to rotate upward around the first connecting shaft 312, so that the first roller 317 and the carrier 11 always maintain abutment state. When the carrier 11 moves, the first roller 317 rotates on the second connecting shaft 316 to reduce the friction between the first roller 317 and the carrier 11, thereby facilitating the transportation of the carrier 11. While guiding the transport carrier 11, if there is static electricity on the carrier 11, the static electricity charge is transferred to the first roller 317, the second connecting shaft 316, the first connecting shaft 312 and the first connecting plate 311 in sequence, and finally the static electricity is eliminated by the grounding wire connected to the first connecting plate 311 to prevent the static electricity from affecting the coating process, which is beneficial to improving the efficiency of the magnetron sputtering coating machine for coating silicon wafers.

[0038] The guiding device 3 also includes a second guiding assembly 32, and the second guiding assembly 32 is installed on all the mounting tubes 21 except the mounting tube 21 equipped with the first guiding assembly 31. The second guiding assembly 32 includes a third connecting plate 321, and the third connecting plate 321 is fixedly installed on the mounting tube 21. A fourth connecting plate 322 is fixedly installed on the third connecting plate 321, and a third connecting shaft 323 is fixedly installed on the fourth connecting plate 322. The third connecting shaft 323 is vertically arranged, and a second roller 324 is rotatably installed on the third connecting shaft 323, and the second roller 324 abuts against the side wall of the carrier plate 11.

[0039] When the carrier 11 moves to abut against the second roller 324, the carrier 11 moves along the transport direction while driving the second roller 324 to rotate. The second rollers 324 of the second guide assemblies 32 on both sides of the carrier 11 abut against the carrier 11 to prevent the carrier 11 from shifting to both sides during movement, and guide the carrier 11 to keep the carrier 11 moving in a straight line, which is convenient for complete coating of the silicon wafers on the carrier 11, and is beneficial to improving the efficiency of the magnetron sputtering coating machine.

[0040] Embodiment 2:

[0041] Reference Figure 5 The difference between the embodiment of the present application and the embodiment 1 is that the second guide assembly 32 is equipped with an adjustment assembly 33 for adjusting the position of the second roller 324, and the third connecting plate 321 is provided with a first slide groove 3211. The adjustment assembly 33 includes a first screw rod 331, and the first screw rod 331 is threadedly connected to the third connecting plate 321. One end of the first screw rod 331 extends into the first slide groove 3211. The first screw rod 331 is located at the outer end of the first slide groove 3211 and is fixedly installed with a handle 3311. The first screw rod 331 extends into the first slide groove 3211 and one end is rotatably connected to the first slide plate 332. The first slide plate 332 is slidably connected to the third connecting plate 321.

[0042] The third connecting plate 321 is provided with a second slide groove 3212, and the second slide groove 3212 is located between the first slide groove 3211 and the second roller 324. The third connecting plate 321 is fixedly installed with a slide rod 334, and the slide rod 334 is arranged in the second slide groove 3212. The second slide plate 335 is slidably connected to the slide rod 334. The first slide plate 332 is fixedly installed with a push rod 333, and the push rod 333 passes through the third connecting plate 321 and extends into the second slide groove 3212. The push rod 333 is slidably connected to the third connecting plate 321, and the end of the push rod 333 away from the first slide plate 332 is fixedly connected to the second slide plate 335. A slider 336 is slidably mounted on the slide bar 334. The slider 336 is arranged on the side of the second slide plate 335 close to the second roller 324. A second spring 337 is sleeved on the slide bar 334. One end of the second spring 337 is fixedly connected to the second slide plate 335. The other end of the second spring 337 is fixedly connected to the slider 336. The slider 336 is fixedly connected to the fourth connecting plate 322.

[0043] When the carrier 11 is transported through the second guide assembly 32, the side wall of the carrier 11 contacts the second roller 324 first, and the carrier 11 pushes the second roller 324 to squeeze the second spring 337. The second spring 337 generates an elastic force to push the second roller 324 to contact the side wall of the carrier 11. When the carrier 11 is transported, the second rollers 324 on both sides of the carrier 11 push the carrier 11 toward the middle at the same time, and the second spring 337 changes the contact mode between the second roller 324 and the carrier 11 from rigid contact to elastic contact with an adjustable range, so that the transportation of the carrier 11 is smoother, and the second spring 337 can keep the second roller 324 and the carrier 11 in contact at all times and guide the carrier 11.

[0044] When it is necessary to adjust the pressing force between the second roller 324 and the carrier plate 11 or to maintain the second spring 337, the handle 3311 is turned to control the rotation of the first screw rod 331, the first screw rod 331 moves on the third connecting plate 321 and drives the first slide plate 332 to slide, the first slide plate 332 drives the push rod 333 to drive the second slide plate 335 to slide on the slide rod 334, and the elastic deformation degree of the second spring 337 is adjusted by changing the distance between the second slide plate 335 and the slider 336, so as to change the elastic force of the second spring 337, thereby changing the pressing degree between the carrier plate 11 and the second roller 324, so as to facilitate the rapid transportation of the carrier plate 11.

[0045] The implementation principle of the embodiment of the present application is: silicon wafers are placed on the carrier 11, the rotating drum 24 is controlled by a motor to drive the carrier 11 to move, and the guiding device 3 assists the transport device 2 in transporting the carrier 11 to increase the stability of the carrier 11 during transportation. The first guiding component 31 in the guiding device 3 guides the carrier 11 while removing the static electricity on the carrier 11, thereby reducing the impact of static electricity on the coating, which is beneficial to improving the efficiency of the magnetron sputtering coating machine during use.

[0046] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A transport guide device for a magnetron sputtering coating machine, characterized in that: The invention comprises a mounting frame (1), a transport device (2) being mounted on the mounting frame (1), a guide device (3) for removing static electricity being mounted on the transport device (2), the guide device (3) comprising a first guide component (31), the first guide component (31) comprising a first connecting plate (311), the first connecting plate (311) being connected to the transport device (2), and a first roller (317) for guiding static electricity being connected to the first connecting plate (311).

2. The transport guide device of a magnetron sputtering coating machine according to claim 1, characterized in that: A grounding wire is connected to the first connecting plate (311); a first connecting shaft (312) is mounted on the first connecting plate (311); a rotating plate (313) is rotatably mounted on the first connecting shaft (312); a second connecting plate (314) is mounted on the first connecting plate (311); the second connecting plate (314) is arranged below the rotating plate (313); a first spring (315) is mounted on the second connecting plate (314); an end of the first spring (315) away from the second connecting plate (314) is connected to the rotating plate (313); a second connecting shaft (316) is mounted on the rotating plate (313); and the first roller (317) is rotatably mounted on the second connecting shaft (316).

3. The transport guide device of a magnetron sputtering coating machine according to claim 1, characterized in that: The guiding device (3) further comprises a second guiding assembly (32), the second guiding assembly (32) comprising a third connecting plate (321), the third connecting plate (321) being connected to the transport device (2), the third connecting plate (321) being connected to a fourth connecting plate (322), the fourth connecting plate (322) being mounted with a third connecting shaft (323), and the third connecting shaft (323) being rotatably mounted with a second roller (324).

4. The transport guide device of a magnetron sputtering coating machine according to claim 3, characterized in that: The third connecting plate (321) is provided with an adjusting assembly (33) for adjusting the position of the second roller (324); the third connecting plate (321) is provided with a first sliding groove (3211); the adjusting assembly (33) comprises a first screw rod (331); the first screw rod (331) is threadedly connected to the third connecting plate (321); one end of the first screw rod (331) is arranged in the first sliding groove (3211); a first slide plate (332) is installed at one end of the first screw rod (331) extending into the first sliding groove (3211); a push rod (333) is installed on the first slide plate (332); the third connecting plate (321) is provided with a second sliding groove (3212); the third connecting plate (321) is provided with a first sliding groove (3211); A sliding rod (334) is provided, the sliding rod (334) is arranged in the second sliding groove (3212), a second sliding plate (335) is slidably mounted on the sliding rod (334), the push rod (333) is connected to the second sliding plate (335), a sliding block (336) is slidably mounted on the sliding rod (334), the sliding block (336) is arranged on a side of the second sliding plate (335) close to the second roller (324), a second spring (337) is sleeved on the sliding rod (334), one end of the second spring (337) is connected to the second sliding plate (335), the other end of the second spring (337) is connected to the sliding block (336), and the sliding block (336) is connected to the fourth connecting plate (322).

5. The transport guide device of a magnetron sputtering coating machine according to claim 4, characterized in that: A rotating handle (3311) is mounted on one end of the first screw rod (331) away from the first slide plate (332).

6. The transport guide device for a magnetron sputtering coating machine according to claim 1, characterized in that: The transport device (2) comprises a mounting cylinder (21), wherein the mounting cylinder (21) is mounted on the mounting frame (1), a rotating shaft (22) is rotatably mounted on the mounting cylinder (21), one end of the rotating shaft (22) is connected to a synchronous wheel (23), the synchronous wheel (23) is connected to a synchronous belt and a motor for controlling the rotation of the rotating shaft (22), and a rotating cylinder (24) is mounted on the other end of the rotating shaft (22).

7. The transport guide device of a magnetron sputtering coating machine according to claim 6, characterized in that: The rotating drum (24) is provided with a mounting groove (241), and an anti-slip ring (25) is installed on the rotating drum (24), and the anti-slip ring (25) is embedded in the mounting groove (241).

Images