Packaging device for integrated circuit board
By designing the packaging device for integrated circuit boards, using guide components, drive mechanisms, unloading mechanisms and compression positioning mechanisms, the high risk problems in the loading and unloading of circuit boards are solved, and a more efficient packaging process is achieved.
Patent Information
- Application Number
- CN202420473636.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-12
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-03-12
AI Technical Summary
The existing integrated circuit packaging devices are highly risky during the loading and unloading of circuit boards, affecting packaging efficiency.
A packaging device for integrated circuit board is designed, using guide components, driving mechanism, unloading mechanism and compression positioning mechanism, and driving the connecting frame to drive the lower positioning plate for unloading, and through the guide components to cooperate with the drive rollers. External feeding.
It reduces the risk of packaging, improves the speed of loading and unloading of circuit boards, and improves packaging efficiency.
Smart Images

Figure CN222530410U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit board packaging, in particular to a packaging device for an integrated circuit board. Background Art
[0002] An integrated circuit is a miniature electronic device or component that uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, and is made into a small piece or several small pieces of semiconductor chips, which are then packaged inside a tube shell to become a miniature structure with the required circuit functions. All the original components have formed a whole in structure, making a major step forward in the direction of miniaturization, low power consumption, intelligence and high reliability of electronic components.
[0003] The integrated circuit packaging devices currently used in my country have a relatively complex structure and a high scrap rate, so the current packaging devices all position the circuit board to reduce the scrap rate. For example, Chinese patent publication number "CN215451343U" discloses a conveniently adjustable integrated circuit board packaging device, including a support frame, a base is fixedly welded at the lower end of the support frame, an adjustment mechanism is inserted and connected to the upper part of the support frame, and the adjustment mechanism is movably installed with the support frame through a bearing, an upper positioning plate is fixedly installed at the lower end of the adjustment mechanism, and a lower positioning mechanism is fixedly installed at the upper end of the lower part of the support frame.
[0004] The packaging devices currently used all use upper and lower positioning plates for positioning and packaging processing. This packaging method requires workers to manually feed the circuit board into the positioning mechanism. The loading and unloading of the circuit board is highly dangerous, and the manual operation is also very troublesome, which affects the packaging efficiency. Utility Model Content
[0005] The utility model aims to solve the shortcomings of the prior art that the loading and unloading of circuit boards are relatively dangerous and affect the packaging efficiency, and proposes a packaging device for integrated circuit boards.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A packaging device for an integrated circuit board is designed, comprising a support frame, support legs are fixed on both sides of the bottom of the support frame, a guide assembly is provided on one side of the support frame, a driving mechanism is provided on the inner side of the support frame, a groove is opened on the surface of the support frame, a discharge mechanism is fixed on the inner side of the groove, and a clamping and positioning mechanism is provided on the top of the support frame.
[0008] Furthermore, the guide assembly includes a guide frame, the guide frame is fixed to one side of the support frame, a plurality of conveying rollers are rotatably connected between the guide frames, and a guide bar is fixed to the inner side of the support frame.
[0009] Furthermore, the driving mechanism includes a mounting groove, a driving motor is fixed to the front side of the supporting frame, and an output shaft of the driving motor passes through the mounting groove and is fixed with a driving roller.
[0010] Furthermore, the unloading mechanism includes a fixed plate, support rods are fixed on all four sides of the top of the fixed plate, a lower positioning plate is movably connected between the support rods, special-shaped gears are fixed on all four sides of the lower positioning plate, support side plates are fixed on the front and rear sides of the fixed plate, a connecting frame is slidably connected to the inside of the support side plate, a driving rack is fixed on the outside of the connecting frame, the driving rack is meshingly connected to the special-shaped gear, and at least two electric telescopic rods are provided between the connecting frame and the support side plates.
[0011] Furthermore, the clamping and positioning mechanism includes a hydraulic cylinder, which is fixed to the top of the support frame. The output shaft of the hydraulic cylinder passes through the support frame and is fixed with a clamping plate. Guide columns are fixed on both sides of the top of the clamping plate and are slidably connected to the support frame.
[0012] Furthermore, a storage platform is fixed on one side of the support frame surface, and the storage platform is inclined.
[0013] The utility model proposes a packaging device for integrated circuit boards, which has the beneficial effects that: the utility model drives the connecting frame to drive the lower positioning plate to unload materials through the electric telescopic rod, and the external loading can be conveniently performed through the guide component and the driving roller, which can not only reduce the risk of packaging, but also increase the speed of loading and unloading circuit boards and improve the packaging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0015] Figure 2 It is a three-dimensional structural schematic diagram of the utility model;
[0016] Figure 3 It is a three-dimensional schematic diagram of the unloading mechanism of the utility model;
[0017] Figure 4 For this utility model Figure 1 A partial enlarged view of the middle A;
[0018] Figure 5 For this utility model Figure 3 A partial enlarged view of point B in the middle.
[0019] In the figure: 1. support frame; 2. support leg; 3. guide assembly; 31. guide frame; 32. conveyor roller; 33. guide bar; 4. driving mechanism; 41. mounting slot; 42. driving motor; 43. driving roller; 5. groove; 6. unloading mechanism; 61. fixing plate; 62. supporting rod; 63. lower positioning plate; 64. special-shaped gear; 65. supporting side plate; 66. connecting frame; 67. driving rack; 68. electric telescopic rod; 7. clamping and positioning mechanism; 71. hydraulic cylinder; 72. clamping plate; 73. guide column; 8. storage table. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0021] Reference Figure 1-5 A packaging device for an integrated circuit board comprises a support frame 1, support legs 2 are fixed on both sides of the bottom of the support frame 1, a guide assembly 3 is provided on one side of the support frame 1, a driving mechanism 4 is provided on the inner side of the support frame 1, a groove 5 is provided on the surface of the support frame 1, a discharge mechanism 6 is fixed on the inner side of the groove 5, and a clamping positioning mechanism 7 is provided on the top of the support frame 1; the packaging device drives the connecting frame 66 to drive the lower positioning plate 63 for unloading through an electric telescopic rod 68, and external loading can be conveniently performed through the guide assembly 3 and the driving roller 43, which can not only reduce the risk of packaging, but also increase the speed of loading and unloading circuit boards and improve packaging efficiency.
[0022] In this embodiment, the guide assembly 3 includes a guide frame 31, and the guide frame 31 is fixed to one side of the support frame 1. A plurality of conveying rollers 32 are rotatably connected between the guide frames 31. A guide bar 33 is fixed to the inner side of the support frame 1. The guide frame 31 cooperates with the conveying rollers 32 to convey the circuit board, and cooperates with the guide bar 33 to guide the circuit board.
[0023] Furthermore, the driving mechanism 4 includes a mounting groove 41, and a driving motor 42 is fixed to the front of the support frame 1. The output shaft of the driving motor 42 passes through the mounting groove 41 and is fixed with a driving roller 43. The driving motor 42 drives the driving roller 43 to drive the circuit board to move and transport the circuit board to the surface of the lower positioning plate 63.
[0024] Furthermore, the unloading mechanism 6 includes a fixed plate 61, support rods 62 are fixed on all sides of the top of the fixed plate 61, a lower positioning plate 63 is movably connected between the support rods 62, and special-shaped gears 64 are fixed on all sides of the lower positioning plate 63. Support side plates 65 are fixed to the front and rear sides of the fixed plate 61, and a connecting frame 66 is slidably connected to the inside of the supporting side plate 65. A driving rack 67 is fixed to the outside of the connecting frame 66, and the driving rack 67 is meshed with the special-shaped gear 64. At least two electric telescopic rods 68 are provided between the connecting frame 66 and the supporting side plate 65. The electric telescopic rods 68 drive the connecting frame 66 to drive the lower positioning plate 63 to be lifted to a vertical state, so that the circuit board can be easily unloaded.
[0025] In addition, the clamping and positioning mechanism 7 includes a hydraulic cylinder 71, which is fixed to the top of the support frame 1. The output shaft of the hydraulic cylinder 71 passes through the support frame 1 and is fixed with a clamping plate 72. The clamping plate 72 adopts the existing packaging technology. Guide columns 73 are fixed on both sides of the top of the clamping plate 72 and the guide columns 73 are slidably connected to the support frame 1. The hydraulic cylinder 71 can drive the clamping plate 72 to cooperate with the lower positioning plate 63 for positioning, thereby reducing packaging waste.
[0026] It should be noted that a storage platform 8 is fixed to one side of the surface of the support frame 1. The storage platform 8 is tilted and can receive circuit boards, making it convenient to concentrate the circuit boards.
[0027] Working method: During work, the staff can convey the circuit board to the guide frame 31 through the external feeding equipment, and the guide bar 33 can guide the circuit board, and then start the drive motor 42, the drive motor 42 drives the drive roller 43 to drive the circuit board to move, and convey the circuit board to the surface of the lower positioning plate 63, and then start the hydraulic cylinder 71 to drive the clamping plate 72 to cooperate with the lower positioning plate 63 for packaging, and then start the electric telescopic rod 68, the electric telescopic rod 68 drives the connecting frame 66 to move, the driving rack 67 on the surface of the connecting frame 66 can drive the special-shaped gear 64, and the special-shaped gear 64 drives the lower positioning plate 63 to lift to a vertical state. At this time, the circuit board will fall into the storage table 8, and then the electric telescopic rod 68 can be retracted to retract the lower positioning plate 63.
[0028] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A packaging device for an integrated circuit board, comprising a support frame (1), characterized in that: Support legs (2) are fixed on both sides of the bottom of the support frame (1), a guide assembly (3) is provided on one side of the support frame (1), a driving mechanism (4) is provided on the inner side of the support frame (1), a groove (5) is provided on the surface of the support frame (1), a discharge mechanism (6) is fixed on the inner side of the groove (5), and a clamping positioning mechanism (7) is provided on the top of the support frame (1).
2. The integrated circuit board packaging device according to claim 1, characterized in that: The guide assembly (3) comprises a guide frame (31), the guide frame (31) is fixed to one side of the support frame (1), a plurality of conveying rollers (32) are rotatably connected between the guide frames (31), and a guide bar (33) is fixed on the inner side of the support frame (1).
3. The integrated circuit board packaging device according to claim 1, characterized in that: The driving mechanism (4) comprises a mounting groove (41), a driving motor (42) is fixed on the front side of the supporting frame (1), and an output shaft of the driving motor (42) passes through the mounting groove (41) and is fixed with a driving roller (43).
4. The integrated circuit board packaging device according to claim 1, characterized in that: The unloading mechanism (6) comprises a fixed plate (61), support rods (62) are fixed around the top of the fixed plate (61), a lower positioning plate (63) is movably connected between the support rods (62), and special-shaped gears (64) are fixed around the lower positioning plate (63), and support side plates (65) are fixed on both the front and rear sides of the fixed plate (61), and a connecting frame (66) is slidably connected inside the supporting side plate (65), and a driving rack (67) is fixed on the outside of the connecting frame (66), and the driving rack (67) is meshed with the special-shaped gear (64), and at least two electric telescopic rods (68) are provided between the connecting frame (66) and the supporting side plate (65).
5. The integrated circuit board packaging device according to claim 1, characterized in that: The clamping and positioning mechanism (7) comprises a hydraulic cylinder (71), the hydraulic cylinder (71) is fixed to the top of the support frame (1), the output shaft of the hydraulic cylinder (71) passes through the support frame (1) and is fixed with a clamping plate (72), guide pillars (73) are fixed on both sides of the top of the clamping plate (72), and the guide pillars (73) are slidably connected to the support frame (1).
6. The integrated circuit board packaging device according to claim 1, characterized in that: A storage platform (8) is fixed on one side of the surface of the support frame (1), and the storage platform (8) is arranged in an inclined manner.
Citation Information
Patent Citations
Integrated circuit board packaging device convenient to adjust
CN215451343U