Wafer tidying mechanism

Abstract

The utility model relates to the technical field of wafer production, in particular to a wafer tidying mechanism, which comprises a base, a cam rotationally arranged on the base, a plurality of groups of clamping mechanisms circumferentially distributed by taking the cam as a circle center, and a wafer bearing table movably arranged on the base in a lifting manner, each clamping mechanism comprises a fixing block arranged on the base in a sliding mode and a fixing column arranged on the fixing block. A plurality of protruding parts are arranged on the periphery of the cam at equal intervals. The number of the protruding parts is the same as that of the clamping mechanisms. One end of the fixing block is used for abutting against the protruding part. A reset piece is arranged between the fixing block and the base. The fixed column is arranged on the wafer bearing table in a penetrating manner; and the clamping motor is used for driving the cam to rotate. According to the utility model, the clamping motor drives the cam to rotate, so that the plurality of fixing columns are close to each other or far away from each other, the wafers are sorted and centered, the cost is low, the wafer sorting and centring device can be adapted to the wafers with different sizes, and the compatibility is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a wafer arranging mechanism. Background Art

[0002] With the development of semiconductor technology, the demand for high-performance and highly integrated semiconductor chips is increasing, and the difficulty of chip production is also increasing. Semiconductor chips are usually deposited on a whole substrate wafer with integrated circuit component structure, then the wafer is cut, and finally the individual crystals obtained after cutting are packaged.

[0003] When processing the wafer, the wafer needs to be loaded first. When loading the wafer, it is impossible to ensure that the wafer is located at the center of the loading mechanism, which causes the robot arm to be unable to accurately grasp the wafer. Therefore, it is necessary to set a sorting mechanism in the loading mechanism so that the wafer is placed at the center of the loading mechanism.

[0004] The current wafer sorting device generally needs to be coordinated with a CCD detector for positioning, which has the problem of high cost. Secondly, the current wafer sorting device can only adapt to wafers of a single size, resulting in limited use. Utility Model Content

[0005] The utility model aims to provide a wafer arranging mechanism in view of the above-mentioned deficiencies in the prior art.

[0006] The purpose of the utility model is achieved through the following technical solutions: a wafer aligning mechanism, comprising a base, a cam rotatably arranged on the base, a plurality of clamping mechanisms circumferentially distributed along the cam as the center, and a wafer receiving table movably arranged on the base;

[0007] Each set of clamping mechanisms includes a fixed block slidably arranged on the base and a fixed column arranged on the fixed block; a plurality of protrusions are arranged at equal intervals on the outer periphery of the cam; the number of the protrusions is the same as the number of the clamping mechanisms;

[0008] One end of the fixed block is used to abut against the protruding portion; a reset member is provided between the fixed block and the base; the wafer support platform is movable and arranged at the top of the fixed block; the fixed column is passed through the wafer support platform;

[0009] Also included is a clamping motor for driving the cam to rotate.

[0010] The utility model is further configured that each set of clamping mechanisms also includes a track arranged on the base and a guide block slidably arranged on the track; the fixed block is arranged on the guide block.

[0011] The utility model is further configured that a roller is rotatably provided at one end of the fixing block; the roller is used to abut against the protruding portion.

[0012] The utility model is further configured that a fixing pin is provided at one end of the base close to the cam; and the reset member comprises a tension spring arranged between the fixing pin and the fixing block.

[0013] The utility model is further configured that the base is provided with a lifting component for driving the wafer carrier to lift up and down.

[0014] The utility model is further configured such that the lifting assembly includes a supporting vertical plate arranged at the bottom of the base, a lead screw rotatably arranged on the supporting vertical plate, a lifting seat threadedly connected to the lead screw, a slide rail arranged on the supporting vertical plate, a slider slidably connected to the slide rail, and a lifting motor arranged on the supporting vertical plate; the output end of the lifting motor is connected to the lead screw; the slider and the film support table are respectively connected to the lifting seat.

[0015] The utility model is further configured that the sheet-carrying platform is provided with a strip-shaped limiting groove running through it; and the fixing column is movably arranged in the strip-shaped limiting groove.

[0016] The utility model is further configured that the fixing block is provided with a strip-shaped fixing groove; the fixing column is detachably connected to the strip-shaped fixing groove via a nut.

[0017] The utility model is further configured that the base is provided with an induction sensor.

[0018] The beneficial effects of the utility model are as follows: the utility model drives the cam to rotate by a clamping motor, so that a plurality of fixed columns are moved closer to or farther away from each other, thereby arranging and centering the wafers, which has low cost, can adapt to wafers of different sizes, and improves compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the utility model. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0020] Figure 1 It is a structural schematic diagram of the utility model;

[0021] Figure 2 It is a structural schematic diagram of the utility model from another perspective;

[0022] Figure 3 It is a partial schematic diagram of the utility model;

[0023] Figure 4 This is a partial schematic diagram of the utility model after the film receiving platform is hidden;

[0024] Figure 5 This is a cross-sectional view of the utility model after the sheet-carrying platform is hidden;

[0025] Among them: 1. Base; 11. Fixing pin; 12. Reset part; 13. Clamping motor; 2. Cam; 21. Protrusion; 3. Plate carrier; 31. Strip limit groove; 4. Fixing block; 41. Fixing column; 42. Roller; 43. Strip fixing groove; 51. Track; 52. Guide block; 6. Support vertical plate; 61. Screw; 62. Lifting seat; 63. Slide rail; 64. Slider; 65. Lifting motor; 7. Induction sensor; 8. Nut. DETAILED DESCRIPTION

[0026] The utility model is further described in conjunction with the following embodiments.

[0027] Depend on Figures 1 to 5 It can be seen that the wafer aligning mechanism described in this embodiment includes a base 1, a cam 2 rotatably arranged on the base 1, a plurality of clamping mechanisms distributed circumferentially with the cam 2 as the center, and a wafer stage 3 movably arranged on the base 1;

[0028] Each set of clamping mechanisms includes a fixed block 4 slidably disposed on the base 1 and a fixed column 41 disposed on the fixed block 4; a plurality of protrusions 21 are evenly spaced on the outer periphery of the cam 2; the number of the protrusions 21 is the same as the number of the clamping mechanisms;

[0029] One end of the fixing block 4 is used to abut against the protruding portion 21; a reset member 12 is provided between the fixing block 4 and the base 1; the wafer support platform 3 is movable and arranged at the top of the fixing block 4; the fixing column 41 is provided through the wafer support platform 3;

[0030] It also includes a clamping motor 13 for driving the cam 2 to rotate.

[0031] Specifically, when the wafer arranging mechanism described in this embodiment is used, first, the clamping motor 13 drives the cam 2 to rotate, and the protrusion 21 on the cam 2 abuts against one end of the fixed block 4, so that the fixed block 4 overcomes the action of the reset member 12 and moves outward, and the fixed column 41 moves outward, so that the radius of the circle formed by the multiple fixed columns 41 is maximized, and at this time, the wafers can be easily stacked on the wafer stage 3, and can accommodate wafers of multiple sizes;

[0032] Then continue to rotate the clamping motor 13 so that the protrusion 21 no longer abuts against the roller shaft 42. At this time, under the action of the reset member 12, the fixed block 4 moves inward, and the fixed column 41 moves inward, thereby reducing the radius of the circle formed by the multiple fixed columns 41, thereby fixing the wafer between the multiple fixed columns 41 and completing the centering process.

[0033] In the wafer arranging mechanism described in this embodiment, each set of clamping mechanisms further includes a track 51 arranged on the base 1 and a guide block 52 slidably arranged on the track 51; the fixed block 4 is arranged on the guide block 52. Specifically, the above arrangement can guide the movement of the fixed block 4 and the fixed column 41.

[0034] In the wafer arranging mechanism described in this embodiment, a roller 42 is rotatably provided at one end of the fixing block 4; the roller 42 is used to abut against the protruding portion 21. Specifically, through the above arrangement, it is convenient for the protruding portion 21 to push the fixing block 4 to move.

[0035] In the wafer aligning mechanism described in this embodiment, the base 1 is provided with a fixing pin 11 at one end close to the cam 2; the resetting member 12 includes a tension spring arranged between the fixing pin 11 and the fixing block 4. The above arrangement facilitates the resetting of the fixing block 4.

[0036] In the wafer arranging mechanism described in this embodiment, the base 1 is provided with a lifting component for driving the wafer stage 3 to rise and fall. Specifically, through the above arrangement, the wafer stage 3 can drive the wafers to rise, so that the wafers can be stacked on the wafer stage 3, waiting for the robot to absorb and take out the materials one by one.

[0037] The wafer arranging mechanism described in this embodiment comprises a lifting assembly including a support vertical plate 6 arranged at the bottom of a base 1, a lead screw 61 rotatably arranged on the support vertical plate 6, a lifting seat 62 threadedly connected to the lead screw 61, a slide rail 63 arranged on the support vertical plate 6, a slider 64 slidably connected to the slide rail 63, and a lifting motor 65 arranged on the support vertical plate 6; the output end of the lifting motor 65 is connected to the lead screw 61; the slider 64 and the wafer stage 3 are respectively connected to the lifting seat 62.

[0038] Specifically, when it is necessary to drive the wafer stage 3 to move up and down, the lifting motor 65 drives the lead screw 61 to rotate, so that the lifting seat 62 can drive the wafer stage 3 to move up and down along the slide rail 63 .

[0039] In the wafer aligning mechanism described in this embodiment, the wafer stage 3 is provided with a strip-shaped limiting groove 31, and the fixing column 41 is movably arranged in the strip-shaped limiting groove 31. Through the above arrangement, the fixing column 41 can be easily moved forward and backward.

[0040] In the wafer arranging mechanism described in this embodiment, the fixing block 4 is provided with a strip-shaped fixing groove 43; the fixing column 41 is detachably connected to the strip-shaped fixing groove 43 via a nut 8. Specifically, the fixing column 41 of this embodiment is detachably connected to the strip-shaped fixing groove 43 via a nut 8, so that the user can adjust the position of the fixing column 41 on the fixing block 4 according to actual needs, thereby being able to adapt to wafers of more sizes.

[0041] In the wafer arranging mechanism described in this embodiment, the base 1 is provided with an induction sensor 7. Through the above arrangement, it is possible to sense whether the wafer has reached a predetermined height, so that the robot can absorb and take out the wafers one by one.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A wafer aligning mechanism, characterized in that: It comprises a base (1), a cam (2) rotatably arranged on the base (1), a plurality of groups of clamping mechanisms distributed in a circumferential direction with the cam (2) as the center, and a wafer receiving platform (3) movably arranged on the base (1) for lifting; Each set of clamping mechanisms comprises a fixed block (4) slidably arranged on the base (1) and a fixed column (41) arranged on the fixed block (4); a plurality of protrusions (21) are arranged at equal intervals on the outer periphery of the cam (2); the number of the protrusions (21) is the same as the number of the clamping mechanisms; One end of the fixed block (4) is used to abut against the protruding portion (21); a reset member (12) is provided between the fixed block (4) and the base (1); the wafer support platform (3) is movable and arranged on the top of the fixed block (4); the fixed column (41) is passed through the wafer support platform (3); It also includes a clamping motor (13) for driving the cam (2) to rotate.

2. A wafer arranging mechanism according to claim 1, characterized in that: Each set of clamping mechanisms also includes a track (51) arranged on the base (1) and a guide block (52) slidably arranged on the track (51); the fixed block (4) is arranged on the guide block (52).

3. A wafer arranging mechanism according to claim 1, characterized in that: A roller shaft (42) is rotatably provided at one end of the fixed block (4); the roller shaft (42) is used to abut against the protruding portion (21).

4. The wafer arranging mechanism according to claim 1, characterized in that: A fixing pin (11) is provided at one end of the base (1) close to the cam (2); the reset member (12) comprises a tension spring provided between the fixing pin (11) and the fixing block (4).

5. The wafer arranging mechanism according to claim 1, characterized in that: The base (1) is provided with a lifting component for driving the wafer carrier (3) to rise and fall.

6. A wafer arranging mechanism according to claim 5, characterized in that: The lifting assembly comprises a supporting vertical plate (6) arranged at the bottom of the base (1), a lead screw (61) rotatably arranged on the supporting vertical plate (6), a lifting seat (62) threadedly connected to the lead screw (61), a slide rail (63) arranged on the supporting vertical plate (6), a slider (64) slidably connected to the slide rail (63), and a lifting motor (65) arranged on the supporting vertical plate (6); the output end of the lifting motor (65) is connected to the lead screw (61); the slider (64) and the wafer support platform (3) are respectively connected to the lifting seat (62).

7. The wafer arranging mechanism according to claim 5, characterized in that: The sheet support platform (3) is provided with a strip-shaped limiting groove (31) extending therethrough; the fixing column (41) is movably arranged in the strip-shaped limiting groove (31).

8. The wafer arranging mechanism according to claim 1, characterized in that: The fixing block (4) is provided with a strip-shaped fixing groove (43); the fixing column (41) is detachably connected to the strip-shaped fixing groove (43) via a nut (8).

9. The wafer arranging mechanism according to claim 1, characterized in that: The base (1) is provided with an induction sensor (7).

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