LED lamp aluminum substrate with high heat dissipation performance

Abstract

The utility model relates to the technical field of aluminum substrates, and discloses a high-heat-dissipation LED lamp aluminum substrate which comprises an aluminum bottom plate, an aluminum substrate body is arranged at the lower end of the aluminum bottom plate and comprises a first aluminum substrate ring, a second aluminum substrate ring and a third aluminum substrate ring, the second aluminum substrate ring is arranged outside the first aluminum substrate ring, and the third aluminum substrate ring is arranged outside the second aluminum substrate ring. The third aluminum substrate ring is arranged outside the second aluminum substrate ring; the plastic connecting blocks are arranged among the first aluminum substrate ring, the second aluminum substrate ring and the third aluminum substrate ring; the cross-shaped plastic frame is arranged in the middle of the interior of the first aluminum substrate ring; and the radiating fins are arranged at the upper ends of the first aluminum substrate ring, the second aluminum substrate ring and the third aluminum substrate ring. The aluminum substrate is divided into the three concentric rings, the three rings are connected through the heat insulation materials, and the heat dissipation fins are matched, so that the aluminum substrate has high heat dissipation performance.

Description

Technical Field

[0001] The utility model relates to the technical field of aluminum substrates, in particular to an aluminum substrate for LED lamps with high heat dissipation. Background Art

[0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided board consists of three layers, namely the circuit layer (copper foil), the insulation layer and the metal base layer. There are also double-sided boards designed for high-end use, with the structure of circuit layer, insulation layer, aluminum base, insulation layer and circuit layer. LED lights are solid-state semiconductor devices that can convert common electrical energy into visible light. The main component of LED lights is semiconductor chips. One end of the chip of the LED light is installed on a fixed bracket, and the other end of the chip is connected to the positive pole of the power supply.

[0003] During the use of LED lamps, a large amount of heat will be generated. If the LED lamps are not cooled in time, the normal working life of the LED lamps will be affected. Therefore, a high heat dissipation LED lamp aluminum substrate is proposed. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the shortcomings of the prior art, the utility model provides an aluminum substrate for an LED lamp with high heat dissipation to solve the problem in the above background technology that the heat generated by the LED lamp is not dissipated in time and the service life is affected.

[0006] (II) Technical solution

[0007] To achieve the above purpose, the utility model provides the following technical solution: an aluminum substrate for LED lamp with high heat dissipation, comprising:

[0008] An aluminum base plate, wherein an aluminum base plate is disposed at the lower end of the aluminum base plate, wherein the aluminum base plate comprises a first aluminum base plate ring, a second aluminum base plate ring and a third aluminum base plate ring, wherein the second aluminum base plate ring is disposed outside the first aluminum base plate ring, and the third aluminum base plate ring is disposed outside the second aluminum base plate ring;

[0009] A plastic connection block is disposed between the first aluminum base plate ring, the second aluminum base plate ring and the third aluminum base plate ring, and the plastic connection block is fixedly connected to the first aluminum base plate ring, the second aluminum base plate ring and the third aluminum base plate ring;

[0010] A cross plastic frame is arranged at a middle position inside the first aluminum substrate ring, and the cross plastic frame is fixedly connected to the first aluminum substrate ring;

[0011] The heat dissipation fins are arranged on the upper ends of the first aluminum base plate ring, the second aluminum base plate ring and the third aluminum base plate ring, and the heat dissipation fins are fixedly connected to the first aluminum base plate ring, the second aluminum base plate ring and the third aluminum base plate ring.

[0012] Preferably, the aluminum base plate is provided with fixing holes inside, and the fixing holes are integrally formed with the aluminum base plate, and the first aluminum base plate ring, the second aluminum base plate ring and the third aluminum base plate ring are provided with a plurality of through holes inside, and the through holes are used to increase the ventilation range and improve the heat dissipation performance.

[0013] Preferably, side panels are installed on both left and right sides of the lower end of the aluminum bottom plate, and the side panels are fixedly connected to the aluminum bottom plate.

[0014] Preferably, a return spring is installed on one side inside the side plate, and the return spring is fixedly connected to the side plate.

[0015] Preferably, a clamp is installed on the side of the outer part of the reset spring facing away from the side plate, and the clamp is fixedly connected to the reset spring. A clamp groove is provided on the inner side of the clamp close to the third aluminum substrate ring, and an oblique opening is provided at the lower end of the clamp. The reset spring enables the clamp to have automatic reset properties.

[0016] Preferably, a power plug is installed at the upper end of the cross plastic frame, and a power socket is installed at the middle position of the lower end of the aluminum bottom plate, and the power socket is adapted to the power plug, and the power socket and the power plug are combined to connect the power supply.

[0017] (III) Beneficial effects

[0018] Compared with the prior art, the utility model provides an aluminum substrate for LED lamps with high heat dissipation, which has the following beneficial effects:

[0019] When the LED lamp generates heat, the utility model transfers the heat to the corresponding first aluminum base plate ring, the second aluminum base plate ring and the third aluminum base plate ring, and then disperses the heat through the heat dissipation fins and exchanges heat with the air, thereby achieving heat dissipation of the LED lamp. At the same time, the plastic connecting block made of polyphenylene sulfide is used to effectively block the heat transfer between the first aluminum base plate ring, the second aluminum base plate ring and the third aluminum base plate ring. In summary, the problems raised in the background technology are solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;

[0021] Figure 2 This is a three-dimensional diagram of the aluminum bottom plate and the aluminum base plate of the utility model in a separated state;

[0022] Figure 3 For the utility model Figure 2 A partial enlarged view of the middle A area;

[0023] Figure 4 This is a top view of the aluminum substrate structure of the utility model.

[0024] In the figure: 1. Aluminum bottom plate; 2. Fixing hole; 3. Side plate; 4. Reset spring; 5. Clamp plate; 6. Clamp groove; 7. Bevel; 8. First aluminum base plate ring; 9. Second aluminum base plate ring; 10. Third aluminum base plate ring; 11. Cross plastic frame; 12. Plastic connecting block; 13. Perforation; 14. Heat dissipation fin; 15. Power jack; 16. Power plug. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] The utility model provides a technical solution, a high heat dissipation LED lamp aluminum substrate, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 ,include:

[0027] An aluminum base plate 1, wherein an aluminum base plate is disposed at the lower end of the aluminum base plate 1, wherein the aluminum base plate comprises a first aluminum base plate ring 8, a second aluminum base plate ring 9 and a third aluminum base plate ring 10, wherein the second aluminum base plate ring 9 is disposed outside the first aluminum base plate ring 8, and the third aluminum base plate ring 10 is disposed outside the second aluminum base plate ring 9;

[0028] The plastic connection block 12 is disposed between the first aluminum substrate ring 8, the second aluminum substrate ring 9 and the third aluminum substrate ring 10, and the plastic connection block 12 is fixedly connected to the first aluminum substrate ring 8, the second aluminum substrate ring 9 and the third aluminum substrate ring 10;

[0029] A cross plastic frame 11 is disposed at a middle position inside the first aluminum substrate ring 8, and the cross plastic frame 11 is fixedly connected to the first aluminum substrate ring 8;

[0030] The heat dissipation fins 14 are arranged at the upper ends of the first aluminum base plate ring 8, the second aluminum base plate ring 9 and the third aluminum base plate ring 10, and the heat dissipation fins 14 are fixedly connected to the first aluminum base plate ring 8, the second aluminum base plate ring 9 and the third aluminum base plate ring 10, and the LED lamp is installed at the lower ends of the first aluminum base plate ring 8, the second aluminum base plate ring 9 and the third aluminum base plate ring 10.

[0031] See also Figure 1 , Figure 2 and Figure 4A fixing hole 2 is provided inside the aluminum base plate 1, and the fixing hole 2 is integrally formed with the aluminum base plate 1. A plurality of through holes 13 are provided inside the first aluminum base plate ring 8, the second aluminum base plate ring 9 and the third aluminum base plate ring 10, and the through holes 13 are used to increase the ventilation range and improve the heat dissipation performance.

[0032] See also Figure 3 Side panels 3 are installed on both left and right sides of the lower end of the aluminum bottom plate 1, and the side panels 3 are fixedly connected to the aluminum bottom plate 1.

[0033] See also Figure 3 A return spring 4 is installed on one side of the side plate 3 , and the return spring 4 is fixedly connected to the side plate 3 .

[0034] See also Figure 3 A clamping plate 5 is installed on the side of the outer part of the reset spring 4 facing away from the side plate 3, and the clamping plate 5 is fixedly connected to the reset spring 4. A clamping groove 6 is provided on the inner side of the clamping plate 5 close to the third aluminum substrate ring 10, and an oblique opening 7 is provided at the lower end of the clamping plate 5. The reset spring 4 enables the clamping plate 5 to have automatic reset properties.

[0035] See also Figure 2 and Figure 4 A power plug 16 is installed at the upper end of the cross plastic frame 11, and a power socket 15 is installed at the middle position of the lower end of the aluminum base plate 1, and the power socket 15 is adapted to the power plug 16, and the power socket 15 and the power plug 16 are combined to connect the power supply.

[0036] This solution: the aluminum base plate 1 is placed at the position where the LED lamp needs to be installed, and is fixed by screws passing through the fixing holes 2. The power plug 16 is aligned with the power jack 15 so that the aluminum base plate fits the aluminum base plate 1. The third aluminum base plate ring 10 hits the bevel 7 of the clamping plate 5 to move it outward. When the third aluminum base plate ring 10 moves to the inside of the clamping groove 6, the reset spring 4 resets and pushes the clamping plate 5 so that the clamping groove 6 clamps the third aluminum base plate ring 10, so that the aluminum base plate can be quickly installed. When the LED lamp generates heat, the heat is transferred to the corresponding first aluminum base plate ring 8, the second aluminum base plate ring 9 and the third aluminum base plate ring 10, and then dispersed through the heat dissipation fins 14 to exchange heat with the air, thereby achieving heat dissipation of the LED lamp. At the same time, the plastic connecting block 12 made of polyphenylene sulfide is used to effectively block the heat transfer between the first aluminum base plate ring 8, the second aluminum base plate ring 9 and the third aluminum base plate ring 10.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high heat dissipation LED lamp aluminum substrate, characterized in that: include: An aluminum base plate (1), wherein an aluminum base plate is disposed at the lower end of the aluminum base plate (1), wherein the aluminum base plate comprises a first aluminum base plate ring (8), a second aluminum base plate ring (9) and a third aluminum base plate ring (10), wherein the second aluminum base plate ring (9) is disposed outside the first aluminum base plate ring (8), and the third aluminum base plate ring (10) is disposed outside the second aluminum base plate ring (9); A plastic connection block (12) is disposed between the first aluminum substrate ring (8), the second aluminum substrate ring (9) and the third aluminum substrate ring (10), and the plastic connection block (12) is fixedly connected to the first aluminum substrate ring (8), the second aluminum substrate ring (9) and the third aluminum substrate ring (10); A cross plastic frame (11) is arranged at a middle position inside the first aluminum substrate ring (8), and the cross plastic frame (11) is fixedly connected to the first aluminum substrate ring (8); The heat dissipation fins (14) are arranged on the upper ends of the first aluminum base plate ring (8), the second aluminum base plate ring (9) and the third aluminum base plate ring (10), and the heat dissipation fins (14) are fixedly connected to the first aluminum base plate ring (8), the second aluminum base plate ring (9) and the third aluminum base plate ring (10).

2. The high heat dissipation LED lamp aluminum substrate according to claim 1, characterized in that: The aluminum base plate (1) is provided with a fixing hole (2) inside, and the fixing hole (2) is formed integrally with the aluminum base plate (1), and the first aluminum base plate ring (8), the second aluminum base plate ring (9) and the third aluminum base plate ring (10) are provided with a plurality of through holes (13) inside.

3. The high heat dissipation LED lamp aluminum substrate according to claim 1, characterized in that: Side plates (3) are installed on both left and right sides of the lower end of the aluminum bottom plate (1), and the side plates (3) are fixedly connected to the aluminum bottom plate (1).

4. The high heat dissipation LED lamp aluminum substrate according to claim 3, characterized in that: A return spring (4) is installed on one side inside the side plate (3), and the return spring (4) is fixedly connected to the side plate (3).

5. The high heat dissipation LED lamp aluminum substrate according to claim 4, characterized in that: A clamping plate (5) is installed on the side of the outer portion of the return spring (4) facing away from the side plate (3), and the clamping plate (5) is fixedly connected to the return spring (4). A clamping groove (6) is provided on the inner side of the clamping plate (5) close to the third aluminum substrate ring (10), and an oblique opening (7) is provided at the lower end of the clamping plate (5).

6. The high heat dissipation LED lamp aluminum substrate according to claim 1, characterized in that: A power plug (16) is installed at the upper end of the cross plastic frame (11), and a power socket (15) is installed at the middle position of the lower end of the aluminum bottom plate (1), and the power socket (15) is compatible with the power plug (16).

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