Tray assembly, battery pack shell and battery pack

Abstract

The utility model relates to the technical field of power batteries, and provides a tray assembly, a battery pack shell and a battery pack, the tray assembly comprises a tray body and a liquid cooling plate, the tray body comprises a bottom plate, the bottom plate is provided with a first concave-convex surface, the liquid cooling plate comprises a runner plate, and the runner plate is provided with a heat exchange runner; a second concave-convex surface is formed on the outer surface of the runner plate, the shape of the first concave-convex surface is matched with that of the second concave-convex surface, and the second concave-convex surface is connected with the first concave-convex surface in an overlapped mode. According to the scheme, the problem that in the prior art, under the condition that the runner plate of the liquid cooling plate is connected with the tray, the overall structure formed by connecting the tray and the liquid cooling plate is low in strength can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of power batteries, and in particular to a tray assembly, a battery pack shell and a battery pack. Background Art

[0002] In recent years, electric vehicles have achieved rapid development. The endurance and safety of electric vehicles have always been important factors in the development of electric vehicles. As the load-bearing component of the power battery, the structural strength of the battery pack shell directly affects the service life of the battery pack.

[0003] Please refer to Figure 1 In the prior art, the battery pack shell generally includes a tray 10 and a liquid cooling plate 20. The liquid cooling plate 20 includes a flow channel plate 21 and a flat plate 22. The liquid cooling plate 20 can be connected to the tray 10 through the flat plate 22, or connected to the tray 10 through the flow channel plate 21. When the liquid cooling plate 20 is connected to the tray 10 through the flow channel plate 21, the overall structural strength formed by the tray 10 and the liquid cooling plate 20 is relatively low. Utility Model Content

[0004] In view of this, the present application provides a tray assembly, a battery pack shell and a battery pack to solve the problem in the prior art that when the flow channel plate of the liquid cooling plate and the tray are connected, the overall structural strength formed by the connection between the tray and the liquid cooling plate is low.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] A tray assembly, comprising:

[0007] The tray body comprises a bottom plate, wherein the bottom plate has a first concave-convex surface;

[0008] The liquid cooling plate comprises a flow channel plate, wherein the flow channel plate is provided with a heat exchange flow channel to form a second concave-convex surface on the outer surface of the flow channel plate, the shape of the first concave-convex surface is adapted to the second concave-convex surface, and the second concave-convex surface is overlapped and connected with the first concave-convex surface.

[0009] Optionally, the tray assembly further includes an adhesive, and the tray body and the liquid cooling plate are adhesively connected via the adhesive.

[0010] Optionally, the first concave-convex surface is provided with a limiting boss protruding toward the second concave-convex surface, and the limiting boss abuts against the second concave-convex surface to form a glue-filled gap between the first concave-convex surface and the second concave-convex surface, and at least part of the adhesive body is located in the glue-filled gap to form an adhesive layer.

[0011] Optionally, at least part of the adhesive body is located between the first concave-convex surface and the second concave-convex surface to form an adhesive layer, and the liquid cooling plate includes a flow channel area and a non-flow channel area, the area where the heat exchange flow channel is located forms the flow channel area, and the liquid cooling plate is provided with a plurality of glue overflow holes, and the glue overflow holes pass through the non-flow channel area.

[0012] Optionally, the adhesive body further includes an adhesive pin, at least a portion of the adhesive pin is located in the glue overflow hole, and the adhesive pin is connected to the adhesive layer.

[0013] Optionally, the adhesive nail comprises a first part and a second part, wherein:

[0014] The first part is located in the glue overflow hole, and two ends of the first part are respectively connected to the adhesive layer and the second part;

[0015] The second portion is located on a surface of the liquid cooling plate away from the second concave-convex surface, and along the axial direction of the glue overflow hole, a projection of the glue overflow hole is located within a projection of the second portion.

[0016] Optionally, the liquid cooling plate includes a flat plate, the flat plate is connected to the flow channel plate and closes the heat exchange flow channel, the flat plate has a plane, and the plane is opposite to the second concave-convex surface;

[0017] The second part is located on the plane, the plane has a heat-conducting medium layer, the heat-conducting medium layer is bonded to the plane, the heat-conducting medium layer is provided with a perforation, the second part is located in the perforation, and the surface of the heat-conducting medium layer facing away from the plane is coplanar with the surface of the second part facing away from the plane.

[0018] Optionally, the tray body further includes a frame, which is connected to the bottom plate and forms a receiving groove, and the liquid cooling plate is located in the receiving groove.

[0019] A battery pack shell comprises the tray assembly described in any one of the above items.

[0020] A battery pack comprises the above-mentioned battery pack shell.

[0021] In the embodiment of the present application, a first concave-convex surface that matches the shape of the second concave-convex surface of the flow channel plate is provided on the bottom plate, and the first concave-convex surface and the second concave-convex surface are superimposed and connected, thereby increasing the contact area between the first concave-convex surface and the second concave-convex surface, that is, increasing the contact area between the bottom plate and the liquid cooling plate, thereby increasing the rigidity and strength of the whole formed after the two are superimposed and connected. It can be seen that the embodiment of the present application can solve the problem in the prior art that when the flow channel plate of the liquid cooling plate is connected to the tray, the overall structural strength formed by the connection of the tray and the liquid cooling plate is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0023] Figure 1 It is a schematic diagram of the assembly structure of a tray and a liquid cooling plate in the prior art;

[0024] Figure 2 A schematic diagram of the structure of a tray assembly provided in an embodiment of the present application;

[0025] Figure 3 An exploded view of a tray assembly provided in an embodiment of the present application;

[0026] Figure 4 A schematic diagram of the structure of the tray body provided in the embodiment of the present application;

[0027] Figure 5 A top view of a tray body provided in an embodiment of the present application;

[0028] Figure 6 A schematic diagram of the structure of the limiting boss provided in the embodiment of the present application;

[0029] Figure 7 A schematic diagram of the structure of the flow channel plate provided in an embodiment of the present application;

[0030] Figure 8 A schematic diagram of the structure of a flat panel provided in an embodiment of the present application;

[0031] Fig. 9 A schematic diagram of the structure of the adhesive layer provided in an embodiment of the present application;

[0032] Fig.10 A partial structural schematic diagram of a cross-sectional view of a tray assembly provided in an embodiment of the present application;

[0033] Fig.11 for Fig.10 A partial schematic diagram of

[0034] Fig.12 A schematic diagram of the matching structure of the adhesive pins, adhesive layer, base plate and liquid cooling plate provided in an embodiment of the present application;

[0035] Fig.13 A schematic diagram of the matching structure of the adhesive pins and the flat plate provided in an embodiment of the present application.

[0036] exist Figure 1-Figure 13 middle:

[0037] 10. Pallet;

[0038] 20. Liquid cooling plate; 21. Flow channel plate; 22. Flat plate; 23. Heat exchange flow channel;

[0039] 30. Adhesive layer;

[0040] 40. Bolts;

[0041] 100, tray body; 110, bottom plate; 111, first concave-convex surface; 112, limiting boss; 120, frame;

[0042] 200, liquid cooling plate; 210, flow channel plate; 211, heat exchange flow channel; 220, flat plate; 231, first hole; 232, second hole;

[0043] 310, adhesive layer; 320, adhesive pin; 321, first part; 322, second part. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0045] Please refer to Figure 1 In the prior art, the flow channel plate 21 has a concave-convex surface on its outer surface due to stamping of the heat exchange flow channel 23. When the liquid cooling plate 20 is connected to the tray 10 through the flow channel plate 21, the raised portion of the concave-convex surface of the flow channel plate 21 is connected to the tray 10, and there is a gap between the recessed portion of the concave-convex surface of the flow channel plate 21 and the tray 10, so that the contact area between the flow channel plate 21 and the tray 10 is small. Therefore, in the prior art, when the liquid cooling plate 20 is connected to the tray 10 through the flow channel plate 21, the overall structural strength formed by the connection of the tray 10 and the liquid cooling plate 20 is low.

[0046] To solve the above problems, please refer to Figures 2 to 13 An embodiment of the present application provides a tray assembly, and the provided tray assembly includes a tray body 100 and a liquid cooling plate 200 .

[0047] The tray body 100 includes a bottom plate 110 , and the bottom plate 110 has a first concave-convex surface 111 .

[0048] The liquid cooling plate 200 includes a flow channel plate 210, and the flow channel plate 210 is provided with a heat exchange flow channel 211. It can be understood that during the processing and production process, the heat exchange flow channel 211 is usually stamped on the flow channel plate 210. Therefore, after the heat exchange flow channel 211 is stamped out of the flow channel plate 210, a second concave-convex surface will be formed on the outer surface of the flow channel plate 210. The shape of the first concave-convex surface 111 is adapted to the second concave-convex surface, that is, the shape of the first concave-convex surface 111 is the same as the shape of the second concave-convex surface.

[0049] The second concave-convex surface is superimposed and connected to the first concave-convex surface 111, the raised portion of the first concave-convex surface 111 is opposite to the concave portion of the second concave-convex surface and extends into the concave portion of the second concave-convex surface to contact it, and the raised portion of the second concave-convex surface is opposite to the concave portion of the first concave-convex surface 111 and extends into the concave portion of the first concave-convex surface to contact it, so as to increase the contact area between the first concave-convex surface 111 and the second concave-convex surface.

[0050] In the embodiment of the present application, by providing a first concave-convex surface 111 on the bottom plate 110 that matches the shape of the second concave-convex surface of the flow channel plate 210, and making the first concave-convex surface 111 and the second concave-convex surface overlap and connect, the contact area between the first concave-convex surface 111 and the second concave-convex surface is increased, that is, the contact area between the bottom plate 110 and the liquid cooling plate 200 is increased, thereby increasing the rigidity and strength of the whole formed after the two are overlapped and connected. It can be seen that the embodiment of the present application can solve the problem in the prior art that when the flow channel plate of the liquid cooling plate is connected to the tray, the overall structural strength formed by the connection of the tray and the liquid cooling plate is low.

[0051] In addition, compared with the prior art, the present application can improve the space utilization between the liquid cooling plate 200 and the tray body 100 and reduce the size of the tray assembly in the height direction by matching the shapes of the first concave-convex surface 111 and the second concave-convex surface. It should be noted that the height direction refers to the direction from the liquid cooling plate 200 to the bottom plate 110.

[0052] Optionally, the tray body 100 can be processed by compression molding, die casting or injection molding. The first concave-convex surface 111 is formed during the processing of the tray body 100. Of course, it can also be processed by other processing methods. This application does not limit the specific processing method of the tray body 100.

[0053] There are many ways to achieve the overlapping connection between the first concave-convex surface 111 and the second concave-convex surface. In an optional embodiment, the tray body 100 and the liquid cooling plate 200 can be connected by bolting to achieve the overlapping connection between the first concave-convex surface 111 and the second concave-convex surface. In another optional embodiment, the first concave-convex surface 111 and the second concave-convex surface can be connected by hot pressing to achieve the connection between the tray body 100 and the liquid cooling plate 200.

[0054] Of course, in the embodiment of the present application, the tray assembly may further include an adhesive, and the tray body 100 and the liquid cooling plate 200 may be bonded and connected via the adhesive to achieve overlapping connection between the first concave-convex surface 111 and the second concave-convex surface.

[0055] In this case, the adhesive can connect the tray body 100 and the liquid cooling plate 200 to form an integrated structure, so that the connection between the first concave-convex surface 111 and the second concave-convex surface is tighter, and the connection stability and reliability are higher. Compared with the technical solution of connecting the tray body 100 and the liquid cooling plate 200 by hot pressing, during the bonding process, there is no need for a large external force to press the tray body 100 and the liquid cooling plate 200, which can avoid deformation of the tray body 100 and the liquid cooling plate 200 during the connection process.

[0056] Optionally, the bonded body may be formed by structural adhesive. Structural adhesive has high strength, can bear large loads, is resistant to aging, fatigue and corrosion, has stable performance within the expected life, and is suitable for bonding strong structural parts.

[0057] The adhesive body may include an adhesive layer 310 , and the adhesive layer 310 may be located between the first concavo-convex surface 111 and the second concavo-convex surface.

[0058] Please refer again Figure 1 The liquid cooling plate 20 and the tray 10 in the prior art can also be connected by the adhesive layer 30, but since the contact area between the flow channel plate 21 and the tray 10 is small, the bonding area between the two is also small, resulting in low overall strength and rigidity of the two, and the liquid cooling plate 20 and the tray 10 are usually connected by bolts 40. Since the heat exchange medium flows in the heat exchange flow channel 23, the heat exchange between the heat exchange medium and other components will cause temperature changes. The temperature change may cause thermal expansion and contraction of the liquid cooling plate 20. The thermal expansion and contraction of the liquid cooling plate 20 will cause the locking interface of the bolt 40 to change and the performance of the locking interface to be affected, thereby causing abnormal noise.

[0059] In the embodiment of the present application, when the first concave-convex surface 111 is provided on the base plate 110, the contact area between the first concave-convex surface 111 and the second concave-convex surface is increased. Therefore, after the first concave-convex surface 111 and the second concave-convex surface are connected by the adhesive layer 310, the bonding area between the first concave-convex surface 111 and the second concave-convex surface is increased, and the adhesive layer 310 can connect the first concave-convex surface 111 and the second concave-convex surface into an integrated structure, thereby ensuring the overall structural strength and rigidity formed after the liquid cooling plate 200 and the base plate 110 are connected, and there is no need to use bolts to connect the two. This can not only reduce the cost of the mechanical connection between the base plate 110 and the liquid cooling plate 200, but also avoid the abnormal noise problem caused by using bolts 40 to connect the liquid cooling plate 20 and the tray 10 in the prior art.

[0060] The thickness of the adhesive layer 310 should not be too thick to prevent the height of the tray assembly from being too large, nor too thin to prevent unstable bonding. Optionally, the thickness of the adhesive layer 310 can be 0.8 mm to 1.2 mm, for example, 1 mm.

[0061] In order to limit the thickness of the adhesive layer 310, in the embodiment of the present application, the first concave-convex surface 111 may be provided with a limiting boss 112 protruding toward the second concave-convex surface, and the limiting boss 112 abuts against the second concave-convex surface, so that a glue-filling gap is formed between the first concave-convex surface 111 and the second concave-convex surface, and at least part of the adhesive body is located in the glue-filling gap, that is, at least part of the adhesive body is located between the first concave-convex surface 111 and the second concave-convex surface, so as to form the adhesive layer 310, and the height of the adhesive layer 310 is the same as the height of the limiting boss 112. In this case, the height of the adhesive layer 310 can be controlled by the limiting boss 112, and the method of controlling the height of the adhesive layer 310 is simple and effective.

[0062] In the specific process of bonding the liquid cooling plate 200 and the bottom plate 110, the structural adhesive may be first applied to the first concave-convex surface 111, and then the liquid cooling plate 200 is placed on the adhesive layer, and the liquid cooling plate 200 and the bottom plate 110 are pressed together to connect the two. However, in actual operation, the amount of adhesive applied to the first concave-convex surface 111 is difficult to control.

[0063] To this end, in the embodiment of the present application, the liquid cooling plate 200 may include a flow channel area and a non-flow channel area, the area where the heat exchange flow channel 211 is located forms the flow channel area, and the liquid cooling plate 200 may be provided with a plurality of overflow holes, and the overflow holes may penetrate the non-flow channel area. Optionally, the plurality of overflow holes may be arranged in rows, and there may be a plurality of rows, and the plurality of rows of overflow holes may be arranged at intervals on the liquid cooling plate 200, and each row may include a plurality of overflow holes.

[0064] In this case, after the structural adhesive is applied to the first concave-convex surface 111, the liquid cooling plate 200 is placed on the adhesive layer, and then the liquid cooling plate 200 and the base plate 110 are pressed together to form an adhesive layer 310 between the first concave-convex surface 111 and the second concave-convex surface. In the process of pressing the liquid cooling plate 200 and the base plate 110 together, excess structural adhesive can overflow through the glue overflow hole, thereby controlling the thickness of the adhesive layer 310.

[0065] Of course, the present application may also adopt other methods to complete the bonding of the liquid cooling plate 200 and the base plate 110, for example, glue is injected between the liquid cooling plate 200 and the base plate 110 through the glue overflow hole to form a bonding layer 310 between the first concave-convex surface 111 and the second concave-convex surface. In this case, the glue overflow hole can not only realize glue injection, but also discharge the air between the liquid cooling plate 200 and the base plate 110.

[0066] In a further technical solution, the tray assembly may further include an adhesive pin 320, at least a portion of which is located in the glue overflow hole, and the adhesive pin 320 is connected to the adhesive layer 310. In this case, the bonding area between the tray body 100 and the liquid cooling plate 200 can be increased, thereby further improving the connection strength between the two.

[0067] Specifically, the adhesive pin 320 may include a first portion 321 and a second portion 322, the first portion 321 may be located in the glue overflow hole, and the two ends of the first portion 321 may be connected to the adhesive layer 310 and the second portion 322 respectively, the second portion 322 may be located on the surface of the liquid cooling plate 200 away from the second concave-convex surface, and along the axial direction of the glue overflow hole, the projection of the glue overflow hole is located within the projection of the second portion 322, that is, the second portion 322 cannot pass through the glue overflow hole. It should be noted that the axial direction of the glue overflow hole is consistent with the height direction of the tray assembly.

[0068] In this case, the adhesive pins 320 can further improve the adhesive strength between the liquid cooling plate 200 and the base plate 110 .

[0069] In the embodiment of the present application, the adhesive nail 320 can be formed by the adhesive layer 310 overflowing through the overflow hole. In this case, the formation of the adhesive nail 320 is more convenient. Of course, in other embodiments, the adhesive nail 320 can be additionally poured through the overflow hole.

[0070] The tray assembly in the embodiment of the present application can be applied to a battery pack shell. When the tray assembly is applied to the battery pack shell, the liquid cooling plate 200 is used to exchange heat for the battery module (of course, the liquid cooling plate 200 can be located inside the tray body 100, so that the liquid cooling plate 200 is in direct contact with the battery module for heat exchange, or the liquid cooling plate 200 can also be located outside the tray body 100, so that the liquid cooling plate 200 indirectly dissipates heat for the battery module through the tray body 100). Therefore, in order to better contact and dissipate heat between the liquid cooling plate 200 and the battery module, the liquid cooling plate 200 can include a flat plate 220, which is connected to the flow channel plate 210 and closes the heat exchange flow channel 211. The flat plate 220 has a flat surface, and the flat surface is opposite to the second concave-convex surface, and the flat surface is used to fit the battery module.

[0071] The second portion 322 is located on the surface of the liquid cooling plate 200 away from the second concave-convex surface, that is, the second portion 322 is located on a plane. Therefore, the existence of the second portion 322 results in a convex structure formed on the plane, which is not conducive to the fitting of the flat plate 220 and the battery module.

[0072] To this end, a heat-conducting medium layer may be provided on the plane, and the heat-conducting medium layer may be a heat-conducting gasket, and the heat-conducting medium layer is connected to the plane in a bonded manner, and the heat-conducting medium layer is provided with a perforation, and the second portion 322 is located in the perforation, and the surface of the heat-conducting medium layer away from the plane is coplanar with the surface of the second portion 322 away from the plane. In this case, by providing the heat-conducting medium layer, the surface of the flat plate 220 away from the flow channel plate 210 forms a planar structure, thereby ensuring the bonding of the liquid cooling plate 200 and the battery module.

[0073] When the liquid cooling plate 200 includes a flow channel plate 210 and a flat plate 220 , the glue overflow hole may include a first hole 231 opened in the flow channel plate 210 and a second hole 232 opened in the flat plate 220 , and the first hole 231 and the second hole 232 are opposite and connected to form a glue overflow hole that penetrates the liquid cooling plate 200 .

[0074] In the embodiment of the present application, the tray body 100 may further include a frame 120, which may be connected to the bottom plate 110 and enclose a receiving groove, and the liquid cooling plate 200 may be located in the receiving groove, and there may be a gap between at least one side of the liquid cooling plate 200 and the groove wall of the receiving groove, thereby reducing the dimensional accuracy requirements for the liquid cooling plate 200 and the tray body 100. In this case, when the tray assembly is applied to the battery pack shell, the liquid cooling plate 200 is located in the battery pack shell, so that the liquid cooling plate 200 and the battery module in the battery pack shell can be in direct contact, thereby improving the heat exchange efficiency and heat exchange effect.

[0075] Based on the above-mentioned tray assembly, an embodiment of the present application also provides a battery pack shell, which includes the above-mentioned tray assembly. Since the battery pack shell has the above-mentioned tray assembly, the beneficial effects of the battery pack shell brought by the tray assembly can be found in the above content and will not be repeated here.

[0076] Based on the above-mentioned battery pack shell, an embodiment of the present application further provides a battery pack, which includes the above-mentioned battery pack shell. Since the battery pack has the above-mentioned battery pack shell, the beneficial effects of the battery pack brought by the battery pack shell can be found in the above content and will not be repeated here.

[0077] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0078] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0079] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0080] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0081] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0082] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A tray assembly, characterized in that: include: The tray body (100) comprises a bottom plate (110), wherein the bottom plate (110) has a first concave-convex surface (111); A liquid cooling plate (200) comprises a flow channel plate (210), wherein the flow channel plate (210) is provided with a heat exchange flow channel (211) so as to form a second concave-convex surface on the outer surface of the flow channel plate (210), wherein the shape of the first concave-convex surface (111) is adapted to the second concave-convex surface, and the second concave-convex surface is superimposed and connected to the first concave-convex surface (111).

2. The tray assembly according to claim 1, characterized in that: The tray assembly also includes an adhesive body, and the tray body (100) and the liquid cooling plate (200) are bonded and connected via the adhesive body.

3. The tray assembly according to claim 2, characterized in that: The first concave-convex surface (111) is provided with a limiting boss (112) protruding in the direction of the second concave-convex surface, and the limiting boss (112) abuts against the second concave-convex surface to form a glue-filled gap between the first concave-convex surface (111) and the second concave-convex surface, and at least part of the adhesive body is located in the glue-filled gap to form an adhesive layer (310).

4. The tray assembly according to claim 2 or 3, characterized in that: At least part of the adhesive body is located between the first concave-convex surface (111) and the second concave-convex surface to form an adhesive layer (310); the liquid cooling plate (200) comprises a flow channel area and a non-flow channel area; the area where the heat exchange flow channel (211) is located forms the flow channel area; the liquid cooling plate (200) is provided with a plurality of glue overflow holes, and the glue overflow holes penetrate the non-flow channel area.

5. The tray assembly according to claim 4, characterized in that: The adhesive body further comprises an adhesive pin (320), at least a portion of the adhesive pin (320) is located in the glue overflow hole, and the adhesive pin (320) is connected to the adhesive layer (310).

6. The tray assembly according to claim 5, characterized in that: The adhesive nail (320) comprises a first part (321) and a second part (322), wherein: The first part (321) is located in the glue overflow hole, and two ends of the first part (321) are respectively connected to the adhesive layer (310) and the second part (322); The second portion (322) is located on a surface of the liquid cooling plate (200) that is away from the second concave-convex surface, and along the axial direction of the glue overflow hole, the projection of the glue overflow hole is located within the projection of the second portion (322).

7. The tray assembly according to claim 6, characterized in that: The liquid cooling plate (200) comprises a flat plate (220), the flat plate (220) is connected to the flow channel plate (210) and closes the heat exchange flow channel (211), the flat plate (220) has a plane, and the plane is opposite to the second concave-convex surface; The second part (322) is located on the plane, the plane has a heat-conducting medium layer, the heat-conducting medium layer is bonded to the plane, the heat-conducting medium layer is provided with a perforation, the second part (322) is located in the perforation, and the surface of the heat-conducting medium layer facing away from the plane is coplanar with the surface of the second part (322) facing away from the plane.

8. The tray assembly according to claim 1, characterized in that: The tray body (100) further comprises a frame (120), wherein the frame (120) is connected to the bottom plate (110) and forms a receiving groove, and the liquid cooling plate (200) is located in the receiving groove.

9. A battery pack housing, characterized in that: Comprising a tray assembly as described in any one of claims 1-8.

10. A battery pack, characterized in that: Comprising the tray assembly as claimed in claim 9.

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