Temperature control device for crystal component

Abstract

The utility model relates to the technical field of temperature control, and discloses a temperature control device for a crystal component, the temperature control device comprises a mounting seat with a crystal mounting position, a TEC component and a heat dissipation piece, the mounting seat and the heat dissipation piece are respectively arranged on two opposite sides of the TEC component, so that when the TEC component cools the mounting seat, the heat dissipation piece cools one side, deviating from the mounting seat, of the TEC component; when the temperature control device is used, the crystal component is installed in the crystal installation position, when the crystal component is cooled, the side, away from the installation base, of the TEC component generates heat, and at the moment, the heat dissipation part dissipates heat of the side, away from the installation base, of the TEC component, so that the heat dissipation part takes away the heat of the side, away from the installation base, of the TEC component, and the service life of the TEC component is prolonged. Therefore, the temperature of one side, deviating from the mounting seat, of the TEC element is reduced, and the cooling effect of the TEC element on the crystal component is further ensured.

Description

Technical Field

[0001] The present application belongs to the technical field of temperature control, and specifically relates to a temperature control device for crystal components. Background Art

[0002] Solid-state lasers are lasers that use solid laser materials as working materials. They are small in size, easy to use, and have high output power. Crystal components are key components of solid-state lasers. They play an important role in the operation of solid-state lasers. Their working state and performance directly affect the performance of the entire laser system. Since the nonlinear effect of crystal components is very sensitive to changes in their own temperature, precise temperature control of crystal components is required during use.

[0003] In the related art, in order to precisely control the temperature of crystal components, TEC elements (semiconductor thermoelectric coolers) are generally used. When the current flow direction inside the TEC element changes, the TEC element can respectively realize the heating or cooling function of the crystal component. However, when the TEC element cools the crystal component, the temperature of the end of the TEC element away from the crystal component will rise, and the heat on the side of the TEC element away from the crystal component cannot be dissipated in time, thus affecting the cooling effect of the crystal component. Utility Model Content

[0004] The present application provides a temperature control device for a crystal component to ensure a cooling effect on the crystal component.

[0005] The technical solution adopted in this application is:

[0006] A temperature control device for a crystal component comprises a mounting seat with a crystal mounting position, a TEC element and a heat sink, wherein the mounting seat and the heat sink are respectively arranged on two opposite sides of the TEC element, so that when the TEC element cools the mounting seat, the heat sink cools the side of the TEC element away from the mounting seat.

[0007] By adopting the above technical solution, when using the temperature control device in the present application, the crystal component is installed in the crystal mounting position. When the crystal component is cooled, the side of the TEC element away from the mounting seat generates heat. At this time, the heat sink dissipates the heat on the side of the TEC element away from the mounting seat, so that the heat sink takes away the heat on the side of the TEC element away from the mounting seat, thereby reducing the temperature of the side of the TEC element away from the mounting seat, thereby ensuring the cooling effect of the TEC element on the crystal component.

[0008] Optionally, the heat sink includes a heat sink shell having a cooling cavity, a water inlet joint provided at one end of the heat sink shell, and a water outlet joint provided at the other end of the heat sink shell, and the water inlet joint and the water outlet joint are both connected to the cooling cavity.

[0009] By adopting the above technical solution, since the existing solid-state laser has a water cooling system, the water cooling system of the fixed laser can be connected to the water inlet joint and the water outlet joint, so that the water cooling system of the solid-state laser can be used to cool the side of the TEC element away from the mounting seat, so that the circulating water can take away the heat generated by the TEC element, thereby avoiding the need for a special water cooling system for the TEC element, thereby reducing the cooling cost of the TEC element, and at the same time reducing the production cost of the fixed laser equipped with the temperature control device in the present application and facilitating the miniaturization design of the fixed laser.

[0010] Optionally, the heat sink includes a heat sink fin in contact with the TEC element and a fan disposed on the heat sink fin.

[0011] By adopting the above technical solution, when the TEC element cools down the crystal components, the heat generated on the side of the TEC element away from the mounting base is transferred to the heat sink fins, and the fan is started at the same time, so that the airflow generated by the fan quickly takes away the heat from the heat sink fins to achieve heat dissipation of the TEC element; by providing the heat sink fins and the fan, the heat sink can be started independently and dissipate heat for the TEC element in real time, avoiding the need to rely on a water cooling system to fix the laser, so that the heat sink can be started at any time and dissipate heat for the TEC element.

[0012] Optionally, the heat sink is provided with support blocks located at both ends of the TEC element, and the mounting seat is connected to the support blocks, so that a space for accommodating the TEC element is formed between the mounting seat and the heat sink.

[0013] By adopting the above technical solution, when assembling the temperature control device, the TEC element is first installed on the heat sink, and then the support blocks are installed on both ends of the TEC element so that the support blocks limit the TEC element, and then the mounting seat is installed on the side of the TEC element away from the heat sink, and the mounting seat is connected to the support block to complete the assembly of the temperature control device. Since the support block can limit the TEC element, the relative movement between the TEC element and the heat sink is avoided, thereby increasing the stability of the TEC element; at the same time, the support block can support the mounting seat, thereby avoiding the mutual squeezing of the mounting seat and the heat sink on the TEC element, thereby avoiding the squeezing and damage of the TEC element, thereby ensuring the service life of the TEC element and reducing the difficulty of assembling the temperature control device.

[0014] Optionally, a positioning groove is provided on a side of the heat sink facing the mounting seat, and the support block is provided with a positioning protrusion extending into the positioning groove.

[0015] By adopting the above technical solution, when installing the support block, the positioning protrusion is first aligned with the positioning groove, and then a pressing force is applied to the support block toward the heat sink, and then the support block drives the positioning protrusion to move toward the heat sink, so that the positioning protrusion extends into the positioning groove, so that the positioning protrusion and the positioning groove cooperate to position the support block, so as to increase the connection stability between the support block and the heat sink, and at the same time avoid the situation where the relative position of the support block and the heat sink may change after the mounting base is installed on the support block, thereby ensuring the assembly efficiency of the temperature control device.

[0016] Optionally, a heat-conducting layer is provided between the mounting seat and the TEC element and between the TEC element and the heat sink.

[0017] By adopting the above technical solution, since a thermal conductive layer is provided between the mounting seat and the TEC element and between the TEC element and the heat sink, the heat transfer efficiency between the TEC element and the mounting seat and the heat sink is increased. Therefore, when there is a temperature difference between the TEC element and the mounting seat and the heat sink, the heat can be quickly transferred through the thermal conductive layer, thereby improving the effective efficiency of the temperature control device.

[0018] Optionally, the mounting seat includes a main body and an upper cover arranged on the main body, the main body is provided with a hidden groove, the groove wall of the hidden groove is provided with a mounting groove, the upper cover has a first section located in the hidden groove and a second section located in the mounting groove, and the crystal mounting position is formed between the side wall of the second section and the groove wall of the mounting groove.

[0019] By adopting the above technical solution, when installing the crystal component, the crystal component is first placed in the installation groove, and then the upper cover is installed, so that the first section is located in the hidden groove, and the second section is located in the installation groove, and at the same time, the two opposite side walls of the crystal component respectively contact the groove wall of the installation groove and the side wall of the second section, so that the groove wall of the installation groove and the side wall of the second section jointly position the crystal component, thereby increasing the stability of the crystal component; in addition, since the first section is located in the hidden groove, the cooperation of the first section and the hidden groove can position the upper cover, thereby increasing the connection stability between the upper cover and the body.

[0020] Optionally, the mounting seat has a temperature sensor for detecting the temperature of the crystal component.

[0021] By adopting the above technical solution, since the temperature sensor can detect the temperature of the crystal component, the temperature of the crystal component can be quickly fed back to the staff, so that the staff can quickly respond to whether to heat or dissipate the crystal component, thereby ensuring the normal operation of the fixed laser equipped with the temperature control device in this application.

[0022] Optionally, a connection seat is provided on a side of the heat sink facing away from the TEC element, the connection seat has an extension portion protruding from the side thereof, and the extension portion is provided with a connection hole.

[0023] By adopting the above technical solution, when installing the temperature control device, it is only necessary to use bolts to fix the connection seat. When fixing the connection seat, the bolts are inserted into the connection holes, and the bolts are threadedly connected to the position where the temperature control device needs to be fixed, so that the bolt heads of the bolts are finally pressed against the extension part to complete the installation of the temperature control device. Since the extension part is located on the side of the connection seat, when the temperature control device is fixed with bolts, the bolts can avoid the heat sink and the mounting seat to achieve the effect of facilitating the installation of the temperature control device.

[0024] Optionally, a plurality of the connection holes are arranged at intervals;

[0025] Alternatively, the connecting hole is a waist-shaped hole.

[0026] By adopting the above technical solution, since a plurality of connection holes are arranged at intervals, when installing the temperature control device, appropriate connection holes can be selected according to different installation positions to achieve the effect of facilitating the installation of the temperature control device, and at the same time the temperature control device can be installed in a more suitable position.

[0027] Since the connecting hole is a waist-shaped hole, when installing the temperature control device, the relative position of the bolt and the connecting hole can be adjusted to adjust the position of the temperature control device, thereby facilitating the installation of the temperature control device to a more suitable position.

[0028] Due to the adoption of the above technical solution, the beneficial effects achieved by this application are as follows:

[0029] 1. The temperature control device in the present application includes a mounting seat with a crystal mounting position, a TEC element and a heat sink, wherein the mounting seat and the heat sink are respectively arranged on opposite sides of the TEC element, so that when the TEC element cools the mounting seat, the heat sink cools the side of the TEC element away from the mounting seat, so that the heat sink takes away the heat from the side of the TEC element away from the mounting seat, thereby reducing the temperature of the side of the TEC element away from the mounting seat, thereby ensuring the cooling effect of the TEC element on the crystal component.

[0030] 2. The heat sink in the present application includes a heat sink shell having a cooling chamber, a water inlet joint provided at one end of the heat sink shell, and a water outlet joint provided at the other end of the heat sink shell, the water inlet joint and the water outlet joint are both connected to the cooling chamber. Since the existing solid-state laser has a water cooling system, the water cooling system of the fixed laser can be connected to the water inlet joint and the water outlet joint, so that the water cooling system of the solid-state laser is used to cool the side of the TEC element away from the mounting seat, so that the circulating water can take away the heat generated by the TEC element, so as to avoid the need for a special water cooling system for the TEC element, thereby reducing the cooling cost of the TEC element, and at the same time can reduce the production cost of the fixed laser equipped with the temperature control device in the present application and facilitate the miniaturization design of the fixed laser.

[0031] 3. The heat sink in the present application includes a heat sink fin in contact with the TEC element and a fan arranged on the heat sink fin, so that when the TEC element cools down the crystal component, the heat generated on the side of the TEC element away from the mounting seat is transferred to the heat sink fin, and the fan is started at the same time, so that the airflow generated by the fan quickly takes away the heat from the heat sink fin to achieve heat dissipation of the TEC element; by providing the heat sink fin and the fan, the heat sink can be started independently and dissipate heat for the TEC element in real time, avoiding the need to rely on a water cooling system to fix the laser, so that the heat sink can be started at any time and dissipate heat for the TEC element. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0033] Figure 1 This is a schematic diagram of the structure of the temperature control device according to one embodiment of the present application;

[0034] Figure 2 This is a schematic structural diagram of the temperature control device according to one embodiment of the present application from another perspective;

[0035] Figure 3 This is a partial structural schematic diagram of the temperature control device according to one embodiment of the present application, mainly showing a support block;

[0036] Figure 4 A cross-sectional view of the heat sink described in one embodiment of the present application;

[0037] Figure 5 This is a schematic structural diagram of a temperature control device according to another embodiment of the present application;

[0038] Figure 6 This is a schematic structural diagram of the temperature control device described in another embodiment of the present application.

[0039] Reference numerals:

[0040] 1. Mounting seat; 11. Main body; 111. Crystal mounting position; 12. Upper cover; 2. TEC element; 3. Heat sink; 31. Heat sink shell; 311. Cooling chamber; 312. Support block; 313. Positioning protrusion; 314. Positioning groove; 32. Water inlet connector; 33. Water outlet connector; 34. Heat sink fin; 341. Heat transfer plate; 342. Heat sink; 35. Fan; 4. Connecting seat; 41. Extension; 411. Connecting hole. DETAILED DESCRIPTION

[0041] In order to more clearly illustrate the overall concept of the present application, a detailed description is given below in an illustrative manner in conjunction with the accompanying drawings.

[0042] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present application is not limited by the specific embodiments disclosed below. It should be noted that the embodiments of the present application and the features in each embodiment may be combined with each other without conflict.

[0043] In addition, in the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0044] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In the present application, unless otherwise clearly specified and limited, a first feature "above" or "below" a second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0046] Reference Figures 1 to 6 , discloses a temperature control device for a crystal component, comprising a mounting base 1 having a crystal mounting position 111, a TEC element 2 and a heat sink 3, wherein the mounting base 1 and the heat sink 3 are respectively arranged on two opposite sides of the TEC element 2, so that when the TEC element 2 cools the mounting base 1, the heat sink 3 cools the side of the TEC element 2 away from the mounting base 1.

[0047] When using the temperature control device in the present application, the crystal component is installed in the crystal mounting position 111. When the crystal component is cooled, the side of the TEC element 2 away from the mounting seat 1 generates heat. At this time, the heat sink 3 dissipates heat on the side of the TEC element 2 away from the mounting seat 1, so that the heat sink 3 takes away the heat from the side of the TEC element 2 away from the mounting seat 1, thereby reducing the temperature of the side of the TEC element 2 away from the mounting seat 1, thereby ensuring the cooling effect of the TEC element 2 on the crystal component.

[0048] It should be noted that the TEC element 2 is the abbreviation of a semiconductor thermoelectric cooler, also known as a thermoelectric cooler.

[0049] The present application does not specifically limit the structure of the heat sink 3, which may adopt any one of the following embodiments:

[0050] Embodiment 1. In this embodiment, referring to Figure 2 , Figure 3 and Figure 4 The heat sink 3 includes a heat sink shell 31 having a cooling cavity 311 , a water inlet joint 32 disposed at one end of the heat sink shell 31 , and a water outlet joint 33 disposed at the other end of the heat sink shell 31 , and both the water inlet joint 32 and the water outlet joint 33 are connected to the cooling cavity 311 .

[0051] Since the existing solid-state laser has a water cooling system, the water cooling system of the fixed laser can be connected to the water inlet joint 32 and the water outlet joint 33, so that the cooling water enters the cold zone cavity through the water inlet joint 32, thereby utilizing the water cooling system of the solid-state laser to cool the side of the TEC element 2 away from the mounting seat 1, so that the cooling water takes away the heat generated by the TEC element 2, thereby avoiding the need for a special water cooling system for the TEC element 2, thereby reducing the cooling cost of the TEC element 2, and at the same time can reduce the production cost of the fixed laser equipped with the temperature control device in the present application and facilitate the miniaturization design of the fixed laser.

[0052] Implementation method 2. In this implementation method, refer to Figure 5 The heat sink 3 includes heat dissipation fins 34 in contact with the TEC element 2 and a fan 35 disposed on the heat dissipation fins 34 .

[0053] When the TEC element 2 cools down the crystal component, the heat generated on the side of the TEC element 2 away from the mounting base 1 is transferred to the heat sink 34, and the fan 35 is started at the same time, so that the airflow generated by the fan 35 quickly takes away the heat of the heat sink 34 to achieve heat dissipation of the TEC element 2; by providing the heat sink 34 and the fan 35, the heat sink 3 can be started independently and dissipate the heat of the TEC element 2 in real time, avoiding the need to rely on a water cooling system to fix the laser, so that the heat sink 3 can be started at any time and dissipate the heat of the TEC element 2.

[0054] Specifically, refer to Figure 5 The heat dissipation fins 34 include a heat transfer plate 341 in contact with the TEC element 2 and a plurality of heat dissipation fins 342 arranged on the heat transfer plate 341. The plurality of heat dissipation fins 342 are arranged perpendicular to the heat transfer plate 341 and a heat dissipation gap is provided between two adjacent heat dissipation fins 342. The fan 35 is provided on the plurality of heat dissipation fins 342 so that the airflow generated by the fan 35 passes through the heat dissipation gap between two adjacent heat dissipation fins 342 and takes away the heat of the heat dissipation fins 342, so as to improve the heat dissipation effect on the TEC element.

[0055] In a preferred embodiment, referring to Figure 3 and Figure 4 The heat sink 3 is provided with support blocks 312 located at both ends of the TEC element 2, and the mounting seat 1 is connected to the support blocks 312, so that a space for accommodating the TEC element 2 is formed between the mounting seat 1 and the heat sink 3.

[0056] When assembling the temperature control device, first install the TEC element 2 to the heat sink 3, then install the support block 312 to both ends of the TEC element 2, so that the support block 312 limits the TEC element 2, and then install the mounting seat 1 on the side of the TEC element 2 away from the heat sink 3, and at the same time, the mounting seat 1 is connected to the support block 312 to complete the assembly of the temperature control device. Since the support block 312 can limit the TEC element 2, it can avoid the relative movement of the TEC element 2 and the heat sink 3, thereby increasing the stability of the TEC element 2; at the same time, the support block 312 can support the mounting seat 1, thereby avoiding the mutual squeezing of the mounting seat 1 and the heat sink 3 on the TEC element 2, thereby avoiding the squeezing and damage of the TEC element 2, thereby ensuring the service life of the TEC element 2 and reducing the difficulty of assembling the temperature control device.

[0057] Further, see Figure 4 , a positioning groove 314 is provided on the side of the heat sink 3 facing the mounting seat, and a positioning protrusion 313 is provided on the support block 312 to extend into the positioning groove 314. That is to say, when installing the support block 312, the positioning protrusion 313 is first aligned with the positioning groove 314, and then a pressing force is applied to the support block 312 in the direction of the heat sink 3, so that the support block 312 drives the positioning protrusion 313 to move in the direction of the heat sink 3, so that the positioning protrusion 313 extends into the positioning groove 314, so that the positioning protrusion 313 cooperates with the positioning groove 314 to achieve the positioning of the support block 312, so as to increase the connection stability between the support block 312 and the heat sink 3, and at the same time, avoid the situation that the relative position of the support block 312 and the heat sink 3 may change after the mounting seat 1 is installed on the support block 312, thereby ensuring the assembly efficiency of the temperature control device.

[0058] In a preferred embodiment, a thermal conductive layer is provided between the mounting seat and the TEC element 2 and between the TEC element 2 and the heat sink 3, thereby increasing the heat transfer efficiency between the TEC element 2 and the mounting seat 1 and the heat sink 3, so that when there is a temperature difference between the TEC element 2 and the mounting seat 1 and the heat sink 3, the heat can be quickly transferred through the thermal conductive layer, thereby improving the effect speed of the temperature control device.

[0059] The present application does not specifically limit the formation method of the heat-conducting layer. Preferably, the heat-conducting layer is formed by heat-conducting silicone grease applied between the TEC element 2 and the mounting seat and between the TEC element 2 and the heat sink 3 to reduce the production cost of the temperature control device. In other embodiments, the heat-conducting layer can also be formed by a heat-conducting silicone sheet adhered between the TEC element 2 and the mounting seat and between the TEC element 2 and the heat sink 3.

[0060] The present application does not specifically limit the formation method of the crystal mounting position 111. Preferably, refer to Figure 1 , Figure 2 , Figure 5 and Figure 6 The mounting base 1 includes a main body 11 and an upper cover 12 arranged on the main body 11. The main body 11 is provided with a hidden groove, and the groove wall of the hidden groove is provided with a mounting groove. The upper cover 12 has a first section located in the hidden groove and a second section located in the mounting groove. A crystal mounting position 111 is formed between the side wall of the second section and the groove wall of the mounting groove.

[0061] It can be understood that the hidden groove and the installation groove together form an L-shaped groove structure, and the first section and the second section together form an L-shaped block structure.

[0062] When installing the crystal component, the crystal component is first placed in the installation groove, and then the upper cover 12 is installed so that the first section is located in the hidden groove and the second section is located in the installation groove. At the same time, the two opposite side walls of the crystal component respectively contact the groove wall of the installation groove and the side wall of the second section, so that the groove wall of the installation groove and the side wall of the second section can jointly position the crystal component, thereby increasing the stability of the crystal component; in addition, since the first section is located in the hidden groove, the cooperation of the first section and the hidden groove can position the upper cover 12, thereby increasing the connection stability between the upper cover 12 and the main body 11.

[0063] In other embodiments, the crystal mounting position 111 may also be formed by a hollow structure disposed in the mounting base 1 .

[0064] In a preferred embodiment, the mounting seat 1 has a temperature sensor for detecting the temperature of the crystal component, and the temperature sensor is arranged on the body 11 .

[0065] Since the temperature sensor can detect the temperature of the crystal component, the temperature of the crystal component can be quickly fed back to the staff, so that the staff can quickly respond to heat or dissipate the crystal component, thereby ensuring the normal operation of the fixed laser equipped with the temperature control device in this application.

[0066] Furthermore, the temperature control device also includes a controller, the temperature sensor is connected to the controller signal, and the TEC element 2 is also connected to the controller signal, so that the controller controls the TEC element 2 according to the temperature of the crystal component detected by the temperature sensor, so as to realize automatic and precise temperature control of the crystal component.

[0067] The present application does not specifically limit the connection method between the temperature control device and other components, and it can adopt any one of the following embodiments:

[0068] Embodiment 1. In this embodiment, referring to Figure 6 A connection base 4 is provided on the side of the heat sink 3 facing away from the TEC element 2 . The connection base 4 has an extension portion 41 protruding from the side thereof. The extension portion 41 is provided with a connection hole 411 .

[0069] It is understandable that the extension portion 41 is a block structure. When installing the temperature control device, it is only necessary to use bolts to fix the connection seat 4. When fixing the connection seat 4, the bolts are inserted into the connection holes 411, and the bolts are threadedly connected to the position where the temperature control device needs to be fixed, so that the bolt heads of the bolts are finally pressed against the extension portion 41 to complete the installation of the temperature control device. Since the extension portion 41 is located on the side of the connection seat 4, when the temperature control device is fixed with bolts, the bolts can avoid the heat sink 3 and the mounting seat 1, so as to achieve the effect of facilitating the installation of the temperature control device.

[0070] Embodiment 2. In this embodiment, a connecting block is extended from the side of the heat sink 3, and a connecting hole 411 is provided on the connecting block, so that the temperature control device can be installed on other components by directly passing the bolts through the connecting hole 411 and threadedly connecting with other components to reduce the volume of the temperature control device.

[0071] The present application does not specifically limit the shape of the connection hole 411 and the number of the connection holes 411, and any one of the following embodiments may be adopted:

[0072] Embodiment 1. In this embodiment, the connection hole 411 is a circular hole and a plurality of connection holes 411 are arranged at intervals. Then, when installing the temperature control device, a suitable connection hole 411 can be selected according to different installation positions to achieve the effect of facilitating the installation of the temperature control device, and at the same time, the temperature control device can be installed in a more suitable position.

[0073] Embodiment 2, in this embodiment, refer to Figure 6 The connecting hole 411 is a waist-shaped hole and only one connecting hole 411 is provided. Then, when installing the temperature control device, the relative position of the bolt and the connecting hole 411 can be adjusted to adjust the position of the temperature control device, thereby facilitating the installation of the temperature control device to a more suitable position.

[0074] Anything not described in this application can be achieved by adopting or drawing on existing technologies.

[0075] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0076] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A temperature control device for a crystal component, characterized in that: The invention comprises a mounting seat (1) having a crystal mounting position (111), a TEC element (2) and a heat sink (3), wherein the mounting seat (1) and the heat sink (3) are respectively arranged on two opposite sides of the TEC element (2), so that when the TEC element (2) cools the mounting seat (1), the heat sink (3) cools the side of the TEC element (2) facing away from the mounting seat (1).

2. A temperature control device for a crystal component according to claim 1, characterized in that: The heat sink (3) comprises a heat sink shell (31) having a cooling cavity (311), a water inlet joint (32) provided at one end of the heat sink shell (31), and a water outlet joint (33) provided at the other end of the heat sink shell (31); the water inlet joint (32) and the water outlet joint (33) are both in communication with the cooling cavity (311).

3. A temperature control device for a crystal component according to claim 1, characterized in that: The heat sink (3) comprises a heat dissipation fin (34) in contact with the TEC element (2) and a fan (35) arranged on the heat dissipation fin (34).

4. A temperature control device for a crystal component according to claim 1, characterized in that: The heat sink (3) is provided with support blocks (312) located at both ends of the TEC element (2), and the mounting seat (1) is connected to the support blocks (312) so that a space for accommodating the TEC element (2) is formed between the mounting seat (1) and the heat sink (3).

5. A temperature control device for a crystal component according to claim 4, characterized in that: A positioning groove (314) is provided on one side of the heat sink (3) facing the mounting seat (1), and a positioning protrusion (313) extending into the positioning groove (314) is provided on the support block (312).

6. A temperature control device for a crystal component according to claim 1, characterized in that: A heat-conducting layer is provided between the mounting seat (1) and the TEC element (2), and between the TEC element (2) and the heat sink (3).

7. A temperature control device for a crystal component according to claim 1, characterized in that: The mounting seat (1) comprises a main body (11) and an upper cover (12) arranged on the main body (11), the main body (11) is provided with a hidden groove, the groove wall of the hidden groove is provided with a mounting groove, the upper cover (12) has a first section located in the hidden groove and a second section located in the mounting groove, and the crystal mounting position (111) is formed between the side wall of the second section and the groove wall of the mounting groove.

8. A temperature control device for a crystal component according to claim 1, characterized in that: The mounting seat (1) has a temperature sensor for detecting the temperature of the crystal component.

9. A temperature control device for a crystal component according to claim 1, characterized in that: A connection seat (4) is provided on the side of the heat sink (3) facing away from the TEC element (2), the connection seat (4) having an extension portion (41) protruding from the side thereof, and the extension portion (41) is provided with a connection hole (411).

10. A temperature control device for a crystal component according to claim 9, characterized in that: A plurality of connection holes (411) are arranged at intervals; Alternatively, the connecting hole (411) is a waist-shaped hole.

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