Radio frequency front end module and communication device
By using a combined winding inductor in series and/or parallel as a matching element in the RF front-end module, the high cost problem caused by chip inductor in the prior art is solved, and a significant reduction in module volume and cost is achieved.
Patent Information
- Application Number
- CN202420477889.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-13
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-03-13
AI Technical Summary
In the existing RF front-end modules, the matching circuit uses chip inductor, resulting in high module production costs.
A winding inductor combined in series and/or parallel is used as a matching element to connect different functional devices to reduce power loss and achieve the integration of passive devices.
Achieving the integration of passive devices in small volumes significantly reduces module size and manufacturing costs.
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Abstract
Description
Technical Field
[0001] The present application relates to the field of communication technology, and in particular to a radio frequency front-end module and a communication device. Background Art
[0002] With the development of science and technology and the continuous progress of society, the trend of miniaturization and high performance of RF communication equipment is accelerating, which puts higher requirements on RF front-end design. RF front-end modules combine different devices into a chip with concentrated functions and high performance. Matching circuits are required between devices to reduce power loss. In traditional RF front-end modules, matching circuits are implemented with chip inductors, resulting in high module production costs. Utility Model Content
[0003] Based on this, it is necessary to provide a radio frequency front-end module and a communication device that can reduce the manufacturing cost of the module to address the above problems.
[0004] A radio frequency front-end module comprises a substrate, a functional device and a matching element, wherein the functional device and the matching element are arranged on the substrate, the number of the functional devices is more than two, and each of the functional devices is connected through a corresponding matching element, and the matching element comprises a winding inductor in series and / or parallel combination.
[0005] In one embodiment, the substrate is a multi-layer structure, and the winding inductor is wound in the multi-layer structure of the substrate.
[0006] In one embodiment, the wire-wound inductor is formed by copper wires wound between different layers of the substrate.
[0007] In one embodiment, the copper wire has a thickness of 15 microns to 20 microns.
[0008] In one embodiment, the substrate includes a first layer, a second layer and a third layer stacked in sequence, and the copper wires are arranged between the first layer, the second layer and the third layer and above and below them.
[0009] In one embodiment, the thickness of the first layer is 35 micrometers to 45 micrometers.
[0010] In one embodiment, the thickness of the second layer is 55 micrometers to 65 micrometers.
[0011] In one embodiment, the thickness of the third layer is 35 microns to 45 microns.
[0012] In one embodiment, the functional device includes at least two of a low noise amplifier, a filter and an antenna switch.
[0013] A communication device comprises a radio frequency antenna and the above-mentioned radio frequency front-end module, wherein the radio frequency antenna is connected to the radio frequency front-end module.
[0014] The above-mentioned RF front-end module and communication device, the RF front-end module includes a substrate, functional devices and matching elements, the functional elements and matching elements are arranged on the substrate, the number of functional devices is more than two, and each functional device is connected through a corresponding matching element, and the matching element includes a winding inductor in series and / or parallel combination. The winding inductor is used in series and / or parallel combination as a matching element to connect different functional devices, and the integration of passive devices is realized in a small volume, so that the module volume and production cost are greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is a schematic structural diagram of a radio frequency front-end module in an embodiment;
[0016] Figure 2 FIG. 4 is a schematic diagram of the structure of a substrate and a wound inductor in an embodiment. DETAILED DESCRIPTION
[0017] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0019] It is understood that the terms "first", "second", etc. used in this application can be used to describe various elements in this article, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. The "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if the connected circuits, modules, units, etc. have transmission of electrical signals or data with each other.
[0020] When used herein, the singular forms "a", "an", and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.
[0021] In one embodiment, Figure 1 As shown, a radio frequency front-end module is provided, including a substrate 110, a functional device 120 and a matching element 130, the functional element 120 and the matching element 130 are arranged on the substrate 110, the number of the functional device 120 is more than two, and each functional device 120 is connected by a corresponding matching element 130, and the matching element 130 includes a winding inductor combined in series and / or parallel. Among them, the type and number of the functional element 120 are not unique, and specifically may include a low noise amplifier, a filter, and an antenna switch. By arranging the matching element 130 between the functional devices 120, the power loss is reduced. It can be understood that the inductance value of the matching element 130 required between different functional elements 120 is different, and the winding inductor can be combined in series and / or in parallel to meet different inductance value requirements.
[0022] In the above-mentioned RF front-end module, each functional device 120 is connected through a corresponding matching element 130, and the matching element 130 includes a winding inductor in series and / or parallel combination. The winding inductor is used in series and / or parallel combination as the matching element 130 to connect different functional devices 120, reduce power loss, realize the integration of passive devices in a small volume, and greatly reduce the module volume and production cost.
[0023] In one embodiment, the substrate 110 is a multi-layer structure, and the winding inductor is wound in the multi-layer structure of the substrate 110. The substrate 110 can be specifically designed as a structure of 2 layers, 3 layers or more layers, and metal wires are arranged between different layers to make the winding inductor, saving substrate space and module cost. The specific material for making the winding inductor is not unique. In this embodiment, the winding inductor is composed of copper wires wound between different layers of the substrate 110.
[0024] In one embodiment, Figure 2 As shown, the substrate 110 includes a first layer 112, a second layer 114 and a third layer 116 which are stacked in sequence, and copper wires 132 are arranged between the first layer 112, the second layer 114 and the third layer 116 and above and below them. The thickness of the copper wire 132 can be 15 microns to 20 microns, and the thickness of the copper wire 132 in this embodiment is 18 microns. Each layer of the substrate 110 is equivalent to an inductor, and a suitable inductance value can be adjusted as a matching element 130. The first layer 112, the second layer 114 and the third layer 116 can be made of GEA705G material, the thickness of the first layer 112 is 35 microns to 45 microns, the thickness of the second layer 114 is 55 microns to 65 microns, and the thickness of the third layer 116 is 35 microns to 45 microns. In this embodiment, the thickness of the first layer 112 is 40 microns, the thickness of the second layer 114 is 60 microns, and the thickness of the third layer 116 is 40 microns.
[0025] In one embodiment, a communication device is also provided, including an RF antenna and the above-mentioned RF front-end module, and the RF antenna is connected to the RF front-end module. The functional elements in the RF front-end module may specifically include a low noise amplifier, a filter, and an antenna switch, etc. The filter may include a high-frequency filter (for example, a filter in the B40 band and the B41 band), an intermediate frequency filter (for example, a filter in the B1 band, the B2 band, and the B3 band), etc. The antenna switch may specifically include a static contact and multiple moving contacts, the static contact is connected to the RF antenna, and each moving contact is connected to the corresponding filter through a matching element, and the back end of the filter is connected to other functional devices. The matching element may be composed of two winding inductors in series, two winding inductors in parallel, or multiple winding inductors in series and parallel, and the specific design is based on actual needs.
[0026] In addition, the communication device may also include a controller, which is connected to the functional devices in the RF front-end module to control the functional devices. For example, the controller is connected to the antenna switch, and the on and off of the antenna switch is controlled by the controller. The type of controller is not unique, for example, it can be a CPU (Central Processing Unit), MCU (Microcontroller Unit), FPGA (Field-Programmable Gate Array) and other devices.
[0027] In the above communication device, each functional device 120 in the RF front-end module is connected through a corresponding matching element 130, and the matching element 130 includes a winding inductor in series and / or parallel combination. The winding inductor is used in series and / or parallel combination as the matching element 130 to connect different functional devices 120, reduce power loss, realize the integration of passive devices in a small volume, and greatly reduce the module volume and production cost.
[0028] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0029] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.
Claims
1. A radio frequency front-end module, characterized in that: It includes a substrate, functional devices and matching elements, wherein the functional devices and the matching elements are arranged on the substrate, the number of the functional devices is more than two, and each of the functional devices is connected through a corresponding matching element, and the matching element includes a winding inductor in series and / or parallel combination.
2. The RF front-end module according to claim 1, characterized in that: The substrate is a multi-layer structure, and the winding inductor is wound in the multi-layer structure of the substrate.
3. The RF front-end module according to claim 2, characterized in that: The wirewound inductor is composed of copper wires wound between different layers of the substrate.
4. The RF front-end module according to claim 3, characterized in that: The copper wire has a thickness of 15 micrometers to 20 micrometers.
5. The RF front-end module according to claim 3, characterized in that: The substrate includes a first layer, a second layer and a third layer which are stacked in sequence, and the copper wires are arranged between the first layer, the second layer and the third layer and above and below them.
6. The RF front-end module according to claim 5, characterized in that: The thickness of the first layer is 35 micrometers to 45 micrometers.
7. The RF front-end module according to claim 5, characterized in that: The second layer has a thickness of 55 micrometers to 65 micrometers.
8. The RF front-end module according to claim 5, characterized in that: The thickness of the third layer is 35 micrometers to 45 micrometers.
9. The RF front-end module according to any one of claims 1 to 8, characterized in that: The functional devices include at least two of a low noise amplifier, a filter and an antenna switch.
10. A communication device, characterized in that: It comprises a radio frequency antenna and the radio frequency front-end module according to any one of claims 1 to 9, wherein the radio frequency antenna is connected to the radio frequency front-end module.