Display panel and display device

Abstract

The utility model provides a display panel and a display device, and relates to the technical field of display. The display panel comprises a display substrate which is provided with a display area, a binding area and a bending area; the orthographic projection of the driving chip on the display substrate is located in the binding area; the supporting layer is located on the side away from the light emitting face of the display substrate; the bonding layer is located on the side, away from the display substrate, of the supporting layer and comprises a first bonding substrate and a first adhesive layer; after the bending area is bent, the binding area is located on the side away from the light emitting face of the display substrate, and the orthographic projection of the first bonding substrate at least covers the orthographic projection of the driving chip. In the embodiment of the invention, after the bending area of the display substrate is bent, the orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driving chip in the display area, so that a relatively large elastic modulus is provided through the first bonding substrate, and the impact resistance of the area where the driving chip is located is further improved; the structural strength of the display panel is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] At present, foldable phones are gradually being accepted by people, thanks to their freely expandable display area. Whether it is daily office communication or new technology experience, people can't put it down. As we all know, although the application scenarios of foldable phones have been broadened, it is precisely because of their foldable characteristics that an inevitable problem has been brought about: after replacing the glass cover of the traditional straight-screen phone with a protective layer made of one or more layers of softer materials, the structural strength of the phone has been significantly reduced, thereby shortening the service life of the phone.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0004] The purpose of the present disclosure is to provide a display panel and a display device, which can improve the impact resistance of the display panel and extend the service life.

[0005] According to one aspect of the present disclosure, there is provided a display panel, comprising:

[0006] A display substrate having a display area and a non-display area located outside the display area, wherein the non-display area includes a binding area and a bending area, and the bending area connects the display area and the binding area;

[0007] A driving chip, whose orthographic projection on the display substrate is located in the binding area;

[0008] A support layer, located on a side away from the light emitting surface of the display substrate, and an orthographic projection on the display substrate at least overlaps with the display area;

[0009] The adhesive layer is located on the side of the support layer away from the display substrate, and includes a first adhesive substrate and a first adhesive layer located on two surfaces of the first adhesive substrate, wherein the elastic modulus of the first adhesive substrate is greater than or equal to 10 11 Pa;

[0010] After the bending area is bent, the binding area is located on the side away from the light emitting surface of the display substrate, and the driving chip is located on the side of the binding area away from the display area, the two first adhesive layers are respectively bonded to the supporting layer and the binding area of ​​the display substrate, and the orthographic projection of the first adhesive substrate in the display area at least covers the orthographic projection of the driving chip in the display area.

[0011] According to any display panel described in the present disclosure, the adhesive layer further includes a second adhesive substrate, and second adhesive layers located on two surfaces of the second adhesive substrate;

[0012] The thickness of the second bonding substrate is smaller than that of the first bonding substrate, and the second bonding substrate is located on a side of the first bonding substrate close to the bending area. After the bending area is bent, the two second adhesive layers are respectively bonded to the support layer and the binding area of ​​the display substrate.

[0013] According to any display panel described in the present disclosure, there is no overlapping area between the first bonding substrate and the second bonding substrate in the rotation axis direction of the bending area.

[0014] According to any display panel described in the present disclosure, the second bonding substrate is in a U-shaped structure with an opening facing away from the bending area, and the first bonding substrate is located in a U-shaped groove surrounded by the second bonding substrate.

[0015] According to any display panel described in the present disclosure, the second bonding substrate is in a ring structure, and at least a portion of the first bonding substrate is located in a region surrounded by the second bonding substrate.

[0016] According to any display panel described in the present disclosure, a width of the second bonding substrate on a side of the first bonding substrate close to the bending area is greater than or equal to 2 mm and less than or equal to 5 mm.

[0017] According to any display panel described in the present disclosure, a dimension of the second bonding substrate located on one side of the first bonding substrate in the rotation axis direction of the bending zone is greater than or equal to 6 mm and less than or equal to 12 mm.

[0018] According to any display panel described in the present disclosure, the adhesive layer also includes a second adhesive layer, which is located on a side of the first adhesive substrate close to the bending area, and after the bending area is bent, the second adhesive layer is respectively bonded to the supporting layer and the binding area of ​​the display substrate.

[0019] According to any display panel described in the present disclosure, the adhesive layer is an integrated whole-layer structure.

[0020] According to any display panel described in the present disclosure, the first bonding substrate has a thickened area and a thinned area;

[0021] After the bending area is bent, the orthographic projection of the thickened area on the display area at least covers the orthographic projection of the driving chip on the display area, and the thinned area is located on a side of the thickened area close to the bending area.

[0022] According to any display panel described in the present disclosure, there is no overlapping area between the thinned area and the thickened area in the rotation axis direction of the bending area.

[0023] According to any display panel described in the present disclosure, the thinned area is in a U-shaped structure with an opening facing away from the bending area, and at least a portion of the thickened area is located in the U-shaped groove surrounded by the thinned area.

[0024] According to any display panel described in the present disclosure, the thinned area is in a ring structure, and the thickened area is located in the area surrounded by the thinned area.

[0025] According to any display panel described in the present disclosure, the thickness of the first bonding substrate in the thickened area is greater than or equal to 0.08 mm.

[0026] According to any display panel described in the present disclosure, the thickness of the first bonding substrate in the thinning area is less than or equal to 0.06 mm.

[0027] According to any display panel described in the present disclosure, an edge of the first bonding substrate extends out of the first adhesive layer.

[0028] According to any display panel described in the present disclosure, the protruding dimension of the edge of the first bonding substrate is greater than or equal to 0.1 mm and less than or equal to 0.2 mm.

[0029] According to any display panel described in the present disclosure, an edge of the first bonding substrate is aligned with an edge of the first adhesive layer.

[0030] According to any display panel described in the present disclosure, an edge of the first bonding substrate has a burr bent to one side, and the burr faces the supporting layer.

[0031] According to any display panel described in the present disclosure, the first bonding substrate is a metal substrate or a fiber substrate.

[0032] According to any display panel described in the present disclosure, one of the two first adhesive layers that is closer to the support layer is a conductive adhesive layer, and the other that is farther from the support layer is a non-conductive adhesive layer.

[0033] According to any display panel described in the present disclosure, the first bonding substrate is a non-conductive structure, and the bonding layer further includes a conductive layer located on a side of the first bonding substrate close to the supporting layer.

[0034] According to any display panel described in the present disclosure, the thickness of the conductive layer is greater than or equal to 5 micrometers and less than or equal to 10 micrometers.

[0035] According to any display panel described in the present disclosure, the support layer includes a bending-resistant layer and a support substrate;

[0036] The anti-bending layer is located between the display substrate and the supporting substrate, and both surfaces of the anti-bending layer have third adhesive layers, and the two third adhesive layers are respectively bonded to the display area of ​​the display substrate and the supporting substrate.

[0037] According to any display panel described in the present disclosure, the display area includes a first display sub-area and a second display sub-area, and a folding area located between the first display sub-area and the second display sub-area.

[0038] According to one aspect of the present disclosure, a display device is provided, comprising the display panel described in the above aspect.

[0039] The embodiments of the present disclosure include at least the following technical effects:

[0040] In the embodiment of the present disclosure, after the two first adhesive layers of the adhesive layer are respectively bonded to the binding areas of the support layer and the display substrate, the orthographic projection of the first adhesive substrate in the display area at least covers the orthographic projection of the driver chip in the display area, thereby providing a larger elastic modulus in the area where the driver chip is located through the first adhesive substrate, thereby improving the impact resistance of the display panel in the area where the driver chip is located, so as to extend the service life of the display panel on the basis of improving the structural strength of the display panel.

[0041] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0043] Figure 1 A schematic diagram of the cross-sectional structure of a display panel before being bent provided in an embodiment of the present disclosure.

[0044] Figure 2 A schematic diagram of the cross-sectional structure of a display panel after being bent provided in an embodiment of the present disclosure.

[0045] Figure 3 A schematic diagram of the cross-sectional structure of another display panel after being bent provided in an embodiment of the present disclosure.

[0046] Figure 4 A schematic diagram of the cross-sectional structure of another display panel after being bent provided in an embodiment of the present disclosure.

[0047] Figure 5 A schematic diagram of the cross-sectional structure of another display panel after being bent provided in an embodiment of the present disclosure.

[0048] Figure 6 A schematic diagram of the cross-sectional structure of another display panel after being bent provided in an embodiment of the present disclosure.

[0049] Figure 7 A schematic diagram of the cross-sectional structure of another display panel after being bent provided in an embodiment of the present disclosure.

[0050] Figure 8 A schematic top view of the structure of a first bonding substrate provided in an embodiment of the present disclosure.

[0051] Fig. 9 A schematic top view of another first bonding substrate provided in an embodiment of the present disclosure.

[0052] Fig.10 A schematic top view of another first bonding substrate provided in an embodiment of the present disclosure.

[0053] Fig.11 A schematic diagram of the cross-sectional structure of another display panel after being bent provided in an embodiment of the present disclosure.

[0054] Fig.12 A schematic diagram of the cross-sectional structure of another display panel after being bent provided in an embodiment of the present disclosure.

[0055] Fig.13 A schematic top view of a first bonding substrate and a second bonding substrate provided in an embodiment of the present disclosure.

[0056] Fig.14 A schematic top view of another first bonding substrate and a second bonding substrate provided in an embodiment of the present disclosure.

[0057] Fig.15 A schematic top view of the structure of another first bonding substrate and a second bonding substrate provided in an embodiment of the present disclosure.

[0058] Reference numerals:

[0059] 100. Display panel;

[0060] AA, display area; BB, non-display area; B1, binding area; B2, bending area;

[0061] 10. Display substrate; 20. Driver chip; 30. Support layer; 40. Adhesive layer; 50. Metal tape; 60. Cover plate protective layer; 70. Flexible circuit;

[0062] 11. Display module; 12. Back film protective layer;

[0063] 121, a first back film layer; 122, a second back film layer;

[0064] 21. First adhesive strip; 22. Second adhesive strip;

[0065] 31. Support substrate; 32. Bending resistance layer; 33. Third adhesive layer;

[0066] 41. first bonding substrate; 42. first adhesive layer; 43. second bonding substrate; 44. second adhesive layer; 45. conductive layer;

[0067] 411, thickened area; 412, thinned area; 413, flashing;

[0068] 421, first sub-adhesive layer; 422, second sub-adhesive layer; 423, conductive adhesive layer; 424, non-conductive adhesive layer;

[0069] 61. Thin glass substrate; 62. Hardened protective layer; 63. High temperature resistant protective layer; 64. Fourth adhesive layer. DETAILED DESCRIPTION

[0070] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0071] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the illustration to another component, these terms are used in this specification only for convenience, such as according to the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0072] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used merely as labels and are not intended to limit the quantity of their objects.

[0073] Figure 1 The schematic diagram of the structure of a display panel 100 provided in an embodiment of the present disclosure is illustrated. Figure 2 A schematic diagram of the structure of a display panel 100 after being bent provided by an embodiment of the present disclosure is illustrated. Figure 3 FIG. 1 is a schematic diagram of another structure of a display panel 100 after being bent provided by an embodiment of the present disclosure. Figure 1 , Figure 2 or Figure 3 As shown, the display panel 100 includes: a display substrate 10 , a driving chip 20 , a support layer 30 and an adhesive layer 40 .

[0074] like Figure 1 As shown, the display substrate 10 has a display area AA and a non-display area BB located outside the display area AA, the non-display area BB includes a binding area B1 and a bending area B2, the bending area B2 connects the display area AA and the binding area B1; the driving chip 20 is located on the side close to the light emitting surface of the display substrate 10, and its orthographic projection on the display substrate 10 is located in the binding area B1; the supporting layer 30 is located on the side away from the light emitting surface of the display substrate 10, and its orthographic projection on the display substrate 10 at least overlaps with the display area AA; the adhesive layer 40 is located on the side of the supporting layer 30 away from the display substrate 10.

[0075] like Figure 2 or Figure 3 As shown, after the bending area B2 of the display substrate 10 is bent, the binding area B1 is located on the side away from the light emitting surface of the display substrate 10, and the driving chip 20 is located on the side of the binding area B1 away from the display area AA. At this time, the bonding layer 40 can be bonded to the support layer 30 and the bonding area B1 of the display substrate 10 respectively.

[0076] The bending area B2 may be bent toward the side away from the light emitting surface of the display substrate 10. After the bending area B2 of the display substrate 10 is bent, the binding area B1 is located on the side away from the light emitting surface of the display substrate 10. Therefore, when the bending area B2 of the display substrate 10 is not bent, the driver chip 20 can be observed on the side of the light emitting surface of the display substrate 10; and when the bending area B2 of the display substrate 10 is bent, the driver chip 20 can be observed on the side away from the light emitting surface of the display substrate 10.

[0077] The binding area B1 of the display substrate 10 is used to fix the driver chip 20, and the driver chip 20 may include a driver element for driving the display area AA to display an image, such as a data driver circuit. The driver chip 20 may be fixed by bonding. Figure 2 or Figure 3 As shown, the side of the driver chip 20 close to the bending area B2 of the display substrate 10 is fixedly connected to the binding area B1 through the first adhesive strip 21, and the side of the driver chip 20 away from the bending area B2 of the display substrate 10 is fixedly connected to the binding area B1 through the second adhesive strip 22. In this way, the driver chip 20 is covered and fixed by the first adhesive strip 21 and the second adhesive strip 22 on both sides of the driver chip 20, which improves the stability of the driver chip 20 and reduces the damage to the driver chip 20 when an external force acts on the area where the driver chip 20 is located on the display substrate 10.

[0078] In addition, the binding area B1 of the display substrate 10 is also used to bind the flexible circuit 70, so as to load corresponding signals on various signal lines of the driving chip 20 through the flexible circuit 70. After the flexible circuit 70 is bound to the binding area B1 of the display substrate 10, as shown in FIG. Figure 2 or Figure 3 As shown, the second adhesive strip 22 on the side of the driving chip 20 away from the bending area B2 can be reused as an adhesive between the flexible circuit 70 and the binding area B1 of the display substrate 10 to improve the stability of the binding of the flexible circuit 70 on the display substrate 10 .

[0079] In some embodiments, the display area AA includes a first display sub-area and a second display sub-area, and a folding area between the first display sub-area and the second display sub-area. Thus, by setting the folding area, the display panel 100 can be folded as a whole, thereby realizing the free expansion of the image display area on the display panel 100, so as to improve user stickiness.

[0080] Due to the provision of the folding area in the display area AA, in order to facilitate the foldability of the display panel 100 , each film layer structure included in the display panel 100 has a bendable property at least in the folding area.

[0081] In some embodiments, Figure 1As shown, the display substrate 10 includes a display module 11 and a back film protection layer 12, the display module 11 has a display area AA and a non-display area BB located outside the display area AA, the non-display area BB includes a binding area B1, and a bending area B2 located between the display area AA and the binding area B1; the back film protection layer 12 is located on the side away from the light emitting surface of the display module 11, and includes a first back film layer 121 and a second back film layer 122, the orthographic projection of the first back film layer 121 on the display module 11 at least overlaps with the display area AA, and the orthographic projection of the second back film layer 122 on the display module 11 at least overlaps with the binding area B1.

[0082] Among them, Figure 1 As shown, before bending in the bending area B2, the driver chip 20 is located on the side close to the light emitting surface of the display module 11, and its orthographic projection on the display module 11 is located in the binding area B1, so that the driver chip 20 is connected to the wiring and flexible circuit 70 of the display module 11 at the binding area B1 at the same time.

[0083] In some embodiments, the support layer 30 includes a support substrate 31 , the orthographic projection of the support substrate 31 on the display substrate 10 at least overlaps with the display area AA, and one side of the support substrate 31 is fixedly connected to the display area AA of the display substrate 10 .

[0084] In this way, the supporting performance of the display substrate 10 is improved by the supporting substrate 31 , thereby improving the structural strength of the display panel 100 and extending the service life of the display panel 100 .

[0085] The support layer 30 has a large elastic modulus to ensure its own structural strength, thereby ensuring the structural strength of the display panel 100. For example, the support layer 30 may include a metal material (such as stainless steel) with a large elastic modulus, or may include a carbon fiber material, a glass fiber material, etc. with a large elastic modulus.

[0086] In other embodiments, Figure 2 or Figure 3 As shown, the supporting layer 30 includes a bending-resistant layer 32 and a supporting substrate 31. The bending-resistant layer 32 is located between the display substrate 10 and the supporting substrate 31, and both surfaces of the bending-resistant layer 32 have a third adhesive layer 33. The two third adhesive layers 33 are respectively bonded to the display area AA of the display substrate 10 and the supporting substrate 31.

[0087] In this way, the bending resistance of the display substrate 10 is improved by the bending resistance layer 32 , and the supporting performance of the display substrate 10 is improved by the supporting substrate 31 , thereby better improving the structural strength of the display panel 100 and extending the service life of the display panel 100 .

[0088] The bending-resistant layer 32 may be a polyimide film or a mixed film of polyperfluoroethylene propylene and polyimide, as long as the bending-resistant layer 32 has a certain bending-resistant performance, the disclosed embodiment does not limit this. As for the supporting substrate 31, the details may refer to the above embodiment.

[0089] In some embodiments, Figure 2 or Figure 3 As shown, the display panel 100 further includes a metal tape 50 (such as a copper foil tape, etc.), and the metal tape 50 is located between the support layer 30 and the adhesive layer 40 .

[0090] In this way, the metal tape 50 can be provided to increase the bonding strength between the adhesive layer 40 and the supporting layer 30, thereby avoiding the peeling of the supporting layer 30 and the adhesive layer 40, and at the same time improve the structural strength of the display panel 100. The metal tape 50 can also be grounded. At this time, some grounding signal lines in the display panel 100 can be directly electrically connected to the metal tape 50, thereby reducing the difficulty of wiring the grounding signal lines.

[0091] In some embodiments, Figure 2 or Figure 3 As shown, the display panel 100 further includes a cover plate protection layer 60 , which is located on a side close to the light emitting surface of the display substrate 10 , and its orthographic projection on the display substrate 10 at least covers the display area AA of the display substrate 10 .

[0092] The cover plate protective layer 60 has a light-transmitting property to ensure the normal display of the image on the display panel 100. Thus, by setting the cover plate protective layer 60, the display substrate 10 is protected without affecting the normal display of the display panel 100, that is, the impact resistance of the display panel 100 is improved, and the display substrate 10 is prevented from being damaged by direct impact of foreign objects, thereby extending the service life of the display panel 100.

[0093] Alternatively, if Figure 2 or Figure 3 As shown, the cover protective layer 60 includes a thin glass substrate 61 and a hardened protective layer 62 located on a side of the thin glass substrate 61 away from the display substrate 10 . The hardened protective layer 62 and the thin glass substrate 61 can be bonded together by transparent adhesive.

[0094] The transparent adhesive may be an optical adhesive, a pressure-sensitive adhesive, etc., as long as it has a certain adhesive force and light transmittance. The hardened protective layer 62 may be a hardened plastic film or a hardened high-temperature resistant polyester film, as long as it has a certain hardness and has high light transmittance, wear resistance, scratch resistance and other characteristics. The disclosed embodiment does not limit this. In the case where the hardened protective layer 62 is a hardened high-temperature resistant polyester film, not only the impact resistance of the display substrate 10 is guaranteed, but also the high-temperature resistance of the display substrate 10 can be guaranteed, thereby further improving the service life of the display panel 100.

[0095] Furthermore, if Figure 2 or Figure 3 As shown, the cover protective layer 60 also includes a high temperature resistant protective layer 63, which is located between the thin glass substrate 61 and the display substrate 10. Both surfaces of the high temperature resistant protective layer 63 have a fourth adhesive layer 64, and the two fourth adhesive layers 64 are respectively bonded to the thin glass substrate 61 and the display area AA of the display substrate 10.

[0096] Thus, by providing the high temperature resistant protective layer 63, the high temperature resistant performance of the display substrate 10 can be effectively guaranteed, thereby further improving the service life of the display panel 100. The high temperature resistant protective layer 63 can be a high temperature polyester film or the like.

[0097] In the embodiment of the present disclosure, the adhesive layer 40 may be bonded only to the binding area B1 after the bending area B2 is bent, or it may be bonded to the binding area B2. Figure 2 or Figure 3 As shown, after the bending area B2 is bent, the adhesive layer 40 extends out of the edge of the binding area B1, thereby being bonded to the edges of the binding area B1 and the bending area B2 at the same time.

[0098] like Figure 2 or Figure 3 As shown, the bonding layer 40 includes a first bonding substrate 41 and first adhesive layers 42 located on two surfaces of the first bonding substrate 41. The elastic modulus of the first bonding substrate 41 is greater than or equal to 10 11 Pa.

[0099] After the bending area B2 of the display substrate 10 is bent, the two first adhesive layers 42 are respectively bonded to the support layer 30 and the binding area B1 of the display substrate 10, and the orthographic projection of the first adhesive substrate 41 in the display area AA at least covers the orthographic projection of the driving chip 20 in the display area AA.

[0100] In this way, after the two first adhesive layers 42 of the adhesive layer 40 are respectively bonded to the supporting layer 30 and the binding area B1 of the display substrate 10, the orthographic projection of the first adhesive substrate 41 in the display area AA at least covers the orthographic projection of the driving chip 20 in the display area AA, so that a larger elastic modulus is provided in the area where the driving chip 20 is located through the first adhesive substrate 41, thereby improving the impact resistance of the display panel 100 in the area where the driving chip 20 is located, so as to extend the service life of the display panel 100 on the basis of improving the structural strength of the display panel 100.

[0101] The elastic modulus of the first bonding substrate 41 can be, for example, 1.0×10 11 Pa, 1.2×10 11 Pa, 1.5×10 11 Pa, 1.8×10 11 Pa, 2.0×10 11 Pa, 2.2×10 11 Pa, 2.5×10 11 The first adhesive layer 42 can be transferred to the surface of the first adhesive substrate 41 (such as a stainless steel substrate) by a transfer process, or can be formed on the surface of the first adhesive substrate 41 (such as a carbon fiber composite substrate) by coating, depending on the specific material of the first adhesive substrate 41.

[0102] It should be noted that, in combination with the above-mentioned case where the display panel 100 further includes the metal tape 50, at this time, Figure 2 or Figure 3 As shown, after the bending area B2 of the display substrate 10 is bent, the two first adhesive layers 42 are respectively bonded to the metal tape 50 and the binding area B1 of the display substrate 10 .

[0103] In some embodiments, the first bonding substrate 41 may be a metal substrate (such as a stainless steel substrate, etc.) or a fiber substrate (such as a carbon fiber composite substrate, a glass fiber composite substrate, an aramid fiber composite substrate, etc.). Of course, the first bonding substrate 41 may also be a substrate of other materials, as long as it has a high elastic modulus to improve the impact resistance of the display panel 100 in the area where the driver chip 20 is located, and the embodiments of the present disclosure do not limit this.

[0104] For example, the first bonding substrate 41 is a stainless steel substrate. In this case, the elastic modulus of the first bonding substrate 41 is 1.94×10 11 Pa; the first bonding substrate 41 is a glass fiber composite board, and the elastic modulus of the first bonding substrate 41 is 1.2×10 11 Pa; the first bonding substrate 41 is a carbon fiber composite board, and the elastic modulus of the first bonding substrate 41 is 2.3×10 11 Pa.

[0105] In some embodiments, the two first adhesive layers 42 on the surface of the first adhesive substrate 41 are both non-conductive adhesive layers, i.e., insulating adhesive layers, to ensure the insulation performance between the binding area B1 and the display area AA, thereby preventing the display area AA from being affected by the binding area B1 when displaying images.

[0106] In other embodiments, Figure 3 As shown, one of the two first adhesive layers 42 on the surface of the first adhesive substrate 41, which is close to the support layer 30, is a conductive adhesive layer 423, and the other away from the support layer 30 is a non-conductive adhesive layer (i.e., insulating adhesive layer) 424. In this way, the single-sided impedance data of the display panel 100 can be directly measured through the adhesive layer 40, that is, the impedance data between the binding area B1 and the support layer 30 after the display panel 100 is bent can be measured to verify the single-sided impedance requirement of the display panel 100.

[0107] Of course, for the first adhesive layers 42 on the two surfaces of the first adhesive substrate 41, the one of the two first adhesive layers 42 closer to the support layer 30 can be a non-conductive adhesive layer 424, and the one away from the support layer 30 can be a conductive adhesive layer 423. As long as the measurement of the unilateral impedance data of the display panel 100 can be achieved, the embodiment of the present disclosure is not limited to this.

[0108] In combination with the above, the first adhesive substrate 41 can be a metal substrate or a fiber substrate. That is, the first adhesive substrate 41 can be a conductive structure or a non-conductive structure. When the first adhesive substrate 41 is a conductive structure, the first adhesive substrate 41 has a certain conductivity, so that the single-sided impedance data of the display panel 100 can be tested normally. When the first adhesive substrate 41 is a non-conductive structure, in order to facilitate the test of the single-sided impedance data of the display panel 100, it can be as follows Figure 4 As shown, the adhesive layer 40 further includes a conductive layer 45 located on the side of the first adhesive substrate 41 close to the support layer 30. Thus, by providing the conductive layer 45, the local conductive performance of the first adhesive substrate 41 can be ensured, thereby ensuring the test of the single-side impedance data of the display panel 100.

[0109] The conductive layer 45 may be an electroplated metal layer, such as an electroplated nickel layer, etc. The conductive layer 45 may cover the entire single-side surface of the first bonding substrate 41, or may cover a single-side partial surface of the first bonding substrate 41, as long as the first bonding substrate 41 can be locally conductive under the setting of the conductive layer 45.

[0110] Preferably, the edge of the conductive layer 45 can be aligned with the edge of the first adhesive layer 42. In this way, the flatness of the first adhesive layer 42 can be ensured, thereby ensuring the bonding area between the first adhesive layer 42 and the support layer 30, and ensuring the local conductivity of the first bonding substrate 41.

[0111] The thickness of the conductive layer 45 is greater than or equal to 5 microns and less than or equal to 10 microns, so as to avoid the conductive layer 45 being too thin to affect the first bonding substrate 41 and still have weak conductivity when the conductive layer 45 is provided, and to avoid the conductive layer 45 being too thick to affect the thickness of the first adhesive layer 42, thereby affecting the bonding effect between the adhesive layer 40 and the support layer 30. For example, the thickness of the conductive layer 45 is 5 microns, 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, etc.

[0112] In some embodiments, for the first adhesive substrate 41 and the first adhesive layer 42 included in the adhesive layer 40, combined with the above-mentioned situation of transferring the first adhesive layer 42 to the surface of the first adhesive substrate 41, it can be a first method: first cut the size of the first adhesive substrate 41 and the first adhesive layer 42, and then transfer the first adhesive layer 42 to the surface of the first adhesive substrate 41; it can also be a second method: first cut the size of the first adhesive substrate 41, then transfer the first adhesive layer 42 to the surface of the first adhesive substrate 41, and finally cut the size of the first adhesive layer 42; it can also be a third method: first transfer the first adhesive layer 42 to the surface of the first adhesive substrate 41, and then cut the size of the first adhesive substrate 41 and the first adhesive layer 42.

[0113] When the bonding layer 40 is manufactured according to the first method described above, optionally, the outer dimensions of the first bonding substrate 41 can be ensured by an etching process, and the outer dimensions of the first adhesive layer 42 can be ensured by a die-cutting process; Figure 2 As shown, the edge of the first adhesive substrate 41 extends out of the first adhesive layer 42. That is, the size of the first adhesive layer 42 is smaller than the size of the first adhesive substrate 41, so as to ensure the feasibility of transferring the first adhesive layer 42 to the surface of the first adhesive substrate 41 and avoid the edge of the first adhesive layer 42 extending out of the first adhesive substrate 41 due to process errors during transfer.

[0114] The edge of the first adhesive substrate 41 protrudes from the first adhesive layer 42 by a size greater than or equal to 0.1 mm, so as to ensure the yield of the first adhesive layer 42 being transferred to the surface of the first adhesive substrate 41. For example, the edge of the first adhesive substrate 41 protrudes from the first adhesive layer 42 by a size of 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc. Preferably, the edge of the first adhesive substrate 41 protrudes from the first adhesive layer 42 by a size of 0.15 mm.

[0115] Of course, the edge of the first bonding substrate 41 extending from the first adhesive layer 42 may also be slightly smaller than 0.1 mm, as long as the yield of the first adhesive layer 42 being transferred to the surface of the first bonding substrate 41 can be guaranteed.

[0116] Furthermore, the edge of the first adhesive substrate 41 extending out of the first adhesive layer 42 is less than or equal to 0.2 mm, so that the size of the first adhesive layer 42 can be increased, thereby ensuring the bonding strength of the bonding area B1 between the adhesive layer 40 and the support layer 30 and the display substrate 10.

[0117] Of course, the edge of the first adhesive substrate 41 may extend slightly larger than 0.2 mm from the first adhesive layer 42 , as long as the bonding stability between the adhesive layer 40 and the binding area B1 of the support layer 30 and the display substrate 10 can be ensured.

[0118] When the adhesive layer 40 is manufactured according to the second or third method described above, since the last step includes cutting the first adhesive layer 42, the adhesive layer 40 can be manufactured as follows. Figure 5 or Figure 6 As shown, the edge of the first bonding substrate 41 is ensured to be flush with the edge of the first adhesive layer 42, so that the first adhesive layer 42 can have a larger size to increase the bonding area of ​​the binding area B1 of the support layer 30 and the display substrate 10, thereby ensuring the stability of the bonding between the adhesive layer 40 and the binding area B1 of the support layer 30 and the display substrate 10.

[0119] Optionally, when the adhesive layer 40 is manufactured according to the second method described above, the external dimensions of the first adhesive substrate 41 can be ensured by an etching process, and the external dimensions of the first adhesive layer 42 can be ensured by a laser cutting process. Optionally, when the adhesive layer 40 is manufactured according to the third method described above, the external dimensions of the first adhesive substrate 41 and the first adhesive layer 42 can be ensured by a stamping process.

[0120] When the first adhesive substrate 41 and the first adhesive layer 42 are cut by a stamping process, Figure 6 As shown, the edge of the first adhesive substrate 41 will form a burr 413 bent to one side, that is, the edge of the first adhesive substrate 41 has a burr 413 bent to one side, and the burr 413 of the edge of the first adhesive substrate 41 can be set to face the support layer 30. In this way, when the adhesive layer 40 is only bonded to the binding area B1, the burr 413 on the first adhesive substrate 41 can be prevented from abutting against the binding area B1 of the display substrate 10, thereby avoiding the situation where the binding area B1 of the display substrate 10 is damaged. Figure 6As shown, when the edge of the adhesive layer 40 extends into the bending area B2, that is, when the adhesive layer 40 is bonded to the edges of the binding area B1 and the bending portion B2 at the same time, the burr 413 on the first adhesive substrate 41 can be prevented from abutting against the bending area B2 of the display substrate 10, thereby avoiding damage to the bending area B2 of the display substrate 10.

[0121] In the embodiment of the present disclosure, the adhesive layer 40 included in the display panel 100 can be an integrated whole layer structure, or a split structure arranged in a direction away from the bending area B2 in combination with the position of the driving chip 20. The integrated structure and the split structure are explained below.

[0122] For the case where the adhesive layer 40 is set as an integrated whole layer structure:

[0123] In some embodiments, the thickness of the entire region of the first adhesive substrate 41 is uniform, which can simplify the processing of the first adhesive substrate 41 and thus improve the assembly efficiency of the display panel 100 .

[0124] In other embodiments, Figure 7 As shown, the first bonding substrate 41 has a thickened area 411 and a thinned area 412. After the bending area B2 is bent, the orthographic projection of the thickened area 411 in the display area AA at least covers the orthographic projection of the driving chip 20 in the display area AA, and the thinned area 412 is located on the side of the thickened area 411 close to the bending area B2.

[0125] In this way, by setting the thinning area 412 on the first bonding substrate 41, the thickness of the first adhesive layer 42 in the thinning area 412 can be increased, thereby increasing the bonding strength of the bonding layer 40 with the binding area B1 of the display substrate 10 and the supporting layer 30 at a position close to the bending area B2, thereby improving the fixing strength of the display area AA and the binding area B1 of the display substrate 10, ensuring the bending effect of the bending area B2 of the display substrate 10, and reducing the radial tension in the bending area B2 and the influence of the high temperature and high humidity environment, which causes the supporting layer 30 and the binding area B1 to partially fall off from the adhesive layer 40, thereby extending the service life of the display panel 100.

[0126] Among them, the thickened area 411 and the thinned area 412 of the first bonding substrate 41 can be obtained by an etching process, and the transition between the thickened area 411 and the thinned area 412 can be a step-type transition or a slope-type transition. In the case of a slope-type transition, the transition can be made through an inclined plane or an inclined arc surface, and the embodiment of the present disclosure does not limit this. In the case where the thickened area 411 and the thinned area 412 of the first bonding substrate 41 are a step-type transition, the first adhesive layer 42 on the surface of the first bonding substrate 41 can be obtained by a die-cutting process. The outer dimensions of the first sub-adhesive layer 421 located in the thickened area 411 and the outer dimensions of the second sub-adhesive layer 422 located in the thinned area 412, and then the first sub-adhesive layer 421 and the second sub-adhesive layer 422 are transferred to the thickened area 411 and the thinned area 412 of the first bonding substrate 41, respectively.

[0127] Among them, Figure 7 As shown, the first adhesive layer 42 includes a first sub-adhesive layer 421 located in the thickened area 411 of the first bonding substrate 41, and a second sub-adhesive layer 422 located in the thinned area 412 of the first bonding substrate 41; the edge of the thickened area 411 of the first bonding substrate 41 extends out of the edge of the first sub-adhesive layer 421, and the edge of the first bonding substrate 41 extends out of the edge of the second sub-adhesive layer 422 at the edge of the thinned area 412, so as to ensure the transfer yield when the first sub-adhesive layer 421 is transferred to the thickened area 411 of the first bonding substrate 41, and the second sub-adhesive layer 422 is transferred to the thinned area 412 of the first bonding substrate 41.

[0128] It should be noted that the size of the edge of the thickened area 411 of the first adhesive substrate 41 extending from the edge of the first sub-adhesive layer 421, and the size of the edge of the thinned area 412 of the first adhesive substrate 41 extending from the edge of the second sub-adhesive layer 422 can refer to the size of the edge of the first adhesive substrate 41 extending from the edge of the first adhesive layer 42 described in the above embodiment, and the embodiment of the present disclosure will not be repeated. For example, the size of the edge of the thickened area 411 of the first adhesive substrate 41 extending from the edge of the first sub-adhesive layer 421, and the size of the edge of the thinned area 412 of the first adhesive substrate 41 extending from the edge of the second sub-adhesive layer 422 are both 0.15 mm.

[0129] Optionally, the thickness of the first bonding substrate 41 in the thickened area 411 is greater than or equal to 0.08 mm. In this way, by limiting the minimum thickness of the first bonding substrate 41 in the thickened area 411, the support strength of the thickened area 411 to the area where the driver chip 20 is located is guaranteed, the impact resistance of the display panel 100 in the area where the driver chip 20 is located is effectively guaranteed, and the possibility of damage to the driver chip 20 is reduced. For example, the thickness of the first bonding substrate 41 in the thickened area 411 can be 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, etc.

[0130] Furthermore, the thickness of the first adhesive substrate 41 in the thickened area 411 can be set to be less than or equal to 0.12 mm. In this way, by limiting the maximum thickness of the first adhesive substrate 41 in the thickened area 411, it is avoided that the first sub-adhesive layer 421 on the surface of the thickened area 411 is too thin, thereby ensuring the bonding stability of the first sub-adhesive layer 421 to the support layer 30 and the binding area B1 of the display substrate 10.

[0131] It should be noted that the specific thickness of the first adhesive substrate 41 in the thickened area 411 can also be set with reference to the distance between the support layer 30 and the binding area B1 after the display substrate 10 is bent, so as to ensure that the thickened area 411 of the first adhesive substrate 41 has sufficient support strength for the area where the driver chip 20 is located, and the two first sub-adhesive layers 421 of the thickened area 411 have sufficient bonding strength with the support layer 30 and the binding area B1 respectively, and the thickness of the first adhesive substrate 41 in the thickened area 411 is set to be slightly less than 0.08 mm, or slightly greater than 0.12 mm. For example, the thickness of the first adhesive substrate 41 in the thickened area 411 is 0.07 mm, 0.13 mm, etc.

[0132] Optionally, the thickness of the first adhesive substrate 41 in the thinning area 412 is less than or equal to 0.06 mm. In this way, by limiting the maximum thickness of the first adhesive substrate 41 in the thinning area 412, the minimum thickness of the second sub-adhesive layer 422 on the surface of the thinning area 412 is guaranteed, thereby ensuring the stability of the second sub-adhesive layer 422 adhering to the position of the support layer 30 close to the bending area B2 of the display substrate 10 and the position of the binding area B1 of the display substrate 10 close to the bending area B2, thereby ensuring the stability of the bending area B2 of the display substrate 10 after bending to form an arc. For example, the thickness of the first adhesive substrate 41 in the thinning area 412 can be 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, etc.

[0133] It should be noted that the specific thickness of the first adhesive substrate 41 in the thinning area 412 can also be set with reference to the distance between the support layer 30 and the binding area B1 after the display substrate 10 is bent, so as to ensure that the two second sub-adhesive layers 422 of the first adhesive substrate 41 in the thinning area 412 have sufficient bonding strength with the support layer 30 and the binding area B1 respectively, and the thickness of the first adhesive substrate 41 in the thinning area 412 is set to be slightly greater than 0.06 mm. For example, the thickness of the first adhesive substrate 41 after thinning is 0.07 mm.

[0134] In the case where the first bonding substrate 41 has the thickened area 411 and the thinned area 412 , the distribution of the thickened area 411 and the thinned area 412 on the first bonding substrate 41 may be determined by referring to the size and shape of the binding area B1 of the display substrate 10 .

[0135] Alternatively, if Figure 8 As shown, there is no overlap between the thinning area 412 and the thickening area 411 in the direction of the rotation axis O of the bending area B2. For example, when the binding area B1 of the display substrate 10 is large and the outer contour is a square structure, the first bonding substrate 41 can be set to a square structure, and a portion of the first bonding substrate 41 close to the bending area B2 is set as the thinning area 412, and a portion away from the bending area B2 is set as the thickening area 411.

[0136] Alternatively, if Fig. 9 As shown, the thinning area 412 is a U-shaped structure with an opening facing away from the bending area B2, and at least part of the thickening area 411 is located in the U-shaped groove surrounded by the thinning area 412. For example, when the binding area B1 of the display substrate 10 is small and the outer contour is a special-shaped structure, the first bonding substrate 41 can be set to a square structure, and a part of the first bonding substrate 41 close to the bending area B2 and the parts on both sides of the bending area B2 in the axial direction are set as the thinning area 412 of the U-shaped structure, and the remaining part is set as the thickening area 411 located in the U-shaped groove of the thinning area 412.

[0137] Alternatively, if Fig.10 As shown, the thinning area 412 is annular in structure, and the thickening area 411 is located in the area surrounded by the thinning area 412. For example, when the binding area B1 of the display substrate 10 is large and the outer contour does not define a structure, the first bonding substrate 41 can be set to a square structure, and the outer ring portion of the first bonding substrate 41 is set as the thinning area 412 of the annular structure, and the portion within the area surrounded by the thinning area 412 is set as the thickening area 411.

[0138] It should be noted that, for the above three implementation modes, Figure 8 , Fig. 9 or Fig.10As shown, the width L1 of the thinning area 412 on the side of the first bonding substrate 41 close to the bending area B2 is greater than or equal to 2 mm and less than or equal to 5 mm. For example, the width L1 of the thinning area 412 on the side of the first bonding substrate 41 close to the bending area B2 is 2 mm, 3 mm, 4 mm, 5 mm, etc. In this way, while ensuring that the thickened area 411 of the first bonding substrate 41 provides better support for the area where the driver chip 20 is located, the stability of the second sub-adhesive layer 422 on the surface of the thinning area 412 of the first bonding substrate 41 to bond to the support layer 30 and the binding area B1 can be ensured, thereby ensuring the stability of the arc formed by the bending area B2 of the display substrate 10 after bending.

[0139] It should be noted that, for the latter two implementations, Fig. 9 or Fig.10 As shown, the dimension L2 of the thinning area 412 on one side of the first bonding substrate 41 in the direction of the rotation axis O of the bending area B2 is greater than or equal to 6 mm and less than or equal to 12 mm. For example, the dimension L2 of the thinning area 412 on one side of the first bonding substrate 41 in the direction of the rotation axis O of the bending area B2 is 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc. In this way, the distribution range of the thinning area 412 on the first bonding substrate 41 can be further increased, thereby increasing the bonding area of ​​the second sub-adhesive layer 422, so as to ensure that the thickened area 411 of the first bonding substrate 41 forms a better support for the area where the driving chip 20 is located, and ensure the stability of the second sub-adhesive layer 422 on the surface of the thinning area 412 of the first bonding substrate 41 to bond the support layer 30 and the binding area B1, thereby ensuring the stability of the bending area B2 of the display substrate 10 after bending to form an arc.

[0140] For the case where the adhesive layer 40 is set as a split structure:

[0141] In some embodiments, Fig.11 As shown, the adhesive layer 40 further includes a second adhesive layer 44, which is located on one side of the first adhesive substrate 41 close to the bending area B2. After the bending area B2 is bent, the second adhesive layer is respectively bonded to the support layer 30 and the binding area B1 of the display substrate 10. In this way, the position of the support layer 30 close to the bending area B2 and the position of the binding area B1 of the display substrate 10 close to the bending area B2 are directly bonded through the integrated second adhesive layer 44, thereby effectively ensuring the stability of the bonding, reducing the situation where the support layer 30 and the binding area B1 partially fall off from the adhesive layer 40 due to the radial tension of the bending area B2 and the influence of the high temperature and high humidity environment, thereby extending the service life of the display panel 100.

[0142] In other embodiments, Figure 3 , Figure 4 or Fig.12As shown, the bonding layer 40 also includes a second bonding substrate 43, and second adhesive layers 44 located on two surfaces of the second bonding substrate 43; the thickness of the second bonding substrate 43 is less than the thickness of the first bonding substrate 41, and the second bonding substrate 43 is located on the side of the first bonding substrate 41 close to the bending area B2. After the bending area B2 is bent, the two second adhesive layers are respectively bonded to the supporting layer 30 and the binding area B1 of the display substrate 10.

[0143] In this way, it can be ensured that the thickness of the second adhesive layer 44 is greater than the thickness of the first adhesive layer 42, thereby being able to further ensure the stability of the bonding between the support layer 30 near the bending area B2 and the position near the bending area B2 in the binding area B1 of the display substrate 10 and the adhesive layer 40, thereby ensuring the bending effect of the bending area B2 of the display substrate 10, reducing the radial tension in the bending area B2 and the influence of the high temperature and high humidity environment, which causes the support layer 30 and the binding area B1 to partially fall off from the adhesive layer 40, thereby extending the service life of the display panel 100.

[0144] The first bonding substrate 41 and the second bonding substrate 43 are spaced apart, and the spacing between the first bonding substrate 41 and the second bonding substrate 43 is greater than or equal to 0.2 mm, so as to avoid interference between the first bonding substrate 41 and the second bonding substrate 43. For example, the spacing between the first bonding substrate 41 and the second bonding substrate 43 is 0.2 mm, 0.3 mm, 0.4 mm, and 0.5 mm. Of course, the spacing between the first bonding substrate 41 and the second bonding substrate 43 can also be slightly less than 0.2 mm, such as 0.18 mm, as long as interference between the first bonding substrate 41 and the second bonding substrate 43 can be avoided.

[0145] The second adhesive layer 44 may be formed on the surface of the second adhesive substrate 43 by coating to improve the tightness of the second adhesive layer 44 and the second adhesive substrate 43. Since the second adhesive layer 44 is formed on the surface of the second adhesive substrate 43 by coating, Fig.12 As shown, the edge of the second bonding substrate 43 can be flush with the edge of the second adhesive layer 44 to ensure that the second adhesive layer 44 has a larger bonding area. The second bonding substrate 43 can be made of a material with a small elastic modulus, such as a high temperature resistant polyester film.

[0146] Optionally, the thickness of the first adhesive substrate 41 is greater than or equal to 0.08 mm. In this way, by limiting the minimum thickness of the first adhesive substrate 41, the support strength of the area where the driver chip 20 is located is guaranteed, the impact resistance of the display panel 100 in the area where the driver chip 20 is located is effectively guaranteed, and the possibility of damage to the driver chip 20 is reduced. For example, the thickness of the first adhesive substrate 41 can be 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, etc.

[0147] Furthermore, the thickness of the first adhesive substrate 41 can be set to be less than or equal to 0.12 mm. In this way, by limiting the maximum thickness of the first adhesive substrate 41, the first adhesive layer 42 on the first adhesive substrate 41 is prevented from being too thin, thereby ensuring the bonding stability of the first adhesive layer 42 to the binding area B1 of the support layer 30 and the display substrate 10.

[0148] It should be noted that the specific thickness of the first adhesive substrate 41 can also be set with reference to the distance between the support layer 30 and the binding area B1 after the display substrate 10 is bent, so as to ensure that the first adhesive substrate 41 has sufficient support strength for the area where the driver chip 20 is located, and the two first adhesive layers 42 have sufficient bonding strength with the support layer 30 and the binding area B1, respectively, and the thickness of the first adhesive substrate 41 is set to be slightly less than 0.08 mm, or slightly greater than 0.12 mm. For example, the thickness of the first adhesive substrate 41 is 0.07 mm, 0.13 mm, etc.

[0149] Optionally, the thickness of the second adhesive substrate 43 is less than or equal to 0.06 mm. In this way, by limiting the maximum thickness of the second adhesive substrate 43, the minimum thickness of the second adhesive layer 44 on the second adhesive substrate 43 is guaranteed, thereby ensuring the stability of the second adhesive layer 44 bonding to the support layer 30 near the bending area B2 of the display substrate 10 and the binding area B1 of the display substrate 10 near the bending area B2, thereby ensuring the stability of the bending area B2 of the display substrate 10 after bending to form an arc. For example, the thickness of the second adhesive substrate 43 can be 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, etc.

[0150] It should be noted that the specific thickness of the second adhesive substrate 43 can also be set with reference to the distance between the support layer 30 and the binding area B1 after the display substrate 10 is bent, so as to ensure that the two second adhesive layers 44 on the surface of the second adhesive substrate 43 have sufficient bonding strength with the support layer 30 and the binding area B1 respectively, and the thickness of the second adhesive substrate 43 is set to be slightly greater than 0.06 mm. For example, the thickness of the second adhesive substrate 43 is 0.07 mm.

[0151] In the case where the adhesive layer 40 includes the first adhesive substrate 41 and the second adhesive substrate 43 , the distribution of the first adhesive substrate 41 and the second adhesive substrate 43 may be determined by referring to the size and shape of the binding area B1 of the display substrate 10 .

[0152] Alternatively, if Fig.13 As shown, the first bonding substrate 41 and the second bonding substrate 43 do not have an overlapping area in the direction of the rotation axis O of the bending area B2. For example, when the binding area B1 of the display substrate 10 is large and the outer contour is a square structure, the first bonding substrate 41 and the second bonding substrate 43 can be set to be square structures, and the second bonding substrate 43 is located on the side close to the bending area B2, and the first bonding substrate 41 is located on the side away from the bending area B2.

[0153] Alternatively, if Fig.14 As shown, the second bonding substrate 43 is a U-shaped structure with its opening facing away from the bending area B2, and the first bonding substrate 41 is located in the U-shaped groove surrounded by the second bonding substrate 43. For example, when the binding area B1 of the display substrate 10 is small and the outer contour is a special-shaped structure, the second bonding substrate 43 can be set to a U-shaped structure, and the opening of the second bonding substrate 43 faces away from the bending area B2, and the first bonding substrate 41 is set to a square structure and is located in the U-shaped groove of the second bonding substrate 43.

[0154] Alternatively, if Fig.15 As shown, the second bonding substrate 43 is annular in structure, and at least part of the first bonding substrate 41 is located in the area surrounded by the second bonding substrate 43. For example, when the binding area B1 of the display substrate 10 is large and the outer contour does not define a structure, the second bonding substrate 43 can be set to be annular in structure, and the first bonding substrate 41 can be set to be a square in structure and located in the area surrounded by the second bonding substrate 43.

[0155] It should be noted that, for the above three implementation modes, Fig.13 , Fig.14 or Fig.15 As shown, the width L3 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 close to the bending area B2 is greater than or equal to 2 mm and less than or equal to 5 mm. For example, the width L3 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 close to the bending area B2 is 2 mm, 3 mm, 4 mm, 5 mm, etc. In this way, while ensuring that the first adhesive substrate 41 forms a better support for the area where the driver chip 20 is located, it is possible to ensure the stability of the second adhesive layer 44 on the surface of the second adhesive substrate 43 to bond the support layer 30 and the binding area B1, thereby ensuring the stability of the arc formed by the bending area B2 of the display substrate 10 after bending.

[0156] It should be noted that, for the latter two implementations, Fig.14 or Fig.15As shown, the dimension L4 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 in the direction of the rotation axis O of the bending area B2 is greater than or equal to 6 mm and less than or equal to 12 mm. For example, the dimension L4 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 in the direction of the rotation axis O of the bending area B2 is 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc. In this way, the distribution range of the second adhesive substrate 43 can be further increased, thereby increasing the bonding area of ​​the second adhesive layer 44, so as to ensure that the first adhesive substrate 41 forms a better support for the area where the driving chip 20 is located, and ensure the stability of the second adhesive layer 44 on the surface of the second adhesive substrate 43 to bond the support layer 30 and the binding area B1, thereby ensuring the stability of the bending area B2 of the display substrate 10 after bending into an arc.

[0157] The present disclosure also provides a display device, which includes the display panel described in the above embodiment. In combination with the display panel described in the above embodiment, the display device including the display panel can ensure the structural strength of the display device and improve the service life of the display device.

[0158] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A display panel, characterized in that: include: A display substrate having a display area and a non-display area located outside the display area, wherein the non-display area includes a binding area and a bending area, and the bending area connects the display area and the binding area; A driving chip, whose orthographic projection on the display substrate is located in the binding area; A support layer, located on a side away from the light emitting surface of the display substrate, and an orthographic projection on the display substrate at least overlaps with the display area; The adhesive layer is located on the side of the support layer away from the display substrate, and includes a first adhesive substrate and a first adhesive layer located on two surfaces of the first adhesive substrate, wherein the elastic modulus of the first adhesive substrate is greater than or equal to 10 11 Pa; After the bending area is bent, the binding area is located on the side away from the light emitting surface of the display substrate, and the driving chip is located on the side of the binding area away from the display area, the two first adhesive layers are respectively bonded to the supporting layer and the binding area of ​​the display substrate, and the orthographic projection of the first adhesive substrate in the display area at least covers the orthographic projection of the driving chip in the display area.

2. The display panel according to claim 1, wherein: The adhesive layer also includes a second adhesive substrate, and second adhesive layers located on both surfaces of the second adhesive substrate; The thickness of the second bonding substrate is smaller than that of the first bonding substrate, and the second bonding substrate is located on a side of the first bonding substrate close to the bending area. After the bending area is bent, the two second adhesive layers are respectively bonded to the support layer and the binding area of ​​the display substrate.

3. The display panel according to claim 2, wherein: There is no overlapping area between the first bonding substrate and the second bonding substrate in the rotation axis direction of the bending region.

4. The display panel according to claim 2, wherein: The second bonding substrate is in a U-shaped structure with an opening facing away from the bending area, and the first bonding substrate is located in a U-shaped groove surrounded by the second bonding substrate.

5. The display panel according to claim 2, wherein: The second bonding substrate is in an annular structure, and at least a portion of the first bonding substrate is located in a region surrounded by the second bonding substrate.

6. The display panel according to any one of claims 3 to 5, characterized in that: The width of the second bonding substrate on a side of the first bonding substrate close to the bending area is greater than or equal to 2 mm and less than or equal to 5 mm.

7. The display panel according to claim 4 or 5, characterized in that: A dimension of the second bonding substrate located on one side of the first bonding substrate in the rotation axis direction of the bending zone is greater than or equal to 6 mm and less than or equal to 12 mm.

8. The display panel according to claim 1, wherein: The adhesive layer further includes a second adhesive layer, which is located on a side of the first adhesive substrate close to the bending area. After the bending area is bent, the second adhesive layer is respectively bonded to the binding area of ​​the support layer and the display substrate.

9. The display panel according to claim 1, wherein: The adhesive layer is an integrated whole-layer structure.

10. The display panel according to claim 9, wherein: The first bonding substrate has a thickened area and a thinned area; After the bending area is bent, the orthographic projection of the thickened area on the display area at least covers the orthographic projection of the driving chip on the display area, and the thinned area is located on a side of the thickened area close to the bending area.

11. The display panel according to claim 10, wherein: There is no overlapping area between the thinned area and the thickened area in the rotation axis direction of the bending area.

12. The display panel according to claim 10, wherein: The thinned area is in a U-shaped structure with its opening facing away from the bending area, and at least a portion of the thickened area is located in the U-shaped groove surrounded by the thinned area.

13. The display panel according to claim 10, wherein: The thinning area is in an annular structure, and the thickening area is located in the area surrounded by the thinning area.

14. The display panel according to any one of claims 10 to 13, characterized in that: The thickness of the first bonding substrate in the thickened area is greater than or equal to 0.08 mm.

15. The display panel according to any one of claims 10 to 13, characterized in that: The thickness of the first bonding substrate in the thinned area is less than or equal to 0.06 mm.

16. The display panel according to claim 1, wherein: An edge of the first bonding substrate extends beyond the first adhesive layer.

17. The display panel according to claim 16, wherein: The protruding dimension of the edge of the first bonding substrate is greater than or equal to 0.1 mm and less than or equal to 0.2 mm.

18. The display panel according to claim 1, wherein: The edge of the first bonding substrate is aligned with the edge of the first adhesive layer.

19. The display panel according to claim 18, wherein: The edge of the first bonding substrate has a burr bent toward one side, and the burr faces the supporting layer.

20. The display panel according to claim 1, wherein: The first bonding substrate is a metal substrate or a fiber substrate.

21. The display panel according to claim 1, wherein: Of the two first adhesive layers, the one close to the support layer is a conductive adhesive layer, and the one away from the support layer is a non-conductive adhesive layer.

22. The display panel according to claim 21, wherein: The first bonding substrate is a non-conductive structure, and the bonding layer further includes a conductive layer located on a side of the first bonding substrate close to the supporting layer.

23. The display panel according to claim 22, wherein: The thickness of the conductive layer is greater than or equal to 5 micrometers and less than or equal to 10 micrometers.

24. The display panel according to claim 1, wherein: The support layer includes a bending-resistant layer and a support substrate; The anti-bending layer is located between the display substrate and the supporting substrate, and both surfaces of the anti-bending layer have third adhesive layers, and the two third adhesive layers are respectively bonded to the display area of ​​the display substrate and the supporting substrate.

25. The display panel according to claim 1, wherein: The display area includes a first display sub-area and a second display sub-area, and a folding area located between the first display sub-area and the second display sub-area.

26. A display device, characterized in that: A display panel comprising any one of claims 1-25.

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