Etching device for semiconductor chip production

Abstract

The utility model discloses an etching device for semiconductor chip production, which relates to the technical field of etching devices and comprises a fixing mechanism, a lifting mechanism is arranged on the side surface of the fixing mechanism, a collecting mechanism is arranged in the fixing mechanism, and an exhaust mechanism is further arranged on the upper surface of the fixing mechanism. Meanwhile, observation windows are arranged on the front surface and the rear surface of the etching box, a worker can observe the etching effect of the two faces of the chip through the two observation windows, and therefore when the device conducts double-face etching, the worker can observe the etching condition of the two faces of the chip very easily; when the upper cover ascends, the collecting disc with micropores in the surface can be driven to ascend, waste residues generated by etching in etching liquid are fished up through the ascending collecting disc, then a worker takes down the waste residues while taking down a chip, the waste residues in the etching liquid can be cleaned, and the purity of the etching liquid is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of etching devices, in particular to an etching device for producing semiconductor chips. Background Art

[0002] Semiconductor chip: A semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. Not only silicon chips, but also common ones include gallium arsenide (gallium arsenide is toxic, so don't be curious to disassemble some low-quality circuit boards), germanium and other semiconductor materials. Semiconductors are also trendy like cars. In the 1970s, American companies such as Intel had the upper hand in the dynamic random access memory (D-RAM) market. However, due to the emergence of large computers, high-performance D-RAM was needed in the 1980s, and Japanese companies ranked among the top. When semiconductor chips are produced and processed, etching devices are used, so that semiconductor chips can be etched, and etching work requires the use of etching devices;

[0003] For example, the patent website discloses an etching device for semiconductor chip production (publication number: CN217903080U). The groove fixing seat of this device is used to place the chip, but the chip is placed flat with the etching side facing up. However, if the chip needs to be etched on both sides, the other side faces down, which makes it impossible for the staff to observe the etching effect below. The staff needs to pick up the chip to observe the etching situation below the chip. Therefore, it is very troublesome for this device to etch the chip on both sides. Therefore, the technicians in this field have proposed an etching device for semiconductor chip production. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides an etching device for producing semiconductor chips, which solves the problems in the above background.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: an etching device for semiconductor chip production, comprising a fixing mechanism, a lifting mechanism is arranged on the side of the fixing mechanism, a collecting mechanism is arranged inside the fixing mechanism, and an exhaust mechanism is also arranged on the upper surface of the fixing mechanism, the fixing mechanism comprises an etching box, the front and rear surfaces of the etching box are provided with observation windows facing it, each of the observation windows is provided with transparent glass, the upper port of the etching box is provided with an upper cover adapted thereto, a moving seat is installed at the center of the lower surface of the upper cover, a moving groove is arranged on the lower surface of the moving seat, a motor is installed at one end of the moving seat, the driving end of the motor extends into the moving groove and is provided with a bidirectional screw whose end is rotatably connected to its inner wall, a threaded seat is provided on each thread of the bidirectional screw, and a clamp is installed on the lower surface of each threaded seat.

[0006] As a further technical solution of the utility model, the lifting mechanism includes lower fixed shifts installed at the bottom of both sides of the etching box, an electric push rod is installed at the center of the upper surface of each lower fixed shift, and an upper fixed plate whose side is fixedly connected to the upper cover is installed at the upper end of each electric push rod.

[0007] As a further technical solution of the utility model, the collection mechanism includes a mounting plate installed on the lower surface of the upper cover and located on both sides of the movable seat, and the lower ends of the two mounting plates are jointly installed with a collection tray in the etching box, and the surface of the collection tray is provided with a plurality of evenly distributed micropores.

[0008] As a further technical solution of the utility model, the exhaust mechanism includes an air pump installed on the upper surface of the etching box, the input end of the air pump is installed with a pipeline penetrating the upper cover, and the output end of the air pump is installed with an exhaust pipe.

[0009] As a further technical solution of the utility model, an input pipe penetrating the upper cover is arranged on the upper surface of the etching box at one side of the vacuum pump, and a valve is arranged on the input pipe near the upper cover.

[0010] Beneficial Effects

[0011] The utility model provides an etching device for semiconductor chip production. Compared with the prior art, it has the following beneficial effects:

[0012] 1. An etching device for semiconductor chip production. The fixing mechanism of the device vertically clamps and fixes the chip. At the same time, observation windows are provided on the front and rear surfaces of the etching box. The staff can use the two observation windows to observe the etching effect on both sides of the chip. There is no need to hold the chip and flip it for observation. Therefore, it is very simple for the staff to observe the etching conditions on both sides of the chip when the device performs double-sided etching.

[0013] 2. An etching device for semiconductor chip production. A collecting mechanism is also installed on the upper cover of the device. When the upper cover rises, it can drive the collecting plate with micropores on the surface to rise. The rising collecting plate is used to pick up the waste residue generated by etching in the etching solution. After that, the staff removes the waste residue together with the chip, and the waste residue in the etching solution can be cleaned, thereby ensuring the purity of the etching solution and preventing it from affecting the etching of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The present invention is a schematic diagram of the structure of an etching device for producing semiconductor chips;

[0015] Figure 2 A side view of an etching device for producing semiconductor chips;

[0016] Figure 3A cross-sectional view of an etching device for producing semiconductor chips;

[0017] Figure 4 A cross-sectional view of a working state of an etching device for producing semiconductor chips;

[0018] Figure 5 The figure is a schematic diagram of the structure of a collecting mechanism of an etching device used in semiconductor chip production.

[0019] In the figure: 1. Etching box; 2. Observation window; 3. Upper cover; 4. Moving seat; 5. Moving groove; 6. Motor; 7. Bidirectional screw; 8. Threaded seat; 9. Clamp; 10. Lower fixed shift; 11. Electric push rod; 12. Upper fixed plate; 13. Mounting plate; 14. Collecting tray; 15. Vacuum pump; 16. Exhaust pipe; 17. Input pipe. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-4 The utility model provides a technical solution of an etching device for semiconductor chip production: an etching device for semiconductor chip production, comprising a fixing mechanism, a lifting mechanism is arranged on the side of the fixing mechanism, a collecting mechanism is arranged inside the fixing mechanism, and an exhaust mechanism is arranged on the upper surface of the fixing mechanism. The fixing mechanism comprises an etching box 1, and the front and rear surfaces of the etching box 1 are both provided with observation windows 2 facing the etching box 1, and transparent glass is arranged in each observation window 2. The upper port of the etching box 1 is provided with an upper cover 3 adapted thereto, and a moving seat 4 is installed at the center of the lower surface of the upper cover 3. A moving groove 5 is arranged on the lower surface of the moving seat 4, and a motor 6 is installed at one end of the moving seat 4. The driving end of the motor 6 extends into the moving groove 5 and is provided with a bidirectional screw 7 whose end is rotatably connected to the inner wall thereof, and a thread seat 8 is arranged on each thread of the bidirectional screw 7, and a clamping plate 9 is installed on the lower surface of each thread seat 8. When in use, the semiconductor chip is placed between the two clamping plates 9, and the motor 6 drives the bidirectional screw 7 to rotate, drives the two thread seats 8 to approach each other, and drives the two clamping plates 9 to approach each other to clamp the chip.

[0022] See also Figure 1-4 An input pipe 17 penetrating the upper cover 3 is provided on the upper surface of the etching box 1 at one side of the vacuum pump 15. A valve is provided on the input pipe 17 near the upper cover 3. When in use, the valve on the input pipe 17 is opened to transport the etching liquid into the etching box 1 through the input pipe 17.

[0023] See also Figure 1-4 The exhaust mechanism includes an air pump 15 installed on the upper surface of the etching box 1. The input end of the air pump 15 is installed with a pipeline penetrating the upper cover 3, and the output end of the air pump 15 is installed with an exhaust pipe 16. When in use, the air pump 15 runs through the pipeline to suck away the poisonous gas generated by the etching in the etching box 1, and then transports it to the poisonous gas recovery device through the exhaust pipe 16.

[0024] See also Figure 3-5 The collecting mechanism includes a mounting plate 13 mounted on the lower surface of the upper cover 3 and on both sides of the movable seat 4. The lower ends of the two mounting plates 13 are jointly mounted with a collecting plate 14 in the etching box 1. The surface of the collecting plate 14 is provided with a plurality of evenly distributed micropores. When in use, the two electric push rods 11 extend to drive the upper cover 3 and its surface components to rise, drive the chip and the collecting plate 14 to rise, and the rising collecting plate 14 also removes the etching liquid. The etching liquid is filtered through the rising collecting plate 14, and the waste residue material residue or chemical product generated in the etching process in the etching liquid is fished out.

[0025] See also Figure 1-4 The lifting mechanism includes lower fixed classes 10 installed at the bottom of both sides of the etching box 1, and an electric push rod 11 is installed at the center of the upper surface of each lower fixed class 10. The upper end of each electric push rod 11 is installed with an upper fixed plate 12 whose side is fixedly connected to the upper cover 3. When in use, the two electric push rods 11 are shortened to drive the upper cover 3 and its surface components to descend, thereby driving the clamped chip to descend until the upper cover 3 covers the upper port of the etching box 1.

[0026] The working principle of the utility model is as follows: the semiconductor chip is placed between the two clamping plates 9, the motor 6 is operated to drive the bidirectional screw 7 to rotate, drive the two threaded seats 8 to approach each other, drive the two clamping plates 9 to approach each other to clamp the chip, and then the two electric push rods 11 are shortened to drive the upper cover 3 and its surface components to descend, and then drive the clamped chip to descend until the upper cover 3 covers the upper port of the etching box 1;

[0027] Connect the exhaust pipe 16 to the input end of the poisonous gas recovery device, open the valve on the input pipe 17, and transport the etching solution into the etching box 1 through the input pipe 17 until the etching solution level overflows the chip, and then the etching solution can etch the chip, and at the same time, the vacuum pump 15 runs through the pipeline to suck away the poisonous gas generated by the etching in the etching box 1, and then transport it to the poisonous gas recovery device through the exhaust pipe 16;

[0028] When the chip etching is completed, the two electric push rods 11 extend to drive the upper cover 3 and its surface components to rise, and drive the chip and the collecting tray 14 to rise until the chip is completely removed from the etching solution. At the same time, the rising collecting tray 14 also removes the etching solution. The etching solution is filtered through the rising collecting tray 14, and the waste residue material residues or chemical products generated in the etching process in the etching solution are fished out, so that the waste residue remains in the collecting tray 14 from which the etching solution is removed. The staff cleans the waste residue in the collecting tray 14, holds the chip, and then the motor 6 drives the bidirectional screw 7 to reverse. Through the above operation, the two clamps 9 are moved away from each other, contacting the clamping of the chip, and then the chip is removed, and the operation is completed.

Claims

1. An etching device for semiconductor chip production, characterized in that: The invention comprises a fixing mechanism, a lifting mechanism is arranged on the side of the fixing mechanism, a collecting mechanism is arranged inside the fixing mechanism, and an exhaust mechanism is arranged on the upper surface of the fixing mechanism. The fixing mechanism comprises an etching box (1), and observation windows (2) are arranged on the front and rear surfaces of the etching box (1), and transparent glass is arranged in each of the observation windows (2). The upper end of the etching box (1) is provided with an upper cover (3) matched with the etching box, and a moving seat (4) is installed at the center of the lower surface of the upper cover (3). A moving groove (5) is arranged on the lower surface of the moving seat (4), and a motor (6) is installed at one end of the moving seat (4). The driving end of the motor (6) extends into the moving groove (5) and is provided with a bidirectional screw (7) whose end is rotatably connected to the inner wall thereof, and each thread of the bidirectional screw (7) is provided with a thread seat (8), and a clamping plate (9) is installed on the lower surface of each thread seat (8).

2. The etching device for semiconductor chip production according to claim 1, characterized in that: The lifting mechanism comprises lower fixed plates (10) installed at the bottom of both sides of the etching box (1), an electric push rod (11) is installed at the center of the upper surface of each lower fixed plate (10), and an upper fixed plate (12) is installed at the upper end of each electric push rod (11) and its side is fixedly connected to the upper cover (3).

3. The etching device for semiconductor chip production according to claim 1, characterized in that: The collecting mechanism comprises a mounting plate (13) mounted on the lower surface of the upper cover (3) and located on both sides of the movable seat (4); a collecting plate (14) is mounted on the lower ends of the two mounting plates (13) in the etching box (1); and a surface of the collecting plate (14) is provided with a plurality of evenly distributed micropores.

4. The etching device for semiconductor chip production according to claim 1, characterized in that: The exhaust mechanism comprises an air pump (15) installed on the upper surface of the etching box (1), a pipeline penetrating the upper cover (3) is installed at the input end of the air pump (15), and an exhaust pipe (16) is installed at the output end of the air pump (15).

5. The etching device for semiconductor chip production according to claim 4, characterized in that: An input pipe (17) penetrating the upper cover (3) is arranged on the upper surface of the etching box (1) at one side of the vacuum pump (15), and a valve is arranged on the input pipe (17) near the upper cover (3).

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