Foam structure for supporting wafer
By designing a foam structure supporting the wafer, the problem of wafer damage caused by external forces during storage and transportation of existing wafer storage devices is solved, and the safe limit storage of wafers is achieved, and the storage and Safety of transshipment.
Patent Information
- Application Number
- CN202421156166.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-25
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-05-25
AI Technical Summary
During the storage and transportation of existing wafer storage devices, due to external forces, the wafers are shifted, collided, worn and damaged.
A foam structure supporting the wafer is designed, including a foam base, storage foam box and sealed ceiling. Through foam material and specific structural design, separate limit storage of the wafer is achieved.
It effectively prevents the wafer from shaking and damage during storage and transportation, improves the storage and transportation safety of wafers, and avoids wear between wafers.
Smart Images

Figure CN222530396U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer storage, in particular to a foam structure for supporting wafers. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8-inch and 12-inch.
[0003] Existing wafer storage devices have the following defects:
[0004] When existing wafer equipment stores and transports wafers, the wafers may shift due to external forces, resulting in collisions, wear and damage between wafers. Therefore, a solution is needed. Utility Model Content
[0005] 1. Technical issues to be solved
[0006] In view of the deficiencies of the prior art, the utility model provides a foam structure for supporting a wafer to solve the problems raised in the above background technology.
[0007] (II) Technical solution
[0008] To achieve the above objectives, the utility model is implemented through the following technical solutions: a foam structure for supporting wafers, including a device body, the device body including a foam base, a storage foam box and a sealed top cover, the foam base and the storage foam box are smoothly transitioned and integrally processed and formed structures, the foam base is located at the bottom of the storage foam box, and the sealed top cover is installed on the top of the storage foam box; the storage foam box is a rectangular structure, a storage bin is provided inside the storage foam box, a plurality of groups of wafer storage slots distributed in a laterally equidistant manner are provided inside the storage bin, the wafer storage slots are in a concave structure, the interior of the wafer storage slots is a hollow structure, and the lower part of the interior of the wafer storage slots is a semicircular structure.
[0009] Preferably, a plurality of groups of foam reinforcing ribs are provided on the surface of the storage foam box, and the foam reinforcing ribs are in a mesh structure.
[0010] Preferably, the foam base has a rectangular structure, an anti-slip mounting frame is provided at the bottom of the foam base, the anti-slip mounting frame has a protruding structure, a reinforcing block is provided inside the anti-slip mounting frame, the reinforcing block has a cross-shaped structure, and the anti-slip mounting frame and the reinforcing block are both made of foam material.
[0011] Preferably, the sealing top cover has a rectangular structure, the bottom of the sealing top cover is a hollow structure, a plurality of groups of limiting wafer blocks distributed in a laterally equidistant manner are arranged inside the bottom end of the sealing top cover, the limiting wafer blocks have a bracket-shaped structure, and a transparent film window is arranged on the top of the sealing top cover.
[0012] (III) Beneficial effects
[0013] The utility model provides a foam structure for supporting wafers, which has the following beneficial effects:
[0014] This type of supporting foam structure can effectively store the wafers individually and in a limited position, thereby preventing the wafers from shaking and being damaged, greatly improving the safety of wafer storage and transportation. Moreover, this type of storage device is made of foam material, which is relatively soft, and will not wear the wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the structure inside the foam storage box of the utility model;
[0017] Figure 3 This is a schematic diagram of the structure of the sealing top cover of the utility model;
[0018] Figure 4 It is a structural schematic diagram of the bottom of the foam base of the utility model.
[0019] In the figure, 1. device body; 2. foam base; 3. storage foam box; 4. sealed top cover; 5. storage bin; 6. wafer storage slot; 7. foam reinforcement ribs; 8. limiting wafer block; 9. transparent film window; 10. anti-slip installation frame; 11. reinforcement block. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] See also Figure 1-4The embodiment of the utility model provides a technical solution: a foam structure for supporting wafers, comprising a device body 1, wherein the device body 1 comprises a foam base 2, a storage foam box 3 and a sealing top cover 4, wherein the foam base 2 and the storage foam box 3 are a smooth transition and integrally processed structure, wherein the foam base 2 is located at the bottom of the storage foam box 3, and the sealing top cover 4 is installed at the top of the storage foam box 3;
[0022] The problem is solved. The storage foam box 3 is in a rectangular structure, a storage bin 5 is provided inside the storage foam box 3, a plurality of groups of wafer storage slots 6 are provided inside the storage bin 5 and are distributed in a laterally equidistant manner, the wafer storage slots 6 are in a concave structure, the interior of the wafer storage slots 6 is a hollow structure, the lower part of the interior of the wafer storage slots 6 is in a semicircular structure, and the staff puts a plurality of groups of wafers into the plurality of groups of wafer storage slots 6 in the storage bin 5 respectively, and further uses the wafer storage slots 6 with the concave structure to separate, limit and store the plurality of groups of wafers, and the bottom end of the interior of the wafer storage slot 6 is in a semicircular structure, which can further better fit the structure of the wafer.
[0023] Furthermore, a plurality of groups of foam reinforcing ribs 7 are provided on the surface of the storage foam box 3 . The foam reinforcing ribs 7 are in a mesh structure. The foam reinforcing ribs 7 can improve the firmness of the overall structure of the storage foam box 3 .
[0024] Differently, the foam base 2 has a rectangular structure, and an anti-slip mounting frame 10 is provided at the bottom of the foam base 2. The anti-slip mounting frame 10 has a convex structure, and a reinforcing block 11 is provided inside the anti-slip mounting frame 10. The reinforcing block 11 has a cross-shaped structure. The anti-slip mounting frame 10 and the reinforcing block 11 are both made of foam material. The anti-slip mounting frame 10 of the foam base 2 and the reinforcing block 11 with a cross-shaped structure can be fitted to the ground, and then the anti-slip purpose is achieved through the foam material.
[0025] Effectively, the sealing top cover 4 is in a rectangular structure, the bottom of the sealing top cover 4 is a hollow structure, a plurality of groups of limiting wafer blocks 8 distributed in a laterally equidistant manner are arranged inside the bottom end of the sealing top cover 4, the limiting wafer blocks 8 are in a bracket-shaped structure, and a transparent film window 9 is arranged on the top of the sealing top cover 4. When sealing, the staff puts the sealing top cover 4 into the storage foam box, and then the grooves at the bottom of the plurality of groups of limiting wafer blocks 8 in the sealing top cover 4 can be put into the top of the wafer, thereby achieving the purpose of limiting, and the staff can observe the condition of the internal wafer through the transparent film window 9.
[0026] Working principle: During operation, the staff puts several groups of wafers into several groups of wafer storage slots 6 in the storage bin 5 respectively, and further uses the concave structure of the wafer storage slots 6 to separate, limit and store the several groups of wafers. The bottom end of the wafer storage slot 6 is a semicircular structure, which can further fit the structure of the wafer more closely. When sealing, the staff puts the sealing top cover 4 into the storage foam box, and then the grooves at the bottom of the several groups of limiting wafer blocks 8 in the sealing top cover 4 can be inserted into the top of the wafer, thereby achieving the purpose of limiting. The staff can observe the situation of the internal wafers through the transparent film window 9.
[0027] The utility model comprises 1. a device body; 2. a foam base; 3. a storage foam box; 4. a sealing top cover; 5. a storage bin; 6. a wafer storage slot; 7. foam reinforcement ribs; 8. a wafer limiting block; 9. a transparent film window; 10. a non-slip mounting frame; and 11. a reinforcement block. All components are universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods. The utility model solves the problem that when existing wafer equipment stores and transports wafers, the wafers may shift under the action of external forces, resulting in collisions, wear and damage between the wafers. The utility model can effectively perform individual limited storage of the wafers through the combination of the above components, thereby preventing the wafers from shaking and being damaged, and greatly improving the safety of wafer storage and transportation.
[0028] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.
[0029] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A foam structure for supporting a wafer, characterized in that: The device comprises a device body (1), wherein the device body (1) comprises a foam base (2), a foam storage box (3) and a sealed top cover (4), wherein the foam base (2) and the foam storage box (3) are smoothly transitioned and integrally processed and formed structures, the foam base (2) is located at the bottom of the foam storage box (3), and the sealed top cover (4) is installed at the top of the foam storage box (3); The storage foam box (3) is in a rectangular structure, a storage bin (5) is provided inside the storage foam box (3), a plurality of groups of wafer storage slots (6) are provided inside the storage bin (5) and are distributed in a laterally equidistant manner, the wafer storage slots (6) are in a concave structure, the interior of the wafer storage slots (6) is a hollow structure, and the lower part of the interior of the wafer storage slots (6) is in a semicircular structure.
2. A foam structure for supporting a wafer according to claim 1, characterized in that: The surface of the storage foam box (3) is provided with a plurality of groups of foam reinforcing ribs (7), and the foam reinforcing ribs (7) are in a mesh structure.
3. The foam structure for supporting a wafer according to claim 1, characterized in that: The foam base (2) is in a rectangular structure, a non-slip mounting frame (10) is provided at the bottom of the foam base (2), the non-slip mounting frame (10) is in a convex structure, a reinforcing block (11) is provided inside the non-slip mounting frame (10), the reinforcing block (11) is in a cross-shaped structure, and the non-slip mounting frame (10) and the reinforcing block (11) are both made of foam material.
4. The foam structure for supporting a wafer according to claim 1, characterized in that: The sealing top cover (4) is in a rectangular structure, the bottom of the sealing top cover (4) is a hollow structure, a plurality of groups of position-limiting wafer blocks (8) distributed in a laterally equidistant manner are arranged inside the bottom end of the sealing top cover (4), the position-limiting wafer blocks (8) are in a bracket-shaped structure, and a transparent film window (9) is arranged on the top of the sealing top cover (4).