Semiconductor patch silver paste box drying oven material frame

By designing the semiconductor patch silver paste box oven material frame, the standardized partition of the material box is achieved using the card slot, the problems of box drop and irregular spacing are solved, and the treatment effect and product quality of the oven are improved.

CN222560589UActive Publication Date: 2025-03-04ANHUI YUGUAN OPTOELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202420918470.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-28
Publication Date
2025-03-04
Estimated Expiration
2034-04-28

AI Technical Summary

Technical Problem

When producing silver paste products in the patching process, the material box is prone to falling off or the spacing is not standardized, resulting in abnormal product quality.

Method used

A semiconductor patch silver paste box oven material frame is designed, including the material frame body, oven vents, wire holes, grid strips, material box partition strips and clamp slots, and standardized partitions of the material box are achieved through the clamp slots.

Benefits of technology

Effectively prevent the material box from falling and irregular spacing, improve the oven processing effect, and improve product quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a semiconductor paster silver paste box drying oven material frame which comprises a material frame body, drying oven ventilation openings, wire holes, grid bars, material box partition bars and clamping grooves, the material frame body is of a cuboid structure and is opened upwards, the drying oven ventilation openings are formed in the four walls of the material frame body, and the wire holes are formed in the wire holes. The drying oven ventilation opening is composed of a plurality of wire holes which are horizontally and parallelly distributed at equal intervals, a grid bar is formed between every two adjacent wire holes, a plurality of material box partition strips which are perpendicularly connected to the grid bars in a lap joint mode are horizontally and parallelly erected in the material frame body, and clamping grooves matched with the grid bars are formed in the end faces of the two ends of each material box partition strip. By means of the mode, according to the material frame of the semiconductor patch silver paste box drying oven, the drying oven ventilation openings are formed in the four walls of the material frame, the grid bars 4 are constructed, the material box partition strips are additionally arranged on the grid bars 4, standard partition of the silver paste box is achieved through the clamping grooves 6, and therefore the processing effect of the drying oven is greatly improved.
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Description

Technical Field

[0001] The utility model relates to the field of semiconductor patch silver paste processing devices, in particular to a semiconductor patch silver paste material box oven material frame. Background Art

[0002] The problems in producing silver paste products in the patch process are:

[0003] 1: When the material box is placed in the oven, it often falls due to employee slipping and carelessness. The dropped product needs to be scrapped, resulting in low yield;

[0004] 2: When placing the material boxes in the oven, the spacing between the material boxes is not placed according to the specifications, resulting in the material box spacing being too small, causing product sealing and testing, resulting in quality abnormalities.

[0005] Therefore, the products to be baked must be placed into the oven one by one manually, and the spacing between the material boxes cannot be controlled. Utility Model Content

[0006] The main technical problem solved by the utility model is to provide a semiconductor patch silver paste material box oven material frame, open oven vents on the four walls of the material frame and construct grille bars 4, add material box partition strips on the grille bars 4, and achieve standardized partition of the silver paste sheet material box through the card slot 6, thereby greatly improving the processing effect of the oven.

[0007] In order to solve the above technical problems, a technical solution adopted by the utility model is: to provide a semiconductor patch silver paste material box oven material frame, including a material frame body, oven vents, wire holes, grid bars, material box partition bars, and slots. The material frame body is a rectangular structure and is open upward. The four walls of the material frame body are provided with oven vents. The oven vents are composed of a number of horizontally parallel wire holes that are equally spaced, and grid bars are formed between adjacent wire holes. A number of material box partition bars that are vertically overlapped on the grid bars are horizontally and parallelly arranged in the material frame body, and the end faces of both ends of the material box partition bars are provided with slots matching the grid bars.

[0008] In a preferred embodiment of the present invention, the material box partition strip forms a pair of inserts on both sides of the slot, and the inserts match in the wire holes.

[0009] In a preferred embodiment of the present invention, a pair of side walls of the material frame body are provided with oval handles.

[0010] In a preferred embodiment of the present invention, the inner and outer surfaces of the material frame body are uniformly coated with an antistatic coating.

[0011] The beneficial effects of the utility model are as follows: the utility model provides a semiconductor patch silver paste material box oven material frame, with oven vents opened on the four walls of the material frame and grid bars 4 constructed, material box partition bars added to the grid bars 4, and standardized partitions of the silver paste sheet material box are achieved through the card slots 6, thereby greatly improving the processing effect of the oven. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0013] Figure 1 It is a structural diagram of a preferred embodiment of a semiconductor patch silver paste material box oven material frame of the utility model. DETAILED DESCRIPTION

[0014] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] like Figure 1 As shown, the embodiment of the utility model includes:

[0016] A semiconductor patch silver paste material box oven material frame, comprising a material frame body 1, an oven vent 2, wire holes 3, grid bars 4, a material box partition bar 5, and a card slot 6. The material frame body 1 is a rectangular parallelepiped structure and is open upward. The four walls of the material frame body 1 are provided with oven vents 2, and the oven vents 2 are composed of a plurality of horizontally parallel wire holes 3 distributed at equal intervals, and grid bars 4 are formed between adjacent wire holes 3. A plurality of material box partition bars 5 vertically overlapped on the grid bars 4 are horizontally and parallelly arranged in the material frame body 1, and card slots 6 matching the grid bars 4 are provided on the end faces of both ends of the material box partition bars 5.

[0017] The material box partition strip 5 forms a pair of inserts on both sides of the card slot 6 , and the inserts match in the wire hole 3 .

[0018] Furthermore, a pair of side walls of the material frame body 1 are provided with oval handles 9 .

[0019] Furthermore, the inner and outer surfaces of the material frame body 1 are uniformly coated with an antistatic coating 8 .

[0020] In the material design of the material frame, plastic products have been removed, the entire material frame uses an anti-static coating, and the handle and the top of the material frame use an arc-shaped design to prevent scratches and abrasions on employees.

[0021] The technical problems that this product can solve include:

[0022] 1: The improved material frame can be placed directly into the oven, which can prevent personnel from taking the material box alone and causing the material box to fall and the product to be scrapped;

[0023] 2: The improved material frame is placed in the oven as a whole, which can effectively prevent the material box spacing from being too small and the silver paste from being layered due to human factors, resulting in quality abnormalities.

[0024] When in use, first put the patch silver paste material box into the material frame body 1, then adjust the position of the card slot 6 on the grid bar 4 so that the material box partition bar 5 can separate the adjacent material boxes at equal distances. Finally, hold the handle and push the entire material frame into the oven.

[0025] Taking into account situations that may cause static electricity, including but not limited to friction between the material box partition strips 5 during the adjustment process, this product also adds an anti-static coating on the inner and outer surfaces to provide static protection for the semiconductor chip.

[0026] In summary, the utility model provides a semiconductor patch silver paste material box oven material frame, opens oven vents on the four walls of the material frame and constructs grilles 4, adds material box partition strips on the grilles 4, and realizes standardized partition of the silver paste sheet material box through the card slot 6, thereby greatly improving the processing effect of the oven.

[0027] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor patch silver paste material box oven material frame, characterized in that: It includes a material frame body, an oven vent, wire holes, grid bars, a material box partition bar, and a slot. The material frame body is a rectangular parallelepiped structure and is open upward. The four walls of the material frame body are provided with oven vents. The oven vents are composed of a number of horizontally parallel wire holes that are equally spaced, and grid bars are formed between adjacent wire holes. A number of material box partition bars vertically overlapped on the grid bars are horizontally and parallelly arranged in the material frame body, and the end faces of both ends of the material box partition bars are provided with slots matching the grid bars. The material box partition strip forms a pair of inserts on both sides of the slot, and the inserts are matched in the wire holes.

2. The semiconductor patch silver paste material box oven material frame according to claim 1, characterized in that: A pair of side wall surfaces of the material frame body are provided with oval handles.

3. The semiconductor patch silver paste material box oven material frame according to claim 1, characterized in that: The inner and outer surfaces of the material frame body are evenly coated with an antistatic coating.