Cooling cover body and heat treatment equipment
By designing a cooling cover body including a cover plate, bump and air hole, heat exchange is used for refrigerant, and contact area of high-temperature gas is increased through bumps, the problems of low cooling efficiency and implosion of high-temperature gas in the prior art are solved, and an efficient and compact cooling effect is achieved.
Patent Information
- Application Number
- CN202420602682.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-03-26
AI Technical Summary
When existing semiconductor heat treatment equipment cools high-temperature gas, the pipeline volume is large, the pipeline is complex and cannot effectively cool the gas in the reaction chamber, resulting in the problem of high-temperature gas implosion.
A cooling cover body is designed, including a cover plate, a bump and a pore. The heat exchange between the cover plate and the refrigerant is achieved through the inlet and outlet pores of the refrigerant. The bump increases the contact area between the high-temperature gas and the cover plate and improves the cooling efficiency.
The rapid cooling of high-temperature gas in the reaction chamber is achieved, avoiding the problem of high-temperature gas implosion. At the same time, due to the simple and compact structure, small size, less space, and high cooling efficiency.
Smart Images
Figure CN222557053U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor heat treatment equipment, in particular to a cooling cover body and heat treatment equipment. Background Art
[0002] Semiconductor heat treatment equipment includes vertical heat treatment equipment. Taking LPCVD (low pressure chemical vapor deposition) equipment as an example, it mainly introduces reaction gas and uses the reaction gas to realize chemical deposition in the reaction chamber. The reaction chamber mainly uses pipelines to realize gas inflow and discharge. During the reaction process in the reaction chamber, high-temperature gas is discharged. The high-temperature gas in the reaction chamber needs to be cooled to prevent implosion problems.
[0003] In the prior art, without changing the pipeline design of the reaction chamber, a cooling pipeline is added outside the exhaust pipeline, and a cooling medium is introduced into the cooling pipeline to achieve rapid cooling of the high-temperature gas using the cooling medium, such as liquid nitrogen. This design results in a large pipeline volume, complex pipelines, and is unable to cool the gas in the reaction chamber. Utility Model Content
[0004] The utility model aims to provide a cooling cover and a heat treatment device, which can quickly cool the high-temperature gas in the reaction chamber to prevent the problem of implosion of the high-temperature gas during the reaction process.
[0005] The embodiment of the utility model is achieved as follows:
[0006] In a first aspect, the utility model provides a cooling cover body, comprising:
[0007] A cover plate, wherein a convex block is provided at one end of the cover plate;
[0008] A first air hole is provided on the side wall of the cover plate, and a second air hole is provided on one end of the cover plate away from the protrusion; the first air hole is connected to the second air hole; one of the first air hole and the second air hole is used for air intake, and the other is used for exhaust.
[0009] In an optional embodiment, a flow channel is provided in the protrusion, and the first air hole and the second air hole are respectively connected to the flow channel.
[0010] In an optional embodiment, the cross-section of the protrusion gradually decreases from an end close to the cover plate to an end away from the cover plate.
[0011] In an optional embodiment, the cross section of the protrusion is circular.
[0012] In an optional embodiment, a block is provided on the side wall of the cover plate, and the first air hole is opened on the block.
[0013] In an optional embodiment, there are a plurality of the card blocks, and the plurality of the card blocks are evenly distributed along the outer circumference of the cover plate, and each of the card blocks is provided with the first air hole.
[0014] In an optional embodiment, the thickness of the block is smaller than the thickness of the cover plate.
[0015] In an optional embodiment, a cooling pipe is further included, and the cooling pipe is connected to the first air hole or the second air hole.
[0016] In a second aspect, the utility model provides a heat treatment device, comprising a reaction chamber and a cooling cover body as described in any one of the aforementioned embodiments, wherein the cooling cover body is connected to the reaction chamber.
[0017] In an optional embodiment, the outer diameter of the cover plate is adapted to the inner diameter of the reaction chamber, and the clamping block on the cover plate overlaps the outer edge of the reaction chamber.
[0018] The beneficial effects of the embodiments of the utility model include:
[0019] The cooling cover provided by the utility model has a first air hole and a second air hole on the cover plate for passing the refrigerant to realize heat exchange between the cover plate and the refrigerant. In addition, a convex block is provided on the cover plate to increase the contact area between the cover plate and the high-temperature gas in the reaction chamber, so that the heat exchange area is large and the heat exchange efficiency is high. The high-temperature gas in the reaction chamber can be cooled, and the cooling efficiency is high, which can avoid the problem of implosion of the high-temperature gas. In addition, the cooling cover has a simple and compact structure, a small volume, takes up less space, and has a high cooling efficiency.
[0020] The heat treatment equipment provided by the utility model comprises the above-mentioned cooling cover body, which has a simple and compact structure, a small volume, occupies less space, has high cooling efficiency, can quickly cool the gas in the reaction chamber, and can avoid the problem of implosion of high-temperature gas. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 A schematic structural diagram of a cooling cover body provided by an embodiment of the utility model from a first perspective;
[0023] Figure 2 A schematic structural diagram of a cooling cover body provided by an embodiment of the utility model from a second viewing angle;
[0024] Figure 3 A schematic structural diagram of a heat treatment device including a cooling cover provided in an embodiment of the utility model.
[0025] Icons: 100 - cooling cover; 110 - cover plate; 120 - bump; 113 - side wall; 115 - block; 131 - first air hole; 133 - second air hole; 200 - heat treatment equipment; 210 - reaction chamber. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0029] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0030] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0031] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0032] Semiconductor heat treatment equipment includes vertical heat treatment equipment. Taking LPCVD (low pressure chemical vapor deposition) equipment as an example, it mainly introduces reaction gas and uses the reaction gas to realize chemical deposition in the reaction chamber. The reaction chamber mainly uses pipelines to realize gas inflow and discharge. During the reaction process in the reaction chamber, high-temperature gas is discharged. The discharged high-temperature gas needs to be cooled to prevent implosion problems.
[0033] In the prior art, without changing the pipeline design of the reaction chamber, a cooling pipeline is added outside the exhaust pipeline, and a cooling medium is introduced into the cooling pipeline to achieve rapid cooling of the high-temperature gas using the cooling medium, such as liquid nitrogen. This design results in a large pipeline volume, complex pipelines, and is unable to cool the gas in the reaction chamber.
[0034] In order to overcome at least one defect in the prior art, an embodiment of the utility model provides a cooling cover body 100, which is connected to the reaction chamber 210, and can quickly cool the high-temperature gas in the reaction chamber 210 to avoid the problem of high-temperature gas implosion. The cooling cover body 100 has a simple and compact structure, a small size, takes up little space, and has high cooling efficiency.
[0035] Please refer to Figures 1 to 3 The present embodiment provides a cooling cover 100, which is applied in a semiconductor heat treatment device 200, for example, it can be connected to the bottom or top of a reaction chamber 210, and serve as a base or top cover of the reaction chamber 210. The cooling cover 100 can quickly cool the high-temperature gas in the reaction chamber 210, prevent the high-temperature gas from imploding, and also prevent the problem of excessive exhaust gas temperature.
[0036] The cooling cover 100 includes a cover plate 110, a bump 120 is provided at one end of the cover plate 110, a first air hole 131 is provided on the side wall 113 of the cover plate 110, and a second air hole 133 is provided at one end of the cover plate 110 away from the bump 120; the first air hole 131 and the second air hole 133 are connected. In the cooling cover 100, the first air hole 131 and the second air hole 133 are provided on the cover plate 110 for passing the refrigerant to realize the heat exchange between the cover plate 110 and the refrigerant. It is easy to understand that one of the first air hole 131 and the second air hole 133 is used for air intake and the other is used for exhaust. In addition, the bump 120 is provided on the cover plate 110, which increases the contact area between the cover plate 110 and the high-temperature gas in the reaction chamber 210, has a large heat exchange area, high heat exchange efficiency, can cool the discharged high-temperature gas, has high cooling efficiency, and can avoid the problem of implosion of high-temperature gas. In addition, the cooling cover body 100 has a simple and compact structure, a small volume, occupies little space, and has high cooling efficiency.
[0037] In this embodiment, the first air hole 131 is used as an air inlet, and the second air hole 133 is used as an air outlet. Of course, in some embodiments, the first air hole 131 can also be used as an air outlet, and the second air hole 133 can be used as an air inlet, which is not specifically limited here.
[0038] Optionally, a flow channel is provided in the convex block 120, and the first air hole 131 and the second air hole 133 are respectively connected to the flow channel. By providing the flow channel in the convex block 120, the heat exchange area can be further increased, the heat exchange efficiency can be improved, and the exhaust high-temperature gas can be quickly cooled. The flow channel in the convex block 120 can be distributed in an annular shape, or in a U-shape, a Z-shape, or any other shape, which is not specifically limited here.
[0039] After the refrigerant in the air inlet hole enters the cover plate 110, it flows along the flow channel, passes through the flow channel in the bump 120, and is discharged from the exhaust hole, taking away the heat in the cover plate 110, realizing heat exchange between the refrigerant and the cover plate 110, and thus realizing rapid cooling of the high-temperature gas. Since the bump 120 is located in the reaction chamber 210, the cover plate 110 can directly exchange heat with the high-temperature gas in the reaction chamber 210 to cool the high-temperature gas in the reaction chamber 210. This rapid cooling of the reaction chamber 210 can, on the one hand, reduce the temperature of the exhaust gas and prevent implosion; on the other hand, it can cool the wafers and the like in the reaction chamber 210, which is beneficial to improving the deposition quality of the film layer on the surface of the wafer.
[0040] Of course, in some embodiments, the flow channel may not be provided in the bump 120 . The flow channel is provided inside the cover plate 110 . The first air hole 131 is connected to the second air hole 133 through the flow channel inside the cover plate 110 to cool the high-temperature gas in the reaction chamber 210 .
[0041] In this embodiment, the first air holes 131 are opened on the side wall 113 of the cover plate 110 and are arranged along the radial direction of the cover plate 110. The second air holes 133 are arranged in the middle of the cover plate 110 and away from the side of the protrusion 120. The plurality of first air holes 131 converge along the radial flow channel to the second air holes 133 in the middle of the cover plate 110, and the gas can enter from the side wall 113 and be discharged from the middle, or enter from the middle and be discharged from the side wall 113, so as to achieve uniform cooling of the cover plate 110, thereby taking away the heat in the reaction chamber 210.
[0042] Optionally, the aperture of the second pore 133 is larger than the aperture of the first pore 131. The refrigerant in this embodiment can be either liquid or gas, as long as it can achieve cooling and heat exchange.
[0043] The cross-sectional shape of the first air hole 131 may be circular, elliptical, arc-shaped, square, triangular or any other shape. The cross-sectional shape of the second air hole 133 may be circular, elliptical, arc-shaped, square, triangular or any other shape. The number of the first air holes 131 is not limited to one, two, three, four, five or more. In some embodiments, the first air hole 131 may not be arranged on the side wall 113, for example, the first air hole 131 and the second air hole 133 are both arranged on the upper surface of the cover plate 110. Alternatively, the first air hole 131 and the second air hole 133 are both arranged on the side wall 113 of the cover plate 110.
[0044] The path of the flow channel in the cover plate 110 can be flexibly set and arranged arbitrarily according to actual needs. It can pass through the protrusion 120 or not. It can be set axially, radially, circumferentially, or in multiple directions, as long as it can be connected to the first air hole 131 and the second air hole 133 respectively.
[0045] Optionally, the cross section of the bump 120 gradually decreases from the end close to the cover plate 110 to the end away from the cover plate 110. Optionally, the cross section of the bump 120 is circular, that is, the bump 120 is truncated. In this way, the bump 120 does not occupy too much space in the reaction chamber 210, and the structure is more compact. The setting of the bump 120 effectively increases the heat exchange area and improves the heat exchange efficiency.
[0046] Of course, in some embodiments, the cross-sectional shape of the bump 120 may also include but is not limited to square, rectangle, diamond, triangle, ellipse, oval, crescent, pentagon, hexagon, octagon, decagon or any other shape, which is not specifically limited here.
[0047] It should be noted that if the cooling cover 100 is applied to the bottom of the reaction chamber 210, the bump 120 can also support the tray for placing the wafer in the reaction chamber 210. In this way, the heat exchange efficiency between the cover 110 and the wafer is higher, which is more conducive to improving the deposition quality of the film layer on the wafer.
[0048] Optionally, the side wall 113 of the cover plate 110 is provided with a block 115, and the block 115 is provided with a first air hole 131. The block 115 can also be used to abut against the reaction chamber 210 to achieve the connection between the cover plate 110 and the reaction chamber 210.
[0049] Optionally, there are multiple card blocks 115, and the multiple card blocks 115 are evenly distributed along the outer periphery of the cover plate 110, and each card block 115 is provided with a first air hole 131. In this embodiment, the card block 115 is in an arc shape, which is adapted to the curvature of the side wall 113 of the cover plate 110. In this embodiment, four card blocks 115 are evenly spaced on the side wall 113, and the card block 115 is arranged in the middle of the side wall 113 along the thickness direction of the cover plate 110. Optionally, the thickness of the card block 115 is less than the thickness of the cover plate 110. In this way, a part of the cover plate 110 can be reserved to be plugged into the reaction chamber 210, so as to realize the sealed connection between the reaction chamber 210 and the cover plate 110, and the connection is more reliable.
[0050] Optionally, the cooling cover body 100 further includes a cooling pipe, which is connected to the first air hole 131 or the second air hole 133. In this embodiment, the cooling pipe is connected to the air inlet, and the air outlet is directly connected to the outside atmosphere. It is understood that the cooling pipe can also be connected to the first air hole 131 and the second air hole 133 respectively, so as to provide a circulating refrigerant into the cover plate 110.
[0051] The embodiment of the utility model further provides a heat treatment device 200, comprising a reaction chamber 210 and a cooling cover 100 as in any one of the aforementioned embodiments, wherein the cooling cover 100 is connected to the reaction chamber 210. Optionally, the outer diameter of the cover plate 110 is adapted to the inner diameter of the reaction chamber 210, a portion of the side wall 113 of the cover plate 110 is inserted into the reaction chamber 210, and the block 115 on the cover plate 110 overlaps the outer edge of the reaction chamber 210.
[0052] It is easy to understand that when the cover plate 110 is connected to the reaction chamber 210, the protrusion 120 on the cover plate 110 faces the reaction chamber 210 and is located in the reaction chamber 210, which is conducive to better contact with the high-temperature gas, increasing the heat exchange area and improving the heat exchange efficiency.
[0053] In summary, the cooling cover 100 and the heat treatment device 200 provided in the embodiment of the utility model have the following beneficial effects, including:
[0054] The cooling cover 100 provided by the utility model is provided with an air inlet and an air outlet on the cover plate 110 for passing the refrigerant to realize heat exchange between the cover plate 110 and the refrigerant. In addition, the cover plate 110 is provided with a bump 120, which increases the contact area between the cover plate 110 and the high-temperature gas in the reaction chamber 210, has a large heat exchange area, and has a high heat exchange efficiency. The high-temperature gas in the reaction chamber 210 can be cooled, and the cooling efficiency is high, which can avoid the problem of implosion of the high-temperature gas. In addition, the cooling cover 100 has a simple and compact structure, a small size, takes up less space, and has a high cooling efficiency.
[0055] The heat treatment equipment 200 provided by the utility model includes the above-mentioned cooling cover body 100, has a simple and compact structure, a small volume, occupies less space, has high cooling efficiency, and can avoid the problem of implosion of high-temperature gas.
[0056] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A cooling cover, characterized in that: include: A cover plate, wherein a convex block is provided at one end of the cover plate; A first air hole is provided on the side wall of the cover plate, and a second air hole is provided on one end of the cover plate away from the protrusion; the first air hole is connected to the second air hole; one of the first air hole and the second air hole is used for air intake, and the other is used for exhaust.
2. The cooling cover according to claim 1, characterized in that: A flow channel is provided in the convex block, and the first air hole and the second air hole are respectively communicated with the flow channel.
3. The cooling cover according to claim 1, characterized in that: The cross section of the protrusion gradually decreases from the end close to the cover plate to the end far away from the cover plate.
4. The cooling cover according to claim 1, characterized in that: The cross section of the protrusion is circular.
5. The cooling cover according to claim 1, characterized in that: A clamping block is disposed on the side wall of the cover plate, and the first air hole is formed on the clamping block.
6. The cooling cover according to claim 5, characterized in that: There are a plurality of the card blocks, and the plurality of the card blocks are evenly distributed along the outer circumference of the cover plate, and each of the card blocks is provided with the first air hole.
7. The cooling cover according to claim 5, characterized in that: The thickness of the block is smaller than the thickness of the cover plate.
8. The cooling cover according to any one of claims 1 to 7, characterized in that: A cooling pipe is also included, and the cooling pipe is communicated with the first air hole or the second air hole.
9. A heat treatment device, characterized in that: It comprises a reaction chamber and a cooling cover body according to any one of claims 1 to 8, wherein the cooling cover body is connected to the reaction chamber.
10. The heat treatment equipment according to claim 9, characterized in that: The outer diameter of the cover plate is adapted to the inner diameter of the reaction chamber, and the clamping block on the cover plate overlaps the outer edge of the reaction chamber.