Cutting device for SIC MOSFET chip production

Abstract

The utility model provides a cutting device for SIC MOSFET chip production, and relates to the technical field of chip production and processing, the cutting device comprises a cutting box, a laser cutting assembly arranged in the middle of the inner side of the cutting box, a processing cabinet arranged at the bottom of the inner side of the cutting box, a cutting table arranged in the middle of the upper end of the processing cabinet, and a clamping assembly arranged on the surface of the upper end of the cutting table; the clamping assembly comprises two sets of sliding plates, the two sets of sliding plates are slidably installed on the two sides of the upper end of the cutting table correspondingly, adjusting screw rods are arranged on the two sides of the upper end of each sliding plate and are in threaded connection with the sliding plates, and pressing pads are arranged in the middles of the bottom ends of the adjusting screw rods. The chip substrate cutting device is simple in structure and convenient to operate, meanwhile, the clamping assembly is arranged on the surface of the upper end of the cutting table, the chip substrate can be pressed and fixed, the situation that the chip substrate is unstable in the cutting process is effectively avoided, and therefore the stability and accuracy in the cutting process are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production and processing, in particular to a cutting device for producing SIC MOSFET chips. Background Art

[0002] A chip generally refers to the carrier of an integrated circuit, and is also the result of the design, manufacture, packaging, and testing of an integrated circuit. It is usually an independent entity that can be used immediately. A chip substrate is a term used in printed circuit boards. The chip substrate can provide electrical connection, protection, support, heat dissipation, and assembly functions for the chip to achieve multi-pin, reduce the size of the packaged product, improve electrical performance and heat dissipation, and achieve ultra-high density or multi-chip modularization.

[0003] During the chip production process, the chip substrate often needs to be cut. Most of the existing chip production cutting devices do not have the function of fixing the chip substrate, which causes the chip substrate to easily move during the cutting process, thereby affecting the accuracy of the chip substrate cutting.

[0004] To solve the above problems, we propose a cutting device for SIC MOSFET chip production to solve the above problems. Utility Model Content

[0005] In order to solve the problems in the background technology, the utility model provides a cutting device for producing SIC MOSFET chips.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A cutting device for producing SIC MOSFET chips comprises a cutting box, and a laser cutting assembly is arranged in the middle of the inner side of the cutting box, a processing cabinet is arranged at the inner bottom of the cutting box, the right end of the processing cabinet is located outside the right end of the cutting box, a cutting table is arranged in the middle of the upper end of the processing cabinet, and a clamping assembly is arranged on the upper end surface of the cutting table; the clamping assembly comprises two groups of sliding plates, the two groups of sliding plates are slidably installed on both sides of the upper end of the cutting table respectively, both sides of the upper end of the sliding plate are arranged with adjusting screws, the adjusting screws are threadedly connected with the sliding plate, and a pressing pad is arranged in the middle of the bottom end of the adjusting screw, and the pressing pad is located in the middle of the bottom end of the sliding plate and close to the upper end surface of the cutting table.

[0008] Preferably, a driving assembly is provided in the middle of the bottom end of the cutting table, including a sliding assembly and a rotating assembly. The sliding assembly is provided in the middle of the upper end of the processing cabinet, and the sliding assembly is used to drive the cutting table to slide horizontally. The rotating assembly is provided in the middle of the upper end of the sliding assembly, and the rotating assembly is used to drive the cutting table to rotate.

[0009] Preferably, two groups of limiting sliding grooves are provided in the middle of the side ends of the cutting table, and the bottoms of the two groups of sliding plates are respectively slidably mounted in the inner middle parts of the two groups of limiting sliding grooves.

[0010] Preferably, the sliding assembly includes a first slide rail, the first slide rail is arranged in the middle of the upper end of the processing cabinet, a first electric slider is slidably installed in the middle of the upper end of the first slide rail, and the cutting table is arranged in the middle of the upper end of the first electric slider.

[0011] Preferably, the rotating assembly comprises a servo motor, the servo motor is fixedly mounted at the middle of the upper end of the first electric slider, and the output end of the servo motor is fixedly connected to the bottom of the cutting table.

[0012] Preferably, a second slide rail is fixedly installed in the middle of the inner side of the cutting box, a second electric slider is slidably installed on the side end of the second slide rail, and the laser cutting assembly is fixedly installed on the outer end of the second electric slider.

[0013] Preferably, a support platform is provided at the middle part of the bottom end of the first slide rail, and the support platform is fixedly installed at the middle part of the upper end of the processing cabinet.

[0014] Preferably, baffles are provided around the upper end of the processing cabinet.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. The technical solution proposed by the utility model has a simple structure and is easy to operate. At the same time, by providing a clamping component on the upper surface of the cutting table, the chip substrate can be pressed and fixed, effectively avoiding the instability of the chip substrate during the cutting process, thereby improving the stability and accuracy of the cutting process;

[0017] 2. In the technical solution proposed in the utility model, two groups of limiting slide grooves are arranged in the middle part of the side end of the cutting table, and the bottoms of the two groups of sliding plates are respectively slidably installed in the inner middle part of the two groups of limiting slide grooves. The sliding plates slide in the inner middle part of the limiting slide grooves, so that the staff can adjust the position of the sliding plates conveniently, so that the clamping assembly is suitable for pressing and fixing chip substrates of different sizes, thereby improving the wide application of the utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0019] Figure 2 This is a schematic diagram of the internal structure of the utility model;

[0020] Figure 3 An exploded view of the drive assembly of the utility model;

[0021] Figure 4 It is a structural schematic diagram of the cutting table in the utility model;

[0022] Figure 5 It is an enlarged view of point A in the utility model.

[0023] In the figure: 1. processing cabinet; 2. support table; 3. first slide rail; 4. first electric slide block; 5. servo motor; 6. cutting table; 7. sliding plate; 8. limit slide groove; 9. adjusting screw; 10. pressing pad; 11. cutting box; 12. second slide rail; 13. second electric slide block; 14. laser cutting assembly; 15. baffle. DETAILED DESCRIPTION

[0024] The embodiment of the present application provides a cutting device for producing SIC MOSFET chips, and its main technical solution is: by providing a clamping assembly on the upper end surface of the cutting table 6, the chip substrate can be pressed and fixed, effectively avoiding the instability of the chip substrate during the cutting process, thereby improving the stability and accuracy of the cutting process;

[0025] Furthermore, by sliding the sliding plate 7 in the inner middle of the limiting slide groove 8, the position of the clamping assembly can be adjusted, so that the clamping assembly is suitable for pressing and fixing chip substrates of different sizes, thereby improving the wide application of the utility model.

[0026] Example: Refer to Figure 1-5 As shown, a cutting device for producing SIC MOSFET chips in this embodiment includes a cutting box 11, and a laser cutting assembly 14 is arranged in the middle of the inner side of the cutting box 11, a processing cabinet 1 is arranged at the inner bottom of the cutting box 11, the right end of the processing cabinet 1 is located outside the right end of the cutting box 11, a cutting table 6 is arranged in the middle of the upper end of the processing cabinet 1, and a clamping assembly is arranged on the upper end surface of the cutting table 6;

[0027] The clamping assembly includes two groups of sliding plates 7, and the two groups of sliding plates 7 are respectively slidably installed on both sides of the upper end of the cutting table 6. Adjusting screws 9 are arranged on both sides of the upper end of the sliding plates 7. The adjusting screws 9 are threadedly connected to the sliding plates 7. A pressing pad 10 is arranged in the middle of the bottom end of the adjusting screw 9. The pressing pad 10 is located in the middle of the bottom end of the sliding plate 7 and close to the upper end surface of the cutting table 6. By placing the chip substrate to be cut on the cutting table 6, and then adjusting the position of the sliding plate 7, and then rotating the adjusting screw 9 to push the pressing pad 10, the pressing pad 10 is lowered to contact the chip substrate, thereby realizing pressing and fixing the chip substrate, thereby improving the stability of the chip substrate when cutting.

[0028] A driving assembly is provided in the middle of the bottom end of the cutting table 6, including a sliding assembly and a rotating assembly. The sliding assembly is provided in the middle of the upper end of the processing cabinet 1, and the sliding assembly is used to drive the cutting table 6 to slide horizontally. The rotating assembly is provided in the middle of the upper end of the sliding assembly, and the rotating assembly is used to drive the cutting table 6 to rotate.

[0029] Two groups of limiting slide grooves 8 are provided in the middle part of the side end of the cutting table 6, and the bottoms of the two groups of sliding plates 7 are respectively slidably installed in the inner middle part of the two groups of limiting slide grooves 8. The sliding plates 7 slide in the inner middle part of the limiting slide grooves 8, so that the staff can adjust the position of the sliding plates 7 conveniently, so that the clamping assembly is suitable for pressing and fixing chip substrates of different sizes.

[0030] The sliding assembly includes a first slide rail 3, which is arranged in the middle of the upper end of the processing cabinet 1. A first electric slider 4 is slidably installed in the middle of the upper end of the first slide rail 3. The cutting table 6 is arranged in the middle of the upper end of the first electric slider 4. The first electric slider 4 slides on the upper end surface of the first slide rail 3 to transport the cutting table 6 to the bottom of the laser cutting assembly 14, and then the cutting table 6 is driven by the first electric slider 4 to slide back and forth, so that the laser cutting assembly 14 cuts the chip substrate placed on the upper surface of the cutting table 6.

[0031] The rotating component includes a servo motor 5, which is fixedly mounted in the middle of the upper end of the first electric slider 4. The output end of the servo motor 5 is fixedly connected to the bottom of the cutting table 6. The servo motor 5 is driven to drive the cutting table 6 to rotate, thereby facilitating the laser cutting component 14 to cut the chip substrate on the X-axis and Y-axis.

[0032] A second slide rail 12 is fixedly installed in the middle of the inner side of the cutting box 11, and a second electric slider 13 is slidably installed on the side end of the second slide rail 12. The laser cutting component 14 is fixedly installed on the outer end of the second electric slider 13. The second electric slider 13 slides on the second slide rail 12 to adjust the position of the laser cutting component 14 in a translational manner.

[0033] In some examples, a support platform 2 is provided in the middle of the bottom end of the first slide rail 3 , and the support platform 2 is fixedly installed in the middle of the upper end of the processing cabinet 1 , so as to provide stable support for the installation of the first slide rail 3 .

[0034] In some examples, baffles 15 are disposed around the upper end of the processing cabinet 1 to block the debris generated on the processing cabinet 1, thereby providing convenience for cleaning the debris on the processing cabinet 1.

[0035] The working principle of the utility model is:

[0036] When the chip substrate needs to be cut, the chip substrate is first placed on the cutting table 6, and then the sliding plate 7 is moved to move the pressing pad 10 to the upper edge of the chip substrate. At this time, the adjusting screw 9 is rotated to drive the pressing pad 10 to move up and down. When the pressing pad 10 descends and contacts the chip substrate, the edge of the chip substrate can be pressed, thereby improving the stability of the chip substrate when placed on the cutting table 6;

[0037] Then, the first electric slider 4 slides on the first slide rail 3 to transport the cutting table 6 into the cutting box 11 until it is located in the middle of the bottom end of the laser cutting assembly 14. At this time, the second electric slider 13 slides on the second slide rail 12 to adjust the position of the laser cutting assembly 14.

[0038] During cutting, the first electric slider 4 slides back and forth horizontally, so that the laser cutting component 14 cuts the chip substrate in the X-axis direction. In addition, the servo motor 5 drives the cutting table 6 to rotate, so that the laser cutting component 14 can cut the chip substrate in the Y-axis direction.

[0039] During the entire cutting process, the edge of the chip substrate is pressed and fixed by the pressing pad 10, thereby improving the stability during the cutting process, further improving the accuracy of cutting the chip substrate, and effectively avoiding the instability of the chip substrate during the cutting process.

[0040] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A cutting device for producing SIC MOSFET chips, comprising a cutting box (11), and a laser cutting assembly (14) arranged in the middle of the inner side of the cutting box (11), characterized in that: A processing cabinet (1) is arranged at the inner bottom of the cutting box (11), the right end of the processing cabinet (1) is located outside the right end of the cutting box (11), a cutting table (6) is arranged at the middle of the upper end of the processing cabinet (1), and a clamping assembly is arranged on the upper end surface of the cutting table (6); The clamping assembly comprises two groups of sliding plates (7), the two groups of sliding plates (7) are respectively slidably mounted on both sides of the upper end of the cutting table (6), and both sides of the upper end of the sliding plates (7) are provided with adjusting screws (9), the adjusting screws (9) are threadedly connected to the sliding plates (7), and a pressing pad (10) is provided in the middle of the bottom end of the adjusting screw (9), and the pressing pad (10) is located in the middle of the bottom end of the sliding plate (7) and close to the upper end surface of the cutting table (6); A driving assembly is arranged at the middle of the bottom end of the cutting table (6), comprising a sliding assembly and a rotating assembly. The sliding assembly is arranged at the middle of the upper end of the processing cabinet (1), and is used to drive the cutting table (6) to slide in a horizontal direction. The rotating assembly is arranged at the middle of the upper end of the sliding assembly, and is used to drive the cutting table (6) to rotate.

2. A cutting device for producing SIC MOSFET chips according to claim 1, characterized in that: Two groups of limiting sliding grooves (8) are provided in the middle of the side ends of the cutting table (6), and the bottoms of the two groups of sliding plates (7) are respectively slidably mounted in the middle of the inner sides of the two groups of limiting sliding grooves (8).

3. A cutting device for producing SIC MOSFET chips according to claim 2, characterized in that: The sliding assembly comprises a first slide rail (3), the first slide rail (3) being arranged at the middle of the upper end of the processing cabinet (1), a first electric slide block (4) being slidably mounted at the middle of the upper end of the first slide rail (3), and the cutting table (6) being arranged at the middle of the upper end of the first electric slide block (4).

4. A cutting device for producing SIC MOSFET chips according to claim 3, characterized in that: The rotating assembly comprises a servo motor (5), the servo motor (5) being fixedly mounted at the middle of the upper end of the first electric slide block (4), and the output end of the servo motor (5) being fixedly connected to the bottom of the cutting table (6).

5. A cutting device for producing SIC MOSFET chips according to claim 1, characterized in that: A second slide rail (12) is fixedly mounted on the inner middle portion of the cutting box (11), a second electric slide block (13) is slidably mounted on the side end of the second slide rail (12), and the laser cutting assembly (14) is fixedly mounted on the outer end of the second electric slide block (13).

6. A cutting device for producing SIC MOSFET chips according to claim 3, characterized in that: A support platform (2) is provided at the middle of the bottom end of the first slide rail (3), and the support platform (2) is fixedly mounted at the middle of the upper end of the processing cabinet (1).

7. A cutting device for producing SIC MOSFET chips according to claim 6, characterized in that: Baffles (15) are arranged around the upper end of the processing cabinet (1).

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