Semi-automatic ball grid array ball mounting device

Abstract

The utility model belongs to the technical field of electronic equipment manufacturing, and particularly relates to a semi-automatic ball grid array ball mounting device which comprises solder paste printing equipment and ball mounting equipment, the solder paste printing equipment comprises a printing machine body, a first substrate fixing seat and a first steel mesh carrying disc, and the ball mounting equipment comprises a ball mounting machine body, a second substrate fixing seat and a second steel mesh carrying disc. According to the utility model, the reworking efficiency is obviously improved, the operation difficulty is reduced, the ball mounting quality and the product performance are ensured, and meanwhile, the automatic ball mounting process and the manual intervention of an operator are combined, so that the automatic ball mounting device can be suitable for ball mounting of chips in batches, and particularly, when a solder ball is lost on a production line, the repair can be quickly and accurately carried out, and the production efficiency is improved. And the high efficiency, accuracy and controllability of the ball mounting rework process are realized.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment manufacturing, in particular to a semi-automatic ball grid array ball planting device. Background Art

[0002] Semiconductor packaging is an important part of electronic manufacturing. Its quality and efficiency directly affect the performance and reliability of electronic products. In packaging, packaging is widely used due to its advantages such as high density, excellent electrical performance and reliability. The BGA ball implantation process is the process of bonding solder paste and metal balls to the surface of the product. Its purpose is to achieve the function of electrical connection or heat conduction. In the production process, it is crucial to ensure that the solder balls on each chip are implanted completely and accurately. However, unforeseen problems on the production line, such as equipment errors, material defects or operational errors, often lead to missing or defective solder balls, which need to be repaired through the rework process;

[0003] In the traditional rework process, it may be necessary to manually or semi-automatically remove the original ball implant and re-implant the ball implant process. This method has the following problems: first, it is inefficient and the rework process is cumbersome and time-consuming; second, it is easy to cause product damage or poor manufacturing, affecting product quality and production efficiency. Although the use of fully automatic machines for rework can improve production efficiency, the lack of cost and flexibility has become a significant limiting factor when processing small batches or chips with special requirements. In addition, fully automatic equipment usually requires complex programming and settings, which is not conducive to operating environments that require frequent changes in production batches;

[0004] Therefore, we need to design new technical solutions. Utility Model Content

[0005] The utility model aims to provide a semi-automatic ball grid array implanting device, which solves the problems raised in the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semi-automatic ball grid array ball planting device, including a solder paste printing device and a ball planting device, wherein the solder paste printing device includes:

[0007] A printing machine body, a connecting frame is fixed to one side wall of the printing machine body, a first slide groove is opened in the middle of one side wall of the connecting frame, a first slide rail is fixed to the inner cavity of the first slide groove, a first electric slider is movably sleeved on the outer wall of the first slide rail, a first electric lifting platform is fixed to the outer wall of the first electric lifting platform, a pneumatic tool holder is fixed to the outer end of the first electric lifting platform, the pneumatic tool holder is composed of a fixing frame and a left cylinder and a right cylinder, a left scraper and a right scraper are respectively fixed to the two sides of the bottom of the pneumatic tool holder, and the left scraper and the right scraper are respectively fixedly connected to the tail ends of the left cylinder and the right cylinder;

[0008] A first steel mesh carrier is fixed at the top of the printing machine body corresponding to the pneumatic knife holder, and first steel mesh fixing clips are fixed at both ends of the first steel mesh carrier.

[0009] A first substrate fixing seat is arranged at the lower side of the first steel mesh carrier, a plurality of evenly distributed negative pressure holes and pin positioning holes are provided at the top of the first substrate fixing seat, second slide grooves are provided at both sides of the top of the printing machine body, a second slide rail is fixed in the inner cavity of the second slide groove, an adapted second electric slider is sleeved on the outer wall of the second slide rail, a second electric lifting platform is fixed on the top of the second electric slider, and the top of the second electric lifting platform is fixedly connected to the corresponding position of the bottom of the first substrate fixing seat;

[0010] The ball planting equipment comprises:

[0011] A ball planting body, wherein a second steel mesh carrier is fixedly installed on one side of the top of the ball planting body, second steel mesh fixing clips are fixed on both ends of the second steel mesh carrier, a second substrate fixing seat is arranged on the lower side of the second steel mesh carrier, a plurality of evenly distributed negative pressure holes and pin holes are opened on the second substrate fixing seat, third slide grooves are opened on both sides of the top of the ball planting body, a third slide rail is fixed on the inner cavity of the third slide groove, an outer wall of the third slide rail is provided with an adaptive third electric slider, a third electric lifting platform is fixed on the top of the third electric slider, and the top of the third electric lifting platform is fixedly connected with the corresponding position of the second substrate fixing seat.

[0012] As a preferred embodiment of the present invention, controllers are respectively fixed to the front side walls of the printing body and the ball implanting body.

[0013] As a preferred embodiment of the utility model, a left cylinder regulating switch and a right cylinder regulating switch are fixed to one side wall of the connecting frame.

[0014] As a preferred embodiment of the utility model, negative pressure vacuum pumps are fixed on the backs of the printing body and the ball planting body, and the negative pressure vacuum pumps are connected to the corresponding negative pressure holes through pipelines.

[0015] As a preferred implementation of the utility model, a first ion blower and a second ion blower are respectively fixed to one side wall of the printing body and the ball implanting body.

[0016] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0017] The utility model significantly improves the rework efficiency, reduces the difficulty of operation, and ensures the ball planting quality and product performance. At the same time, by combining the automated ball planting process and the operator's manual intervention, it can be suitable for batch chip planting. In particular, when the solder balls are missing on the production line, they can be repaired quickly and accurately, thus achieving high efficiency, precision and controllability of the ball planting rework process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0019] Figure 1 This is a schematic diagram of the structure of a substrate solder paste printing device of a semi-automatic ball grid array ball planting device of the utility model;

[0020] Figure 2 It is a schematic diagram of the structure of a substrate ball planting device of a semi-automatic ball grid array ball planting device of the utility model;

[0021] Figure 3 It is a schematic diagram of the connection structure between a printing body and a first substrate fixing seat of a semi-automatic ball grid array ball planting device of the utility model;

[0022] Figure 4 The utility model is a schematic diagram of the connection structure between a ball planting body and a second substrate fixing seat of a semi-automatic ball grid array ball planting device.

[0023] In the figure:

[0024] 1. Printing machine body; 11. Connecting frame; 12. First substrate fixing seat; 13. First steel mesh carrier; 14. Pneumatic knife holder; 15. Left scraper; 16. Right scraper; 17. First steel mesh fixing clamp; 18. Left cylinder adjustment switch; 19. Right cylinder adjustment switch;

[0025] 2. First slide slot; 21. First slide rail; 22. First electric lift platform;

[0026] 3. The first ion fan;

[0027] 4. Ball implantation body; 41. Second substrate fixing seat; 42. Third electric slider; 43. Second steel mesh carrier; 44. Second steel mesh fixing clamp; 45. Second ion blower; 46. Third slide rail; 47. Third electric lifting platform;

[0028] 5. Controller;

[0029] 6. Second slide rail; 61. Second electric slide block; 62. Second electric lift platform. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0031] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0032] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "set" should be understood in a broad sense, for example, they can be fixedly connected or set, or detachably connected or set, or integrally connected or set. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. The models of electrical appliances provided in the present utility model are only for reference, and different models of electrical appliances with the same functions can be replaced according to actual usage.

[0033] See also Figure 1-4 ,The utility model provides a technical solution: a semi-automatic ball grid array ball planting device, including a solder paste printing device and a ball planting device;

[0034] The solder paste printing equipment comprises:

[0035] A printing machine body 1, a connecting frame 11 is fixed to one side wall of the printing machine body 1, a first slide groove 2 is opened in the middle of one side wall of the connecting frame 11, a first slide rail 21 is fixed to the inner cavity of the first slide groove 2, a first electric slider is movably mounted on the outer wall of the first slide rail 21, a first electric lifting platform 22 is fixed to the outer wall of the first electric slider, a pneumatic tool holder 14 is fixed to the outer end of the first electric lifting platform 22, the pneumatic tool holder 14 is composed of a fixing frame and a left cylinder and a right cylinder, a left scraper 15 and a right scraper 16 are fixed to the two sides of the bottom of the pneumatic tool holder 14, respectively, and the left scraper 15 and the right scraper 16 are fixedly connected to the tail ends of the left cylinder and the right cylinder respectively;

[0036] A first steel mesh carrier plate 13 is fixed at the top of the printing machine body 1 corresponding to the pneumatic tool holder 14, and first steel mesh fixing clamps 17 are fixed at both ends of the first steel mesh carrier plate 13;

[0037] A first substrate fixing seat 12 is arranged at the lower side of the first steel mesh carrier 13, a plurality of evenly distributed negative pressure holes and pin positioning holes are provided at the top of the first substrate fixing seat 12, second slide grooves are provided on both sides of the top of the printing machine body 1, a second slide rail 6 is fixed in the inner cavity of the second slide groove, an adapted second electric slider 61 is sleeved on the outer wall of the second slide rail 6, a second electric lifting platform 62 is fixed on the top of the second electric slider 61, and the top of the second electric lifting platform 62 is fixedly connected to the corresponding position of the bottom of the first substrate fixing seat 12;

[0038] In actual use, the operator starts the equipment and enters the solder paste printing stage, and ensures that all components operate normally. Then, the operator manually loads the substrate onto the first substrate fixing seat 12, uses pins for positioning, ensures that the substrate is correctly placed, enables the vacuum adsorption function to fix the substrate, and then starts the second electric slider 61 to drive the first substrate fixing seat 12 to move, so that it moves to the corresponding position on the lower side of the first steel mesh carrier 13. Then, the second electric lifting platform 62 drives the first substrate fixing seat 12 to lift it to fit the lower side of the first steel mesh carrier 13, and puts the steel mesh on it for positioning. Then, the first electric lifting platform 22 is used to drive the left scraper 15 and the right scraper 16 to descend and fit the surface of the steel mesh. Then, solder paste is added in advance, and the first electric slider is used to drive the left scraper 15 and the right scraper 16 to reciprocate to realize solder paste printing. After printing, the substrate is moved back to the loading position. After turning off the vacuum adsorption, the operator manually unloads the printed substrate.

[0039] The ball planting equipment comprises:

[0040] A ball planting body 4, wherein a second steel mesh carrier 43 is fixedly installed on one side of the top of the ball planting body 4, and second steel mesh fixing clips 44 are fixed on both ends of the second steel mesh carrier 43, and a second substrate fixing seat 41 is arranged on the lower side of the second steel mesh carrier 43, and a plurality of evenly distributed negative pressure holes and pin holes are provided on the second substrate fixing seat 41, and third slide grooves are provided on both sides of the top of the ball planting body 4, and a third slide rail 46 is fixed on the inner cavity of the third slide groove, and an outer wall of the third slide rail 46 is provided with an adapted third electric slider 42, and a third electric lifting platform 47 is fixed on the top of the third electric slider 42, and the top of the third electric lifting platform 47 is fixedly connected to the corresponding position of the second substrate fixing seat 41;

[0041] When in use, the steel mesh is placed on the second steel mesh carrier 43 and fixed with the second steel mesh fixing clamp 44. Then, the substrate with solder paste printed on it is manually loaded onto the second substrate fixing seat 41. The pin positioning and vacuum adsorption processes are repeated to ensure the stability of the substrate. Then, the third electric slider 42 is used to drive the second substrate fixing seat 41 to move so that it moves to the lower side of the second steel mesh carrier 43. Then, the third electric lifting platform 47 is started to drive the second substrate fixing seat 41 to lift so that the substrate fits the lower side of the steel mesh. Then, the ball planting operation is manually performed. After the ball planting is completed, the substrate first descends and then moves back to reset. Then, the vacuum adsorption is turned off. The operator then manually unloads the material to complete the entire process. If the vacuum adsorption or the in-place judgment fails at any stage, the system will automatically start unloading and perform manual intervention to solve the problem. The above-mentioned usage steps ensure the efficient and accurate processing of substrates on the production line, and the seamless connection from solder paste printing to solder ball implantation improves production efficiency and product quality.

[0042] like Figure 1 As shown; the first ion blower 3 and the second ion blower 45 are respectively fixed to one side wall of the printing body 1 and the ball planting body 4, which can remove static electricity on the surface of the substrate by generating ion wind, prevent static electricity from interfering with the ball planting process, and improve the success rate and quality of ball planting;

[0043] like Figure 1 and 2 As shown; the front side walls of the printing body 1 and the ball planting body 4 are respectively fixed with a controller 5, and the controller 5 is connected to an external PLC, so as to perform automatic control by using a pre-set PLC control program;

[0044] like Figure 1 As shown; a left cylinder regulating switch 18 and a right cylinder regulating switch 19 are fixed to one side wall of the connecting frame 11, and the left cylinder regulating switch 18 and the right cylinder regulating switch 19 can be used to adjust the left cylinder and the right cylinder of the pneumatic tool holder 14 to drive the left scraper 15 and the right scraper 16 to adjust the position respectively;

[0045] It should be noted that a negative pressure vacuum pump is fixed on the back of the printing body 1 and the ball planting body 4. The negative pressure vacuum pump is connected to the corresponding negative pressure hole through a pipeline. The negative pressure hole can generate negative pressure by using the vacuum negative pressure pump, so that the substrate can be adsorbed by the vacuum negative pressure to achieve high stability.

[0046] The semi-automatic ball grid array implantation device of the present application is specifically implemented as follows:

[0047] Step 1: The operator starts the equipment and enters the solder paste printing stage, and ensures that all components operate normally. Then, the operator manually loads the substrate onto the first substrate fixing seat 12, uses pins for positioning, ensures that the substrate is correctly placed, activates the vacuum adsorption function to fix the substrate, and then starts the second electric slider 61 to drive the first substrate fixing seat 12 to move, so that it moves to the corresponding position on the lower side of the first steel mesh carrier 13. Then, the second electric lifting platform 62 drives the first substrate fixing seat 12 to lift it to fit the lower side of the first steel mesh carrier 13, and puts the steel mesh on it for positioning. Then, the first electric lifting platform 22 is used to drive the left scraper 15 and the right scraper 16 to descend and fit the surface of the steel mesh. Then, solder paste is added in advance, and the first electric slider is used to drive the left scraper 15 and the right scraper 16 to reciprocate to realize solder paste printing. After printing, the substrate is moved back to the loading position. After turning off the vacuum adsorption, the operator manually unloads the printed substrate.

[0048] Step 2: Place the steel mesh on the second steel mesh carrier 43, fix it with the second steel mesh fixing clamp 44, and then manually load the substrate with solder paste printed on it onto the second substrate fixing seat 41, repeat the pin positioning and vacuum adsorption process to ensure the stability of the substrate, and then use the third electric slider 42 to drive the second substrate fixing seat 41 to move so that it moves to the lower side of the second steel mesh carrier 43, and then start the third electric lifting platform 47 to drive the second substrate fixing seat 41 to lift so that the substrate fits the lower side of the steel mesh, and then manually perform the ball planting operation. After the ball planting is completed, the substrate first drops and then moves back to reset, and then turns off the vacuum adsorption. The operator then manually unloads the material to complete the entire process. If the vacuum adsorption or in-place judgment fails at any stage, the system will automatically start unloading and perform manual intervention to solve the problem. The above-mentioned usage steps ensure the efficient and accurate processing of substrates on the production line, and the seamless connection from solder paste printing to solder ball implantation improves production efficiency and product quality.

[0049] In addition, the components included in the semi-automatic ball grid array implanting device of the utility model are all universal standard parts or components known to technical personnel in this field, and their structures and principles can be known to technical personnel through technical manuals or through conventional experimental methods. In the idle part of the device, all the above-mentioned electrical components, which refer to power elements, electrical components, and compatible monitoring computers and power supplies, are connected through wires. The specific connection means should refer to the following working principle. The electrical connection is completed in the working order of each electrical component. The detailed connection means are well-known technologies in this field. The following mainly introduces the working principle and process, and no longer explains the electrical control.

[0050] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0051] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semi-automatic ball grid array ball planting device, comprising a solder paste printing device and a ball planting device, characterized in that: The solder paste printing equipment comprises: A printing machine body (1), a connecting frame (11) is fixed to one side wall of the printing machine body (1), a first slide groove (2) is opened in the middle of one side wall of the connecting frame (11), a first slide rail (21) is fixed to the inner cavity of the first slide groove (2), a first electric slider is movably mounted on the outer wall of the first slide rail (21), a first electric lifting platform (22) is fixed to the outer wall of the first electric sliding block, a pneumatic tool holder (14) is fixed to the outer end of the first electric lifting platform (22), the pneumatic tool holder (14) is composed of a fixing frame and a left cylinder and a right cylinder, a left scraper (15) and a right scraper (16) are respectively fixed to the two sides of the bottom of the pneumatic tool holder (14), and the left scraper (15) and the right scraper (16) are respectively fixedly connected to the tail ends of the left cylinder and the right cylinder; A first steel mesh carrier plate (13) is fixed at the top of the printing machine body (1) corresponding to the pneumatic knife holder (14), and first steel mesh fixing clamps (17) are fixed at both ends of the first steel mesh carrier plate (13); A first substrate fixing seat (12) is arranged at the lower side of the first steel mesh carrier (13), a plurality of evenly distributed negative pressure holes and pin positioning holes are provided at the top of the first substrate fixing seat (12), second slide grooves are provided on both sides of the top of the printing machine body (1), a second slide rail (6) is fixed in the inner cavity of the second slide groove, an outer wall of the second slide rail (6) is provided with an adaptable second electric slider (61), a second electric lifting platform (62) is fixed at the top of the second electric slider (61), and the top of the second electric lifting platform (62) is fixedly connected to the corresponding position of the bottom of the first substrate fixing seat (12); The ball planting equipment comprises: A ball planting body (4), wherein a second steel mesh carrier (43) is fixedly installed on one side of the top of the ball planting body (4), and second steel mesh fixing clamps (44) are fixed at both ends of the second steel mesh carrier (43), and a second substrate fixing seat (41) is arranged on the lower side of the second steel mesh carrier (43), and a plurality of evenly distributed negative pressure holes and pin holes are opened on the second substrate fixing seat (41), and third slide grooves are opened on both sides of the top of the ball planting body (4), and a third slide rail (46) is fixed in the inner cavity of the third slide groove, and an adaptive third electric slider (42) is mounted on the outer wall of the third slide rail (46), and a third electric lifting platform (47) is fixed on the top of the third electric slider (42), and the top of the third electric lifting platform (47) is fixedly connected to the corresponding position of the second substrate fixing seat (41).

2. A semi-automatic ball grid array implantation device according to claim 1, characterized in that: Controllers (5) are respectively fixed to the front side walls of the printing machine body (1) and the ball implanting machine body (4).

3. The semi-automatic ball grid array implantation device according to claim 1, characterized in that: A left cylinder regulating switch (18) and a right cylinder regulating switch (19) are fixed to one side wall of the connecting frame (11).

4. The semi-automatic ball grid array implantation device according to claim 1, characterized in that: Negative pressure vacuum pumps are fixed on the backs of the printing machine body (1) and the ball implanting machine body (4), and the negative pressure vacuum pumps are connected to the corresponding negative pressure holes through pipelines.

5. The semi-automatic ball grid array implantation device according to claim 1, characterized in that: A first ion blower (3) and a second ion blower (45) are respectively fixed to one side wall of the printing machine body (1) and the ball implanting machine body (4).

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