Capacitor pin bending equipment

Abstract

The utility model provides a capacitor lead pin bending device which comprises a bending fixed die, a plurality of first limiting grooves and a plurality of second limiting grooves. The movable bending die is located on the side, in the penetrating direction of the first limiting groove, of the fixed bending die and is movably arranged, the movable bending die comprises a bending face and a plurality of second limiting grooves, and the second limiting grooves are located in the front side, in the moving direction of the movable bending die, of the bending face; the sides, deviating from the bending face, of the second limiting grooves and the sides, close to the bending fixed die, of the second limiting grooves are provided with opening parts, the two opening parts are connected, the second limiting grooves and the first limiting grooves are arranged in a one-to-one correspondence mode, and the corresponding first limiting grooves and the corresponding second limiting grooves are used for limiting different parts in the same guide needle correspondingly. According to the capacitor lead pin bending equipment provided by the invention, the lead pin bending precision consistency of the capacitor lead pin bending equipment can be improved, and the yield of the capacitor lead pin bending equipment is improved.

Description

Technical Field

[0001] The utility model generally relates to the technical field of capacitors, and in particular to a capacitor lead pin bending device. Background Art

[0002] In order to meet the ultra-thin development trend of electronic devices, the pins of capacitors need to be bent so that the capacitors can be soldered to the circuit board in a lying position. The existing capacitor pin bending machine includes a bending fixed die and a bending movable die, and the bending fixed die is located above the bending movable die. During the bending operation, the staff places the capacitor to be bent on the bending fixed die, and the pins of the capacitor are located on one side of the bending fixed die and extend to the bottom of the bending fixed die. The bending movable die moves relative to the bending fixed die to drive the pins to bend.

[0003] However, when the capacitor is bent by the above-mentioned existing capacitor lead pin bending machine, due to the lack of position constraints on the capacitor lead pins, the capacitor lead pin bending machine has the problem of inconsistent bending accuracy when performing batch bending processing on the lead pins, which affects the yield of the capacitor lead pin bending machine. Utility Model Content

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a capacitor lead pin bending device.

[0005] The present application also provides a capacitor lead pin bending device, comprising:

[0006] A bending fixed die, wherein the bending fixed die is provided with a plurality of first limiting grooves penetrating therethrough;

[0007] The bending movable mold is located on one side of the bending fixed mold along the penetration direction of the first limiting groove and is movably arranged. The bending movable mold includes a bending surface and a plurality of second limiting grooves. The plurality of second limiting grooves are located on the front side of the bending surface along the moving direction of the bending movable mold. The second limiting grooves are provided with openings on the side away from the bending surface and the side close to the bending fixed mold, and the two openings are connected. The plurality of second limiting grooves are arranged one-to-one with the plurality of first limiting grooves, and the corresponding first limiting grooves and second limiting grooves are used to respectively limit different parts of the same guide pin.

[0008] Furthermore, the second limiting groove includes a second groove wall surface arranged close to the bending surface, and the second groove wall surface is inclined in a direction away from the bending surface.

[0009] Furthermore, the bending fixed die includes a first fixed die side surface, and the first limiting groove is opened on the first fixed die side surface.

[0010] Furthermore, the bending movable die also includes an inclined end surface, which is located at the front side of the bending surface along the moving direction of the bending movable die, and the second limiting groove is located at the inclined end surface.

[0011] Furthermore, the second limiting groove penetrates the bending movable mold along the penetration direction of the first limiting groove.

[0012] Furthermore, the second limiting groove does not extend beyond the bending surface along the penetrating direction of the first limiting groove.

[0013] Furthermore, the opening portion of the second limiting groove which is arranged away from the bending surface is expanded.

[0014] Furthermore, it also includes a stopper arranged on the bending movable mold, the stopper is located on the side of the bending surface away from the second limiting groove, and the stopper is used to block the capacitor when the bending surface bends the lead pin.

[0015] Furthermore, the stopper is arranged to be positionally adjustable in a direction approaching or moving away from the bending surface.

[0016] Furthermore, the stop member is a stop plate, which includes a first plate segment and a second plate segment, the first plate segment and the second plate segment are connected to form an L-shaped structure, the first plate segment is provided with a position adjustment hole, the bending movable mold is provided with a threaded connector, the threaded connector passes through the position adjustment hole and is screwed to the bending movable mold.

[0017] The capacitor lead pin bending equipment provided in the present application is characterized in that a plurality of first limiting grooves are provided through the bending fixed die, and a plurality of second limiting grooves are provided on the bending movable die. The plurality of second limiting grooves are located on the front side of the bending surface along the moving direction of the bending movable die. The second limiting grooves are provided with openings on the side away from the bending surface and the side close to the bending fixed die, and the two openings are connected. The plurality of second limiting grooves are arranged in a one-to-one correspondence with the plurality of first limiting grooves, and the corresponding first limiting grooves and second limiting grooves are used to respectively limit the fixed section and the bending section of the same lead pin, so that the bending precision error of the lead pins between the multiple capacitors after the bending process is small and the bending precision of each capacitor is high, thereby improving the consistency of the lead pin bending precision of the capacitor lead pin bending equipment, and thereby improving the yield rate of the capacitor lead pin bending equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0019] Figure 1 A schematic diagram of the structure of the capacitor provided in an embodiment of the present application when the lead pins are not bent;

[0020] Figure 2 A schematic diagram of the structure of the capacitor provided in an embodiment of the present application after the lead pins are bent;

[0021] Figure 3 A schematic front view of a capacitor lead pin bending device provided in an embodiment of the present application;

[0022] Figure 4 A schematic top view of a bending fixed die provided in an embodiment of the present application;

[0023] Figure 5 A three-dimensional schematic diagram of a bending movable mold provided in an embodiment of the present application;

[0024] Figure 6 A three-dimensional schematic diagram of a bending movable mold provided in another embodiment of the present application. DETAILED DESCRIPTION

[0025] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant utility model, rather than to limit the utility model. It is also necessary to explain that, for ease of description, only the parts related to the utility model are shown in the accompanying drawings.

[0026] Please refer to the attached Figure 1-2 The capacitor 500 includes a capacitor body 510 and a pin assembly arranged on the capacitor body 510, and the pin assembly includes a plurality of lead pins 520. Optionally, the pin assembly includes two lead pins 520 arranged in a row and spaced apart, one end of the lead pin 520 extends from the capacitor body 510, and the portion of the lead pin 520 extending from the capacitor body 510 can be divided into a connected fixed section 521 and a section to be bent 522. An embodiment of the present application provides a capacitor lead pin bending device for bending the section to be bent 522 of the lead pin 520. It should be understood that after the section to be bent 522 is bent, the section to be bent 522 becomes a bent section 523.

[0027] Please refer to the attached Figure 3The capacitor lead pin bending device provided in the embodiment of the present application includes a frame 100 and a bending module, and the bending module is arranged on the frame 100. The bending module includes a matching bending fixed die 200 and a bending movable die 300, the bending fixed die 200 is fixedly arranged on the frame 100 and the bending movable die 300 is movably arranged on the frame 100. The bending fixed die 200 has a bearing surface 201 and a bending matching surface 202 that are relatively arranged, and the bearing surface 201 and the bending matching surface 202 are respectively located on both sides of the bending fixed die 200 along the first direction. The bending fixed die 200 is provided with a plurality of first limiting grooves 210, and the plurality of first limiting grooves 210 are arranged at intervals and all penetrate the bending fixed die 200 along the first direction, and the two ends of the first limiting grooves 210 penetrate to the bearing surface 201 and the bending matching surface 202 respectively. The bending movable die 300 is located on one side of the bending fixed die 200 along the through direction of the first limiting groove 210, that is, the bending movable die 300 is located on one side of the bending fixed die 200 close to the bending matching surface 202 along the first direction, and the moving direction of the bending movable die 300 is the second direction, and the second direction is perpendicular to the first direction. The bending movable die 300 includes a bending surface 301, which is located on one side of the bending movable die 300 close to the bending fixed die 200 along the first direction, and the bending surface 301 cooperates with the bending matching surface 202 to bend the to-be-bent segment 522 to form a bending segment 523. The bending movable die 300 is also provided with a plurality of second limiting grooves 310, which are located at the front side of the bending surface 301 along the moving direction of the bending movable die 300, that is, when the bending movable die 300 moves along the second direction, the second limiting grooves 310 pass through the first limiting grooves 210 before the bending surface 301. An opening is provided on the side of the second limiting groove 310 away from the bending surface 301, and the opening is a first opening 311. An opening is also provided on the side of the second limiting groove 310 close to the bending fixed die 200, and the opening is a second opening 312. The first opening 311 and the second opening 312 are connected. The plurality of second limiting grooves 310 are arranged in one-to-one correspondence with the plurality of first limiting grooves 210, and the corresponding first limiting grooves 210 and second limiting grooves 310 are used to limit different parts of the same guide pin 520, specifically: the first limiting groove 210 is used to limit the fixed section 521 of the guide pin 520, and the second limiting groove 310 is used to limit the section to be bent 522 of the guide pin 520. The first limiting groove 210 includes a first groove wall surface 211, and the first groove wall surface 211 is located on the side of the first limiting groove 210 away from the bending movable mold 300 along the second direction. Based on the attached Figure 3 The first direction is the vertical downward direction, and the second direction is the horizontal right to left direction.

[0028] The bending process of the capacitor lead pin bending device on the lead pin 520 is as follows:

[0029] S10: The user inserts the plurality of lead pins 520 of the capacitor 500 into the plurality of first limiting grooves 210 respectively. At this time, the body of the capacitor 500 is pressed against the bearing surface 201 and the capacitor 500 is supported by the bearing surface 201. The fixed section 521 of the lead pin 520 is located in the first limiting groove 210 and contacts and cooperates with the first groove wall surface 211. The to-be-bent section 522 of the lead pin 520 passes through the first limiting groove 210 from the bending matching surface 202.

[0030] S20: The bending movable mold 300 moves along the second direction to bend the bending section 523, wherein during the movement, the sections to be bent 522 of the plurality of lead pins 520 respectively enter the plurality of second limiting grooves 310 (enter the second limiting grooves 310 through the openings) and are bent and attached to the bending mating surface 202 under the push of the bending surface 301, at which time the section to be bent 522 is bent to become the bending section 523, and finally the bending movable mold 300 is reset and moved in the opposite direction of the second direction for the user to remove the capacitor 500. During the bending process, the fixed section 521 and the section to be bent 522 of the lead pin 520 are respectively limited and constrained by the first limiting groove 210 and the second limiting groove 310.

[0031] The lead pin bending equipment provided in this embodiment limits the fixed section 521 and the section to be bent 522 of the same lead pin 520 respectively through the corresponding first limiting groove 210 and the second limiting groove 310 during the bending process, thereby reducing the bending displacement deviation of the lead pin 520, so that the bending accuracy error of the lead pins 520 between the multiple capacitors 500 after the bending process is small and the bending accuracy of the lead pins 520 of each capacitor 500 is relatively high, thereby improving the consistency of the bending accuracy of the lead pins 520 of the capacitor lead pin bending equipment, thereby improving the yield rate of the capacitor lead pin bending equipment.

[0032] Optionally, in order to facilitate the removal of the capacitor 500 from the bending fixed die 200 after the bending process, the first limiting groove 210 can be set on the first fixed die side 203 of the bending fixed die 200, and the first fixed die side 203 is located on the side of the bending fixed die 200 close to the bending movable die 300 along the second direction and between the bearing surface 201 and the bending matching surface 202. At this time, the first limiting groove 210 has an open end and the open end is arranged opposite to the first groove wall surface 211, and the guide pin 520 is separated from the bending fixed die 200 through the open end.

[0033] Optionally, the dimensions of the portions of the first limiting groove 210 and the second limiting groove 310 used for limiting cooperation with the guide needle 520 along the third direction can be larger than the dimensions of the guide needle 520, and the difference can be but is not limited to less than 0.02 mm, so that the limiting accuracy of the first limiting groove 210 and the second limiting groove 310 for the guide needle 520 is very high, wherein the third direction, the second direction and the first direction are arranged perpendicular to each other.

[0034] Optionally, in order to avoid position interference between the bending movable mold 300 and the bending fixed mold 200 during movement along the second direction, the second limiting groove 310 may be arranged not to extend beyond the bending surface 301 along the penetrating direction of the first limiting groove 210 .

[0035] Optionally, the movable cooperation mode of the bending movable die 300 and the frame 100 may be but is not limited to sliding cooperation.

[0036] In some embodiments of the present application, the second limiting groove 310 includes a second groove wall surface 313 disposed near the bending surface 301, and the second groove wall surface 313 is disposed opposite to the first opening portion 311. The second groove wall surface 313 is disposed obliquely in a direction away from the bending surface 301, so that when the bending movable mold 300 moves along the second direction, the section to be bent 522 can be pre-bent under the push of the second groove wall surface 313, thereby improving the bending accuracy of the bending section 523 and reducing the material strain of the guide pin 520 during bending.

[0037] Please refer to the attached Figure 4 In some embodiments of the present application, the bending movable die 300 includes an inclined end surface 302, which is located at the front side of the bending surface 301 along the moving direction of the bending movable die 300, and the second limiting groove 310 is located at the inclined end surface 302. In this way, the second limiting groove 310 can limit and constrain the bending segment 522 at least in the early stage of bending.

[0038] Among them, one end of the second limiting groove 310 away from the bending surface 301 passes through the bending movable mold 300, so that a first opening portion 311 is formed on the side of the second limiting groove 310 away from the bending surface 301, and the second limiting groove 310 also has a second opening portion 312 located on the inclined end surface 302, and the first opening portion 311 and the second opening portion 312 are connected.

[0039] Optionally, the second limiting groove 310 and the bending surface 301 are spaced apart; or, the second limiting groove 310 and the bending surface 301 are not spaced apart, for example, the second limiting groove 310 extends to the bending surface 301 .

[0040] Please refer to the attached Figure 5The present application also provides an embodiment different from the above-mentioned bending fixed die 200. In this embodiment, the bending movable die 300 includes a front end 303 and a rear end 304 arranged relatively along the second direction, the front end 303 is arranged close to the bending fixed die 200, and the bending surface 301 is located between the front end 303 and the rear end 304. The second limiting groove 310 is located at the front end 303, and the end of the second limiting groove 310 away from the bending surface 301 penetrates the front end 303, so that the side of the second limiting groove 310 away from the bending surface 301 forms a first opening 311, and the end of the second limiting groove 310 close to the bending surface 301 along the first direction penetrates the bending movable die 300 so that the end of the second limiting groove 310 close to the bending surface 301 forms a second opening 312, and the first opening 311 and the second opening 312 are connected. One end of the second groove wall 313 is connected to the bending surface 301.

[0041] In some embodiments of the present application, the second limiting groove 310 can be arranged along the first direction through the bending movable mold 300, so that the bending module can be suitable for guide pins 520 with different bending lengths, thereby improving the versatility of the guide pin bending equipment.

[0042] Of course, in other embodiments, the second limiting groove 310 may not be arranged along the first direction to penetrate the bending movable mold 300 .

[0043] In some embodiments of the present application, the opening of the second limiting groove 310 that is away from the bending surface 301 is expanded. Due to the existence of processing errors, there will be a large range of position deviations between the multiple sections to be bent 522 in the multiple capacitors 500. Through the above-mentioned setting, the entrance area of ​​the lead pin 520 of the second limiting groove 310 is expanded, so that the lead pin 520 with a large position deviation can also smoothly enter the second limiting groove 310 when the bending movable mold 300 moves, thereby improving the practicality of the lead pin bending device.

[0044] In some embodiments of the present application, when the first limiting groove 210 is provided on the first fixed mold side surface 203, the length of the first limiting groove 210 along the second direction can be set longer or shorter. When the first limiting groove 210 is set shorter, for example, when the length of the first limiting groove 210 along the second direction is less than the size of the lead pin 520, most of the capacitor body 510 is in a suspended state, and the bearing surface 201 has poor bearing stability on the capacitor body 510. At this time, during the bending process, when the bending movable mold 300 bends the lead pin 520, the fixed section 521 will drive the capacitor body 510 to deflect in the opposite direction, which will cause the lead pin 520 to be bent unqualified. For this reason, the lead pin bending device also includes a stopper 410 arranged on the bending movable mold 300, the stopper 410 is located on the side of the bending surface 301 away from the second limiting groove 310, and the stopper 410 is used to resist the capacitor 500 when the bending surface 301 bends the lead pin 520. By providing the above-mentioned stopper 410 , the stopper 410 can push and reset the capacitor 500 that is moving in the opposite direction during the movement of the bending movable die 300 , so as to ensure the accurate bending process of the to-be-bent section 522 .

[0045] Of course, when the length of the first limiting groove 210 along the second direction is relatively large, for example, when the length of the first limiting groove 210 along the second direction is close to the diameter of the capacitor body 510 or is several times the diameter of the capacitor body 510, the above-mentioned stopper 410 may not be provided to simplify the lead pin bending equipment.

[0046] In some embodiments of the present application, the stop member 410 is adjustable in position along the direction close to or away from the bending surface 301, that is, the position of the stop member 410 along the second direction is adjustable, so that the lead pin bending device can be suitable for capacitors 500 of different sizes, thereby improving the versatility of the lead pin bending device.

[0047] Optionally, the stopper 410 is a stopper plate, which includes a first plate segment 411 and a second plate segment 412, and the first plate segment 411 and the second plate segment 412 are connected to form an L-shaped structure. The first plate segment 411 is provided with a position adjustment hole, and the position adjustment hole is extended along the second direction. The bending movable mold 300 is provided with a threaded connector 420, and the threaded connector 420 passes through the position adjustment hole and is screwed to the bending movable mold 300. When the position of the stopper 410 needs to be adjusted, the threaded connector 420 can be loosened so that the stopper 410 can be moved. After the position adjustment of the stopper 410 is completed, the threaded connector 420 is tightened so that the stopper 410 is fixed to the bending movable mold 300 through the threaded connector 420. The threaded connector 420 can be, but is not limited to, a bolt or the like. Of course, the position adjustment method of the stop member 410 is not limited to the above. For example, a plurality of limit holes spaced along the second direction can be opened on the bending fixed mold 200, and the stop member 410 is provided with a limit matching hole. When the limit matching hole is aligned with the corresponding limit hole, the limit matching hole and the limit hole are inserted in sequence through the limit pin.

[0048] It should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like used above to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means more than two.

[0049] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the utility model involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the concept of the utility model. For example, the above features are replaced with the technical features with similar functions disclosed in the present application (but not limited to) by each other to form a technical solution.

Claims

1. A capacitor pin bending device, characterized in that: include: A bending fixed die, wherein the bending fixed die is provided with a plurality of first limiting grooves penetrating therethrough; A bending movable mold, the bending movable mold is located on one side of the bending fixed mold along the penetration direction of the first limiting groove and is movably arranged, the bending movable mold includes a bending surface and a plurality of second limiting grooves, the plurality of second limiting grooves are located on the front side of the bending surface along the moving direction of the bending movable mold, the second limiting groove is provided with openings on the side away from the bending surface and the side close to the bending fixed mold, and the two openings are connected, the plurality of second limiting grooves are arranged one-to-one with the plurality of first limiting grooves, and the corresponding first limiting grooves and second limiting grooves are used to respectively limit different parts of the same guide pin.

2. The capacitor lead pin bending device according to claim 1, characterized in that: The second limiting groove includes a second groove wall surface arranged close to the bending surface, and the second groove wall surface is inclined in a direction away from the bending surface.

3. The capacitor pin bending device according to claim 1, characterized in that: The bending fixed die includes a first fixed die side surface, and the first limiting groove is arranged on the first fixed die side surface.

4. The capacitor pin bending device according to claim 1, characterized in that: The bending movable mold further includes an inclined end surface, the inclined end surface is located at the front side of the bending surface along the moving direction of the bending movable mold, and the second limiting groove is located at the inclined end surface.

5. The capacitor pin bending device according to claim 1, characterized in that: The second limiting groove penetrates the bending movable mold along the penetrating direction of the first limiting groove.

6. The capacitor pin bending device according to claim 1, characterized in that: The second limiting groove does not extend out of the bending surface along the penetrating direction of the first limiting groove.

7. The capacitor pin bending device according to claim 1, characterized in that: The opening of the second limiting groove, which is away from the bending surface, is expanded.

8. The capacitor pin bending device according to claim 1, characterized in that: It also includes a stopper arranged on the bending movable mold, the stopper is located on the side of the bending surface away from the second limiting groove, and the stopper is used to block the capacitor when the bending surface bends the lead pin.

9. The capacitor pin bending device according to claim 8, characterized in that: The stopper is arranged in a positionally adjustable manner in a direction approaching or away from the bending surface.

10. The capacitor pin bending device according to claim 9, characterized in that: The stop member is a stop plate, and the stop plate includes a first plate segment and a second plate segment, the first plate segment and the second plate segment are connected to form an L-shaped structure, the first plate segment is provided with a position adjustment hole, and the bending movable mold is provided with a threaded connector, and the threaded connector passes through the position adjustment hole and is screwed to the bending movable mold.

Images