Capacitance compensation fling-cut switch using silicon carbide module
By using silicon carbide modules and dispersed-mounted control modules in capacitor compensation switches, combined with heat dissipation fan and thermal grease layer, the problem of reduced performance of thyristor modules in high temperature environments is solved, and higher heat resistance and Thermal dissipation performance extends the service life of the equipment.
Patent Information
- Application Number
- CN202421153866.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-05-24
AI Technical Summary
The existing capacitor compensation switches have reduced working efficiency and are prone to damage in high temperature environments, resulting in insufficient reliability and poor heat dissipation effect.
Silicon carbide modules are used to replace the traditional thyristor modules, and the silicon carbide module and control module are dispersed and installed on the heat dissipation base, adding a heat dissipation fan and thermal grease layer to improve heat dissipation effect.
It improves high temperature resistance and heat dissipation performance, extends service life, enhances the reliability of electrical performance, and improves heat dissipation effect.
Smart Images
Figure CN222531337U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of capacitor compensation switching switches, and in particular to a capacitor compensation switching switch using a silicon carbide module. Background Art
[0002] The application range of capacitor compensation switching switch is very wide. For example, it can be used in low-voltage reactive power compensation devices to quickly switch low-voltage parallel capacitors through zero, which can achieve no inrush current, no sparks, and no noise during working conditions. The existing capacitor compensation switching switch includes a heat dissipation base and a thyristor module and a control module arranged on the upper end of the heat dissipation base. In a high temperature environment, the working efficiency of the thyristor module will be significantly reduced, and it is also easy to be damaged. Therefore, the reliability of the existing capacitor compensation switching switch needs to be improved. In addition, the control module and the thyristor module are both installed on the upper end of the heat dissipation base, which occupies a large space and hinders heat dissipation, resulting in heat concentration on the upper end of the heat dissipation base, resulting in poor heat dissipation effect. Utility Model Content
[0003] In order to improve the reliability of electrical performance and extend service life, the present application provides a capacitor compensation switching switch using a silicon carbide module.
[0004] The present application provides a capacitor compensation switching switch using a silicon carbide module, which adopts the following technical solution:
[0005] A capacitor compensation switching switch using a silicon carbide module comprises a silicon carbide module, a control module and a heat dissipation base, wherein the silicon carbide module is arranged at the upper end of the heat dissipation base, the control module is arranged at one side of the heat dissipation base, and the silicon carbide module is electrically connected to the control module.
[0006] By adopting the above technical solution, compared with the thyristor module, on the one hand, the silicon carbide module has better high temperature resistance, and the silicon carbide module can still work stably in a certain range of high temperature environment; on the other hand, the thermal conductivity of silicon carbide is higher than that of silicon material, which is easy to dissipate heat and helps to reduce performance degradation caused by overheating. In addition, the current density of silicon carbide is higher. At the same power level, the volume of the silicon carbide module is smaller than that of the thyristor module, thereby reducing the occupied space, thereby reducing heat dissipation obstacles and improving the heat dissipation effect. The present application adopts a silicon carbide module to replace the traditional thyristor module, and the silicon carbide module and the control module are dispersedly installed on the heat dissipation base, which improves the heat resistance and heat dissipation performance, is conducive to improving the reliability of electrical performance, and prolongs the service life.
[0007] Optionally, the heat dissipation base includes a mounting top plate, a connecting bracket and a mounting foot which are arranged in sequence from top to bottom, the silicon carbide module is arranged on the mounting top plate, and a heat sink assembly is provided on the connecting bracket.
[0008] By adopting the above technical solution, the heat generated by the silicon carbide module during operation is dissipated through the heat sink assembly, further reducing the possibility of overheating and damage to the silicon carbide module.
[0009] Optionally, a thermal conductive silicone grease layer is provided on a side of the mounting top plate close to the silicon carbide module.
[0010] By adopting the above technical solution, the thermal grease layer fills the gap between the silicon carbide module and the mounting top plate, thereby increasing the effective heat dissipation area of the silicon carbide module, further improving the heat dissipation effect, and ensuring the stable operation of the silicon carbide module.
[0011] Optionally, a cooling fan is provided at one end of the connecting bracket.
[0012] By adopting the above technical solution and starting the heat dissipation fan, the efficiency of high-temperature gas being discharged from the heat sink assembly can be accelerated, thereby improving the heat dissipation efficiency.
[0013] Optionally, a thermistor is provided in the thermal grease layer, the thermistor is electrically connected to the control module, and the heat dissipation fan is electrically connected to the control module.
[0014] By adopting the above technical solution, the temperature of the silicon carbide module and its surrounding environment can be transferred to the thermistor through the thermal grease layer. The thermistor outputs a resistance value according to its own temperature and feeds this resistance value back to the control module. When the ambient temperature is below the set value, the cooling fan does not work and the cooling base performs passive cooling to avoid energy waste caused by excessive cooling intensity. When the ambient temperature is too high and passive cooling by the cooling base alone cannot meet the cooling demand, the control module controls the cooling fan to start for active cooling to improve the cooling effect.
[0015] Optionally, the connecting bracket is provided with heat dissipation holes penetrating through both ends of the connecting bracket.
[0016] By adopting the above technical solution, the base material of the heat dissipation base can be saved and the production cost can be reduced. At the same time, the gas flow in the heat dissipation through hole can easily take away the heat on the connecting bracket, thereby further improving the heat dissipation effect.
[0017] Optionally, the heat sink assembly includes heat sink side fins and a heat sink bottom fin, the heat sink side fins are symmetrically arranged on both side walls of the connecting bracket, and the heat sink bottom fin is arranged on the lower side of the connecting bracket.
[0018] By adopting the above technical solution, the heat dissipation base can dissipate heat on three sides simultaneously through the heat dissipation side plates and the heat dissipation bottom plate on both sides, thereby ensuring that the heat dissipation base has good heat dissipation performance.
[0019] Optionally, the control module includes a circuit board and an outer shell, the silicon carbide module is electrically connected to the circuit board, the circuit board is installed in the outer shell, the mounting top plate is provided with a first convex groove on the side close to the outer shell, the mounting foot is provided with a second convex groove on the side close to the outer shell, and the outer shell is fixed to the heat dissipation base by fasteners provided in the first convex groove and the second convex groove.
[0020] By adopting the above technical solution, the outer shell and the circuit board are installed on the side of the heat dissipation base and separated from the silicon carbide module to avoid interference with the heat dissipation of the silicon carbide module. The outer shell can protect the circuit board and has the effect of dust and moisture proof.
[0021] Optionally, heat dissipation ribs are provided on the heat dissipation side plates and the heat dissipation bottom plate.
[0022] By adopting the above technical solution, the cross-sectional areas of the heat dissipation side fins and the heat dissipation bottom fins are increased through the heat dissipation ribs, thereby increasing the heat dissipation area of the heat dissipation fin assembly and improving the heat dissipation effect.
[0023] In summary, the present application includes at least one of the following beneficial technical effects:
[0024] 1. This application adopts a silicon carbide module to replace the traditional thyristor module, and the silicon carbide module and the control module are dispersedly installed on the heat dissipation base, which improves the heat resistance and heat dissipation performance, is beneficial to improve the reliability of electrical performance, and prolongs the service life.
[0025] 2. By setting up the cooling fan and starting the cooling fan, the efficiency of high-temperature gas being discharged from the heat sink assembly can be accelerated, thereby improving the heat dissipation efficiency.
[0026] 3. Through the setting of thermistor, the temperature of silicon carbide module and its surrounding environment can be transferred to thermistor through thermal grease layer. Thermistor outputs resistance value according to its own temperature and feeds back this resistance value to control module. When the ambient temperature is below the set value, cooling fan does not work and cooling base performs passive cooling to avoid energy waste caused by excessive cooling intensity. When the ambient temperature is too high and passive cooling by cooling base alone cannot meet the cooling demand, control module controls cooling fan to start for active cooling to improve cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 It is a cross-sectional view showing the overall structure of the first embodiment of the present application.
[0028] Figure 2 It is a schematic diagram of the structure of the heat dissipation fan in the first embodiment of the present application.
[0029] Figure 3 It is a cross-sectional view of the thermal grease layer in the first embodiment of the present application.
[0030] Figure 4 It is a schematic diagram of the structure of the heat dissipation ribs in the second embodiment of the present application.
[0031] Explanation of the reference numerals: 1. Silicon carbide module; 2. Heat dissipation base; 21. Mounting top plate; 211. Thermal grease layer; 212. First convex groove; 22. Connecting bracket; 221. Heat dissipation through hole; 23. Mounting foot; 231. Second convex groove; 3. Heat sink assembly; 31. Heat dissipation side plate; 32. Heat dissipation bottom plate; 4. Control module; 41. Circuit board; 42. Outer shell; 5. Fastener; 6. Heat dissipation fan; 7. Thermistor; 8. Heat dissipation ribs. DETAILED DESCRIPTION
[0032] The following is combined with Figure 1-4 , further details of this application are given.
[0033] Embodiment 1:
[0034] Embodiment 1 of the present application discloses a capacitor compensation switching switch using a silicon carbide module. Figure 1 A capacitor compensation switching switch using a silicon carbide module includes a silicon carbide module 1 and a heat dissipation base 2. The heat dissipation base 2 includes a mounting top plate 21, a connecting bracket 22 and a mounting foot 23 which are integrally formed from top to bottom. The silicon carbide module 1 is mounted on the upper end surface of the heat dissipation base 2; a heat sink assembly 3 is provided on the connecting bracket 22. The silicon carbide module 1 is electrically connected to a control module 4, which is provided on one side of the heat dissipation base 2. In this way, the upper end surface of the mounting top plate 21 is only equipped with the silicon carbide module 1, so there are few mounting parts and the installation is convenient.
[0035] During the operation of the capacitor compensation switching switch, the heat generated by the silicon carbide module 1 is dissipated through the heat sink assembly 3, reducing the possibility of overheating and damage to the silicon carbide module 1. Compared with the thyristor module, on the one hand, the silicon carbide module 1 has better high temperature resistance, and the silicon carbide module 1 can still work stably in a certain range of high temperature environments; on the other hand, the thermal conductivity of silicon carbide is higher than that of silicon material, which is easy to dissipate heat and helps to reduce performance degradation caused by overheating. In addition, the current density of silicon carbide is higher. At the same power level, the volume of the silicon carbide module 1 is smaller than that of the thyristor module, thereby reducing the occupied space, thereby reducing heat dissipation obstacles and improving the heat dissipation effect. The present application adopts a silicon carbide module 1 to replace the traditional thyristor module, and the silicon carbide module 1 and the control module 4 are dispersedly installed on the heat dissipation base 2, which improves the heat resistance and heat dissipation performance, is conducive to improving the reliability of electrical performance, and prolongs the service life.
[0036] Reference Figure 1A thermal grease layer 211 is coated on one side of the mounting top plate 21 close to the silicon carbide module 1. The thermal grease layer 211 fills the gap between the silicon carbide module 1 and the mounting top plate 21. The thermal grease layer 211 has good thermal conductivity, which facilitates the conduction of heat generated by the silicon carbide module 1 to the mounting top plate 21, thereby increasing the effective heat dissipation area of the silicon carbide module 1, further improving the heat dissipation effect, and ensuring the stable operation of the silicon carbide module 1.
[0037] Reference Figure 1 The heat sink assembly 3 includes heat sink side pieces 31 and heat sink bottom pieces 32. The heat sink side pieces 31 are symmetrically fixed to the side walls of the connecting bracket 22 and are arranged along the length direction of the connecting bracket 22. The heat sink bottom piece 32 is fixed to the lower side of the connecting bracket 22 and is arranged along the vertical direction. Through the heat sink side pieces 31 and the heat sink bottom piece 32 on both sides, the heat sink base 2 dissipates heat on three sides at the same time, ensuring that the heat sink base 2 has good heat dissipation performance.
[0038] Reference Figure 1 The middle part of the connecting bracket 22 is provided with a heat dissipation through hole 221 penetrating through both ends of the connecting bracket 22 along its length direction. In the first embodiment, the heat dissipation through hole 221 is waist-shaped. In this way, the base material of the heat dissipation base 2 can be saved and the production cost can be reduced. At the same time, the gas in the heat dissipation through hole 221 can be easily taken away from the heat on the connecting bracket 22, thereby further improving the heat dissipation effect.
[0039] Reference Figure 1 and Figure 2 A heat dissipation fan 6 is installed on one side of the connecting bracket 22, and the heat dissipation fan 6 covers the heat dissipation side plate 31, the heat dissipation bottom plate 32 and one end of the heat dissipation through hole 221. When the heat dissipation fan 6 is started, the efficiency of high temperature gas being discharged from the heat dissipation fin assembly 3 and the heat dissipation through hole 221 can be accelerated, thereby improving the heat dissipation efficiency.
[0040] Reference Figure 1 and Figure 3 , a thermistor 7 is built into the thermal grease layer 211, and the thermistor 7 is electrically connected to the control module 4, and the heat dissipation fan 6 is electrically connected to the control module 4. When in use, the temperature of the silicon carbide module 1 and its surrounding environment can be transmitted to the thermistor 7 through the thermal grease layer 211, and the thermistor 7 outputs a resistance value according to its own temperature, and feeds this resistance value back to the control module 4. When the ambient temperature is below the set value, the heat dissipation fan 6 does not work, and the heat dissipation base 2 performs passive heat dissipation to avoid excessive heat dissipation intensity causing waste of electricity; when the ambient temperature is too high, and the heat dissipation base 2 alone cannot meet the heat dissipation requirements for passive heat dissipation, the control module 4 controls the heat dissipation fan 6 to start, and performs active heat dissipation to improve the heat dissipation effect.
[0041] Reference Figure 1The control module 4 includes a circuit board 41 and an outer shell 42. The silicon carbide module 1 is electrically connected to the circuit board 41, and the circuit board 41 is installed in the outer shell 42. A first convex groove 212 is provided on the side of the mounting top plate 21 close to the outer shell 42, and a second convex groove 231 is provided on the side of the mounting foot 23 close to the outer shell 42. The outer shell 42 is fixed to the heat dissipation base 2 by fasteners 5 installed in the first convex groove 212 and the second convex groove 231. In this way, the outer shell 42 and the circuit board 41 are installed on the side of the heat dissipation base 2, separated from the silicon carbide module 1, to avoid interference with the heat dissipation of the silicon carbide module 1, and the outer shell 42 can protect the circuit board 41, with the effect of dust and moisture proof.
[0042] Embodiment 2:
[0043] Embodiment 2 of the present application discloses a capacitor compensation switching switch using a silicon carbide module. Figure 1 and Figure 4 The difference between the second embodiment and the first embodiment is that heat dissipation ribs 8 are uniformly and integrally formed on both sides of the heat dissipation side plate 31 and the heat dissipation bottom plate 32, and the cross-sectional areas of the heat dissipation side plate 31 and the heat dissipation bottom plate 32 are increased by the heat dissipation ribs 8, thereby increasing the heat dissipation area of the heat dissipation fin assembly 3 and improving the heat dissipation effect.
[0044] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A capacitor compensation switching switch using a silicon carbide module, characterized in that: The invention comprises a silicon carbide module (1), a control module (4) and a heat dissipation base (2), wherein the silicon carbide module (1) is arranged at the upper end of the heat dissipation base (2), the control module (4) is arranged at one side of the heat dissipation base (2), and the silicon carbide module (1) is electrically connected to the control module (4).
2. According to claim 1, a capacitor compensation switching switch using a silicon carbide module is characterized in that: The heat dissipation base (2) comprises a mounting top plate (21), a connecting bracket (22) and a mounting foot (23) which are arranged in sequence from top to bottom; the silicon carbide module (1) is arranged on the mounting top plate (21); and a heat sink assembly (3) is arranged on the connecting bracket (22).
3. The capacitor compensation switching switch using the silicon carbide module according to claim 2 is characterized in that: A thermal conductive silicone grease layer (211) is provided on one side of the mounting top plate (21) close to the silicon carbide module (1).
4. The capacitor compensation switching switch using the silicon carbide module according to claim 3 is characterized in that: A heat dissipation fan (6) is provided at one end of the connecting bracket (22).
5. The capacitor compensation switching switch using the silicon carbide module according to claim 4, characterized in that: A thermistor (7) is arranged in the thermal grease layer (211); the thermistor (7) is electrically connected to the control module (4); and the heat dissipation fan (6) is electrically connected to the control module (4).
6. The capacitor compensation switching switch using the silicon carbide module according to claim 2, characterized in that: The connecting bracket (22) is provided with a heat dissipation through hole (221) penetrating through both ends of the connecting bracket (22).
7. The capacitor compensation switching switch using the silicon carbide module according to claim 2, characterized in that: The heat sink assembly (3) comprises heat sink side fins (31) and a heat sink bottom fin (32); the heat sink side fins (31) are symmetrically arranged on two side walls of the connecting bracket (22); and the heat sink bottom fin (32) is arranged on the lower side of the connecting bracket (22).
8. The capacitor compensation switching switch using the silicon carbide module according to claim 2, characterized in that: The control module (4) comprises a circuit board (41) and an outer shell (42); the silicon carbide module (1) is electrically connected to the circuit board (41); the circuit board (41) is installed in the outer shell (42); a first convex groove (212) is provided on a side of the mounting top plate (21) close to the outer shell (42); a second convex groove (231) is provided on a side of the mounting foot (23) close to the outer shell (42); and the outer shell (42) is fixed to the heat dissipation base (2) by fasteners (5) provided in the first convex groove (212) and the second convex groove (231).
9. The capacitor compensation switching switch using the silicon carbide module according to claim 7, characterized in that: The heat dissipation side plates (31) and the heat dissipation bottom plate (32) are provided with heat dissipation ribs (8).