High-temperature-resistant optical fiber array

Abstract

The utility model relates to the technical field of optical fibers, in particular to a high-temperature-resistant optical fiber array, which is firmer in bonding, ensures accurate positioning of the front ends of the optical fibers by arranging a mounting groove, and ensures accurate positioning of the front ends of the optical fibers by arranging a pressing plate on the surface of the top of an inner cavity of a protective cover plate and connecting the pressing plate with the protective cover plate through a pressing spring. The pressing plate is tightly attached to the optical fiber, so that the optical fiber is firmly fixed in the mounting groove, meanwhile, a thermal insulation sponge is arranged in the protective cover plate, it is guaranteed that the light array is not degummed at the high temperature, the module can be suitable for the working condition of high-temperature environment packaging, the reliability of the module is improved, and the service life of the module is prolonged while the bonding performance is guaranteed. The size of a customer can be miniaturized, the operation on the optical fiber under miniaturization is facilitated, the transmission of the optical fiber is more stable, and the optical fiber can be directly coupled with a silicon optical chip.

Description

Technical Field

[0001] The utility model relates to the technical field of optical fibers, in particular to a high temperature resistant optical fiber array. Background Art

[0002] Fiber arrays have broad application prospects as the input and output ends of optical communication modules. The structure commonly used in optical fiber communication devices on the market is a single-layer fiber array, which places the optical input end and the optical output end side by side in the positioning groove and fixes them with a cover plate. With the upgrading and development of optical modules, the external dimensions of the modules are getting smaller and smaller, and the size of the internal device FiberArray is also smaller. At the same time, the smaller size also reduces the bonding force of the optical fiber. At the same time, the application environment temperature of the module is getting higher and higher. Therefore, how to improve the bonding performance of the optical fiber and prevent it from debonding in a high temperature environment has become a technical problem that needs to be solved. Utility Model Content

[0003] The purpose of the utility model is to provide a high temperature resistant optical fiber array to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-temperature resistant optical fiber array, comprising a substrate base, a protective cover plate and optical fibers, the top surface of the substrate base being evenly provided with a plurality of mounting grooves, optical fibers being placed inside the mounting grooves, and the gaps between the bare fiber portions of the optical fibers and the corresponding mounting grooves being filled with adhesive, a protective cover plate being provided on the top of the substrate base, a thermal insulation sponge being provided inside the protective cover plate, a connecting groove being provided at the bottom of the protective cover plate, a clamping plate being provided at the top of the inner cavity of the connecting groove, and the clamping plate being connected to the top of the inner cavity of the connecting groove through a clamping spring.

[0005] Preferably, fixing screw holes are provided on both side surfaces of the protective cover plate, fixing screws are installed in the fixing screw holes, and the fixing screws are fixedly connected to the side surfaces of the substrate base.

[0006] Preferably, the bottom surface of the pressing plate is in close contact with the surface of the optical fiber, and the bottom surface of the pressing plate is arc-shaped, and the curvature matches the curvature of the surface of the optical fiber.

[0007] Preferably, a protective rubber pad is laid on the bottom surface of the pressing plate.

[0008] Preferably, the number of the installation grooves is greater than or equal to the number of optical fibers.

[0009] Compared with the prior art, the beneficial effects of the utility model are: the utility model has stronger adhesion, and the precise positioning of the front end of the optical fiber is ensured by setting the installation groove. A clamping plate is set on the top surface of the inner cavity of the protective cover plate, and the clamping plate is connected to the protective cover plate through a clamping spring, and the clamping plate is tightly fitted with the optical fiber, so that the optical fiber is firmly fixed inside the installation groove. At the same time, a temperature insulation sponge is provided inside the protective cover plate to ensure that the light array does not debond at high temperatures, so that it can be suitable for high-temperature environment packaging conditions, improve the reliability of the module, and while ensuring the bonding performance, it is conducive to the miniaturization of customer size, convenient for the operation of optical fiber under miniaturization, and makes the optical fiber transmission more stable, and can be directly coupled with the silicon photonic chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0011] Figure 2 It is a schematic diagram of the internal structure of the connecting groove of the utility model.

[0012] In the figure: 1. substrate base; 2. protective cover; 3. optical fiber; 4. mounting groove; 5. thermal insulation sponge; 6. fixing screw hole; 7. fixing screw; 8. connecting groove; 9. clamping spring; 10. clamping plate; 11. protective rubber pad. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0014] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0015] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0016] See also Figure 1-2 The utility model provides a technical solution: a high-temperature resistant optical fiber array, including a substrate base 1, a protective cover plate 2 and an optical fiber 3. The top surface of the substrate base 1 is evenly provided with a plurality of mounting grooves 4, and the optical fiber 3 is placed inside the mounting groove 4. The gap between the bare fiber part of the optical fiber 3 and the corresponding mounting groove 4 is filled with adhesive. A protective cover plate 2 is provided on the top of the substrate base 1, and a thermal insulation sponge 5 is provided inside the protective cover plate 2. A connecting groove 8 is opened at the bottom of the protective cover plate 2, and a clamping plate 10 is provided at the top of the inner cavity of the connecting groove 8. The clamping plate 10 is connected to the top of the inner cavity of the connecting groove 8 through a clamping spring 9.

[0017] Furthermore, fixing screw holes 6 are provided on both sides of the protective cover plate 2 , and fixing screws 7 are installed in the fixing screw holes 6 . The fixing screws 7 are fixedly connected to the side surfaces of the substrate base 1 .

[0018] Furthermore, the bottom surface of the pressing plate 10 is in close contact with the surface of the optical fiber 3 , and the bottom surface of the pressing plate 10 is in an arc shape, and the curvature matches the curvature of the surface of the optical fiber 3 .

[0019] Furthermore, a protective rubber pad 11 is laid on the bottom surface of the pressing plate 10 .

[0020] Furthermore, the number of the mounting grooves 4 is greater than or equal to the number of the optical fibers 3 .

[0021] The utility model has a stronger bonding, and the precise positioning of the front end of the optical fiber 3 is ensured by setting the installation groove 4. A clamping plate 10 is set on the top surface of the inner cavity of the protective cover plate 2, and the clamping plate 10 is connected to the protective cover plate 2 through a clamping spring 9, and the clamping plate 10 is tightly fitted with the optical fiber 3, so that the optical fiber 3 is firmly fixed inside the installation groove 4. At the same time, a temperature insulation sponge 5 is set inside the protective cover plate 2 to ensure that the light array does not debond at high temperature, so that it can be suitable for high temperature environment packaging conditions, improve the reliability of the module, and while ensuring the bonding performance, it is conducive to the miniaturization of customer size, convenient for the operation of the optical fiber 3 under miniaturization, and more stable for optical fiber transmission, which can be directly coupled with the silicon photonic chip.

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high temperature resistant optical fiber array, comprising a substrate base (1), a protective cover plate (2) and optical fibers (3), characterized in that: The top surface of the substrate base (1) is evenly provided with a plurality of mounting grooves (4), the mounting grooves (4) are provided with optical fibers (3), the gaps between the bare fiber parts of the optical fibers (3) and the corresponding mounting grooves (4) are filled with adhesive, the top of the substrate base (1) is provided with a protective cover plate (2), the protective cover plate (2) is provided with a thermal insulation sponge (5), the bottom of the protective cover plate (2) is provided with a connecting groove (8), the top of the inner cavity of the connecting groove (8) is provided with a clamping plate (10), and the clamping plate (10) is connected to the top of the inner cavity of the connecting groove (8) via a clamping spring (9).

2. A high temperature resistant optical fiber array according to claim 1, characterized in that: The protective cover plate (2) is provided with fixing screw holes (6) on both sides, fixing screws (7) are installed in the fixing screw holes (6), and the fixing screws (7) are fixedly connected to the side surfaces of the base plate base (1).

3. The high temperature resistant optical fiber array according to claim 1, characterized in that: The bottom surface of the pressing plate (10) is tightly fitted to the surface of the optical fiber (3); the bottom surface of the pressing plate (10) is arc-shaped, and the curvature matches the curvature of the surface of the optical fiber (3).

4. The high temperature resistant optical fiber array according to claim 1, characterized in that: The bottom surface of the pressing plate (10) is paved with a protective rubber pad (11).

5. The high temperature resistant optical fiber array according to claim 1, characterized in that: The number of the installation grooves (4) is greater than or equal to the number of the optical fibers (3).

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