Welding device for mobile phone mainboard production

By designing a welding device for the production of mobile phone motherboards including fans, liquid tanks and reaction pots, the problems of insufficient clamping of the motherboard and harmful gas purification during the welding process are solved, and gas purification and stable clamping of the motherboard during the welding process are achieved.

CN222552405UActive Publication Date: 2025-03-04SHANGQIU SHUZHI TECH CO LTD
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Patent Information

Application Number
CN202421285048.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-06
Publication Date
2025-03-04
Estimated Expiration
2034-06-06

AI Technical Summary

Technical Problem

The existing welding devices are insufficient when clamping the mobile phone motherboard, which leads to loosening of the motherboard during welding, causing welding deviations and damage to the motherboard. At the same time, the harmful gases generated during welding cannot be effectively purified.

Method used

A welding device for the production of mobile phone motherboards is designed, using a fan, a liquid tank, a reaction pot and other structures. The harmful gas is sucked in through the fan, and the potassium permanganate solution in the reaction pot is purified by purifying the harmful gases. At the same time, the main fixed block, slide chute, clamping device and other structures are used to achieve stable clamping of motherboards of different shapes.

Benefits of technology

Effectively purify harmful gases generated during welding and protect human health; at the same time, through efficient clamping structure, ensure the stability of the motherboard during welding and avoid welding deviations and damage to the motherboard.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222552405U_ABST
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Abstract

The utility model relates to the technical field of welding devices, and discloses a welding device for mobile phone mainboard production, a fan is fixedly installed at the bottom of a transverse plate B and located on one side of a main fixing block, a liquid tank is fixedly installed at the bottom of a transverse plate A and located between arc legs, and a reaction kettle is arranged in the liquid tank. Harmful gas is purified by arranging a draught fan, a liquid tank, a reaction kettle and other structures, in the welding process, pungent gas can be generated due to high-temperature welding, sulfur dioxide serves as the main component and can be sucked into the human body for a long time, the human body can be hurt, the draught fan is started, then a main board is welded, smoke blown out during welding of the main board is absorbed by suction holes of an air suction block, and the welding quality is improved. Harmful gas enters the fan through the circulating groove, then the harmful gas is blown into the reaction kettle through the gas outlet pipe, the gas enters a potassium permanganate solution through the vent holes, the potassium permanganate solution can perform oxidation-reduction reaction on the harmful gas such as sulfur dioxide, and the effect of purifying the harmful gas is achieved.
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Description

Technical Field

[0001] The utility model relates to the technical field of welding devices, in particular to a welding device for producing mobile phone motherboards. Background Art

[0002] The mobile phone motherboard is the main circuit board in the mobile phone. It contains the main electronic components and interfaces, as well as some auxiliary electronic components. The motherboard uses insulating material as the base material, cut into plates of a certain size as required (copper foil on the insulating plate), and punched according to wiring requirements (such as component holes, fastening holes, metallized holes, etc.) to achieve mutual connection between electronic components.

[0003] During the production process of mobile phone motherboards, the motherboard needs to be welded. During welding, the high temperature melts the metal, and the melted metal is fused together to weld two or more metals together, which has a higher bearing capacity. During the welding process, high temperature welding will produce pungent gas, which is harmful gas. The main component is sulfur dioxide. Long-term inhalation into the human body will cause harm to the body.

[0004] The existing welding device has certain deficiencies in clamping the mainboard. For example, when clamping a circular mainboard, the clamping is not firm and becomes loose. When welding the mainboard, deviation may occur, resulting in damage to the mainboard. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a welding device for producing mobile phone motherboards, which has the advantages of purifying harmful gases and high clamping adaptability, and solves the problems raised by the above-mentioned background technology.

[0006] The utility model provides the following technical solutions: a welding device for producing mobile phone motherboards, comprising a transverse plate A, the bottom of the transverse plate A is in a circular ring shape and is evenly fixedly installed with arc legs, the top of the transverse plate A is fixedly installed with an arc circle, an arc groove is opened inside the arc circle, a transverse plate B is movably installed inside the arc groove, a main fixed block is fixedly installed in the middle of the bottom of the transverse plate B, the bottom of the transverse plate B is located on both sides of the main fixed block and is fixedly installed with auxiliary fixed blocks, a clamping device is rotatably installed between the auxiliary fixed block and the main fixed block, an air suction block is fixedly installed on one side of the top of the transverse plate A, the bottom of the transverse plate B is located on one side of the main fixed block and is fixedly installed with a fan, the bottom of the transverse plate A is located between the arc legs and is fixedly installed with a liquid tank, a reaction pot is provided inside the liquid tank, and the reaction pot 8 is filled with acidic potassium permanganate solution.

[0007] Preferably, the suction block is provided with a suction hole on one side close to the center of the horizontal plate B, the interior of the suction block is hollow, the interior of the horizontal plate B is provided with a circulation groove, the circulation groove is communicated with the suction hole, an suction pipe is fixedly connected between the fan and the circulation groove, an air outlet pipe is fixedly installed on the side of the liquid tank fan away from the air suction pipe, the reaction pot is fixedly connected to the end of the air outlet pipe away from the fan, and the top of the reaction pot is evenly provided with air holes in a circular shape.

[0008] Preferably, one end of the clamping device is located on one side of the auxiliary fixed block and is fixedly installed with a clamping block, and adaptation holes are provided on both sides of the cross plate B at the clamping block, and the outer ring of the clamping block is slidably sleeved with a sleeve, and the sleeve is located in the adaptation hole, and two sliding grooves are provided on the top of the cross plate B, and the outer ring of the clamping device is located in the sliding groove and is rotatably sleeved with a clamping plate, and the clamping plate is located on the upper surface of the cross plate B, the outer ring of the clamping plate is an arc edge, and the top of the clamping plate is provided with an arc-shaped protrusion.

[0009] Preferably, a slide is fixedly installed at the bottom of the clamping plate, and the slide is rotatably sleeved on the outer ring of the clamping device. The outer ring of the clamping device is provided with a thread, and the inner ring of the slide is provided with a thread groove. The thread groove of the inner ring of the slide is adapted to the thread of the outer ring of the clamping device.

[0010] Preferably, the surface of the card plate is provided with a groove, and a sliding column is fixedly installed between the inner walls of the groove, and the upper surface of the card plate is located on the outer ring of the sliding column and two sliding blocks are slidably installed, and the inside of the sliding block is provided with a hole groove matched with the sliding column, and a movable column is rotatably installed on the top of the sliding block, and a rotating hole is provided on the top of the movable column, and a stud is rotatably installed inside the rotating hole, the outer ring of the stud is provided with a thread, and the inside of the rotating hole is provided with a thread groove, and the thread groove inside the rotating hole is matched with the thread of the outer ring of the stud, a torsion block is fixedly installed on the top of the stud, and a pressure block is fixedly installed on the bottom of the stud, and the pressure block is made of soft rubber material.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] 1. The welding device for producing mobile phone motherboards purifies harmful gases by setting structures such as fans, liquid tanks, and reaction pots. During the welding process, pungent gases are generated due to high-temperature welding. The gases are harmful gases, the main component of which is sulfur dioxide. Long-term inhalation into the human body will cause harm to the human body. The fan is started, and then the motherboard is welded. The smoke from the motherboard welding is absorbed by the suction holes of the suction block, enters the interior of the fan through the circulation slot, and then blows the harmful gases into the interior of the reaction pot through the exhaust pipe. The gas enters the potassium permanganate solution through the air holes. The potassium permanganate solution will undergo oxidation-reduction reactions on harmful gases such as sulfur dioxide, thereby purifying the harmful gases.

[0013] 2. The welding device for mobile phone motherboard production can adapt to motherboards of different shapes by setting up main fixing blocks, sliding grooves, clamping devices and other structures. By adjusting the rotation direction of the sleeve, the clamping device can drive the card plate to slide inward or outward. When the two card plates slide inward at the same time, the outer side of the motherboard is clamped. After the motherboard is clamped, the torsion block is rotated in the opposite direction to move the pressure block downward to press against the upper surface of the motherboard, thereby preventing the motherboard from shaking during the welding process, thereby achieving the effect of adapting to motherboards of different shapes. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 This is a cross-sectional view of the overall structure of the utility model;

[0016] Figure 3 It is a cross-sectional view from another perspective of the overall structure of the utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the clamping device of the utility model;

[0018] Figure 5 for Figure 2 Enlarged view of point A in the middle.

[0019] In the figure: 1. horizontal plate A; 11. arc circle; 2. arc leg; 3. horizontal plate B; 31. main fixed block; 32. auxiliary fixed block; 33. slide groove; 34. circulation groove; 4. clamping device; 41. clamping block; 42. sleeve; 43. clamping plate; 431. slide cylinder; 432. slide column; 44. slider; 45. movable column; 46. stud; 47. torsion block; 48. pressure block; 5. suction block; 6. fan; 61. suction pipe; 62. exhaust pipe; 7. liquid tank; 8. reaction pot; 81. air vent. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-Figure 5A welding device for producing mobile phone motherboards comprises a horizontal plate A1, the bottom of the horizontal plate A1 is in a circular ring shape and is evenly fixedly installed with arc legs 2, the top of the horizontal plate A1 is fixedly installed with an arc circle 11, an arc groove is provided inside the arc circle 11, a horizontal plate B3 is movably installed inside the arc groove, a main fixed block 31 is fixedly installed in the middle of the bottom of the horizontal plate B3, the bottom of the horizontal plate B3 is located on both sides of the main fixed block 31 and fixedly installed with auxiliary fixed blocks 32, a clamping device 4 is rotatably installed between the auxiliary fixed block 32 and the main fixed block 31, the outer ring of the clamping device 4 is provided with threads, an air suction block 5 is fixedly installed on one side of the top of the horizontal plate A1, a suction hole is provided on one side of the air suction block 5 close to the center of the horizontal plate B3, the interior of the air suction block 5 is hollow, a flow groove 34 is provided inside the horizontal plate B3, and the flow groove 34 is communicated with the suction hole.

[0022] See also Figure 1-Figure 5 The bottom of the horizontal plate B3 is located on one side of the main fixed block 31 and is fixedly installed with a fan 6. An air intake pipe 61 is fixedly connected between the fan 6 and the flow slot 34. The bottom of the horizontal plate A1 is located between the arc legs 2 and is fixedly installed with a liquid tank 7. A reaction pot 8 is arranged inside the liquid tank 7. The reaction pot 8 is filled with an acidic potassium permanganate solution. An air outlet pipe 62 is fixedly installed on the side of the fan 6 away from the air intake pipe 61. The reaction pot 8 is fixedly installed on the end of the air outlet pipe 62 away from the fan 6. The top of the reaction pot 8 is annular and evenly provided with air holes 81;

[0023] When welding the main board, high temperature melts the metal, so that the molten metal fuses together, and two or more metals are welded together, which has a higher bearing capacity. During the welding process, pungent gas will be generated due to high temperature welding. The gas is harmful gas, the main component of which is sulfur dioxide. Long-term inhalation into the human body will cause harm to the human body. Use the clamping device 4 to fix the main board on the upper surface of the cross plate B3, place the acidic potassium permanganate in the liquid tank 7, start the fan 6, and then weld the main board. The smoke from the main board welding is absorbed by the suction hole of the suction block 5, enters the interior of the fan 6 through the circulation groove 34, and then blows the harmful gas into the interior of the reaction pot 8 through the exhaust pipe 62. The gas enters the potassium permanganate solution through the air vent 81. The potassium permanganate solution will undergo an oxidation-reduction reaction with harmful gases such as sulfur dioxide, so that the harmful gas is oxidized and reduced by potassium permanganate, which will not cause harm to the human body.

[0024] See also Figure 1-Figure 4One end of the clamping device 4 is located on one side of the auxiliary fixed block 32 and is fixedly installed with a clamping block 41. Matching holes are provided on both sides of the cross plate B3 at the clamping block 41. The outer ring of the clamping block 41 is slidably sleeved with a sleeve 42, and the sleeve 42 is located in the matching hole. Two sliding grooves 33 are provided on the top of the cross plate B3. The outer ring of the clamping device 4 is located in the sliding groove 33 and is rotatably sleeved with a clamping plate 43. The clamping plate 43 is located on the upper surface of the cross plate B3. The outer ring of the clamping plate 43 is an arc edge. The top of the clamping plate 43 is provided with an arc-shaped protrusion, which is adapted to the arc edge of the circular main board. A slide cylinder 431 is fixedly installed on the bottom of the clamping plate 43, and the slide cylinder 431 is located at the outer ring of the clamping device 4 and is rotatably sleeved.

[0025] See also Figure 1-Figure 5 The inner ring of the slide 431 is provided with a thread groove, and the inner ring thread groove of the slide 431 is adapted to the outer ring thread of the clamping device 4. The surface of the card plate 43 is provided with a strip groove, and a slide post 432 is fixedly installed between the inner walls of the strip groove. The upper surface of the card plate 43 is located on the outer ring of the slide post 432 and two sliders 44 are slidably installed. The inside of the slider 44 is provided with a hole groove adapted to the slide post 432. A movable column 45 is rotatably installed on the top of the slider 44. A rotating hole is provided on the top of the movable column 45. A stud 46 is rotatably installed inside the rotating hole. The outer ring of the stud 46 is provided with a thread, and a thread groove is provided inside the rotating hole. The thread groove inside the rotating hole is adapted to the outer ring thread of the stud 46. A torsion block 47 is fixedly installed on the top of the stud 46. The arc edge of the torsion block 47 is adapted to human fingers. A pressure block 48 is fixedly installed on the bottom of the stud 46. The pressure block 48 is made of soft rubber material and has high friction.

[0026] By rotating the sleeve 42, the clamping device 4 is driven to rotate in the same direction, and the slide 431 drives the card plate 43 located on the outer ring of the clamping device 4 to slide. By adjusting the rotation direction of the sleeve 42, the clamping device 4 drives the card plate 43 to slide inward or outward. When the two card plates 43 slide inward at the same time, the outer side of the main board is clamped. If the main board is rectangular in shape and placed on the upper surface of the cross plate B3, the position of the slider 44 is moved inward from both ends of the card plate 43, and the main board is clamped using the plane of the card plate 43, so that one side of the slider 44 is aligned with the rectangular The plane of the card plate 43 is fitted with the side of the rectangular mainboard. If the mainboard is circular, slide the slider 44 to both ends of the card plate 43 so that the top of the slider 44 fits with the arc edge of the arc-shaped protrusion, and place the mainboard between the arc-shaped protrusions of the card plate 43 so that the arc surface of the arc-shaped protrusion fits better with the arc edge of the circular mainboard. After the mainboard is clamped, rotate the torsion block 47 in the opposite direction to move the pressure block 48 downward to press against the upper surface of the mainboard to prevent the mainboard from shaking during the welding process, thereby achieving the effect of adapting to mainboards of different shapes.

[0027] Working principle: By rotating the sleeve 42, the clamping device 4 is driven to rotate in the same direction, and the slide 431 drives the card plate 43 located at the outer ring of the clamping device 4 to slide. By adjusting the rotation direction of the sleeve 42, the clamping device 4 drives the card plate 43 to slide inward or outward. When the two card plates 43 slide inward at the same time, the outer side of the main board is clamped. If the main board is rectangular in shape, it is placed on the upper surface of the cross plate B3, and the position of the slider 44 is moved inward from the two ends of the card plate 43. The plane of the card plate 43 and one side of the slider 44 are used to fit the plane of the rectangular main board. If the main board is circular in shape, the slider 44 is slid toward the two ends of the card plate 43 so that the top of the slider 44 is matched with the arc edge of the arc protrusion, and the main board is placed between the arc protrusions of the card plate 43 so that the arc surface of the arc protrusion is more closely fitted with the arc edge of the circular main board. After the main board is clamped, the torsion block 47 is twisted and rotated to make the pressure block 48 moves downward to press against the upper surface of the mainboard to prevent the mainboard from shaking during the welding process, which has the effect of adapting to mainboards of different shapes. During the welding process, pungent gas will be generated due to high-temperature welding. The gas is harmful gas, the main component of which is sulfur dioxide. Long-term inhalation into the human body will cause harm to the human body. The mainboard is fixed to the upper surface of the horizontal plate B3 using the clamping device 4, and the interior of the liquid tank 7 is placed with acidic potassium permanganate. The fan 6 is started, and then the mainboard is welded. The smoke from the mainboard welding is absorbed by the suction hole of the suction block 5, enters the interior of the fan 6 through the circulation groove 34, and then blows the harmful gas into the interior of the reaction pot 8 through the exhaust pipe 62. The gas enters the potassium permanganate solution through the air vent 81. The potassium permanganate solution will undergo an oxidation-reduction reaction with harmful gases such as sulfur dioxide, so that the harmful gas is oxidized and reduced by potassium permanganate, which will not cause harm to the human body.

Claims

1. A welding device for producing a mobile phone motherboard, comprising a horizontal plate A (1), characterized in that: The bottom of the horizontal plate A (1) is in a circular ring shape and is evenly fixedly mounted with arc legs (2); the top of the horizontal plate A (1) is fixedly mounted with an arc ring (11); an arc groove is provided inside the arc ring (11); a horizontal plate B (3) is movably mounted inside the arc groove; a main fixing block (31) is fixedly mounted in the middle of the bottom of the horizontal plate B (3); and auxiliary fixing blocks (32) are fixedly mounted on both sides of the main fixing block (31) at the bottom of the horizontal plate B (3); the auxiliary fixing blocks ( A clamping device (4) is rotatably mounted between the cross plate (32) and the main fixed block (31); an air suction block (5) is fixedly mounted on one side of the top of the cross plate A (1); a fan (6) is fixedly mounted on the bottom of the cross plate B (3) located on one side of the main fixed block (31); a liquid tank (7) is fixedly mounted on the bottom of the cross plate A (1) located between the arc legs (2); a reaction pot (8) is arranged inside the liquid tank (7); and an acidic potassium permanganate solution is contained in the reaction pot (8).

2. A welding device for producing mobile phone motherboards according to claim 1, characterized in that: The suction block (5) is provided with a suction hole on one side close to the center of the horizontal plate B (3); the interior of the suction block (5) is hollow; the interior of the horizontal plate B (3) is provided with a flow groove (34); the flow groove (34) is communicated with the suction hole; an suction pipe (61) is fixedly connected between the fan (6) and the flow groove (34); an outlet pipe (62) is fixedly installed on the side of the fan (6) of the liquid tank (7) away from the suction pipe (61); the reaction pot (8) is fixedly connected to the end of the outlet pipe (62) away from the fan (6); and the top of the reaction pot (8) is evenly provided with air holes (81) in a circular ring shape.

3. A welding device for producing mobile phone motherboards according to claim 2, characterized in that: One end of the clamping device (4) is located on one side of the auxiliary fixed block (32) and is fixedly installed with a clamping block (41). Both sides of the cross plate B (3) are provided with matching holes at the clamping block (41). The outer ring of the clamping block (41) is slidably sleeved with a sleeve (42), and the sleeve (42) is located in the matching hole. Two sliding grooves (33) are provided on the top of the cross plate B (3). The outer ring of the clamping device (4) is located inside the sliding groove (33) and is rotatably sleeved with a clamping plate (43). The clamping plate (43) is located on the upper surface of the cross plate B (3). The outer ring of the clamping plate (43) is an arc edge, and the top of the clamping plate (43) is provided with an arc-shaped protrusion.

4. A welding device for producing mobile phone motherboards according to claim 3, characterized in that: A slide cylinder (431) is fixedly mounted on the bottom of the clamping plate (43), and the slide cylinder (431) is rotatably sleeved on the outer ring of the clamping device (4). The outer ring of the clamping device (4) is provided with a thread, and the inner ring of the slide cylinder (431) is provided with a thread groove. The thread groove of the inner ring of the slide cylinder (431) is adapted to the thread of the outer ring of the clamping device (4).

5. A welding device for producing mobile phone motherboards according to claim 4, characterized in that: The surface of the card plate (43) is provided with a groove, and a sliding column (432) is fixedly installed between the inner walls of the groove. Two sliding blocks (44) are slidably installed on the upper surface of the card plate (43) at the outer ring of the sliding column (432). A hole groove matching the sliding column (432) is provided inside the sliding block (44). A movable column (45) is rotatably installed on the top of the sliding block (44). A rotating hole is provided on the top of the movable column (45). A stud (46) is rotatably installed inside the rotating hole. The outer ring of the stud (46) is provided with a thread, and a thread groove is provided inside the rotating hole. The thread groove inside the rotating hole is matched with the outer ring thread of the stud (46). A torsion block (47) is fixedly installed on the top of the stud (46), and a pressure block (48) is fixedly installed on the bottom of the stud (46). The pressure block (48) is made of soft rubber material.