High-heat-dissipation embedded adapter

Abstract

The utility model discloses a high-heat-dissipation embedded adapter, and relates to the technical field of adapter devices. The device comprises a shell, a spring sleeve rod is arranged in the shell, the top end of the spring sleeve rod is fixedly connected with a placement plate, the bottom of the placement plate is fixedly connected with a charging coil, the bottom of the charging coil is fixedly connected with a vapor chamber, the bottom of the vapor chamber is fixedly connected with an upper heat dissipation plate, and the upper heat dissipation plate is fixedly connected with a lower heat dissipation plate. By arranging the spring sleeve rod, when a mobile phone is placed on the placing plate, the mobile phone can be automatically adjusted to form a stable groove space, so that the mobile phone can be stably placed in a charging area, convenient charging experience is provided, the stability and the safety of equipment are enhanced, and in the charging process, the charging efficiency is improved. Through the combined design of the vapor chamber, the upper heat dissipation plate and the lower heat dissipation plate, heat generated in the charging process can be effectively dispersed and dissipated, and it is ensured that the adapter can still keep good heat dissipation performance during continuous high-load work.

Description

Technical Field

[0001] The utility model relates to the technical field of adapter devices, in particular to a high-heat dissipation embedded adapter. Background Art

[0002] An adapter is an interface converter. It can be an independent hardware interface device that allows hardware or electronic interfaces to be connected to other hardware or electronic interfaces. It can also be an information interface, such as: a power adapter, a tripod base adapter, a USB to serial port adapter, etc.

[0003] When a mobile phone is wirelessly charged with an existing high-heat dissipation embedded adapter, the mobile phone is generally in an unfixed state, which is prone to collision and deviation from the charging area. Once the mobile phone deviates from the effective charging area of ​​the wireless charger, not only will the charging be interrupted, but also excessive heat will be generated due to the reduced energy conversion efficiency during the wireless charging process, which may not only damage the life of the mobile phone battery and the wireless charger, but also pose certain safety hazards. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a high heat dissipation embedded adapter to solve the technical problem that the mobile phone is generally in an unfixed state and is prone to collision, resulting in deviation from the charging area.

[0005] To achieve the above object, the utility model provides the following technical solutions: a high heat dissipation embedded adapter, comprising a shell, a spring sleeve rod is arranged inside the shell, a placement plate is fixedly connected to the top of the spring sleeve rod, a charging coil is fixedly connected to the bottom of the placement plate, a heat spreader is fixedly connected to the bottom of the charging coil, and an upper heat dissipation plate is fixedly connected to the bottom of the heat spreader;

[0006] A motor is fixedly connected to the bottom of one side of the shell, a turbofan is fixedly connected to the output end of the motor, and an air inlet is fixedly connected to the top of the turbofan.

[0007] By adopting the above technical solution, the design of the high heat dissipation embedded adapter has good heat dissipation performance. Through the design of the heat spreader, the heat generated during charging can be quickly and evenly dispersed to the upper heat dissipation plate.

[0008] Furthermore, an air guide plate is fixedly connected to the other side of the shell, and the air guide plate is arranged in an oblique structure.

[0009] By adopting the above technical solution, the oblique structural setting of the air guide plate can guide the airflow more effectively, ensuring that the hot air can flow along a predetermined path.

[0010] Furthermore, a lower heat dissipation plate is arranged below the upper heat dissipation plate, and a circuit board is fixedly connected to the bottom of the lower heat dissipation plate.

[0011] By adopting the above technical solution, by setting up an upper heat sink and a lower heat sink, the high heat dissipation embedded adapter can achieve double-layer heat dissipation, greatly improving the heat dissipation efficiency. The upper heat sink is mainly responsible for receiving and dissipating the heat from the heat spreader, while the lower heat sink collects the heat from the circuit board and dissipates it into the air.

[0012] Furthermore, the circuit board is fixedly connected to the casing, and a wind shield is provided between the casing and the turbofan.

[0013] By adopting the above technical solution, the fixed connection between the circuit board and the housing provides a stable working environment for the circuit board, which helps to reduce possible damage to the circuit board due to vibration or movement, thereby improving the stability and durability of the equipment.

[0014] Furthermore, four spring sleeve rods are provided, and the four spring sleeve rods are arranged in a rectangular structure.

[0015] By adopting the above technical solution and setting four spring sleeve rods, the high heat dissipation embedded adapter can provide a more stable supporting force, ensuring that the mobile phone or other device placed on the placement plate can remain stable and is not easy to slip or shift.

[0016] Furthermore, an upper heat dissipation groove is provided on the upper heat dissipation plate, and a plurality of the upper heat dissipation grooves are provided, and the plurality of the upper heat dissipation grooves are linearly and evenly arranged.

[0017] By adopting the above technical solution and opening a plurality of upper heat dissipation slots on the upper heat dissipation plate, the heat dissipation area is effectively increased, so that the heat can be dissipated into the air more quickly through the heat dissipation slots.

[0018] Furthermore, a lower heat dissipation slot is provided on the lower heat dissipation plate, and a plurality of the lower heat dissipation slots are provided, and the plurality of lower heat dissipation slots and the plurality of upper heat dissipation slots are arranged relative to each other.

[0019] By adopting the above technical solution, a plurality of lower heat dissipation slots are provided on the lower heat dissipation plate, thereby further enhancing the heat dissipation effect. These heat dissipation slots effectively increase the heat dissipation area, so that the heat can be dissipated into the air more quickly.

[0020] Furthermore, a wind duct plate is fixedly connected to the top of the placement plate, and a wind duct is opened on the wind duct plate.

[0021] By adopting the above technical solution, the air duct plate fixedly connected to the top of the placement plate provides a clear channel for the airflow, which helps to guide and concentrate the airflow and improve the heat dissipation efficiency.

[0022] Furthermore, a plurality of the air ducts are provided, and the plurality of the air ducts are linearly and evenly arranged.

[0023] By adopting the above technical solution and setting up multiple air ducts, the heat dissipation area and heat dissipation channels can be further increased to ensure sufficient heat dissipation.

[0024] Furthermore, the air duct plate is made of ceramic material.

[0025] By adopting the above technical solution, the air duct plate made of ceramic material has excellent thermal conductivity, and it can more effectively conduct heat from the inside of the adapter to the outside, thereby improving the heat dissipation efficiency.

[0026] In summary, the utility model mainly has the following beneficial effects:

[0027] 1. The utility model provides a spring sleeve rod, and when the mobile phone is placed on the placement plate, it can automatically adjust and form a stable groove space to ensure that the mobile phone is stably placed in the charging area, which not only provides a convenient charging experience, but also enhances the stability and safety of the device. During the charging process, the combined design of the heat spreader, the upper heat sink and the lower heat sink can effectively disperse and dissipate the heat generated during the charging process, ensuring that the adapter can still maintain good heat dissipation performance when working under continuous high load, avoiding device damage or performance degradation caused by overheating;

[0028] 2. The utility model can form a stable air duct by setting the air guide plate, ensuring that the cold air blown out from the turbo fan can flow along a predetermined path, thereby effectively blowing the hot air outward, preventing damage to the equipment caused by overheating accumulation, and also extending the service life of the equipment;

[0029] 3. The utility model provides an air duct plate and eliminates the wind shield. When the mobile phone is pressed down, the turbo fan can more directly inhale cold air from the air inlet and blow it out. On the one hand, the blown cold air directly cools the upper heat sink and the lower heat sink, and effectively takes away the heat inside the adapter. On the other hand, the cold air will also blow through the air duct on the air duct plate, and take away the heat generated when the mobile phone is charging, thereby further improving the heat dissipation effect, which not only ensures the heat dissipation performance of the adapter itself, but also optimizes the heat dissipation environment of the mobile phone, making the entire charging process safer and more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0031] Figure 2 It is a schematic diagram of the cutaway structure of the housing of the utility model;

[0032] Figure 3 It is a schematic diagram of the explosion structure of the utility model;

[0033] Figure 4 It is a three-dimensional structural schematic diagram of the air duct plate of the utility model.

[0034] In the figure: 1. outer shell; 2. spring sleeve rod; 3. placement plate; 4. charging coil; 5. heat spreader; 6. upper heat sink; 7. motor; 8. turbo fan; 9. air inlet; 10. air guide plate; 11. lower heat sink; 12. circuit board; 13. wind shield; 14. upper heat sink; 15. lower heat sink; 16. air duct plate; 17. air duct. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0036] The following describes an embodiment of the utility model based on its overall structure.

[0037] Embodiment 1:

[0038] A high heat dissipation embedded adapter, such as Figure 1-Figure 4 As shown, it includes a shell 1, a spring sleeve rod 2 is arranged inside the shell 1, a placement plate 3 is fixedly connected to the top of the spring sleeve rod 2, a charging coil 4 is fixedly connected to the bottom of the placement plate 3, a heat spreader 5 is fixedly connected to the bottom of the charging coil 4, and an upper heat sink 6 is fixedly connected to the bottom of the heat spreader 5;

[0039] A motor 7 is fixedly connected to the bottom of one side of the shell 1, a turbofan 8 is fixedly connected to the output end of the motor 7, and an air inlet 9 is fixedly connected to the top of the turbofan 8. The design of the high-heat dissipation embedded adapter has good heat dissipation performance. Through the design of the heat spreader 5, the heat generated during charging can be quickly and evenly dispersed to the upper heat sink 6. At the same time, the turbofan 8 driven by the motor 7 inhales cold air through the air inlet 9, effectively cooling the upper heat sink 6, ensuring that the adapter can maintain a good heat dissipation state while efficiently charging, preventing overheating from causing damage to the adapter and the charging device.

[0040] See also Figure 1 , Figure 2 and Figure 3 A wind guide plate 10 is fixedly connected to the other side of the shell 1. The wind guide plate 10 is arranged in an oblique structure. The oblique structure of the wind guide plate 10 can more effectively guide the airflow and ensure that the hot air can flow along a predetermined path. At the same time, it can also prevent the hot air from being scattered during the flow, thereby further improving the heat dissipation effect.

[0041] See also Figure 1 , Figure 2 and Figure 3 A lower heat sink 11 is arranged below the upper heat sink 6, and a circuit board 12 is fixedly connected to the bottom of the lower heat sink 11. By arranging the upper heat sink 6 and the lower heat sink 11, the high heat dissipation embedded adapter can achieve double-layer heat dissipation, which greatly improves the heat dissipation efficiency. The upper heat sink 6 is mainly responsible for receiving and dissipating the heat from the heat spreader 5, while the lower heat sink 11 collects the heat of the circuit board 12 and dissipates it into the air. At the same time, the circuit board 12 fixedly connected to the bottom of the lower heat sink 11 is also well protected from heat dissipation, which can effectively prevent the performance degradation or damage caused by overheating of the circuit board 12, thereby improving the overall reliability and service life of the adapter.

[0042] See also Figure 1 , Figure 2 and Figure 3 The circuit board 12 is fixedly connected to the housing 1, and a wind shield 13 is arranged between the housing 1 and the turbofan 8. The fixed connection between the circuit board 12 and the housing 1 provides a stable working environment for the circuit board, which helps to reduce possible damage to the circuit board due to vibration or movement, thereby improving the stability and durability of the equipment. At the same time, the wind shield 13 arranged between the housing 1 and the turbofan 8 can effectively prevent the airflow generated by the turbofan 8 from escaping and causing wind leakage.

[0043] See also Figure 1 , Figure 2 and Figure 3 There are four spring sleeve rods 2, and the four spring sleeve rods 2 are arranged in a rectangular structure. By setting four spring sleeve rods 2, the high heat dissipation embedded adapter can provide a more stable supporting force, ensuring that the mobile phone or other devices placed on the placement plate 3 can remain stable and are not easy to slip or shift. At the same time, the four spring sleeve rods 2 are arranged in a rectangular structure. This layout can evenly distribute the supporting force, avoid instability caused by single-point force, and make the entire supporting structure more solid, thereby enhancing the overall structural strength of the adapter and improving its service life.

[0044] See also Figure 1 , Figure 2 and Figure 3 An upper heat dissipation groove 14 is provided on the upper heat dissipation plate 6, and a plurality of upper heat dissipation grooves 14 are provided. The plurality of upper heat dissipation grooves 14 are arranged linearly and evenly. By providing a plurality of upper heat dissipation grooves 14 on the upper heat dissipation plate 6, the heat dissipation area is effectively increased, so that heat can be dissipated into the air more quickly through the heat dissipation grooves. At the same time, the plurality of upper heat dissipation grooves 14 are arranged linearly and evenly. This layout ensures the uniformity of heat dissipation and avoids heat accumulation in a certain area, thereby improving the overall heat dissipation effect and ensuring the stable operation of the equipment.

[0045] See also Figure 1 , Figure 2 and Figure 3 The lower heat dissipation plate 11 is provided with a lower heat dissipation slot 15, and a plurality of lower heat dissipation slots 15 are provided. The plurality of lower heat dissipation slots 15 and the plurality of upper heat dissipation slots 14 are arranged relative to each other. By providing a plurality of lower heat dissipation slots 15 on the lower heat dissipation plate 11, the heat dissipation effect is further enhanced. These heat dissipation slots effectively increase the heat dissipation area, so that the heat can be dissipated into the air more quickly. At the same time, the relative arrangement of the plurality of lower heat dissipation slots 15 and the plurality of upper heat dissipation slots 14 forms an efficient heat dissipation channel, so that the heat on the upper heat dissipation plate 6 and the lower heat dissipation plate 11 can be quickly dissipated, thereby improving the overall heat dissipation efficiency.

[0046] The implementation principle of the utility model is as follows: first, place the high heat dissipation embedded adapter in an appropriate position, ensure that the air inlet 9 and the air guide plate 10 of the adapter are not blocked to ensure good air circulation, connect the power cord of the adapter to a stable power source, and place the mobile phone on the placement plate 3. Since a spring sleeve rod 2 is arranged inside the adapter, the placement plate 3 is subjected to the gravity of the mobile phone, so that the spring sleeve rod 2 is adjusted to form a groove space to ensure that the mobile phone is stably placed in the charging area. When the mobile phone is correctly placed in the charging area, the charging coil will automatically sense and start wireless charging for the mobile phone. During the charging process, the heat spreader 5 and the upper heat sink 6 and the lower heat sink 11 inside the adapter will effectively disperse the heat generated during the charging process. At the same time, the motor 7 will drive the turbo fan 8 to inhale cold air from the air inlet 9, and through the guidance of the air guide plate 10, air leakage is prevented, and the upper heat sink 6 and the lower heat sink 11 are effectively cooled to ensure that the adapter maintains good heat dissipation performance while charging efficiently. When the mobile phone is fully charged or charging needs to be interrupted, the mobile phone only needs to be removed from the placement plate.

[0047] Embodiment 2:

[0048] See also Figure 4 A duct plate 16 is fixedly connected to the top of the placement plate 3, and an air duct 17 is opened on the air duct plate 16. The air duct plate 16 fixedly connected to the top of the placement plate 3 provides a clear channel for the airflow, which helps to guide and concentrate the airflow and improve the heat dissipation efficiency. At the same time, the air duct 17 opened on the air duct plate 16 can further optimize the flow path of the airflow, reduce turbulence and resistance, so that the cold air can flow more smoothly and effectively take away the heat generated when the mobile phone is charging.

[0049] See also Figure 4There are multiple air ducts 17, and the multiple air ducts 17 are arranged linearly and evenly. By setting up multiple air ducts 17, the heat dissipation area and the heat dissipation channels can be further increased to ensure sufficient heat dissipation. At the same time, the multiple air ducts 17 are arranged linearly and evenly, which can ensure uniform distribution of airflow, avoid local overheating or uneven heat dissipation, and ensure that the adapter can still maintain good heat dissipation performance when working under high load, thereby extending its service life and improving working stability.

[0050] See also Figure 4 The material of the air duct plate 16 is ceramic. The air duct plate 16 made of ceramic has excellent thermal conductivity. It can more effectively conduct heat from the inside of the adapter to the outside, thereby improving the heat dissipation efficiency. At the same time, the ceramic material also has good high temperature resistance. Even under high load operation, the air duct plate 16 will not be deformed or damaged due to excessive temperature, thereby ensuring the stability and reliability of the adapter.

[0051] The implementation principle of the utility model is as follows: first, the wind shield 13 is removed. When the mobile phone is pressed down, the turbo fan 8 is driven to inhale cold air from the air inlet 9 and blow it out. At this time, the air blown out can effectively cool the upper heat sink 6 and the lower heat sink 11 on the one hand, and on the other hand, it blows through the air duct 17 on the air duct plate 16 to take away the heat generated when the mobile phone is charged, thereby improving the heat dissipation effect.

[0052] Parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art, and will not be described in detail here.

[0053] Although an embodiment of the utility model has been shown and described, this specific embodiment is only an explanation of the utility model and is not a limitation of the utility model. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the utility model. However, as long as they are within the scope of the claims of the utility model, they are protected by patent law.

Claims

1. A high heat dissipation embedded adapter, characterized in that: It comprises a shell (1), a spring sleeve rod (2) is arranged inside the shell (1), the top of the spring sleeve rod (2) is fixedly connected to a placement plate (3), the bottom of the placement plate (3) is fixedly connected to a charging coil (4), the bottom of the charging coil (4) is fixedly connected to a heat spreader (5), and the bottom of the heat spreader (5) is fixedly connected to an upper heat dissipation plate (6); A motor (7) is fixedly connected to the bottom of one side of the housing (1), a turbofan (8) is fixedly connected to the output end of the motor (7), and an air inlet (9) is fixedly connected to the top of the turbofan (8).

2. The high heat dissipation embedded adapter according to claim 1, characterized in that: The other side of the housing (1) is fixedly connected with an air guide plate (10), and the air guide plate (10) is arranged in an oblique structure.

3. The high heat dissipation embedded adapter according to claim 1, characterized in that: A lower heat dissipation plate (11) is arranged below the upper heat dissipation plate (6), and a circuit board (12) is fixedly connected to the bottom of the lower heat dissipation plate (11).

4. The high heat dissipation embedded adapter according to claim 3, characterized in that: The circuit board (12) and the housing (1) are fixedly connected, and a windshield (13) is provided between the housing (1) and the turbofan (8).

5. The high heat dissipation embedded adapter according to claim 1, characterized in that: Four spring sleeve rods (2) are provided, and the four spring sleeve rods (2) are arranged in a rectangular structure.

6. The high heat dissipation embedded adapter according to claim 1, characterized in that: An upper heat dissipation slot (14) is provided on the upper heat dissipation plate (6), a plurality of the upper heat dissipation slots (14) are provided, and the plurality of the upper heat dissipation slots (14) are linearly and evenly arranged.

7. The high heat dissipation embedded adapter according to claim 3, characterized in that: The lower heat dissipation plate (11) is provided with a lower heat dissipation slot (15), a plurality of the lower heat dissipation slots (15) are provided, and the plurality of lower heat dissipation slots (15) and the plurality of upper heat dissipation slots (14) are arranged relative to each other.

8. The high heat dissipation embedded adapter according to claim 1, characterized in that: The top of the placement plate (3) is fixedly connected to an air duct plate (16), and an air duct (17) is provided on the air duct plate (16).

9. The high heat dissipation embedded adapter according to claim 8, characterized in that: A plurality of the air ducts (17) are provided, and the plurality of the air ducts (17) are linearly and evenly arranged.

10. The high heat dissipation embedded adapter according to claim 8, characterized in that: The material of the air duct plate (16) is ceramic.

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