Efficient heat dissipation device for CPU

Abstract

The utility model relates to the field of heat dissipation, in particular to an efficient heat dissipation device for a CPU. The utility model provides an efficient cooling device for a CPU. The efficient cooling device comprises a heat conduction block, a copper pipe, cooling fins, a first installation shell, a limiting frame, a folding pipe, a second installation shell and the like. A plurality of pairs of copper pipes are symmetrically installed on the two sides of the heat conduction block, a plurality of cooling fins are installed in the copper pipes, first installation shells are symmetrically installed on the two sides of the cooling fins, limiting frames are installed on the two sides of the first installation shells and movably connected with the copper pipes, and folding pipes penetrate through the side faces of the limiting frames. Second mounting shells are mounted at the ends, away from the limiting frames, of the folding pipes. The heat of the CPU is transmitted to the cooling fins, the electric fan works, air is sucked in, the heat in the cooling fins is carried, enters the folding pipe, then comes to the mounting plate and is discharged out of the case, and the effects that the heat is discharged out of the case and the CPU is efficiently cooled are achieved.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation, in particular to a high-efficiency heat dissipation device for a CPU. Background Art

[0002] CPU, which means central processing unit in Chinese, is the core component of computer system. CPU undertakes the operation and control functions of computer system. It is responsible for executing the instructions in computer program, including arithmetic operation, logical operation, data transmission and other operations. The main components of CPU include controller and arithmetic unit, in addition to cache memory and data and control bus to realize the connection between them. The performance of CPU has a direct impact on the running speed and efficiency of computer. It can be integrated on a semiconductor chip. This highly integrated chip is called microprocessor. If the computer is compared to a person, then CPU can be compared to the human brain, which is responsible for processing and coordinating all tasks and information flow.

[0003] The CPU runs at high speed and generates a lot of heat when working, so it needs a special radiator. The required CPU radiator generally discharges the heat into the chassis. Since there are also motherboards, display cards, hard drives and other devices in the chassis, they also need to run at low temperatures. The heat discharged by the CPU radiator remains in the chassis, increasing the heat in the chassis, often causing other devices to malfunction due to the heat discharged by the CPU radiator, causing the computer to freeze.

[0004] In order to solve the above problems, we design a high-efficiency heat dissipation device for CPU. Utility Model Content

[0005] In order to overcome the disadvantage that the heat discharged by the CPU radiator remains in the chassis, increases the heat in the chassis, and often causes other devices to fail to work due to the heat discharged by the CPU radiator, the utility model provides a high-efficiency heat dissipation device for the CPU.

[0006] The technical solution of the utility model is as follows: a high-efficiency heat dissipation device for a CPU comprises a heat conduction block, a copper tube, a heat sink, a first mounting shell, a limiting frame, a folding tube, a second mounting shell, a mounting plate, an electric fan and a limiting frame, a plurality of pairs of copper tubes are symmetrically mounted on both sides of the heat conduction block, a plurality of heat sinks are mounted in the copper tubes, a first mounting shell is symmetrically mounted on both sides of the heat sink, limiting frames are mounted on both sides of the first mounting shell, the limiting frames are movably connected to the copper tubes, folding tubes are passed through the sides of the limiting frames, the ends of the folding tubes away from the limiting frames are mounted with second mounting shells, the ends of the second mounting shells away from the folding tubes are provided with mounting plates, limiting frames are symmetrically mounted on both sides of the heat sink, and the two limiting frames on the same side are commonly connected with an electric fan.

[0007] In addition, it is particularly preferred that it also includes a fixing frame, a clamping rod, a tension spring and a filter plate. The fixing frames are symmetrically installed on both sides of the electric fan, the fixing frames are penetrated by clamping rods, the outer side of the clamping rods is covered with a tension spring, and the two clamping rods are movably connected to the filter plate.

[0008] In addition, it is particularly preferred that a rubber pad is further included. The rubber pad is slidably penetrated in the copper tube, and the rubber pad is located between the two heat sinks and below the bottom heat sink.

[0009] Furthermore, it is particularly preferred that the filter plate is located outside the electric fan.

[0010] In addition, it is particularly preferred that mounting holes are provided on both sides of the mounting plate.

[0011] In addition, it is particularly preferred that a magnet block is further included, and magnet blocks are installed on the side surfaces of the mounting plate.

[0012] The beneficial effects of the utility model are as follows: the heat of the CPU is transferred to the heat sink, and the electric fan works to inhale the wind, carrying the heat in the heat sink into the folded tube, and then to the mounting plate and discharged to the outside of the chassis, thereby achieving the effect of discharging the heat from the chassis and efficiently cooling the CPU. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0014] Figure 2 It is a three-dimensional structural schematic diagram of the copper tube, the first installation shell, the limiting frame and other components of the utility model.

[0015] Figure 3 It is a three-dimensional structural schematic diagram of the copper tube, heat sink, rubber pad and other components of the utility model.

[0016] Figure 4 It is a three-dimensional structural schematic diagram of components such as the first mounting shell, the limiting frame and the folding tube.

[0017] Figure 5 It is a three-dimensional structural schematic diagram of components such as the second mounting shell, the mounting plate and the magnet block.

[0018] Figure 6 It is a three-dimensional structural schematic diagram of the electric fan of the utility model.

[0019] Figure 7 It is a three-dimensional structural schematic diagram of the components such as the fixing frame, the clamping rod and the filter plate of the utility model.

[0020] Figure 8 It is a three-dimensional structural schematic diagram of the fixing frame, the clamping rod and the tension spring of the utility model.

[0021] Figure numbers: 1_heat conducting block, 2_copper tube, 3_heat sink, 4_first mounting shell, 5_limiting frame, 6_folding tube, 7_second mounting shell, 8_mounting plate, 9_electric fan, 10_limiting frame, 11_fixing frame, 12_clamping rod, 13_tension spring, 14_filter plate, 15_magnet block, 16_rubber pad. DETAILED DESCRIPTION

[0022] The utility model is described in detail below in conjunction with the accompanying drawings.

[0023] Example 1

[0024] A high-efficiency heat dissipation device for a CPU, such as Figure 1-Figure 8 As shown, it includes a heat conducting block 1, a copper tube 2, a heat sink 3, a first mounting shell 4, a limiting frame 5, a folding tube 6, a second mounting shell 7, a mounting plate 8, an electric fan 9 and a limiting frame 10. A plurality of pairs of copper tubes 2 are symmetrically mounted on both sides of the heat conducting block 1. A plurality of heat sinks 3 are mounted inside the copper tubes 2. The heat sink 3 plays a role in heat dissipation. A first mounting shell 4 is symmetrically mounted on both sides of the heat sink 3. Limiting frames 5 are mounted on both sides of the first mounting shell 4. The limiting frames 5 are movably connected to the copper tube 2. Folding tubes 6 are passed through the sides of the limiting frames 5. The folding tubes 6 can be bent. The ends of the folding tubes 6 away from the limiting frames 5 are mounted with second mounting shells 7. The ends of the second mounting shells 7 away from the folding tubes 6 are provided with mounting plates 8. The mounting plates 8 are mounted on the sides of the chassis. Limiting frames 10 are symmetrically mounted on both sides of the heat sink 3. The two limiting frames 10 on the same side are commonly connected with an electric fan 9.

[0025] The heat-conducting block 1 is installed on the surface of the CPU. A large amount of heat is generated when the CPU is working. The heat is transferred to the heat-conducting block 1, and then transferred to the heat sink 3 through the copper tube 2. The electric fan 9 works, sucks in the surrounding air, and blows it to the heat sink 3. The heat on the surface of the heat sink 3 is blown away, and the blown air enters the folding tube 6, and then passes through the second mounting shell 7 and blows out of the chassis, thereby dissipating the heat to the outside of the chassis without increasing the temperature inside the chassis.

[0026] Example 2

[0027] On the basis of Example 1, Figure 1 and Figure 2 As shown, it also includes a fixing frame 11, a clamping rod 12, a tension spring 13 and a filter plate 14, a magnet block 15 and a rubber pad 16. The fixing frames 11 are symmetrically installed on both sides of the electric fan 9. The fixing frames 11 are penetrated by clamping rods 12, and the outer side of the clamping rods 12 is sleeved with a tension spring 13. The two clamping rods 12 are movably connected to the filter plate 14 together. A rubber pad 16 is slidably penetrated in the copper tube 2. The rubber pad 16 is located between the two heat sinks 3 and below the bottom heat sink 3. The filter plate 14 is located on the outside of the electric fan 9. Mounting holes are opened on both sides of the mounting plate 8, and magnet blocks 15 are installed on the sides of the mounting plate 8.

[0028] When dust and other impurities adhere to the surface of the filter plate 14, the clamping rod 12 is pulled to both sides, and the clamping rod 12 moves to both sides along the fixing frame 11, and the clamping rod 12 leaves the filter plate 14, and the filter plate 14 is taken out for cleaning, and then reinstalled between the two clamping rods 12, so as to clean the filter plate 14, and the magnet block 15 is adsorbed on the side wall of the chassis, so as to strengthen and fix the mounting plate 8.

[0029] It should be understood that this embodiment is only used to illustrate the present invention and is not used to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the claims attached to this application.

Claims

1. A high-efficiency heat dissipation device for a CPU, comprising a heat conducting block (1) and a copper tube (2), wherein a plurality of pairs of copper tubes (2) are symmetrically mounted on both sides of the heat conducting block (1), wherein: The invention also comprises a heat sink (3), a first mounting shell (4), a limiting frame (5), a folding tube (6), a second mounting shell (7), a mounting plate (8), an electric fan (9) and a limiting frame (10). A plurality of heat sinks (3) are mounted in the copper tube (2). The first mounting shell (4) is symmetrically mounted on both sides of the heat sink (3). The limiting frames (5) are mounted on both sides of the first mounting shell (4). The limiting frames (5) are movably connected to the copper tube (2). The folding tube (6) is passed through the side of the limiting frame (5). The end of the folding tube (6) away from the limiting frame (5) is mounted with the second mounting shell (7). The end of the second mounting shell (7) away from the folding tube (6) is provided with a mounting plate (8). The limiting frames (10) are symmetrically mounted on both sides of the heat sink (3). The two limiting frames (10) on the same side are commonly connected to the electric fan (9).

2. A high-efficiency heat dissipation device for a CPU as claimed in claim 1, characterized in that: The utility model also comprises a fixing frame (11), a clamping rod (12), a tension spring (13) and a filter plate (14). The fixing frames (11) are symmetrically installed on both sides of the electric fan (9). The fixing frames (11) are penetrated by clamping rods (12). The outer side of the clamping rods (12) is covered with a tension spring (13). The two clamping rods (12) are movably connected to the filter plate (14).

3. A high-efficiency heat dissipation device for a CPU as claimed in claim 2, characterized in that: It also includes a rubber pad (16) which is slidably penetrated in the copper tube (2) and is located between the two heat sinks (3) and below the bottom heat sink (3).

4. A high-efficiency heat dissipation device for a CPU as claimed in claim 3, characterized in that: The filter plate (14) is located outside the electric fan (9).

5. A high-efficiency heat dissipation device for a CPU as claimed in claim 4, characterized in that: Both sides of the mounting plate (8) are provided with mounting holes.

6. A high-efficiency heat dissipation device for a CPU as claimed in claim 5, characterized in that: It also includes a magnet block (15), and the side surfaces of the mounting plate (8) are all equipped with the magnet block (15).

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