Fingerprint sensor and fingerprint identification system
By setting the driver IC chip on COF Film and connecting it with the fingerprint recognition scanning array in turn, the problems of the unsightly appearance of traditional capacitive fingerprint sensors and the limitation of application development are solved, and a more beautiful and diversified application development prospect is achieved.
Patent Information
- Application Number
- CN202420243729.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-31
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-01-31
AI Technical Summary
The traditional capacitive fingerprint sensor has an unsightly appearance due to the bumps of the driver IC chip, which limits its application in personalized fingerprint application scenarios and affects its application development prospects.
The driver IC chip is arranged on the COF Film, and the scanning array, COF Film, the driver IC chip and the IO circuit are connected in sequence through fingerprint recognition to form a fingerprint sensor structure.
It alleviates the problem of unsightly appearance of fingerprint sensors, improves its application potential in personalized fingerprint application scenarios, and expands the application development prospects of capacitive fingerprint sensors.
Smart Images

Figure CN222529806U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor sensors, in particular to a fingerprint sensor and a fingerprint recognition system. Background Art
[0002] Limited by the current COG (chip on glass) technology, the driver IC chip of the traditional capacitive fingerprint sensor is bound to the substrate, so the capacitive fingerprint sensor has a protrusion of the driver IC chip in the structure, which brings structural limitations to the later function development. As a result, the appearance of the current fingerprint sensor is not beautiful, and it is not conducive to its application in personalized fingerprint application scenarios, which further hinders the application and development prospects of traditional capacitive fingerprint sensors. Utility Model Content
[0003] The purpose of the utility model is to provide a fingerprint sensor and a fingerprint recognition system, which can alleviate the technical problems that the fingerprint sensor has an unsightly appearance and is not conducive to its application in personalized fingerprint application scenarios, as well as the application development of traditional capacitive fingerprint sensors is hindered, and enhance the diversity of the application development prospects of capacitive fingerprint sensors.
[0004] In a first aspect, an embodiment of the utility model provides a fingerprint sensor, comprising: a substrate, a fingerprint recognition scanning array, a COF film, a driver IC chip and an IO circuit of the driver IC chip; the fingerprint recognition scanning array is arranged on the substrate; the driver IC chip and the IO circuit of the driver IC chip are arranged on the COF film; the fingerprint recognition scanning array, the driver IC chip and the IO circuit of the driver IC chip are connected in sequence.
[0005] In a preferred embodiment of the present invention, the fingerprint identification scanning array has a spray-coated protective layer.
[0006] In a preferred embodiment of the present invention, the spray protective layer comprises: a primer, a mid-coat and a topcoat arranged in sequence from bottom to top.
[0007] In a preferred embodiment of the present invention, the primer, the intermediate paint and the topcoat all have waterproof, dustproof and moisture-proof properties.
[0008] In a preferred embodiment of the present invention, the materials of the primer, the intermediate paint and the topcoat all include: silicone, epoxy resin, unsaturated polyester resin, polyurethane, nitro paint and phenolic resin.
[0009] In a preferred embodiment of the present invention, the fingerprint identification scanning array comprises: a receiving electrode layer, an insulating layer, a transmitting electrode layer and an electrode protection layer which are sequentially arranged on the contact surface of the substrate from bottom to top.
[0010] In a preferred embodiment of the present invention, the materials of the receiving electrode layer and the transmitting electrode layer include: indium tin oxide, molybdenum aluminum molybdenum, titanium aluminum titanium, and nano silver.
[0011] In a preferred embodiment of the present invention, the material of the insulating layer includes: photoresist, silicon oxynitride, silicon dioxide and polyamide fiber.
[0012] In a preferred embodiment of the present invention, the material of the substrate includes: a glass substrate, a polyimide film, a synthetic quartz substrate, a sapphire ceramic substrate, and a high-precision printed circuit board.
[0013] In a second aspect, an embodiment of the utility model further provides a fingerprint recognition system, comprising: the above-mentioned fingerprint sensor, and also comprising: an MCU microcontroller unit connected to the IO circuit of the above-mentioned driver IC chip in the above-mentioned fingerprint sensor.
[0014] The embodiments of the present invention have the following beneficial technical effects:
[0015] The embodiment of the utility model provides a fingerprint sensor and fingerprint recognition system, including: a substrate, a fingerprint recognition scanning array, a COF film, a driver IC chip and an IO circuit of the driver IC chip; the fingerprint recognition scanning array is arranged on the substrate; the driver IC chip and the IO circuit of the driver IC chip are arranged on the COF film; the fingerprint recognition scanning array, the driver IC chip and the IO circuit of the driver IC chip are connected in sequence. The fingerprint sensor is arranged on the COF film, thereby alleviating the unsightly appearance of the fingerprint sensor, and the disadvantage of applying it in personalized fingerprint application scenarios, as well as the technical problems that the application development of traditional capacitive fingerprint sensors is hindered, and the diversity of the application development prospects of capacitive fingerprint sensors is improved.
[0016] Other features and advantages disclosed in this embodiment will be described in the subsequent description, or some features and advantages can be inferred or determined without doubt from the description, or can be learned by implementing the above-mentioned technology of the present disclosure.
[0017] In order to make the above-mentioned objectives, features and advantages of the present disclosure more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 A schematic diagram of the structure of a fingerprint sensor provided by an embodiment of the utility model;
[0020] Figure 2 A schematic diagram of the structure of another fingerprint sensor provided by an embodiment of the utility model;
[0021] Figure 3 A schematic diagram of the structure of a third fingerprint sensor provided by an embodiment of the utility model;
[0022] Figure 4 A schematic diagram of the structure of a fingerprint recognition system provided by an embodiment of the utility model.
[0023] Icons: 11-substrate; 12-fingerprint recognition scanning array; 13-COF Film; 14-driver IC chip; 15-IO circuit of driver IC chip; 41-fingerprint sensor; 42-MCU microcontroller unit. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0025] Currently, due to the limitations of the current COG technology, the driver IC chip of the traditional capacitive fingerprint sensor is generally bound to the substrate, which results in the protrusion of the driver IC chip in the structure of the above-mentioned capacitive fingerprint sensor, which brings structural limitations to the later functional development. As a result, the appearance of the current fingerprint sensor is not beautiful, and it is not conducive to its application in personalized fingerprint application scenarios, which further hinders the application and development prospects of traditional capacitive fingerprint sensors.
[0026] Based on this, the embodiment of the utility model provides a fingerprint sensor and a fingerprint recognition system, which, by placing a driver IC chip on a COF Film, alleviates the unsightly appearance of the fingerprint sensor, and is not conducive to its application in personalized fingerprint application scenarios, as well as the technical problems that hinder the application development of traditional capacitive fingerprint sensors, thereby improving the diversity of the application development prospects of capacitive fingerprint sensors. To facilitate understanding of the embodiment of the utility model, a fingerprint sensor disclosed in the embodiment of the utility model is first introduced in detail.
[0027] Example 1
[0028] In this embodiment, Figure 1 A schematic diagram of the structure of a fingerprint sensor provided in an embodiment of the utility model.
[0029] Depend on Figure 1 As can be seen, the fingerprint sensor includes: a substrate 11, a fingerprint identification scanning array 12, a COF Film 13, a driver IC chip 14 and an IO circuit 15 of the driver IC chip.
[0030] Among them, the above-mentioned fingerprint recognition scanning array 12 is arranged on the above-mentioned substrate 11; the above-mentioned driver IC chip 14 and the IO circuit 15 of the above-mentioned driver IC chip are arranged on the above-mentioned COF Film 13; the above-mentioned fingerprint recognition scanning array 12, the above-mentioned driver IC chip 14 and the IO circuit 15 of the above-mentioned driver IC chip are connected in sequence.
[0031] In one embodiment, the fingerprint identification scanning array 12 has a spray-coated protective layer.
[0032] Furthermore, the spray protective layer includes: a primer, a mid-coat and a topcoat arranged in sequence from bottom to top.
[0033] Furthermore, the primer, the intermediate paint and the topcoat all have waterproof, dustproof and moisture-proof properties.
[0034] In actual operation, the materials of the above-mentioned primer, the above-mentioned mid-coat and the above-mentioned topcoat all include: silicone, epoxy resin, unsaturated polyester resin, polyurethane, nitro paint and phenolic resin.
[0035] Furthermore, the fingerprint identification scanning array includes: a receiving electrode layer, an insulating layer, a transmitting electrode layer and an electrode protection layer which are sequentially arranged on the contact surface of the substrate from bottom to top.
[0036] The materials of the receiving electrode layer and the transmitting electrode layer include: indium tin oxide, molybdenum aluminum molybdenum, titanium aluminum titanium, and nano silver.
[0037] Furthermore, the materials of the insulating layer include: photoresist, silicon oxynitride, silicon dioxide and polyamide fiber.
[0038] Furthermore, the materials of the substrate 11 include: glass substrate, polyimide film, synthetic quartz substrate, sapphire ceramic substrate, and high-precision printed circuit board.
[0039] In this embodiment, the thickness of the electrode protection layer is 0.06um to 50um, the thickness of the insulating layer is 0.06um to 50um, and further, the thickness of the substrate 11 is 30um to 700um.
[0040] In practical applications, in order to increase the diversity of application development prospects of the capacitive fingerprint sensor, the substrate 11 may be designed to be polygonal or circular.
[0041] For ease of understanding, Figure 2 A schematic diagram of the structure of another fingerprint sensor provided by an embodiment of the utility model; Figure 3 This is a schematic structural diagram of a third fingerprint sensor provided in an embodiment of the utility model.
[0042] Depend on Figure 2 As can be seen, the substrate 11 is a quadrilateral, and the COF Film 13 can also be designed into different shapes according to actual application requirements. Figure 3 As can be seen, the substrate 11 is circular.
[0043] Furthermore, a spray protection layer is provided on the fingerprint identification scanning array 12 to obtain an intermediate fingerprint sensor.
[0044] Furthermore, the intermediate fingerprint sensor is subjected to AF coating treatment to obtain the fingerprint sensor.
[0045] The embodiment of the utility model provides a fingerprint sensor, including: a substrate, a fingerprint identification scanning array, a COF film, a driver IC chip and an IO circuit of the driver IC chip; the fingerprint identification scanning array is arranged on the substrate; the driver IC chip and the IO circuit of the driver IC chip are arranged on the COF film; the fingerprint identification scanning array, the driver IC chip and the IO circuit of the driver IC chip are connected in sequence. The fingerprint sensor is arranged on the COF film, thereby alleviating the unsightly appearance of the fingerprint sensor, and the disadvantage of applying it in personalized fingerprint application scenarios, as well as the technical problems that the application development of traditional capacitive fingerprint sensors is hindered, and the diversity of the application development prospects of capacitive fingerprint sensors is improved.
[0046] Example 2
[0047] Based on the above embodiments, Figure 4 A schematic diagram of the structure of a fingerprint recognition system provided by an embodiment of the utility model.
[0048] Depend on Figure 4 As can be seen, the fingerprint recognition system includes: the above-mentioned fingerprint sensor 41 , and also includes: an MCU micro control unit 42 connected to the IO circuit 15 of the driver IC chip in the above-mentioned fingerprint sensor 41 .
[0049] In this embodiment, the MCU micro control unit 42 is connected to the IO circuit 15 of the driver IC chip through FOF or FOB technology.
[0050] The fingerprint recognition system provided by the embodiment of the utility model has the same implementation principle and technical effects as those of the aforementioned fingerprint sensor embodiment. For the sake of brief description, for parts not mentioned in the embodiment of the above-mentioned fingerprint recognition system, reference may be made to the corresponding contents in the aforementioned fingerprint sensor embodiment.
[0051] Finally, it should be noted that the above embodiments are only specific implementation methods of the utility model, which are used to illustrate the technical solution of the utility model, rather than to limit it. The protection scope of the utility model is not limited thereto. Although the utility model is described in detail with reference to the above embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solution recorded in the above embodiments within the technical scope disclosed by the utility model, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiment of the utility model, and should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the above claims.
Claims
1. A fingerprint sensor, characterized in that: include: Substrate, fingerprint identification scanning array, COF Film, driver IC chip and IO circuit of the driver IC chip; The fingerprint identification scanning array is arranged on the substrate; the driver IC chip and the IO circuit of the driver IC chip are arranged on the COF Film; The fingerprint identification scanning array, the driver IC chip and the IO circuit of the driver IC chip are connected in sequence.
2. The fingerprint sensor according to claim 1, characterized in that: The fingerprint identification scanning array has a spray-coated protective layer.
3. The fingerprint sensor according to claim 2, characterized in that: The spray coating protective layer comprises: a primer, a mid-coat and a topcoat which are arranged in sequence from bottom to top.
4. The fingerprint sensor according to claim 3, characterized in that: The primer, the intermediate paint and the topcoat all have waterproof, dustproof and moisture-proof properties.
5. The fingerprint sensor according to claim 1, characterized in that: The fingerprint identification scanning array comprises: a receiving electrode layer, an insulating layer, a transmitting electrode layer and an electrode protection layer which are sequentially arranged on the contact surface of the substrate from bottom to top.
6. A fingerprint recognition system, characterized in that: include: The fingerprint sensor according to any one of claims 1 to 5, further comprising: an MCU microcontroller unit connected to the IO circuit of the driver IC chip in the fingerprint sensor.